BGA2866
BGA2866
BGA2866
1. Product profile
1.3 Applications
LNB IF amplifiers
General purpose low noise wideband amplifier for frequencies between
DC and 2.2 GHz
2. Pinning information
Table 1. Pinning
Pin Description Simplified outline Graphic symbol
1 VCC
6 5 4 1
2, 5 GND2
3 RF_OUT 6 3
4 GND1
4 2, 5
6 RF_IN 1 2 3
sym052
NXP Semiconductors BGA2866
MMIC wideband amplifier
3. Ordering information
Table 2. Ordering information
Type number Package
Name Description Version
BGA2866 - plastic surface-mounted package; 6 leads SOT363
4. Marking
Table 3. Marking
Type number Marking code Description
BGA2866 *ED * = - : made in Hong Kong
* = p : made in Hong Kong
* = W : made in China
* = t : made in Malaysia
5. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage RF input AC coupled 0.5 +7.0 V
ICC supply current - 36 mA
Ptot total power dissipation Tsp = 90 C - 200 mW
Tstg storage temperature 40 +125 C
Tj junction temperature - 125 C
Pdrive drive power - +10 dBm
6. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-sp) thermal resistance from junction to Ptot = 200 mW; Tsp = 90 C 300 K/W
solder point
7. Characteristics
Table 6. Characteristics
VCC = 5.0 V; ZS = ZL = 50 ; Pi = 40 dBm; Tamb = 25 C; measured on demo board; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 4.5 5.0 5.5 V
ICC supply current 14.7 17.4 20.1 mA
BGA2866 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
BGA2866 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
8. Application information
Figure 1 shows a typical application circuit for the BGA2866 MMIC. The device is
internally matched to 50 and therefore does not need any external matching. The value
of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF
for applications above 100 MHz. However, when the device is operated below 100 MHz,
the capacitor value should be increased.
The PCB top ground plane, connected to pins 2, 4 and 5 must be as close as possible to
the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes
as close as possible to the MMIC.
VS
C1
VS
C2
RF_IN RF_OUT C3
RF input RF output
GND1 GND2
001aaf761
wideband wideband
amplifier LNA amplifier mixer
mixer
from RF to IF circuit to IF circuit
antenna
circuit or demodulator or demodulator
oscillator oscillator
001aaf762 001aaf763
The MMIC is very suitable as IF amplifier in e.g. LNB’s. As second amplifier after an LNA, the MMIC offers an
The excellent wideband characteristics make it an easy easy matching, low noise solution.
building block.
Fig 2. Application as IF amplifier Fig 3. Application as RF amplifier
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8.2 Graphs
90°
1.0
+1
0.4
+0.2 +5
0.2
0 0.2 0.5 1 2 5 10
180° 0° 0
(1)
(3) (2)
−0.2 −5
−0.5 −2
−135° −45°
−1
1.0
−90° 001aam318
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90°
1.0
+1
0.4
+0.2 (3) +5
0.2
0 (1)
0.2 0.5 1 2 5 10
180° 0° 0
(2)
−0.2 −5
−0.5 −2
−135° −45°
−1
1.0
−90° 001aam319
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001aam320 001aam321
103 0
K
RLin
(dB) (1)
102 (2)
(3)
−10 (4)
(5)
(1)
10 (2)
(3)
(4)
(5)
−20
1
10−1 −30
0 1 2 3 0 1 2 3
f (GHz) f (GHz)
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001aam322 001aam323
0 30
Gp
RLout (dB)
(dB) 28
−10
26
(1)
(2)
(3)
(4)
(5) 24
−20
(1)
(2)
22
(3)
(4)
(5)
−30 20
0 1 2 3 0 1 2 3
f (GHz) f (GHz)
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001aam324 001aam325
0 7
ISL NF
(dB) (5) (dB)
(3)
−20 6
−40 (1) 5
(1)
(2) (4)
(4)
−60 4 (3)
(2)
(5)
−80 3
0 1 2 3 0 1 2 3
f (GHz) f (GHz)
8.3 Tables
Table 7. Supply current over temperature and supply voltages
Typical values.
Symbol Parameter Conditions Tamb (C) Unit
40 +25 +85
ICC supply current VCC = 4.5 V 16.41 15.27 14.36 mA
VCC = 5.0 V 17.73 16.63 15.85 mA
VCC = 5.5 V 19.29 17.73 17.27 mA
Table 8. Second harmonic output power over temperature and supply voltages
Typical values.
Symbol Parameter Conditions Tamb (C) Unit
40 +25 +85
PL(2H) second harmonic output power f = 250 MHz; Pdrive = 33 dBm
VCC = 4.5 V 48 49 51 dBm
VCC = 5.0 V 49 51 53 dBm
VCC = 5.5 V 50 52 54 dBm
f = 950 MHz; Pdrive = 33 dBm
VCC = 4.5 V 40 41 42 dBm
VCC = 5.0 V 40 41 42 dBm
VCC = 5.5 V 40 41 42 dBm
BGA2866 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Table 9. Input power at 1 dB gain compression over temperature and supply voltages
Typical values.
Symbol Parameter Conditions Tamb (C) Unit
40 +25 +85
Pi(1dB) input power at 1 dB gain compression f = 250 MHz
VCC = 4.5 V 18 18 19 dBm
VCC = 5.0 V 18 18 18 dBm
VCC = 5.5 V 17 18 18 dBm
f = 950 MHz
VCC = 4.5 V 19 19 19 dBm
VCC = 5.0 V 18 18 19 dBm
VCC = 5.5 V 18 18 18 dBm
f = 2150 MHz
VCC = 4.5 V 20 21 22 dBm
VCC = 5.0 V 20 21 22 dBm
VCC = 5.5 V 20 21 22 dBm
Table 10. Output power at 1 dB gain compression over temperature and supply voltages
Typical values.
Symbol Parameter Conditions Tamb (C) Unit
40 +25 +85
PL(1dB) output power at 1 dB gain compression f = 250 MHz
VCC = 4.5 V 4 3 3 dBm
VCC = 5.0 V 5 4 4 dBm
VCC = 5.5 V 5 5 4 dBm
f = 950 MHz
VCC = 4.5 V 4 3 3 dBm
VCC = 5.0 V 5 4 4 dBm
VCC = 5.5 V 6 5 4 dBm
f = 2150 MHz
VCC = 4.5 V 3 2 0 dBm
VCC = 5.0 V 4 2 1 dBm
VCC = 5.5 V 4 3 1 dBm
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Table 11. Saturated output power over temperature and supply voltages
Typical values.
Symbol Parameter Conditions Tamb (C) Unit
40 +25 +85
PL(sat) saturated output power f = 250 MHz
VCC = 4.5 V 6 5 5 dBm
VCC = 5.0 V 7 6 6 dBm
VCC = 5.5 V 8 7 6 dBm
f = 950 MHz
VCC = 4.5 V 6 5 5 dBm
VCC = 5.0 V 7 7 5 dBm
VCC = 5.5 V 8 7 6 dBm
f = 2150 MHz
VCC = 4.5 V 4 3 2 dBm
VCC = 5.0 V 5 4 2 dBm
VCC = 5.5 V 5 4 2 dBm
Table 12. Second-order intermodulation distance over temperature and supply voltages
Typical values.
Symbol Parameter Conditions Tamb (C) Unit
40 +25 +85
IM2 second-order intermodulation distance f1 = 250 MHz;
f2 = 251 MHz;
Pdrive = 36 dBm
VCC = 4.5 V 40 42 46 dBc
VCC = 5.0 V 44 47 51 dBc
VCC = 5.5 V 48 51 56 dBc
f1 = 950 MHz;
f2 = 951 MHz;
Pdrive = 36 dBm
VCC = 4.5 V 38 40 43 dBc
VCC = 5.0 V 42 43 45 dBc
VCC = 5.5 V 45 46 46 dBc
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Table 13. Output third-order intercept point over temperature and supply voltages
Typical values.
Symbol Parameter Conditions Tamb (C) Unit
40 +25 +85
IP3O output third-order intercept point f1 = 250 MHz;
f2 = 251 MHz;
Pdrive = 36 dBm
VCC = 4.5 V 18 18 17 dBm
VCC = 5.0 V 20 19 18 dBm
VCC = 5.5 V 21 19 19 dBm
f1 = 950 MHz;
f2 = 951 MHz;
Pdrive = 36 dBm
VCC = 4.5 V 17 16 15 dBm
VCC = 5.0 V 18 17 16 dBm
VCC = 5.5 V 20 18 16 dBm
f1 = 2150 MHz;
f2 = 2151 MHz;
Pdrive = 36 dBm
VCC = 4.5 V 13 11 9 dBm
VCC = 5.0 V 14 12 9 dBm
VCC = 5.5 V 15 12 10 dBm
BGA2866 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
9. Test information
30 mm
IC1 C2
30 C1
mm
C3
001aal226
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D B E A X
y HE v M A
6 5 4
pin 1
index A
A1
1 2 3 c
e1 bp w M B Lp
e
detail X
0 1 2 mm
scale
04-11-08
SOT363 SC-88
06-03-16
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11. Abbreviations
Table 16. Abbreviations
Acronym Description
IF Intermediate Frequency
LNA Low-Noise Amplifier
LNB Low-Noise Block converter
PCB Printed-Circuit Board
SMD Surface Mounted Device
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[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
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information is available on the Internet at URL http://www.nxp.com.
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authorized or warranted to be suitable for use in life support, life-critical or
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modifications or additions. NXP Semiconductors does not give any
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applications and therefore such inclusion and/or use is at the customer’s own
use of such information.
risk.
Short data sheet — A short data sheet is an extract from a full data sheet
Applications — Applications that are described herein for any of these
with the same product type number(s) and title. A short data sheet is intended
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for quick reference only and should not be relied upon to contain detailed and
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specified use without further testing or modification.
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third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
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the products or of the application or use by customer’s third party
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customer(s). NXP does not accept any liability in this respect.
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no Limiting values — Stress above one or more limiting values (as defined in
responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC 60134) will cause permanent
source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
In no event shall NXP Semiconductors be liable for any indirect, incidental,
the Recommended operating conditions section (if present) or the
punitive, special or consequential damages (including - without limitation - lost
Characteristics sections of this document is not warranted. Constant or
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repeated exposure to limiting values will permanently and irreversibly affect
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the quality and reliability of the device.
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standard warranty and NXP Semiconductors’ product specifications.
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the product is not suitable for automotive use. It is neither qualified nor tested Translations — A non-English (translated) version of a document is for
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In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer 13.4 Trademarks
(a) shall use the product without NXP Semiconductors’ warranty of the
Notice: All referenced brands, product names, service names and trademarks
product for such automotive applications, use and specifications, and (b)
are the property of their respective owners.
whenever customer uses the product for automotive applications beyond
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15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2
7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2
8 Application information. . . . . . . . . . . . . . . . . . . 4
8.1 Application examples . . . . . . . . . . . . . . . . . . . . 4
8.2 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.3 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
9 Test information . . . . . . . . . . . . . . . . . . . . . . . . 13
10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
13.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
14 Contact information. . . . . . . . . . . . . . . . . . . . . 17
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.