bm2scq12xt LBZ e

Datasheet
Quasi-resonant AC/DC Converter

Built-in 1700 V SiC-MOSFET
BM2SCQ12xT-LBZ Series
General Description Key Specifications
This is the product guarantees long time support in ◼ Operating Power Supply Voltage Range:
industrial market. VCC: 15.0 V to 27.5 V
BM2SCQ12xT-LBZ series is a quasi-resonant AC/DC DRAIN: 1700 V (Max)
converter that provides an optimum system for all ◼ Normal Operating Current: 2000 µA (Typ)
products which has an electrical outlet. Quasi-resonant ◼ Burst Operating Current: 500 µA (Typ)
operation enables soft switching and helps to keep the ◼ Maximum Operating Frequency: 120 kHz (Typ)
EMI low. ◼ Operating Temperature: -40 °C to +105 °C
This IC can be designed easily because it includes the
1700 V/4 A SiC (Silicon-Carbide) MOSFET.
Design with a high degree of flexibility is achieved with Package W (Typ) x D (Typ) x H (Max)
current detection resistors as external devices. The burst TO220-6M 10.0 mm x 4.5 mm x 25.6 mm
operation reduces an input power at light load.
BM2SCQ12xT-LBZ series includes various protection
functions, such as soft start function, burst operation,
over current limiter per cycle, over-voltage protection
function, overload protection function.
Features
◼ Long Time Support Product for Industrial Applications
◼ 6 Pins: TO220-6M Package
◼ Built-in 1700 V/4 A/1.12 Ω SiC-MOSFET
◼ Quasi-resonant Type (Low EMI) Applications
◼ Frequency Reduction Function Power Supply for Industrial Equipment, AC Adaptor,
◼ Low Current Consumption (19 µA) during Standby Household Appliances
◼ Burst Operation at Light Load
◼ SOURCE Pin Leading Edge Blanking Lineup
◼ VCC UVLO (Under Voltage Lockout protection) Product name FB OLP VCC OVP
◼ VCC OVP (Over Voltage Protection) BM2SCQ121T-LBZ Auto Restart Latch
◼ Over Current Protection Circuit per Cycle BM2SCQ122T-LBZ Latch Latch
◼ Soft Start Function BM2SCQ123T-LBZ Auto Restart Auto Restart
◼ ZT Pin Trigger Mask Function BM2SCQ124T-LBZ Latch Auto Restart
◼ ZT OVP (Over Voltage Protection)
Typical Application Circuit
FUSE
Diode
Filter
Bridge
DRAIN SOURCE FB GND ZT VCC
ERROR
AMP
〇Product structure :Silicon and silicon carbide integrated circuit 〇This product has no designed protection against radioactive rays
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© 2018 ROHM Co., Ltd. All rights reserved. TSZ02201-0F1F0A200470-1-2
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Pin Configuration
(TOP VIEW)
DRAIN SOURCE FB GND ZT VCC

1 2 3 4 5 6
Pin Description
ESD Diode
Pin No. Pin Name I/O Function
VCC GND
1 DRAIN I/O MOSFET DRAIN pin - ✔
2 SOURCE I MOSFET SOURCE pin ✔ ✔
3 FB I Feedback signal input pin ✔ ✔
4 GND I/O GND pin ✔ -
5 ZT I Zero current detection pin - ✔
6 VCC I Power supply input pin - ✔
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Block Diagram
VOUT
FUSE VH
RSTART
Diode
Filter
Bridge
Va
CVCC
6 1
VCC DRAIN
VCC UVLO
+
-
4.0 V 18.0 V
NOUT
18.5 V/14.0 V Regulator Internal Clamper
Supply
+
-
ZT ACSNS Comp. +
-
RZT1
+
- ZT OVP Comp.
VCC OVP
OSC 1700 V
(LATCH) 28.0 V OSC
SiC-MOSFET
ZT
ZT Comp. 1 shot
5 +
ERROR
- AND OR
CZT 7V
Time Out
( 45 µs )
AMP
RZT2 ZT
200 mV Blanking AND S Q POUT
OUT(H->L) NOUT PRE
0.60 µs FBOLP_OH AND
Driver
OR OUT
Maximum
+
Blanking
+
Frequency NOUT
- R
VREF(4 V) (120 kHz)
1.00 V
20 kΩ
Burst
FB Comp.
3 +
-
CFB 0.50 V
OLP
+ Timer FBOLP_OH
- (128 ms)
Soft Start
DCDC
200 kΩ Comp.
FB/2 -
1.00 V
200 kΩ -
+
CURRENT SENSE (V-V Change) SOURCE

Leading Edge
Normal: ｘ 1.0 Blanking 2
RS
4
GND
PC
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Description of Blocks
1 Startup Sequences (FB OLP: Auto Recovery Mode)

The BM2SCQ12xT-LBZ’s startup sequence is shown in Figure 1.
See the sections below for the detailed descriptions.
Input
Voltage
VH
19.5 V
VCC Pin 14.0 V
Voltage
Internal REF 128 ms 128 ms 128 ms

VFLOP1
Pull Up
VFLOP2
FB Pin
Voltage
Over
VOUT Normal Load
Load Light
Load
IOUT
Burst Mode
Switching
Soft Start
Time
A BC D E F GH IJ K
Figure 1. Startup Sequence Timing Chart
A: The input voltage VH is applied.

B: The VCC pin voltage rises due to start resistor RSTART, and this IC starts operating when the VCC pin voltage
becomes higher than VUVLO1 (Typ = 19.5 V). When the protection functions are judged as normal status, the
switching operation starts. At that time, since the VCC pin voltage value always drops due to the pin's consumption
current, it is necessary to set the VCC pin voltage to higher than VUVLO2 (Typ = 14.0 V).
C: The IC has a soft start function which regulates the voltage level at the SOURCE pin to prevent an excessive rise in
voltage and current.
D: When the switching operation starts, VOUT rises. At startup, the output voltage should be set to the regulated voltage
within tFOLP period (Typ = 128 ms).
E: At a light load, the IC starts burst operation in order to keep power consumption down.
F: Overload operation.
G: When the FB pin voltage keeps being more than VFOLP1 (Typ = 2.8 V) for tFOLP (Typ = 128 ms) or more, the switching
operation is stopped by the overload protection circuit. If the FB pin voltage status becomes less than VFOLP2(Typ =
2.6 V) even once, tFOLP (Typ = 128 ms) timer is reset
H: When the VCC pin voltage becomes VUVLO2 (Typ = 14.0 V) or less, restart is executed.
I: The IC’s circuit current is reduced and the VCC pin voltage rises. (Same as B)
J: Same as F.
K: Same as G.
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1 Startup Sequences (FB OLP: Auto Recovery Mode) – continued
Start resistance RSTART is the resistance required to start the IC. If the start resistance RSTART value is set to low, the
standby power becomes large and the startup time becomes short. Conversely, if the start resistance RSTART value is set
to large, standby power becomes low and the startup time becomes long. The standby current IOFF of
BM2SCQ12xT-LBZ is 30 µA (Max). However, this is the minimum current required to start the IC. It is necessary to set
the appropriate current value for the set target.
e.g. Start Resistance RSTART Setting
𝑅𝑆𝑇𝐴𝑅𝑇 < (𝑉𝑀𝐼𝑁 − 𝑉𝑈𝑉𝐿𝑂 (𝑀𝑎𝑥)) ÷ 𝐼𝑂𝐹𝐹 [Ω]
Where:
𝑅𝑆𝑇𝐴𝑅𝑇 is the start resistance.
𝑉𝑀𝐼𝑁 is the minimum AC voltage.
𝑉𝑈𝑉𝐿𝑂 is the VCC UVLO voltage.
𝐼𝑂𝐹𝐹 is the standby current.
When the AC input voltage is AC 80 V, VMIN = 113 V.

And it can be calculated as (113 - 20)/30 μA = 3.1 MΩ because VUVLO1 (Max) = 20.0 V at this time.
Considering the optimal value for the resistor which is 3.1 MΩ or less and set RSTART to 3.0 MΩ.
The power dissipation at this time is calculated by the formula below.
𝑃𝑑(𝑅𝑆𝑇𝐴𝑅𝑇 ) = (𝑉𝐻 − 𝑉𝐶𝐶 )2 ÷ 𝑅𝑆𝑇𝐴𝑅𝑇 = (141𝑉 − 14V)2 ÷ 3.0𝑀𝛺 = 5.4 [mW]

Where:
𝑃𝑑 is the power dissipation.
𝑅𝑆𝑇𝐴𝑅𝑇 is the start resistance.
𝑉𝐻 is the input voltage.
𝑉𝐶𝐶 is the IC power supply voltage.
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Description of Blocks – continued
2 VCC Pin Protection Function

BM2SCQ12xT-LBZ includes the VCC low voltage protection function VCC UVLO and the VCC over voltage protection
function VCC OVP. These functions prevent the abnormal voltage-related break in MOSFETs used for switching. The
VCC UVLO function is an auto recovery type comparator with voltage hysteresis and the VCC OVP function is the
comparator uses latch mode or auto recovery mode. After latch function is detected by VCC OVP, latching is released
(reset) when the condition the VCC pin voltage < VLATCH (Typ = VUVLO2 - 3.5 V) is met. This operation is shown in Figure
2. And VCC OVP has a built-in mask time tLATCH (Typ = 150 µs). This function masks such as the surges occur at the pin.
Input
Voltage
VH
VOVP1
VUVLO1
VCC Pin
Voltage
VUVLO2
VLATCH
0V
ON ON
VCC UVLO OFF

OFF
ON
VCC OVP OFF OFF
ON ON
Switching OFF OFF OFF
L : Normal
Internal H : Latch
Latch Signal
A B C DE F G H I J K L M N A B Time
Figure 2. VCC UVLO/OVP (Latch Mode)
A: VH is applied, the VCC voltage rises.

B: When the VCC pin voltage is higher than VUVLO1 (Typ = 19.5 V), the switching operation starts.
C: When the VCC pin voltage is lower than VUVLO2 (Typ = 14.0 V), the switching operation stops.
D: When the VCC pin voltage is higher than VUVLO1 (Typ = 19.5 V), the switching operation starts.
E: The VCC pin voltage drops until the output voltage is stabilized.
F: The VCC pin voltage rises.
G: When the VCC pin voltage is higher than VOVP1 (Typ = 29.5 V), the switching is stopped by an internal latch signal.
H: When the switching operation stops, power supply from the auxiliary coil stops and the VCC pin voltage drops.
I: When the VCC pin voltage is lower than VUVLO2 (Typ = 14.0 V), the VCC pin voltage rises because the IC current
consumption current drops.
J: When the VCC pin voltage is higher than VUVLO1 (Typ = 19.5 V), there are no switching operations because the IC is
during latch operation. The VCC pin voltage drops because the IC current consumption current is lowered.
K: Same as H.
L: Same as I.
M: VH is OPEN (unplugged). The VCC pin voltage drops.
N: When the VCC pin voltage < VLATCH (Typ = VUVLO2 -3.5 V), it is latch-released.
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3 DC/DC Converter Function

BM2SCQ12xT-LBZ uses PFM (Pulse Frequency Modulation) mode control. The FB pin, the ZT pin, and the SOURCE
pin are monitored to provide a system optimized as DC/DC. The switching MOSFET ON width (turn OFF) is controlled
by the FB pin and the SOURCE pin, and the OFF width (turn ON) is controlled by the ZT pin. By setting maximum
frequency, PFM mode will control it to meet noise regulation. A detailed description is below. (Refer to Figure 3)
VH
RSTART
Va
CVCC
6 1
VCC DRAIN
18.0 V
NOUT Clamper
+
-
ZT ACSNS Comp.
+
- ZT OVP Comp.
1700 V
RZT1
(LATCH) SiC-MOSFET
ZT
ZT Comp. 1 shot
5 +
OR
- AND
Time Out
CZT 7V
RZT2 ( 45 µs )
ZT Blanking
200 mV AND S Q POUT
OUT(H L)
0.60 µs NOUT PRE
FBOLP_OH AND
Driver
OR OUT
Maximum
+
Blanking
+ NOUT
Frequency R
VREF(4 V) - (120 kHz)
1.00 V
20 kΩ Burst
FB Comp.
3 +
-
CFB 0.50V
OLP
+ Timer FBOLP_OH
- (128 ms)
Soft Start
DCDC
200 kΩ Comp.
FB/2 -
1.00 V
200 kΩ -
+
CURRENT SENSE (V-V Change) Leading Edge SOURCE

Normal: x 1.0 Blanking 2
RS
4
GND
Figure 3. Block Diagram of DC/DC Operations
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3 DC/DC Converter Function – continued
3.1 Determination of ON Width (Turn OFF)

ON width is controlled by the FB pin and SOURCE pin. The ON width is determined by comparing the FB pin
voltage at 1/AV (Typ = 1/2) with the SOURCE pin voltage. In addition, the comparator level is changed by
comparing with the IC's internally generated VLIM1A (Typ = 1.0 V), as is shown in Figure 4. The SOURCE pin is also
used for the over current limiter circuit per pulse. Changes at the FB pin changes in the maximum blanking
frequency and over current limiter level.
mode 1: Burst operation

mode 2: Frequency reduction operation (reduces maximum frequency)
mode 3: Maximum frequency operation (operates at maximum frequency)
mode 4: Overload operation (pulse operation is stopped when overload is detected)
Maximum Operating
Frequency [kHz]
mode 1 mode 2 mode 3 mode 4
fSW1
fSW2
FB Pin
0.0 0.5 1.25 2.0 2.8 Voltage
[V]
CS
Limiter [V] mode 1 mode 2 mode 3 mode 4
VLIM1
VLIM2
FB Pin
Voltage
0.0 0.5 1.25 2.0 2.8
[V]
Figure 4. Relationship of FB Pin Voltage to Over Current Limiter and Maximum Frequency
The switch of over current protection in the soft start function and input voltage is performed by adjusting the
over current limiter lever. In this case, the VLIM1 and VLIM2 values are as listed below.
Table 1. Over Current Protection Voltage

IZT ≥ -1.0 mA IZT < -1.0 mA
Soft Start
VLIM1A VLIM2A VLIM1B VLIM2B
from startup to less than 1 ms 0.250 V (25.0 %) 0.063 V (6.3 %) 0.175 V (17.5 %) 0.047 V (4.7 %)
from 1 ms to less than 4 ms 0.500 V (50.0 %) 0.125 V (12.5 %) 0.350 V (35.0 %) 0.094 V (9.4 %)
4 ms or more 1.000 V (100.0 %) 0.250 V (25.0 %) 0.700 V (70.0 %) 0.188 V (18.8 %)
(Note) Values those compared to VLIM1A (Typ = 1.0 V) during IZT ≥ -1.0 mA are shown in ().
3.2 L.E.B. (Leading Edge Blanking) Function

When the switching MOSFET is turned ON, surge current occur at each capacitor component and drive current.
Therefore, when the SOURCE pin voltage rises temporarily, detection errors may occur in the over current limiter
circuit. To prevent detection errors, BM2SCQ12xT-LBZ has the blanking function. This function masks the
SOURCE pin voltage for tLEB (Typ = 250 ns) after the DRAIN pin changes from high to low. This blanking function
reduces the SOURCE pin noise filter.
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3.3 SOURCE Over Current Protection Switching Function

When the input voltage (VH) becomes high, the ON time is shortened and the operating frequency increases. As a
result, the maximum rated power is increased for a certain over current limiter. As a countermeasure, the IC will use
its internal over current protection function to switch. In case of high voltage, the over current comparator value
which determines the ON time is multiplied by 0.7 of normal operation.
Detection and switch are performed by monitoring the ZT inflow current. When the MOSFET is turned ON, Va
becomes a negative voltage dependent on the input voltage (VH). The ZT pin is clamped to nearly 0 V in the IC.
The formula used to calculate this is shown below. A block diagram is shown in Figure 5. Also, graphs are shown in
Figure 6, Figure 7 and Figure 8.
𝐼𝑍𝑇 = (𝑉𝑎 − 𝑉𝑍𝑇 ) ÷ 𝑅𝑍𝑇1 = 𝑉𝑎 ÷ 𝑅𝑍𝑇1 = 𝑉𝐻 × 𝑁𝑎 ÷ 𝑁𝑝 ÷ 𝑅𝑍𝑇1 [A]

𝑅𝑍𝑇1 = 𝑉𝑎 ÷ 𝐼𝑍𝑇 [Ω]
Where:
𝐼𝑍𝑇 is the ZT inflow current.
𝑉𝑎 is the auxiliary winding voltage.
𝑉𝑍𝑇 is the ZT pin voltage.
𝑅𝑍𝑇1 is the ZT pin resistance 1.
𝑉𝐻 is the input voltage.
𝑁𝑎 is the primary side winding.
𝑁𝑝 is the auxiliary winding.
From the above, the VH voltage is set with a resistance value (RZT1). The ZT bottom detection voltage is determined
at that time, therefore, set the timing with CZT.
VH
RSTART
Va
CVCC
IZT =(VH x Na)/(Np x RZT1)
6 1
VCC DRAIN
18.0 V
NOUT Clamper
+
-
ZT ACSNS Comp.
+
- ZT OVP Comp.
RZT1
(LATCH)
ZT
Comp. 1 shot
5 +
OR
- AND
CZT ZT 7V
Time Out
RZT2 ( 45 µs )
ZT Blanking
200 mV AND S Q POUT
OUT(H L)
0.60 µs NOUT PRE
FBOLP_OH AND
Driver
OR OUT
Maximum
+
Blanking
+ NOUT
Frequency R
VREF(4 V) - (120 kHz)
1.00 V
20 kΩ Burst
FB Comp.
3 +
-
CFB 0.50V
OLP
+ Timer FBOLP_OH
- (128 ms)
Soft Start
DCDC
200 kΩ Comp.
FB/2 -
1.00 V
200 kΩ -
+
CURRENT SENSE (V-V Change) Leading Edge SOURCE

Normal: x 1.0 Blanking 2
RS
4
GND
Figure 5. Block Diagram of SOURCE Switching Current
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3.3 SOURCE Over Current Protection Switching Function – continued
SOURCE Y
Limiter [V] mode 1 mode 2 mode 3 mode 4
VLIM1A
VLIM1B
IZT ≥ -1.0 mA
IZT < -1.0 mA
VLIM2A
VLIM2B
0.0 0.5 1.0 1.5 2.0 2.8 X

FB pin voltage [V]
Figure 6. SOURCE Switching: SOURCE Limiter vs FB Pin Voltage
SOURCE Y
Limiter [V]
VLIM1
VLIM1 x 0.7
X
1.0 ZT Pin Current [mA]
Figure 7. SOURCE Switching: SOURCE Limiter vs ZT Pin Current
e.g. Setup method (for switching between 100 V AC and 220 V AC.)
100 V AC: 141 V ±42 V (±30 % margin)
220 V AC: 308 V ±62 V (±20 % margin)
In the above cases, the SOURCE current is switched in the range from 182 V to 246 V.
→ This is done when VH = 214 V.
Given: Np = 100, Na = 15.
𝑉𝑎 = 𝑉𝐼𝑁 × 𝑁𝑎 ÷ 𝑁𝑝 = 214𝑉 × 15 ÷ 100 × (−1) = −32.1 [V]

𝑅𝑍𝑇 = 𝑉𝑎 ÷ 𝐼𝑍𝑇 = −32.1𝑉 ÷ −1𝑚𝐴 = 32.1 [kΩ]
Where:
𝑉𝑎 is the auxiliary winding voltage.
𝑉𝐼𝑁 is the input voltage.
𝑁𝑎 is the primary side winding.
𝑁𝑝 is the auxiliary side winding.
𝑅𝑍𝑇 is the ZT pin resistance.
𝐼𝑍𝑇 is the ZT pin inflow current.
According to the above, RZT = 32 kΩ is set.

SOURCE Y
Limiter [V]
VLIM1
VLIM1 x 0.7
X
214 VH Pin Voltage [V]
Figure 8. Example of SOURCE Switching: SOURCE Limiter vs VH Pin Voltage
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3.4 Determination of OFF Width (Turn ON)

The OFF width is controlled at the ZT pin. While switching is OFF, the power stored in the coil is supplied to the
secondary side output capacitor. When this power supply ends, there is no more current flowing to the secondary
side, so the DRAIN pin of switching MOS voltage drops. Consequently, the voltage on the auxiliary coil side also
drops.
A voltage that was resistance-divided by RZT1 and RZT2 is applied to the ZT pin. When this voltage level drops to
VZT1 (Typ = 100 mV) or below, switching is turned ON by the ZT comparator. To detect zero current status at the ZT
pin, time constants are generated using CZT, RZT1, and RZT2. Additionally, the ZT trigger mask and the ZT timeout
function are built-in.
3.5 ZT Pin Trigger Mask Function

When the switching is set OFF from ON, superposition of noise may occur at the ZT pin. At this time, the ZT
comparator is masked for the tZTMASK (Typ = 0.60 µs) to prevent the ZT comparator operate errors. (Refer to Figure
9)
Switching ON OFF ON OFF ON
OUT
ZT Pin
Voltage
ZT Trigger tZMASK tZMASK

Mask Pin
A B C D E F G
Time
Figure 9. ZT Pin Trigger Mask Function
A: Switching is OFF→ON
B: Switching is ON→OFF
C: Because noise occurs at the ZT pin, the ZT comparator is not operated during tZTMASK (Typ = 0.60 µs).
D: Same as A.
E: Same as B.
F: Same as C.
G: Same as A.
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3.6 ZT Timeout Function
ZT Timeout Function 1
When the ZT pin voltage is not higher than VZT2 (Typ = 200 mV) during tZTOUT1 (Typ = 45 µs) because of the
decrease of output voltage or the shorted ZT pin such as at startup, this function turns on the switching by
force.
ZT Timeout Function 2
After the ZT comparator detects the bottom, the IC turns on MOSFET by force when the IC does not operate
next detection within tZTOUT2 (Typ = 5.0 µs). After the ZT comparator detected signal once, this function
operates. For that, it does not operate at startup or at low output voltage. When the IC is not able to detect
bottom by decreasing auxiliary winding voltage, the function operates.
ZT pin GND
short
ZT Pin VZT2
voltage VZT1
Bottom
Detection
5 µs 5 µs
5 µs
Timeout
45 µs 45 µs 45 µs
Timeout
SOURCE
Pin Voltage
DRAIN
Pin Voltage
A BC D E F G H I
Time
Figure 10. ZT Timeout Function
A: At startup, the IC starts to operate by ZT timeout function1 because of the ZT pin voltage is 0 V.
B: MOSFET turns ON.
C: MOSFET turns OFF.
D: The ZT pin voltage drops to lower than VZT2 (Typ = 200 mV) by the oscillation decreasing.
E: MOSFET turns ON after tZTOUT2 (Typ = 5.0 µs) from D point by ZT timeout function 2.
F: The ZT pin voltage drops to lower than VZT2 (Typ = 200 mV) by the oscillation decreasing.
G: MOSFET turns ON after tZTOUT2 (Typ = 5.0 µs) from F point by ZT timeout function 2.
H: The ZT pin is shorted to GND.
I: MOSFET turns ON after tZTOUT1 (Typ = 45.0 µs) by ZT timeout function 1.
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4 Soft Start Function

Normally, a large current flows to the AC/DC power supply when the AC power supply is turned ON. BM2SCQ12xT-LBZ
includes a soft start function to prevent large changes in the output voltage current during startup. This function is
performed when the VCC pin voltage drops to VUVLO2 (Typ = 14.0 V) or less.
Soft start function performs the following operation after startup. (Refer to turn OFF described above in section 3.1).
･ from startup to less than 1 ms → Set the SOURCE limiter value to 25 % of normal
･ from 1 ms to less than 4 ms → Set the SOURCE limiter value to 50 % of normal
･ 4 ms or more → Normal operation
5 Over Load Protection Function

The overload protection function monitors the overload status of the secondary output current at the FB pin and fixes the
OUT pin at low level when the overload status is detected. During overload status, current no longer flows to the
photo-coupler, so the FB pin voltage rises. When this status continues for the tFOLP (Typ = 128 ms), it judges the status
as an overload and the OUT pin is fixed at low level. If the FB pin voltage drops to lower than VFOLP2 (Typ = 2.6 V) within
tFOLP (Typ = 128 ms) after once it exceeds VFOLP1 (Typ = 2.8 V), the overload protection timer is reset.
At startup, the FB pin voltage is pulled up to the internal voltage by a pull-up resistor, so operation starts from VFOLP1
(Typ = 2.8 V) or above. Therefore, it is necessary for the design to set the FB pin voltage at VFOLP2 (Typ = 2.6 V) or below
within tFOLP (Typ = 128 ms). In other words, the startup time of the secondary output voltage must be set to within tFOLP
(Typ = 128 ms) after the IC starts.
To release latching at selecting latch mode is operated when the VCC pin voltage becomes lower than VLATCH (Typ =
VUVLO2 - 3.5 V) by unplugging power supply.
6 ZT OVP (Over Voltage Protection)

ZT OVP (Over Voltage Protection) function is built-in the ZT pin. When the ZT pin voltage reaches VZTL (Typ = 3.5 V), this
function operates detection. The ZT pin OVP function is performed in latch mode.
ZT OVP function has a built-in mask time defined as tLATCH (Typ = 150 µs). This operates detection when ZT OVP status
continues for tLATCH (Typ = 150 µs). This function masks such as surges those occur at the pin. Refer to Figure 11. (A
similar tLATCH (Typ = 150 µs) is built-in VCC OVP.)
ΔT1 < tLATCH (Typ = 150 µs) ΔT2 = tLATCH (Typ = 150 µs)
ΔT1 ΔT2
VZTL
ZT Pin PULSE PULSE
Voltage
ON
Switching OFF
A B C D E
Figure 11. ZT OVP and Latch Mask Function
A: Switching turns ON and the ZT pin starts pulse operation.

B: The ZT pin voltage > VZTL (Typ = 3.5 V).
C: The status of the ZT pin voltage > VZTL (Typ = 3.5 V) is within tLATCH (Typ = 150 µs), so the switching is reset to
the normal operations.
D: The ZT pin voltage > VZTL (Typ = 3.5 V).
E: The status of ZT pin voltage > VZTL (Typ = 3.5 V) continues for tLATCH (Typ = 150 µs), so latching occurs and the
switching turned OFF.
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7 Thermal Shutdown Function

Thermal Shutdown function is auto restart type. When VCC UVLO is released, the IC starts from state 2 because of
preventing from thermal destruction of external parts. At startup, it does not start until the temperature becomes T1 or
below. (Refer to Figure 12.)
Switching
State 2
OFF
State 1
ON
T1 = 135 °C T2 = 185 °C Temperature [°C]

(Typ) (Typ)
Figure 12. Thermal Shutdown Function
Operation Modes of Protection Circuit

Table 2 below lists the operation modes of the various protection functions.
Table 2. Operation Modes of Protection Circuit
Item Operation Mode
VCC Under Voltage Locked Out Auto recovery

BM2SCQ121T-LBZ/BM2SCQ122T-LBZ = Latch
VCC Over Voltage Protection
BM2SCQ123T-LBZ/BM2SCQ124T-LBZ = Auto recovery
BM2SCQ121T-LBZ/BM2SCQ123T-LBZ = Auto recovery

FB Over Limited Protection
BM2SCQ122T-LBZ/BM2SCQ124T-LBZ = Latch
ZT Over Voltage Protection Latch
Thermal Shutdown Auto recovery
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Absolute Maximum Ratings (Ta = 25 °C)

Parameter Symbol Rating Unit Conditions
Maximum Applied Voltage 1 VMAX1 -0.3 to +32 V The VCC pin
Maximum Applied Voltage 2 VMAX2 -0.3 to +6.5 V The SOURCE, FB, ZT pin
Maximum Applied Voltage 3 VMAX3 -0.3 to +1700 V The DRAIN pin
ZT Pin Maximum Current ISZT ±3.0 mA
Power Dissipation Pd 1.50 W (Note 1)
Maximum Junction Temperature Tjmax 150 °C

Storage Temperature Range Tstg -55 to +150 °C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) When mounted (on 70 mm x 70 mm x 1.6 mm thick, glass epoxy on single-layer substrate) De-rated by 12 mW/°C when operating above Ta = 25 °C
Thermal Loss
The thermal design should be set operation for the following conditions.
1. The ambient temperature Ta must be 105 °C or less.

2. The IC’s loss must be within the allowable dissipation Pd.
The thermal dissipation characteristics are as follows.

(PCB: 70 mm x 70 mm x 1.6 mm, mounted on glass epoxy substrate)
2.0
1.5
Pd[W]
1.0
0.5
0.0
0 25 50 75 100 125 150
Ta[℃]
Figure 13. Thermal Abatement Characteristics
Recommended Operating Conditions

Parameter Symbol Min Typ Max Unit Conditions
Operating Power Supply Voltage Range 1 VCC 15.0 24.0 27.5 V VCC pin voltage
Operating Power Supply Voltage Range 2 VDRAIN -0.3 - +1700 V DRAIN pin voltage
Operating Temperature Topr -40 25 +105 °C
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Electrical Characteristics
(Unless otherwise noted, VCC = 24 V, Ta = 25 °C)
[MOSFET]
Voltage between DRAIN and SOURCE Pin V(BR)DDS 1700 - - V ID = 1 mA/VGS = 0 V
DRAIN Leak Current IDSS - - 100 µA VDS = 1700 V/VGS = 0 V
On Resistance RDS(ON) - 1.12 - Ω ID = 0.25 A/VGS = 18 V
[Operating Current]
VCC = 18.0 V
Standby Operating Current IOFF 10 19 30 µA
(VCC UVLO = Disable)
FB Pin Voltage= 1.0 V

Normal Operating Current ION1 1000 2000 4000 µA
(At Pulse Operation)
FB Pin Voltage = 0.0 V

Burst Operating Current ION2 150 500 1000 µA
(At Burst Operation)
FB OLP, VCC OVP,

Protection Circuit Operating Current IPROTECT 800 1600 2200 µA
ZT OVP
[VCC Pin Protection Function]
VCC UVLO Voltage 1 VUVLO1 19.00 19.50 20.00 V VCC pin voltage rising
VCC UVLO Voltage 2 VUVLO2 13.00 14.00 15.00 V VCC pin voltage falling
VCC UVLO Hysteresis Voltage VUVLO3 - 5.50 - V VUVLO3 = VUVLO1 - VUVLO2
VCC OVP Voltage 1 VOVP1 27.50 29.50 31.50 V VCC pin voltage rising
VCC OVP Voltage 2 VOVP2 21.00 23.00 25.00 V VCC pin voltage falling
VCC OVP Hysteresis Voltage VOVP3 - 6.50 - V VOVP3 = VOVP1 - VOVP2
Latch Released Voltage VLATCH - VUVLO2-3.5 - V VCC pin Voltage
Latch Mask Time tLATCH 50 150 250 µs
[DC/DC Converter Block (Turn OFF)]
FB Pin Pull-up Resistance RFB 15 20 25 kΩ
SOURCE Pin FB pin voltage = 2.2 V
VLIM1A 0.950 1.000 1.050 V
Over Current Detection Voltage 1A (IZT ≥ -1.0 mA)

VLIM1B 0.620 0.700 0.780 V
Over Current Detection Voltage 1B (IZT < -1.0 mA)

VLIM2A 0.200 0.300 0.400 V
Over Current Detection Voltage 2A (IZT ≥ -1.0 mA)

VLIM2B 0.140 0.210 0.280 V
Over Current Detection Voltage 2B (IZT < -1.0 mA)
SOURCE Pin Switching

IZT 0.900 1.000 1.100 mA
ZT Pin Current
SOURCE Pin
tLEB - 250 - ns
Leading Edge Blanking Time
Minimum ON Width tMIN - 0.500 - µs
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Electrical Characteristics – continued

(Unless otherwise noted, VCC = 24 V, Ta = 25 °C)
[DC/DC Converter Block (Turn ON)]

Maximum Operating Frequency 1 fSW1 106 120 134 kHz FB pin voltage = 2.0 V
Maximum Operating Frequency 2 fSW2 20 30 40 kHz FB pin voltage = 0.5 V
FB Pin Frequency Reduction Start Voltage VFBSW1 1.100 1.250 1.400 V
FB Pin Frequency Reduction End Voltage 1 VFBSW2 0.400 0.500 0.600 V
FB Pin Frequency Reduction End Voltage 2 VFBSW3 - 0.550 - V
Voltage Gain AV 1.700 2.000 2.300 V/V ΔVFB/ΔVSOURCE
ZT Pin Comparator Voltage 1 VZT1 60 100 140 mV ZT pin voltage falling
ZT Pin Comparator Voltage 2 VZT2 120 200 280 mV ZT pin voltage rising
For noise prevention

ZT Pin Trigger Mask Time tZTMASK 0.25 0.60 0.95 µs after OUT pin voltage
H→L
Count from final ZT pin

ZT Pin Trigger Timeout Period 1 tZTOUT1 30.0 45.0 90.0 µs
trigger
Count from final ZT pin

ZT Pin Trigger Timeout Period 2 tZTOUT2 2.0 5.0 8.0 µs
trigger (2 stages)
Maximum ON Time tZTON 27.0 45.0 62.0 µs
[DC/DC Protection Functions]
Soft Start Time 1 tSS1 0.600 1.000 1.400 ms
Soft Start Time 2 tSS2 2.400 4.000 5.600 ms
FB OLP Voltage 1 VFOLP1 2.500 2.800 3.100 V FB pin voltage rising
FB OLP Voltage 2 VFOLP2 2.300 2.600 2.900 V FB pin voltage falling
FB OLP Timer tFOLP 90 128 166 ms
ZT OVP Voltage VZTL 3.250 3.500 3.750 V
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Typical Performance Curves

(Reference Data)
30.00 2500
Normal Operating Current: ION1 [uA]

Standby Operating Current: IOFF [uA]
2300
25.00
2100
20.00
1900
15.00
1700
10.00 1500
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature [℃] Temperature [℃]
Figure 14. Standby Operating Current vs Temperature Figure 15. Normal Operating Current vs Temperature
900 2000
Burst Operating Current: ION2 [uA]
Operating Current: IPROTECT [uA]
750 1800
Protection Circuit
600 1600
450 1400
300 1200
150 1000
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 16. Burst Operating Current vs Temperature Figure 17. Protection Circuit Operating Current vs Temperature
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Typical Performance Curves – continued

(Reference Data)
20.0 15.0
VCC UVLO Voltage 2: VUVLO2 [V]

VCC UVLO Voltage 1: VUVLO1 [V]
19.8
14.5
19.6
14.0
19.4
13.5
19.2
19.0 13.0
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 18. VCC UVLO Voltage 1 vs Temperature Figure 19. VCC UVLO Voltage 2 vs Temperature
6.5 31.5
VCC UVLO Hysteresis Voltage:
VCC OVP Voltage 1: VOVP1 [V]
6.0 30.5
VUVLO3 [V]
5.5 29.5
5.0 28.5
4.5 27.5
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 20. VCC UVLO Hysteresis Voltage vs Temperature Figure 21. VCC OVP Voltage 1 vs Temperature
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(Reference Data)
25.0 1.05
FB Pin Pull-up Resistance: RFB [kΩ]
Detection Voltage 1A: VLIM1A [V]

SOURCE Pin Over Current
23.0 1.03
21.0 1.01
19.0 0.99
17.0 0.97
15.0 0.95
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 22. FB Pin Pull-up Resistance vs Temperature Figure 23. SOURCE Pin Over Current Detection Voltage 1A
vs Temperature
0.80 0.40
Detection Voltage 2A: VLIM2A [V]
Detection Voltage 1B: VLIM1B [V]
0.75 0.35
0.70 0.30
0.65 0.25
0.60 0.20
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 24. SOURCE Pin Over Current Detection Voltage 1B Figure 25. SOURCE Pin Over Current Detection Voltage 2A
vs Temperature vs Temperature
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(Reference Data)
0.30 1.10
Detection Voltage 2B: VLIM2B [V]
SOURCE Pin Switching

ZT Pin Current: IZT [mA]
1.05
0.25
1.00
0.20
0.95
0.15 0.90
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 26 SOURCE Pin Over Current Detection Voltage 2B Figure 27. SOURCE Pin Switching ZT Pin Current
0.90 130.0
Maximum Operating Frequency 1:
0.80
Minimum ON Width: tMIN [μs]
0.70 125.0
0.60
fSW1 [kHz]
0.50 120.0
0.40
0.30 115.0
0.20
0.10 110.0
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 28. Minimum ON Width vs Temperature Figure 29. Maximum Operating Frequency 1 vs Temperature
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(Reference Data)
40.0 1.40
Maximum Operating Frequency 2:
FB Pin Frequency Reduction

1.35
Start Voltage: VFBSW1 [V]

35.0
1.30
fSW2 [kHz]
30.0 1.25
1.20
25.0
1.15
20.0 1.10
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 30. Maximum Operating Frequency 2 Figure 31. FB Pin Frequency Reduction Start Voltage
0.60 0.65

End Voltage 1: VFBSW2 [V]
End Voltage 2: VFBSW3 [V]
0.55 0.60
0.50 0.55
0.45 0.50
0.40 0.45
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 32. FB Pin Frequency Reduction End Voltage 1 Figure 33 FB Pin Frequency Reduction End Voltage 2
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(Reference Data)
2.30 140
ZT Pin Comparator Voltage 1:

2.20
Voltage Gain: AV [V/V]
120
2.10
VZT1 [mV]
2.00 100
1.90
80
1.80
1.70 60
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 34. Voltage Gain vs Temperature Figure 35. ZT Pin Comparator Voltage 1 vs Temperature
60.00 1.4
Maximum ON Time: tZTON [μs]
55.00
Soft Start Time 1: tSS1 [ms]
1.2
50.00
45.00 1.0
40.00
0.8
35.00
30.00 0.6
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 36. Maximum ON Time vs Temperature Figure 37. Soft Start Time 1 vs Temperature
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(Reference Data)
5.5 3.1
FB OLP Voltage 1: VFOLP1 [V]

Soft Start Time 2: tSS2 [ms]
5.0 3.0
4.5 2.9
4.0 2.8
3.5 2.7
3.0 2.6
2.5 2.5
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 38. Soft Start Time 2 vs Temperature Figure 39. FB OLP Voltage 1 vs Temperature
2.9 150.0
FB OLP Voltage 2: VFOLP2 [V]
2.8
FB OLP Timer: tFOLP [ms]
140.0
2.7
130.0
2.6
120.0
2.5
2.4 110.0
2.3 100.0
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Figure 40. FB OLP Voltage 2 vs Temperature Figure 41. FB OLP Timer vs Temperature
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(Reference Data)
3.8
3.7
ZT OVP Voltage: VZTL [V]
3.6
3.5
3.4
3.3
3.2
-40 -20 0 20 40 60 80 100 120
Temperature [℃]
Figure 42. ZT OVP Voltage vs Temperature
I/O Equivalence Circuit
1 DRAIN 2 SOURCE 3 FB 4 GND 5 ZT 6 VCC
VCC Internal Reg

DRAIN VCC
GND
ZT
Internal MOSFET
SOURCE
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Operational Notes
1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC

This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor Transistor (NPN)
Pin A Pin B B Pin B
C
Pin A E
P B C
P+ P+ P+ N P P+
N N N N Parasitic N N N
E
Elements
Parasitic
P Substrate P Substrate
Elements
GND GND GND GND
Parasitic Parasitic N Region
Elements Elements close-by
Figure 43. Example of IC Structure
11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. The IC should
be powered down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the
OFF state even if the Tj falls below the TSD threshold.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Ordering Information
B M 2 S C Q 1 2 x T - L B Z
(FB OLP) (VCC OVP) Package Product Rank

1: Auto Restart Latch T: TO220-6M LB: Industrial applications
2: Latch Latch
3: Auto Restart Auto Restart
4: Latch Auto Restart
Lineup
Product name FB OLP VCC OVP

BM2SCQ121T-LBZ Auto Restart Latch
BM2SCQ122T-LBZ Latch Latch
BM2SCQ123T-LBZ Auto Restart Auto Restart
BM2SCQ124T-LBZ Latch Auto Restart
Marking Diagram
TO220-6M (TOP VIEW)
Part Number Marking
LOT Number
Product name Part Number Marking

BM2SCQ121T-LBZ M2SCQ121
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Physical Dimension and Packing Information

Package Name TO220-6M
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Revision History
Date Revision Changes

09.Jan.2019 001 New Release
03.Apr.2019 002 Add the division of product name
P1 Features: Modify the internal MOSFET’s on resistance.
P1 Features: Modify the notation of VCC UVLO.
P3 Modify the Block Diagram.
03.Dec.2019 003
P12 Modify the points D and F of Figure 10.
11.Jan.2022 004 P14 Modify Operation Modes of Protection Circuit
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Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
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Notice-PAA-E Rev.004
Datasheet
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Notice – WE Rev.001

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Datasheet

Quasi-resonant AC/DC Converter

Typical Application Circuit

DRAIN SOURCE FB GND ZT VCC

DRAIN SOURCE FB GND ZT VCC

CURRENT SENSE (V-V Change) SOURCE

1 Startup Sequences (FB OLP: Auto Recovery Mode)

Internal REF 128 ms 128 ms 128 ms

Figure 1. Startup Sequence Timing Chart

A: The input voltage VH is applied.

1 Startup Sequences (FB OLP: Auto Recovery Mode) – continued

e.g. Start Resistance RSTART Setting

𝑅𝑆𝑇𝐴𝑅𝑇 < (𝑉𝑀𝐼𝑁 − 𝑉𝑈𝑉𝐿𝑂 (𝑀𝑎𝑥)) ÷ 𝐼𝑂𝐹𝐹 [Ω]

When the AC input voltage is AC 80 V, VMIN = 113 V.

𝑃𝑑(𝑅𝑆𝑇𝐴𝑅𝑇 ) = (𝑉𝐻 − 𝑉𝐶𝐶 )2 ÷ 𝑅𝑆𝑇𝐴𝑅𝑇 = (141𝑉 − 14V)2 ÷ 3.0𝑀𝛺 = 5.4 [mW]

Description of Blocks – continued

2 VCC Pin Protection Function

VCC UVLO OFF

VCC OVP OFF OFF

Switching OFF OFF OFF

A: VH is applied, the VCC voltage rises.

Description of Blocks – continued

3 DC/DC Converter Function

CURRENT SENSE (V-V Change) Leading Edge SOURCE

Figure 3. Block Diagram of DC/DC Operations

3 DC/DC Converter Function – continued

3.1 Determination of ON Width (Turn OFF)

mode 1: Burst operation

Table 1. Over Current Protection Voltage

3.2 L.E.B. (Leading Edge Blanking) Function

3 DC/DC Converter Function – continued

3.3 SOURCE Over Current Protection Switching Function

𝐼𝑍𝑇 = (𝑉𝑎 − 𝑉𝑍𝑇 ) ÷ 𝑅𝑍𝑇1 = 𝑉𝑎 ÷ 𝑅𝑍𝑇1 = 𝑉𝐻 × 𝑁𝑎 ÷ 𝑁𝑝 ÷ 𝑅𝑍𝑇1 [A]

IZT =(VH x Na)/(Np x RZT1)

CURRENT SENSE (V-V Change) Leading Edge SOURCE

Figure 5. Block Diagram of SOURCE Switching Current

3.3 SOURCE Over Current Protection Switching Function – continued

0.0 0.5 1.0 1.5 2.0 2.8 X

Figure 6. SOURCE Switching: SOURCE Limiter vs FB Pin Voltage

𝑉𝑎 = 𝑉𝐼𝑁 × 𝑁𝑎 ÷ 𝑁𝑝 = 214𝑉 × 15 ÷ 100 × (−1) = −32.1 [V]

According to the above, RZT = 32 kΩ is set.

3 DC/DC Converter Function – continued

3.4 Determination of OFF Width (Turn ON)

3.5 ZT Pin Trigger Mask Function

Switching ON OFF ON OFF ON

ZT Trigger tZMASK tZMASK

Figure 9. ZT Pin Trigger Mask Function

3 DC/DC Converter Function – continued

3.6 ZT Timeout Function

Figure 10. ZT Timeout Function

Description of Blocks – continued

4 Soft Start Function

5 Over Load Protection Function

6 ZT OVP (Over Voltage Protection)

A: Switching turns ON and the ZT pin starts pulse operation.

Description of Blocks – continued

7 Thermal Shutdown Function

T1 = 135 °C T2 = 185 °C Temperature [°C]