Kingston EMMC16G TB29 70H01 v1 1-3236240
Kingston EMMC16G TB29 70H01 v1 1-3236240
Kingston EMMC16G TB29 70H01 v1 1-3236240
(e•MMC™ 5.1)
EMMC16G-TB29-70H01
v1.1
Product Features
• Packaged managed NAND flash memory with e•MMC™ 5.1 interface
• Backward compatible with all prior e•MMC™ specification revisions
• 153-ball JEDEC FBGA RoHS Compliant package
• Operating voltage range:
o VCCQ = 1.8 V/3.3 V
o VCC = 3.3 V
• Operating Temperature (Tcase) - 25C to +85C
• Storage Temperature -40C to +85C
• Compliant with e•MMC™ 5.1 JEDEC Standard Number JESD84-B51
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• Background operation control & High Priority Interrupt (HPI)
• RPMB throughput improvement
• Secure write protection
• Pre EOL information
• Optimal size
Product Description
Kingston’s e•MMC™ products conform to the JEDEC e•MMC™ 5.1 standard. These devices are an ideal
universal storage solution for many commercial and industrial applications. In a single integrated
packaged device, e•MMC™ combines triple-level cell (TLC) NAND flash memory with an onboard
e•MMC™ controller, providing an industry standard interface to the host system. The integrated
e•MMC™ controller directly manages NAND flash media which relieves the host processor of these
tasks, including flash media error control, wear-leveling, NAND flash management and performance
optimization. Future revision to the JEDEC e•MMC™ standard will always maintain backward
compatibility. The industry standard interface to the host processor ensures compatibility across future
NAND flash generations as well, easing product sustainment throughout the product life cycle.
Configurations
Kingston’s e•MMC™ products support a variety of configurations that allow the e•MMC™ device to be
tailored to your specific application needs. The most popular configurations described below are each
offered under standard part numbers.
Standard TLC – By default the e•MMC™ device is configured with the NAND flash in a standard TLC
mode. This configuration provides reasonable performance and reliability for many applications.
Pseudo Single Level Cell (pSLC) – The TLC NAND flash in the Kingston e•MMC™ device can be
configured to further improve device endurance, data retention, reliability and performance over the
standard TLC configuration. This is done by converting the NAND TLC cells to a pseudo single level cell
(SLC) configuration. In this configuration, along with the performance and reliability gains, the device
capacity is reduced by 2/3 of the capacity. This one-time configuration is achieved by setting the
e•MMC™ enhanced attribute for the hardware partition.
Kingston e•MMC™ can be ordered preconfigured with the option of reliable write or pSLC at no
additional cost. Standard TLC devices can also be one-time configured in-field by following the
procedures outlined in the JEDEC e•MMC™ specification. The JEDEC e•MMC™ specification allows
for many additional configurations such as up to 4 additional general purpose (GPn) hardware partitions
each with the option to support pSLC and reliable write. Additionally, Kingston provides a content
loading service that can streamline your product assembly while reducing production costs. For more
information, contact your Kingston representative.
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Kingston e•MMC™ devices are fully compliant with the JEDEC Standard Specification No. JESD84-
B51. This datasheet provides technical specifications for Kingston’s family of e•MMC™ devices. Refer
to the JEDEC e•MMC™ standard for specific information related to e•MMC™ device function and
operation. See: http://www.jedec.org/sites/default/files/docs/JESD84-B51.pdf
TLC mode using PS8229 - Leading edge 3D NAND flash technology in TLC mode rated to 3,000
endurance cycles.
- Strong data protection with LDPC Error control
- Improved data integrity with end-to-end data protection.
pSLC mode using PS8229 - Leading edge 3D NAND flash technology in pSLC mode.
- Strong data protection with LDPC Error control
- Improved data integrity with end-to-end data protection.
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Part Numbering
Figure 1 – Part Number Format
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Device Performance
Table 2 below provides sequential read and write speeds for all capacities. Performance numbers can vary
under different operating conditions. Values are given at HS400 bus mode. Contact your Kingston
Representative for performance numbers using other bus modes.
Power Consumption
Device current consumption for various device configurations is defined in the power class fields of the
EXT_CSD register. Power consumption values are summarized in Table 3 below.
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Table 5 - e•MMC™ Operating Voltage
Parameter Symbol Min Nom Max Unit
Supply voltage (NAND) VCC 2.7 3.3 3.6 V
2.7 3.3 3.6 V
Supply voltage (I/O) VCCQ (1)
1.7 1.8 1.95 V
Supply power-up for 3.3V tPRUH 35 ms
Supply power-up for 1.8V tPRUL 25 ms
Note 1:VCCQ (I/O) 3.3 volt range is not supported while operating in HS200 & HS400 modes
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e•MMC™ Bus Modes
Kingston e•MMC™ devices support all bus modes defined in the JEDEC e•MMC™ 5.1 specification.
These modes are summarized in Table 6 below.
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Signal Description
Clock: Each cycle of this signal directs a one bit transfer on the command
CLK I and either a one bit (1x) or a two bits transfer (2x) on all the data lines. The
frequency may vary between zero and the maximum clock frequency.
Data: These are bidirectional data channels. The DAT signals operate in
push-pull mode. These bidirectional signals are driven by either the
e•MMC™ device or the host controller. By default, after power up or reset,
only DAT0 is used for data transfer. A wider data bus can be configured for
DAT[7:0] I/O/PP data transfer, using either DAT0-DAT3 or DAT0-DAT7, by the e•MMC™
host controller. The e•MMC™ device includes internal pull-ups for data
lines DAT1-DAT7. Immediately after entering the 4-bit mode, the device
disconnects the internal pull ups of lines DAT1, DAT2, and DAT3.
Correspondingly, immediately after entering to the 8-bit mode, the device
disconnects the internal pull-ups of lines DAT1–DAT7.
Hardware Reset: By default, hardware reset is disabled and must be enabled in the
RST_n I
EXT_CSD register if used. Otherwise, it can be left un-connected.
RFU - Reserved for future use: These pins are not internally connected. Leave floating
Not Connected: These pins are not internally connected. Signals can be routed
NC - through these balls to ease printed circuit board design. See Kingston’s Design
Guidelines for further details.
VSF - Vendor Specific Function: These pins are not internally connected
Internal Voltage Node: Note that this is not a power supply input. This pin provides
Vddi - access to the output of an internal voltage regulator to allow for the connection of an
external Creg capacitor. See Kingston’s Design Guidelines for further details.
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Vss S Supply ground for core
Note: I=Input; O=Ouput; PP=Push-Pull; OD=Open_Drain; NC=Not Connected(or logical high); S=Power Supply
Design Guidelines
Design guidelines are outlined in a separate document. Contact your Kingston Representative for more
information.
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Package Dimensions
11.5 x 13.0 x 0.8mm
Figure 2 – Package Dimensions
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Figure 3 – Ball Pattern Dimensions
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Ball Assignment (153 ball)
1 2 3 4 5 6 7 8 9 10 11 12 13 14
D NC NC NC NC NC NC NC D
F NC NC NC Vcc VSF NC NC NC F
H NC NC NC DS Vss NC NC NC H
J NC NC NC Vss Vcc NC NC NC J
L NC NC NC NC NC NC L
1 2 3 4 5 6 7 8 9 10 11 12 13 14
Note: VSF, RFU and NC balls are not electrically connected. RFU balls may be defined with functionality by the
Joint Electron Device Engineering Council (JEDEC) in future revisions of the e•MMC™ standard. Please refer to
Kingston’s design guidelines for more info.
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Device Marking
240xxxx-xxx.xxxx-x
YYWW PPPPPPPPPPPP
Part Number
xxxxxxxxxxxx
CoO
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Card Identification Register (CID)
The Card Identification (CID) register is a 128-bit register that contains device identification information
used during the e•MMC™ protocol device identification phase. Refer to JEDEC Standard Specification
No.JESD84-B51 for details.
A-1
Card Specific Data Register [CSD]
The Card-Specific Data (CSD) register provides information on how to access the contents stored in
e•MMC™. The CSD registers are used to define the error correction type, maximum data access time, data
transfer speed, data format…etc. For details, refer to section 7.3 of the JEDEC Standard Specification
No.JESD84-B51.
B-1
Field Bits Value
ECC [ 9:8 ] 0x00
CRC [ 7:1 ] Follow JEDEC Standard
reserved [ 0:0 ] 0x01
B-2
Extended Card Specific Data Register [EXT_CSD]
The Extended CSD register defines the Device properties and selected modes. It is 512 bytes long. The
most significant 320 bytes are the Properties segment, which defines the Device capabilities and cannot
be modified by the host. The lower 192 bytes are the Modes segment, which defines the configuration the
Device is working in. These modes can be changed by the host by means of the SWITCH command. For
details, refer to section 7.4 of the JEDEC Standard Specification No.JESD84-B51.
C-1
Field Byte Value
PWR_CL_DDR_200_360 [253:253] 0x00
CACHE_SIZE [252:249] 1024
GENERIC_CMD6_TIME [248:248] 0x32
POWER_OFF_LONG_TIME [247:247] 0xFF
BKOPS_STATUS [246:246] 0x00
CORRECTLY_PRG_SECTORS_NUM [245:242] 0
INI_TIMEOUT_AP [241:241] 0x64
CACHE_FLUSH_POLICY [240:240] 0x01
PWR_CL_DDR_52_360 [239:239] 0x00
PWR_CL_DDR_52_195 [238:238] 0x00
PWR_CL_200_195 [237:237] 0x00
PWR_CL_200_130 [236:236] 0x00
MIN_PERF_DDR_W_8_52 [235:235] 0x00
MIN_PERF_DDR_R_8_52 [234:234] 0x00
Reserved [233:233] 0x00
TRIM_MULT [232:232] 0x05
SEC_FEATURE_SUPPORT [231:231] 0x55
SEC_ERASE_MULT [230:230] 0xF7
SEC_TRIM_MULT [229:229] 0xF7
BOOT_INFO [228:228] 0x07
Reserved [227:227] 0x00
BOOT_SIZE_MULT [226:226] 0x20
ACC_SIZE [225:225] 0x08
HC_ERASE_GRP_SIZE [224:224] 0x01
ERASE_TIMEOUT_MULT [223:223] 0x11
REL_WR_SEC_C [222:222] 0x01
HC_WP_GRP_SIZE [221:221] 0x10
S_C_VCC [220:220] 0x08
S_C_VCCQ [219:219] 0x08
PRODUCTION_STATE_AWARENESS_TIMEOUT [218:218] 0x14
S_A_TIMEOUT [217:217] 0x15
SLEEP_NOTIFICATION_TIME [216:216] 0x0F
SEC_COUNT [215:212] 30621696
SECURE_WP_INFO [211:211] 0x01
MIN_PERF_W_8_52 [210:210] 0x08
MIN_PERF_R_8_52 [209:209] 0x08
MIN_PERF_W_8_26_4_52 [208:208] 0x08
MIN_PERF_R_8_26_4_52 [207:207] 0x08
MIN_PERF_W_4_26 [206:206] 0x08
MIN_PERF_R_4_26 [205:205] 0x08
Reserved [204:204] 0x00
C-2
Field Byte Value
PWR_CL_26_360 [203:203] 0x00
PWR_CL_52_360 [202:202] 0x00
PWR_CL_26_195 [201:201] 0x00
PWR_CL_52_195 [200:200] 0x00
PARTITION_SWITCH_TIME [199:199] 0xFF
OUT_OF_INTERRUPT_TIME [198:198] 0xFF
DRIVER_STRENGTH [197:197] 0x1F
DEVICE_TYPE [196:196] 0x57
Reserved [195:195] 0x00
CSD_STRUCTURE [194:194] 0x02
Reserved [193:193] 0x00
EXT_CSD_REV [192:192] 0x08
CMD_SET [191:191] 0x00
Reserved [190:190] 0x00
CMD_SET_REV [189:189] 0x00
Reserved [188:188] 0x00
POWER_CLASS [187:187] 0x00
Reserved [186:186] 0x00
HS_TIMING [185:185] 0x01
STROBE_SUPPORT [184:184] 0x01
BUS_WIDTH [183:183] 0x02
Reserved [182:182] 0x00
ERASED_MEM_CONT [181:181] 0x00
Reserved [180:180] 0x00
PARTITION_CONFIG [179:179] 0x00
BOOT_CONFIG_PROT [178:178] 0x00
BOOT_BUS_CONDITIONS [177:177] 0x00
Reserved [176:176] 0x00
ERASE_GROUP_DEF [175:175] 0x00
BOOT_WP_STATUS [174:174] 0x00
BOOT_WP [173:173] 0x00
Reserved [172:172] 0x00
USER_WP [171:171] 0x00
Reserved [170:170] 0x00
FW_CONFIG [169:169] 0x00
RPMB_SIZE_MULT [168:168] 0x20
WR_REL_SET [167:167] 0x00
WR_REL_PARAM [166:166] 0x15
SANITIZE_START [165:165] 0x00
BKOPS_START [164:164] 0x00
BKOPS_EN [163:163] 0x00
C-3
Field Byte Value
RST_n_FUNCTION [162:162] 0x00
HPI_MGMT [161:161] 0x00
PARTITIONING_SUPPORT [160:160] 0x07
MAX_ENH_SIZE_MULT [159:157] 623
PARTITIONS_ATTRIBUTE [156:156] 0x00
PARTITION_SETTING_COMPLETED [155:155] 0x00
GP_SIZE_MULT_4 [154:152] 0
GP_SIZE_MULT_3 [151:149] 0
GP_SIZE_MULT_2 [148:146] 0
GP_SIZE_MULT_1 [145:143] 0
ENH_SIZE_MULT [142:140] 0
ENH_START_ADDR [139:136] 0
Reserved [135:135] 0x00
SEC_BAD_BLK_MGMNT [134:134] 0x00
PRODUCTION_STATE_AWARENESS [133:133] 0x00
TCASE_SUPPORT [132:132] 0x00
PERIODIC_WAKEUP [131:131] 0x00
PROGRAM _CID_CSD_DDR_SUPPORT [130:130] 0x01
Reserved [129:128] 0
VENDOR_SPECIFIC_FIELD [127:67 ] N/A
ERROR_CODE [ 66:65 ] 0
ERROR_TYPE [ 64:64 ] 0x00
NATIVE_SECTOR_SIZE [ 63:63 ] 0x00
USE_NATIVE_SECTOR [ 62:62 ] 0x00
DATA_SECTOR_SIZE [ 61:61 ] 0x00
INI_TIMEOUT_EMU [ 60:60 ] 0x00
CLASS_6_CTRL [ 59:59 ] 0x00
DYNCAP_NEEDED [ 58:58 ] 0x00
EXCEPTION_EVENTS_CTRL [ 57:56 ] 0
EXCEPTION_EVENTS_STATUS [ 55:54 ] 0
EXT_PARTITIONS_ATTRIBUTE [ 53:52 ] 0
CONTEXT_CONF [ 51:37 ] 0
PACKED_COMMAND_STATUS [ 36:36 ] 0x00
PACKED_FAILURE_INDEX [ 35:35 ] 0x00
POWER_OFF_NOTIFICATION [ 34:34 ] 0x00
CACHE_CTRL [ 33:33 ] 0x00
FLUSH_CACHE [ 32:32 ] 0x00
BARRIER_CTRL [ 31:31 ] 0x00
MODE_CONFIG [ 30:30 ] 0x00
MODE_OPERATION_CODES [ 29:29 ] 0x00
Reserved [ 28:27 ] 0
C-4
Field Byte Value
FFU_STATUS [ 26:26 ] 0x00
PRE_LOADING_DATA_SIZE [ 25:22 ] 0
MAX_PRE_LOADING_DATA_SIZE [ 21:18 ] 10125312
PRODUCT_STATE_AWARENESS_ENABLEMENT [ 17:17 ] 0x01
SECURE_REMOVAL_TYPE [ 16:16 ] 0x39
CMDQ_MODE_EN [ 15:15 ] 0x00
Reserved [ 14:0 ] 0
C-5
History
Revision History Date
v1.0 Initial Release 06 / 2022
v1.1 Added Kingston Contact Information 06 / 2023
D -1
Contact Kingston
Authorized Distributor
Kingston:
EMMC16G-TB29-70H01