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®

RT7736

SmartJitterTM PWM Flyback Controller


General Description Features
The RT7736 series is a high performance enhanced PWM  Proprietary SmartJitterTM Technology
flyback controller with proprietary SmartJitterTM technology.  Reducing EMI Emissions of SMPS
The innovative SmartJitterTM technology not only reduces  Output Jittering Ripple Elimination

EMI emissions of SMPS when the system enters burst  No Load Input Power Under 100mW (RT7736G/R/L/E)
switching green mode, but also eliminates output jittering  Accurate Over Load Protection
ripple.  UVLO 9V/14.5V
 PRO Pin for External Arbitrary OVP/OTP
The RT7736 is a current mode PWM controller including
 IC ON/OFF Control (RT7736G/R/L)
built-in slope compensation, internal Leading Edge
 BNO Pin for Brown-In/Out (RT7736B/D/F)
Blanking (LEB) and cycle-by-cycle current limit. It provides
 Soft Driving for EMI Noise Reduction
excellent green power performance, especially under light
 −300mA
Driver Capability : 300mA/−
load and no load conditions. It allows for simpler design
 High Noise Immunity
and reduces external component count.
 RoHS Compliant and Halogen Free
This controller integrates comprehensive safety protection
functions for robust designs including input Under-Voltage Applications
Lockout (UVLO), Over-Voltage Protection (OVP), Over-
 Switching AC/DC Adaptor
Load Protection (OLP), Secondary Rectifier Short
 DVD Open Frame Power Supply
Protection (SRSP), CS pin open protection and cycle-by-
 Set-Top Box (STB)
cycle current limit.
 ATX Standby Power
The RT7736 is a cost-effective and compact solution for  TV/Monitor Standby Power
NB adaptor applications. It is available in the SOT-23-6  PC Peripherals
package.  NB Adaptor

Simplified Application Circuit

Vo+
+
+

AC Mains
(90V to 265V)

Vo-

VDD
PRO GATE
COMP
RT7736
CS
GND

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1
RT7736
Ordering Information
RT7736
Package Type Note :
E : SOT-23-6 Richtek products are :
Lead Plating System  RoHS compliant and compatible with the current require-
G : Green (Halogen Free and Pb Free) ments of IPC/JEDEC J-STD-020.
RT7736 Version (Refer to Version Table)  Suitable for use in SnPb or Pb-free soldering processes.

Marking Information
RT7736GGE RT7736RGE
IFF= : Product Code 2B= : Product Code
IFF=DNN DNN : Date Code 2B=DNN DNN : Date Code

RT7736LGE RT7736EGE
09= : Product Code 0F= : Product Code
09=DNN DNN : Date Code 0F=DNN DNN : Date Code

RT7736BGE RT7736DGE
00= : Product Code 0N= : Product Code
00=DNN DNN : Date Code 0N=DNN DNN : Date Code

RT7736FGE
0P= : Product Code
0P=DNN DNN : Date Code

RT7736 Version Table


Version RT7736G RT7736R RT7736L RT7736E RT7736B RT7736D RT7736F
Frequency 65kHz 65kHz 65kHz 65kHz 65kHz 65kHz 65kHz
OLP Delay
56ms 56ms 56ms 56ms 56ms 88ms 64ms
Time
Auto Auto Auto Auto Auto
Internal OVP Latch Latch
Recovery Recovery Recovery Recovery Recovery
Auto Auto Auto Auto Auto Auto Auto
OLP & SRSP
Recovery Recovery Recovery Recovery Recovery Recovery Recovery
Auto
PRO Pin High Latch Latch Latch X X X
Recovery
Auto Auto Auto
PRO Pin Low Latch X X X
Recovery Recovery Recovery
External OTP Auto Auto
Latch Latch X X X
by PRO Recovery Recovery
External
X X X X ○ ○ ○
Brown-In/Out

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RT7736
Pin Configurations
(TOP VIEW)
GATE VDD CS GATE VDD CS

6 5 4 6 5 4

2 3 2 3

GND COMP PRO GND COMP BNO

RT7736G/R/L/E RT7736B/D/F
SOT-23-6 SOT-23-6

Functional Pin Description


Pin No. Pin Name Pin Function
1 GND Ground of the Controller.
Feedback Voltage Input. Connect an opto-coupler to close the control loop and
2 COMP
achieve output voltage regulation.
PRO Protection Input for OVP, OTP or ON/OFF Control. (RT7736G/R/L/E)
3
BNO Brown-In/Out Detection Input for RT7736B/D/F Only.
Current Sense Input. The current sense resistor between this pin and GND is used for
4 CS
current limit setting.
Supply Voltage Input. The controller will be enabled when VDD exceeds VTH_ON
5 VDD
(14.5V typ.) and disabled when VDD decreases lower than VTH_OFF (9V typ.)
6 GATE Gate Driver Output for External Power MOSFET.

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RT7736
Function Block Diagram
VDD

+
VTH_H -
IBias OVP
VTH_OTP + +
PRO - - 27V
VTH_L +
-
Secondary Rectifier OTP POR
Shutdown
Short Protection
2V - Logic UVLO +
+ - 9V/14.5V
Counter
COMP Open Bias &
Sensing Bandgap

OLP TOLP : 56ms Oscillator

Constant Dmax
Power
5.2V
Soft Driver
S
- Q GATE
COMP - R
+
PWM
Comparator
CS Slope
Ramp COMP
Burst Switching Green VBURL
Mode VBURH
LEB X3 VDD
GND

Figure 1. Block Diagram for RT7736G, RT7736R, RT7736L and RT7736E

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RT7736
VDD

OVP
+
VBIN_TH/VBNO_TH + - 27V
BNO -
Secondary Rectifier
OTP POR
Short Protection Shutdown
2V - Logic
+ UVLO +
- 9V/14.5V
Counter
COMP Open
Sensing Bias &
Bandgap
OLP TOLP : 56ms (RT7736B) Oscillator
TOLP : 88ms (RT7736D)
TOLP : 64ms (RT7736F)
Dmax
Constant
5.2V Power
Soft Driver
S
- Q GATE
COMP - R
+
PWM
Comparator
CS Slope
Ramp COMP
Burst Switching Green VBURL
Mode VBURH
LEB X3 VDD
GND

Figure 2. Block Diagram for RT7736B, RT7736D and RT7736F

Operation
Burst Switching Green Mode then force switching at a very low level to supply energy
The burst mode is designed to reduce switching loss. to VDD pin. VDD holdup mode is also improved to hold up
When the output load reduces, and the VCOMP drops and VDD by less switching cycles. This mode is very useful
reaches VBURL, the controller will cease switching. After for reducing start-up resistor loss and keeping start-up
output voltage decreases and the VCOMP goes up to VBURH, time within specification. This function makes bias winding
the switching will be resumed. design and transient design easier.

VDD Holdup Mode Oscillator

Under very light load conditions, the VDD may drop down The oscillator runs at 65kHz and features frequency
to turn-off threshold voltage. To avoid this situation when jittering function. Its jittering depth is Δf with about TJIT
VDD drops to a set threshold, VDD_ET, the hysteresis envelope frequency at fOSC. It also generates slope
comparator will bypass PWM and burst mode loop, and compensation saw-tooth, maximum duty cycle pulse and
overload protection slope.

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5
RT7736
Leading Edge Blanking (LEB) Feedback Open and Opto-Coupler Short
To prevent unexpectedly gate switching interruption from If the output voltage feedback loop is open or the opto-
the initial spike on CS pin, the LEB delay is designed to coupler is shorted, the OVP/OLP function will be triggered
block this spike at the beginning of gate switching. depending on which one occurs first.

Gate Driver Secondary Rectifier Short Protection


A totem pole gate driver is designed to meet both EMI The current spike during secondary rectifier short test is
and efficiency requirements in low power applications. An extremely high because of the saturated main transformer.
internal pull-low circuit is activated after pretty low VDD to Meanwhile, the transformer acts like a leakage inductance.
prevent external MOSFET from accidentally turning on During high line, the current in power MOSFET is
during UVLO. sometimes too high for OLP delay time. To offer better
and easier protection design, the RT7736 will shut down
PRO Pin (RT7736G/R/L/E) after a few of cycles before fuse is impacted.
The RT7736G/R/L/E features a PRO pin, and it can be
applied for external arbitrary OVP or OTP applications Output Short Protection
(RT7736G/R/L/E), and also can be applied for IC ON/OFF The RT7736 implements output short protection by
control (RT7736G/R/L). detecting GATE width with delay time. It could minimize
the power loss and temperature during output short,
BNO Pin (RT7736B/D/F) especially at high line input voltage.
The RT7736B/D/F features a BNO pin, and it can be applied
for external arbitrary brown-in/out. The BNO pin is
connected to the AC line input or bulk capacitor with a
resistive divider to achieve brown-in/out protection.

Cycle-by-Cycle Current Limit


This is a basic but very useful function and it can be
implemented easily in current mode controller.

Over-Load Protection
In over load conditions, long time current limit will lead to
system thermal stress problem. To further protect the
system, the RT7736 is designed with a proprietary
prolonged turn-off period during hiccup. The power loss
and temperature during OLP will be averaged to an
acceptable level over the ON/OFF cycle.

CS Pin Open Protection


When the CS pin is opened, the controller will shut down
after a few cycles.

Over-Voltage Protection
Output voltage can be roughly sensed by the VDD pin. If
the sensed voltage reaches VOVP threshold, the controller
will shut down after deglitch delay. The controller will
resume once the fault is removed.

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6
RT7736
Absolute Maximum Ratings (Note 1)
 Supply Input Voltage, VDD to GND ------------------------------------------------------------------------------------- −0.3V to 30V
 GATE to GND --------------------------------------------------------------------------------------------------------------- −0.3V to 16.5V
 PRO, BNO, COMP, CS to GND ---------------------------------------------------------------------------------------- −0.3V to 6.5V
 Power Dissipation, PD @ TA = 25°C

SOT-23-6 --------------------------------------------------------------------------------------------------------------------- 0.38W


 Package Thermal Resistance (Note 2)

SOT-23-6, θJA ---------------------------------------------------------------------------------------------------------------- 260.7°C/W


 Junction Temperature ------------------------------------------------------------------------------------------------------ 150°C
 Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------------- 260°C
 Storage Temperature Range --------------------------------------------------------------------------------------------- −65°C to 150°C
 ESD Susceptibility (Note 3)

HBM (Human Body Model) ----------------------------------------------------------------------------------------------- 3kV


MM (Machine Model) ------------------------------------------------------------------------------------------------------ 250V

Recommended Operating Conditions (Note 4)


 Supply Input Voltage, VDD ----------------------------------------------------------------------------------------------- 12V to 25V
 Junction Temperature Range --------------------------------------------------------------------------------------------- −40°C to 125°C
 Ambient Temperature Range --------------------------------------------------------------------------------------------- −40°C to 85°C

Electrical Characteristics
(VDD = 15V, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
VDD Section
V DD Over-Voltage Protection Level VOVP 26 27 28 V
V DD Zener Clamp VZ 29 -- -- V
On Threshold Voltage VTH_ON 13.5 14.5 15.5 V
Off Threshold Voltage VTH_OFF 8.5 9 9.5 V
Disable Brown-in Detection to
VDD_BNI 11 12 13 V
Avoid Start-up Failed
VDD Holdup Mode Entry Point VDD_ET VCOMP < 1.3V 9.5 10 10.5 V
VDD Holdup Mode Ending Point VDD_ED VCOMP < 1.3V 10 10.5 11 V
Latch-off Clamping Voltage VDD_LH -- 5.5 -- V
Threshold Voltage for Latch-off
VLH_OFF -- 5 -- V
Release
VDD < V TH_ON  0.1V,
Start-up Current IDD_ST -- 5 10 A
TA = 40°C to 80°C
Latch-off Operating Current IDD_LH TA = 40°C to 80°C 2 -- 10 A
VDD = 15V, GATE pin open,
Operating Supply Current IDD_OP1 -- 1 -- mA
VCOMP = 2.5V
VDD = 15V, GATE pin open,
Operating Supply Current IDD_OP2 -- 0.9 -- mA
VCOMP = 1.7V
IDD Sinking Current of Waiting For RT7736B/D/F ; V DD = 15V,
IDD_BNI 100 150 200 A
Brown-in After Start-up GATE and COMP pin open

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7
RT7736
Parameter Symbol Test Conditions Min Typ Max Unit
During entering auto recovery
IDD Sinking Current IDD_ARP 300 400 500 A
protection
Oscillator Section
Normal PWM Frequency fOSC VCOMP > VBS_ET 60 65 70 kHz
Maximum Duty Cycle DCYMAX 70 75 80 %
Minimum Burst Switching Green
f BS_MIN 18.5 22 25.5 kHz
Mode Frequency
PWM Frequency Jittering Range f -- ±6 -- %
PWM Frequency Jittering Period TJIT -- 16 -- ms
Frequency Variation Versus VDD
f DV VDD = 9V to 23V -- -- 2 %
Deviation
Frequency Variation Versus
f DT TA = 30°C to105°C -- -- 5 %
Temperature Deviation
COMP Input Section
Open Loop Voltage VCOMP_OP COMP pin open 5 5.2 5.4 V
Short Circuit Current of COMP IZERO VCOMP = 0V 0.24 0.29 0.34 mA
RT7736G/R/L/E/B -- 56 --
Delay Time of COMP Open-loop
TOLP fOSC = 65kHz RT7736D -- 88 -- ms
Protection
RT7736F -- 64 --
Burst Switching Green Mode Entry
VBS_ET 2.3 2.35 2.4 V
Voltage
Burst Switching Green Mode
VBS_ED 2.1 2.15 2.2 V
Ending Voltage
Delay Time of Output Short fOSC = 65kHz,
TD_OSP -- 8 -- ms
Protection RT7736G/R/L/E/B
Current Sense Section
Maximum Current Limit VCS_MAX (Note 5) 1.05 1.1 1.15 V
Leading Edge Blanking Time TLEB (Note 5) 150 250 350 ns
Internal Propagation Delay Time TPD (Note 5) -- 100 -- ns
Minimum On-Time TON_MIN 250 350 450 ns
Detection On-Time of Output Short fOSC = 65kHz,
TON_OSP 0.7 1.1 1.5 s
Protection RT7736G/R/L/E/B (Note 6)
GATE Section
Rising Time TR VDD = 15V, CL = 1nF -- 60 -- ns
Falling Time TF VDD = 15V, CL = 1nF -- 40 -- ns
Gate Output Clamping Voltage VCLAMP VDD = 23V -- 13.5 -- V
PRO Interface Section (RT7736G/R/L/E)
Pull High Threshold VTH_H 1.75 1.8 1.85 V
Pull Low OTP Threshold VTH_OTP 0.47 0.5 0.53 V
Pull Low Threshold VTH_L 0.25 0.3 0.35 V

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8
RT7736
Parameter Symbol Test Conditions Min Typ Max Unit
Open Loop Voltage VPRO_OP PRO pin open -- 1.3 -- V
Internal Bias Current IBIAS 90 100 110 A
Pull High Sinking Current ISIN -- -- 500 A
Delay Time of OTP by PRO T D_OTP f OSC = 65kHz -- 56 -- ms
BNO Interface Section (RT7736B/D/F)
Brown-In Threshold VBNI_TH 0.96 1 1.04 V
Brown-Out Threshold VBNO_TH 0.81 0.85 0.89 V
RT7736B -- 56 --
De-bounce Time of VBNO_TH T D_BNO f OSC = 65kHz RT7736D -- 88 -- ms
RT7736F -- 24 --
Over-Temperature Protection (OTP) Section
Over-Temperature Protection T OTP On Chip OTP (Note 6) -- 140 -- C

Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured in natural convection (still air) at TA = 25°C with the component mounted on a low effective thermal
conductivity test board of JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Leading edge blanking time and internal propagation delay time are guaranteed by design.
Note 6. Guaranteed by design.

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RT7736
Typical Application Circuit

Vo+

+
AC Mains
(90V to 265V)

Vo-

(Optional)
5
3 VDD
PRO GATE 6
2
COMP
RT7736G/R/L/E
CS 4
GND
1

Figure 3. Application Circuit For RT7736G, RT7736R, RT7736L and RT7736E

Vo+

+
+

AC Mains
(90V to 265V)

Vo-

(Optional)
5
3 BNO VDD
GATE 6
2
COMP
RT7736B/D/F
CS 4
GND
1

Figure 4. Application Circuit for RT7736B, RT7736D and RT7736F

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RT7736
Typical Operating Characteristics
IDD_ST vs. VDD IDD_ST vs. Temperature
6 10

5
8
4
I DD_ST (µA)

I DD_ST (µA)
3 6

2
4
1

0 2
0 3 6 9 12 15 -50 -25 0 25 50 75 100 125
VDD (V) Temperature (°C)

VTH_ON vs. Temperature VTH_OFF vs. Temperature


16.0 10.0

15.5
9.5
15.0
VTH_OFF (V)
VTH_ON (V)

14.5 9.0

14.0
8.5
13.5

13.0 8.0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

VDD_LH & VLH_OFF vs. Temperature VOVP vs. Temperature


5.8 28.00

27.75
5.6
VDD_LH & VLH_OFF (V)

27.50

27.25
5.4
VOVP (V)

VDD_LH
27.00

5.2 26.75

26.50
5.0 VLH_OFF
26.25

4.8 26.00
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

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11
RT7736

fOSC vs. VDD fOSC vs. Temperature


67.0 68

66.5
66
66.0

65.5
f OSC (kHz)

f OSC (kHz)
64
65.0

64.5 62

64.0
60
63.5

63.0 58
10 13 16 19 22 25 -50 -25 0 25 50 75 100 125
VDD (V) Temperature (°C)

fBS_MIN vs. Temperature IDD_LH vs. Temperature


26 8

7
24
6
f BS_MIN (kHz)

I DD_LH (µA)

22 5

4
20
3

18 2
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

IDD_BNI vs. Temperature IDD_ARP vs. Temperature


200 425

180 400
I DD_BNI (µA)

I DD_ARP (µA)

160 375

140 350

120 325
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

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RT7736

IDD_OP1 vs. Temperature IDD_OP2 vs. Temperature


850 850

800 800

I DD_OP2 (µA)
I DD_OP1 (µA)

750 750

700 700

650 650
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

VCOMP_OP vs. Temperature IZERO vs. Temperature


5.4 310

5.3 300
VCOMP_OP (V)

I ZERO (µA)

5.2 290

5.1 280

5 270
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

TOLP vs. Temperature TOLP vs. Temperature


62 94
RT7736G/R/L/E/B RT7736D

92
60
TOLP (ms)
TOLP (ms)

90
58
88

56
86

54 84
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

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RT7736

TOLP vs. Temperature TD_BNO vs. Temperature


70 30
RT7736F RT7736F

68 28

TD_BNO (ms)
TOLP (ms)

66 26

64 24

62 22

60 20
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

VCLAMP vs. Temperature tR vs. Temperature


15.5 80

70
14.5
VCLAMP (V)

60
tR (ns)

13.5
50

12.5
40

11.5 30
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

tF vs. Temperature IBIAS vs. Temperature


60 106

50
102

40
I BIAS (µA)
tF (ns)

98
30

94
20

10 90
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

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RT7736

VTH_H vs. Temperature VTH_OTP vs. Temperature


1.90 0.60

1.85 0.55

VTH_OTP (V)
VTH_H (V)

1.80 0.50

1.75 0.45

1.70 0.40
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

VTH_L vs. Temperature VBNI_TH vs. Temperature


0.40 1.10

0.35 1.05
VBNI_TH (V)
VTH_L (V)

0.30 1.00

0.25 0.95

0.20 0.90
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

VBNO_TH vs. Temperature


0.95

0.90
VBNO_TH (V)

0.85

0.80

0.75
-50 -25 0 25 50 75 100 125
Temperature (°C)

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RT7736
Application Information
When the system enters green mode, a output power
SmartJitterTM Technology relationship is formed between the feedback voltage VCOMP
The RT7736 series applies RICHTEK proprietary and the PWM switching frequency, and a new stable
SmartJitterTM technology. equilibrium point is eventually reached after back-and-forth
In order to reduce switching loss for lower power adjustments. It limits the frequency jittering range is
consumption during light load or no load, general PWM limited and the improving EMI function is poor, as shown
controllers have green mode function according to the in Figure 5.
feedback voltage VCOMP. The innovative SmartJitterTM technology not only helps
The output power equation is : reduce EMI emissions of SMPS when the system entering
2 green mode, but also eliminates output jittering ripple.
x V
Po_DCM (VCOMP ) = 1  Lp   1 COMP   fs (VCOMP ) 
2  RCS 
Where LP is the magnetizing inductance of the transformer, Accurate Over-Load Protection and Tight Current
RCS is the current sense resistor, VCOMP is the feedback Limit Tolerance
voltage of the COMP pin. fS is the switching frequency of Generally, the saw current limit is applied to low cost
the power switch, η is the conversion efficiency, and x1 is flyback controllers because of simple design. The RT7736
a constant coefficient. series applies with RICHTEK proprietary technology
Output power is a function of feedback voltage VCOMP. through well foundry control, design and test/trim mode
Frequency jittering technique is typically used to improve in final test. Therefore, the current limit tolerance is tight
EMI problems in general PWM controllers, and the enough to make design and mass production easier, and
frequency jittering period is based on PWM switching it provides accurate over-load protection.
frequency.

General PWM
Jittering Freq. Jittering Freq. RT7736
Controller

Normal Normal
Operating Operating

fs mean = 64.85kHz fs mean = 64.61kHz


Jittering Range =  6.3% Jittering Range =  6.0%

General PWM Jittering Freq. RT7736


Jittering Freq.
Controller

Green Mode Green Mode

fs mean = 42.99kHz fs mean = 42.58kHz


Jittering Range =  3.3% Jittering Range =  7.7%

Figure 5. Frequency Jittering Range During Green Mode : General PWM Controller vs. RT7736
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16
RT7736
Start-Up Circuit VDD Discharge Time in Auto Recovery Mode
To minimize power loss, it's recommended to connect Figure 7 shows the VDD and VGATE waveforms during an
the start-up circuit to the bleeding resistors. It's power auto recovery protection (e.g., OLP). In this mode, the
saving and also could reset latch mode protection quickly. start-up resistors, VDD sinking current and VDD decoupling
Figure 6 shows IDD_Avg vs. RBleeding curve. Users can apply capacitor will affect the restart time. The discharge time
this curve to design the adequate bleeding resistors. tD_Discharge of VDD voltage can be calculated by using the
In order to prolong turn-off period and minimize the power following equation :
loss and thermal rising during hiccup, the controller is CVDD  (VDD_DIS  VTH_OFF )
tD_Discharge 
designed to have smaller sinking current during entering IDD_ARP  IST
auto-recovery protection, IDD_ARP. Therefore, the start-up Where the CVDD is the VDD decoupling capacitor, the
current at maximum AC line input voltage must be smaller VDD_DIS is the initial VDD voltage after entering the auto
than IDD_ARP (IDD_ARP(min) = 300μA). Otherwise, when the recovery mode, the VTH_OFF (9V typ.) is the falling UVLO
controller enters auto-recovery protection, the VDD voltage threshold of the controller, the IDD_ARP (300μA typ.)
capacitor won't be dropped down to VTH_OFF by IC's sinking is the sinking current of the VDD pin in the auto recovery
current and then restart. The controller behaves like latch mode, and IST is the start-up current of the power system.
protection or triggers the SCR of VDD. Please note that the start-up current at high input voltage
The RT7736 implemented brown-in detected function must be smaller than the IDD_ARP. Otherwise, the VDD
(RT7736B/D/F) as described in “BNO Pin Application” voltage can't reach the VTH_OFF to activate the next start-
section. In order to avoid start-up failure, the controller is up process after an auto recovery protection. Therefore,
designed to have smaller sinking current after start-up the system behavior resembles the behavior of latch mode.
and then wait for brown-in, IDD_BNI. Therefore, the start-up VDD

current at brown-in voltage of AC line input must be smaller VDD_DIS


VTH_ON
than IDD_BNI (IDD_BN (min) = 100μA). Otherwise, the VDD VTH_OFF
voltage will rise up continuously and then trigger the SCR t
VGATE OLP Delay
of VDD. Time tD_Discharge

t
Figure 7. Auto Recovery Mode (e.g., OLP)

IDD_Avg vs. RBleeding Curve IDD_Avg vs. RBleeding Curve


90 250

RBleeding RBleeding
80 IDD_Avg 225 IDD_Avg

RBleeding RBleeding
70 200
I DD_Avg (μA)

I DD_Avg (μA)

60 175
VDD VDD

50 150

40 90Vac 125 265Vac


85Vac 230Vac
30 80Vac 100

20 75

10 50
0.6 1.0 1.4 1.8 2.2 2.6 3.0 0.6 1.0 1.4 1.8 2.2 2.6 3.0
RBleeding (MΩ ) RBleeding (MΩ)

Figure 6. IDD_Avg vs. RBleeding Curve


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17
RT7736
VDD Holdup Mode The Brown-in/out detected from bulk capacitor is shown
The VDD holdup mode is only designed to prevent VDD in Figure 9, and the resistive divider (RC and RD) can be
from decreasing to the turn-off threshold voltage under calculated by the following equations :
VBulk_Brown-in  VBNI_TH   1  C 
light load or load transient. Relative to burst mode, the R
VDD holdup mode brings higher switching. Hence, it is  RD 
VBulk_Brown-out  VBNO_TH   1  C 
highly recommended that the system should avoid R
 RD 
operating at this mode during light load or no load
The BNO pin application from bulk capacitor can use higher
conditions, normally.
resistance on the divider for power saving, but this method
BNO Pin Application (RT7736B/D/F) can't have brown-in/out function at light load because bulk
capacitor still has energy stored when AC line input is
The RT7736 features a BNO pin (RT7736B/D/F), and it
turned off. The recommended bypass capacitor CBNO is
can be applied for external arbitrary brown-in/out. The BNO
smaller than 1nF.
pin is connected to the AC line input or bulk capacitor by
resistive divider to achieve brown-in/out function. To avoid start-up failure, the RT7736 implements brown-
Comparing the BNO pin connected to the AC line input in detected function, as shown in Figure 10. When VDD is
with bulk capacitor, the advantage of the BNO pin greater than VTH_ON, the controller starts to operate and
connected to the AC line input is having brown-in/out waits for brown-in signal. If brown-in signal is not enabled
function regardless of output loads. before VDD falls below VDD_BNI, the controller will be shut
down and then re-start. If the brown-in signal VBNO is higher
Figure 8 shows the application circuit of the BNO pin
than VBNI_TH, the controller will be enabled.
connected to AC line input with resistive divider. The
resistive divider (RA and RB) can be calculated by the
following equations : AC Mains
(90V to 265V)
VBrown-in_AC_rms  2  VBNI_TH   1  A 
R CBulk RC
 RB 
VBrown-out_AC_rms  2  VBNO_TH   1  A 
R
BNO
 RB 
RT7736 CBNO RD
The sum of resistor values (RA and RB) should be smaller GND
than 1.5MΩ because parasitic capacitors of bridge of diode
may make hysteresis of brown-in/out function invalid. Figure 9. Brown-in/out Detected from Bulk Capacitor

AC Mains
(90V to 265V)

RA

BNO
RB CBNO RT7736
GND

Figure 8. Brown-in/out Detected from AC Line Input

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18
RT7736
VDD
VTH_ON
Brown-in
VDD_BNI Detection

VTH_OFF
VBNO < VBNI_TH

VBNO < VBNI_TH VBNO > VBNI_TH Entering Auto Recovery Protection (Ex : OLP)

IDD
1.6mA (typ.)
Operating
Current
IDD_ARP
IDD_BNI
IDD_ST
Brown-in
(VBNO > VBNI_TH)
VAC

GATE

Figure 10. RT7736 Brown-in Detected Function

Auto
PRO Pin Application (RT7736G/R/L/E) Recovery
+
Deglitch
The RT7736 provides a PRO pin for external arbitrary OVP/ VTH_H -
Latch
OTP or IC ON/OFF applications as shown in Figure 12 to
Auto
Figure 15. VTH_OTP + 56ms Recovery
PRO Delay Time
In Figure 11, when the voltage of the PRO pin is between -
Latch
VTH_OTP and VTH_H, the controller is enabled for normal
Auto
operation. If the voltage of the PRO pin is lower than VTH_L + Recovery
Deglitch
VTH_OTP and higher than VTH_L after delay time TD_OTP, the -
Latch
controller will be shut down and cease switching. If the
voltage of the PRO pin is higher than VTH_H or lower than
VTH_L, the controller will be shut down and cease switching VPRO

after deglitch delay. Auto Recovery/Latch

When the voltage of the PRO pin is pulled above VTH_H, VTH_H

the supply current of the PRO pin must be higher than


Normal Operating
500μA and be limited below 5mA. When IC enters latch
mode, VDD will be clamped at latched voltage VDD_LH, and VTH_OTP
it will be released until VDD falls to latched reset voltage Auto Recovery/Latch
VLH_OFF. VTH_L
Auto Recovery/Latch
When the PRO pin is open, it is set at 1.3V internally.
Leave the PRO pin open if it is not used. If designer needs
to apply a bypass capacitor on the PRO pin, the Figure 11. PRO Pin Diagram
capacitance should be less than 1nF. The internal bias
current of the PRO pin is 100μA (typ.).

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19
RT7736
PRO Because it is hard to distinguish the difference between
output short and big capacitance load, circuit design must
be careful to make sure GATE width is larger than TON_OSP
(tON > tON_OSP(MAX)) after delay time TD_OSP during start-
(Option) up.
NTC
Resistors on GATE Pin
In Figure 16, RG is applied to alleviate ringing spike of
Figure 12. External OTP gate drive loop in typical application circuits. The value of
RG must be considered carefully with respect to EMI and
VDD
efficiency for the system.
The built-in internal discharge resistor RID in parallel with
GATE pin prevents the MOSFET from any uncertain
PRO conditions. If the connection between the GATE pin and
(Option)
the Gate of the MOSFET is disconnected, the MOSFET
Figure 13. OVP for VDD will be false triggered by the residual energy through the
Gate-to-Drain parasitic capacitor CGD of the MOSFET and
VDD PRO the system will be damaged. Therefore, it’s highly
recommended to add an external discharge-resistor RED
connected between the Gate of MOSFET and GND
terminals. The energy through the CGD is discharged by
(Option) the external discharge-resistor to avoid MOSFET false
triggering.

AC Mains
Figure 14. OVP for VDD (90V to 265V)

PRO Vo+
The built-in internal discharge-resistor prevents
the MOSFET from any uncertain conditions.

RT7736 CGD

(Option) (Option) Soft RG


GATE
Driver
RID RED

Figure 15. OVP for Output Voltage CS


GND
Output Short Protection (RT7736G/R/L/E/B)
The RT7736 implements output short protection (RT7736G/
It is recommend to add the external discharge-
R/L/E/B) by detecting GATE width with delay time TD_OSP. resistor to avoid MOSFET false triggering.
It can minimize the power loss during output short,
Figure 16. Resistors on Gate Pin
especially at high line input voltage.

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20
RT7736
Feedback Resistor
In order to enhance light load efficiency, the loss of the AC Mains
(90V to 265V)
feedback resistor in parallel with photo-coupler is reduced,
as shown in Figure 17. Due to small feedback resistor
current, shunt regulator selection (e.g. TL-431) and
minimum regulation current design must be considered
carefully to make sure it's able to regulate under low
cathode current. VDD
PRO GATE

RT7736
COMP CS
Vo+ GND
+

Vo- R-C Filter

Figure 18. R-C Filter on CS Pin

Over-Temperature Protection (OTP)


The RT7736 provides an internal OTP function to protect
Feedback the controller itself from suffering thermal stress and
Resistor permanent damage. It's not suggested to use the function
as precise control of over temperature. Once the junction
temperature is higher than the OTP threshold, the
controller will shut down until the temperature cools down.
Meanwhile, if VDD reaches turn-off threshold voltage
Figure 17. Feedback Resistor VTH_OFF, the controller will hiccup till the over-temperature
condition is removed.

Negative Voltage Spike on Each Pin Thermal Considerations


Negative voltage (< −0.3V) to the controller pins will cause For continuous operation, do not exceed absolute
substrate injection and lead to controller damage or circuit maximum junction temperature. The maximum power
false triggering. For example, the negative spike voltage dissipation depends on the thermal resistance of the IC
at the CS pin may come from improper PCB layout or package, PCB layout, rate of surrounding airflow, and
inductive current sense resistor. Therefore, it is highly difference between junction and ambient temperature. The
recommended to add an R-C filter to avoid the CS pin maximum power dissipation can be calculated by the
damage, as shown in Figure 18. Proper PCB layout and following formula :
component selection should be considered during circuit PD(MAX) = (TJ(MAX) − TA) / θJA
design.
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For

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21
RT7736
SOT-23-6 package, the thermal resistance, θ JA, is Layout Consideration
260.7°C/W on a standard JEDEC 51-3 single-layer thermal A proper PCB layout can abate unknown noise interference
test board. The maximum power dissipation at TA = 25°C and EMI issue in the switching power supply. Please refer
can be calculated by the following formula : to the guidelines when you want to design PCB layout for
PD(MAX) = (125°C − 25°C) / (260.7°C/W) = 0.38W for switching power supply :
SOT-23-6 package  The current path (1) through bulk capacitor, transformer,
The maximum power dissipation depends on the operating MOSFET, R CS returns to bulk capacitor is a high
ambient temperature for fixed T J(MAX) and thermal frequency current loop. It must be as short as possible
resistance, θJA. The derating curve in Figure 19 allows to decrease noise coupling and keep away from other
the designer to see the effect of rising ambient temperature low voltage traces, such as IC control circuit paths,
on the maximum power dissipation. especially.
0.5  The path (2) of the RCD snubber circuit is also a high
Single-Layer PCB
Maximum Power Dissipation (W)1

switching loop. Keep it as small as possible.


0.4
 Separate the ground traces of bulk capacitor(a),
MOSFET(b), auxiliary winding(c) and IC control circuit(d)
0.3
for reducing noise, output ripple and EMI issue. Connect
these ground traces together at bulk capacitor ground
0.2
(a). The areas of these ground traces should be large
enough.
0.1
 Place the bypass capacitor as close to the controller as
0.0
possible.
0 25 50 75 100 125  In order to reduce reflected trace inductance and EMI,
Ambient Temperature (°C) minimize the area of the loop connecting the secondary
Figure 19. Derating Curve of Maximum Power winding, output diode and output filter capacitor. In
Dissipation additional, apply sufficient copper area at the anode and
cathode terminal of the diode for heatsinking.

AC Mains CBULK
(90V to 265V) (2)

(a)
CBULK Ground (a)

Trace Trace Trace


VDD (c)
PRO GATE
IC Auxiliary MOSFET
RT7736 Ground (d) Ground (c) Ground (b)
(1)
COMP CS
GND

(d) (b)

Figure 20. PCB Layout Guide

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22
RT7736
Outline Dimension

H
D
L

C B

A
A1
e

Dimensions In Millimeters Dimensions In Inches


Symbol
Min Max Min Max
A 0.889 1.295 0.031 0.051
A1 0.000 0.152 0.000 0.006
B 1.397 1.803 0.055 0.071
b 0.250 0.560 0.010 0.022
C 2.591 2.997 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024

SOT-23-6 Surface Mount Package

Richtek Technology Corporation


14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789

Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.

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23

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