RFM12B
RFM12B
RFM12B
Datasheet REV2.1
RFM12B
the purpose of this spec covers mainly for the physical characteristic of the module, for register configure and its related command info please refer to RF12B data sheets
General Introduction
RFM12B is a low costing ISM band transceiver module implemented with unique PLL. It works signal ranges from 433/868/915MHZ bands, comply with FCC, ETSI regulation. The SPI interface is used to communicate with microcontroller for parameter setting.
Features:
Low costing, high performance and price ratio Tuning free during production PLL and zero IF technology Fast PLL lock time High resolution PLL with 2.5 KHz step High data rate (up to 115.2 kbps with internal demodulator with external RC filter highest data rate is 256 kbps) Differential antenna input/output Automatic antenna tuning Programmable TX frequency deviation (from 15 to 240 KHz) Programmable receiver bandwidth (from 67 to 400 kHz) Analog and digital signal strength indicator (ARSSI/DRSSI) Automatic frequency control (AFC) Data quality detection (DQD) Internal data filtering and clock recovery RX synchron pattern recognition SPI compatible serial control interface Clock and reset signal output for external MCU use 16 bit RX Data FIFO Two 8 bit TX data registers Standard 10 MHz crystal reference Wakeup timer 2.2V 3.8V power supply Low power consumption Standby current less than 0.3uA Supports very short packets (down to 3 bytes)
RFM12B-Die
RFM12B-TSSOP
Typical Application
Remote control Wireless data collection Toys Remote sensor Home security system Tire pressure monitoring system 1 Tel: +86-755-82973805 Fax: +86-755-82973550 E-mail: [email protected] http://www.hoperf.com
RFM12B
Datasheet REV2.1
Pin Definition
SMD DIP
definition nINT/VDI VDD SDI SCK nSEL SDO nIRQ FSK/DATA/nFFS DCLK/CFIL/FFIT
Function Interrupt input (active low)/Valid data indicator Positive power supply SPI data input SPI clock input Chip select (active low) Serial data output with bus hold Interrupts request outputactive low Transmit FSK data input/ Received data output (FIFO not used)/ FIFO select Clock output (no FIFO )/ external filter capacitor(analog mode)/ FIFO interrupts(active high)when FIFO level set to 1, FIFO empty interruption can be achieved
DO DIO S
Clock output for external microcontroller Reset outputactive low Power ground
Electrical Parameter
Maximumnot at working mode
symbol Vdd Vin Iin ESD Tst Tld parameter Positive power supply All pin input level Input current except power Human body model Storage temperature Soldering temperature(10s) -55 minimum -0.5 -0.5 -25 maximum 6.0 Vdd+0.5 25 1000 125 260 Unit V V mA V
RFM12B
Datasheet REV2.1
DC characteristic
symbol Idd_TX_0 parameter Supply current (TX mode, Pout = 0dBm) Remark 315,433MHz band 868MHz band 915MHz band Idd_TX_PMAX Supply current (TX mode, Pout = Pmax) 315,433MHz band 868MHz band 915MHz band Idd_RX Supply current (RX mode) 315,433MHz band 868MHz band 915MHz band Ix Ipd Ilb Vlb Vlba Idle current Sleep mode current Low battery detection Low battery detect threshold Low battery detection accuracy Vil Vih Iil Iih Vol Voh Low level input High level input Leakage current Leakage current Low level output High level output Vil=0V Vih=Vdd, Vdd=5.4V Iol=2mA Ioh=-2mA Vdd-0.4 0.7*Vdd -1 -1 1 1 0.4 0.3*Vdd V V uA uA V V 0.1V per step 2.2 0 Crystal oscillator on All blocks off minimum typical 15 16 17 22 23 24 11 12 13 0.62 0.3 0.5 3.7 5 maximum 17 18 19 24 25 26 13 14 15 1.2 mA uA uA V % mA mA Unit mA
RFM12B
Datasheet REV2.1
AC characteristic
symbol fref parameter PLL frequency frequency fLO (10MHz crystal used) frequency fLO (9MHZ crystal used) 433 MHz band,2.5KHz step 868 MHz band,5KHz step 915 MHz band,7.5KHz step 433 MHz band,2.5KHz step 868 MHz band,5KHz step 915 MHz band,7.5KHz step frequency fLO (11MHZ crystal used) BW Receiver bandwidth 433 MHz band,2.5KHz step 868 MHz band,5KHz step 915 MHz band,7.5KHz step
mode 0 mode 1 mode 2 mode 3 mode 4 mode 5
remark
min 9 430.24 860.48 900.72 387.22 774.43 810.65 473.26 946.53 990.79 60 120 180 240 300 360
typical 10
max 11 439.75 879.51 929.27 395.76 791.56 836.34 483.73 967.46 1022.2
Unit MHz
MHz
MHz
MHz
tlock
tst, P BR BRA
With a running crystal oscillator With internal digital demodulator With external RC filter
BER 10 , BW=134KHz,BR=1.2kbps, 433MHz band
-3
200 0.6
us kbps kbps
Pmin
sensitivity
BER 10-3, BW=134KHz,BR=1.2kbps, 868MHz band BER 10-3, BW=134KHz,BR=1.2kbps, 915MHz band
AFCrange
5 46 1 6
dB dB nF dB
RSRESP
500
us
RFM12B
Datasheet REV2.1
AC characteristic(Transmitter)
symbol parameter remark 433MHz band Pmax Max. available output power 868MHz band 915MHz band Pout Typical output power Selectable in 3 dB steps Co Output capacitance (set by the automatic antenna tuning circuit) Qo Quality factor of the output capacitance Lout Output phase noise In low bands In high bands 100 kHz from carrier 1 MHz from carrier BRTX FSK bit rate Via internal TX data register BRATX FSK bit rate
TX data connected to the FSK input
min 3 2 2 Pmax-21
typical 5 4 4
max
Unit
dBm
Pmax
dbm
2 2.1
2.6 2.7
3.2 3.3
pf
13 8
15 10
256
kbps
dffsk
15
240
kHZ
AC characteristic(Turn-on/Turnaround timings)
symbol Tst parameter Crystal oscillator startup time Transmitter turn-on time Ttx_XTAL_ON Receiver turn-on time Trx_XTAL_ON Transmitter Receiver Ttx_rx_SYNT_ON turnover time Synthesizer off, crystal oscillator on with 10 MHz step Synthesizer off, crystal oscillator on with 10 MHz step Synthesizer and crystal oscillator on during TX/RX change with 10 MHz step Receiver Transmitter Trx_tx_SYNT_ON Cxl turnover time Synthesizer and crystal oscillator on during RX/TX change with 10 MHz step Crystal load capacitance Programmable in 0.5 pF steps, tolerance+/- 10% tPOR Internal POR timeout After Vdd has reached 90% of final value tPBt Wake-up timer clock period Cin, D tr, f Digital input apacitance
Digital output rise/fall time
min
typical 1
max 5
Unit ms
250
us
250
us
150
us
150
us
8.5
16
pf
100
ms
0.96
1.05
ms
pf ns
RFM12B
Datasheet REV2.1
SGS Reports
RFM12B
Datasheet REV2.1
RFM12B
Datasheet REV2.1
Mechanical Dimensionunits
SMD PACKAGES1
in mm
SMD PACKAGES2
RFM12B
Datasheet REV2.1 DIP PACKAGED
SMD PACKAGES1P
RFM12B
Datasheet REV2.1 SMD PACKAGES2P
DIP PACKAGEDP
RFM12B
Datasheet REV2.1
RFM12B 433
1RFM12B-433D : RFM12B module at 433MHz band, DIP module, die chip. 2RFM12B-433DP : RFM12B module at 433MHz band, DIP module, package chip. 3RFM12B-868S1 : RFM12B module at 868MHZ band, SMD module, thickness at 4.2mm,die chip. 4RFM12B-868S1P: RFM12B module at 868MHZ band, SMD module, thickness at 4.2mm, package chip. 5RFM12B-915S2 : RFM12B module at 915MHZ band, SMD module, thickness at 2.2mm,die chip. 6RFM12B-915S2P: RFM12B module at 868MHZ band, SMD module, thickness at 4.2mm, package chip.
Module model RFM12B-433D RFM12B-433DP RFM12B-433S1 RFM12B-433S1P RFM12B-433S2 RFM12B-433S2P RFM12B-868D RFM12B-868DP RFM12B-868S1 RFM12B-868S1P RFM12B-868S1 RFM12B-868S1P RFM12B-915D RFM12B-915DP RFM12B-915S1 RFM12B-915S1P RFM12B-915S2 RFM12B-915S2P
operation band 433MHz 433MHz 433MHz 433MHz 433MHz 433MHz 868MHz 868MHz 868MHz 868MHz 868MHz 868MHz 915MHz 915MHz 915MHz 915MHz 915MHz 915MHz
module package type DIP DIP SMD, thickness at 4.2mm SMD, thickness at 4.2mm SMD, thickness at 2.2mm SMD, thickness at 2.2mm DIP DIP SMD, thickness at 4.2mm SMD, thickness at 4.2mm SMD, thickness at 2.2mm SMD, thickness at 2.2mm DIP DIP SMD, thickness at 4.2mm SMD, thickness at 4.2mm SMD, thickness at 2.2mm SMD, thickness at 2.2mm
core chip package type Die 16pin TSSOP Die 16pin TSSOP Die 16pin TSSOP Die 16pin TSSOP Die 16pin TSSOP Die 16pin TSSOP Die 16pin TSSOP Die 16pin TSSOP Die 16pin TSSOP
RFM12B
Datasheet REV2.1
This document may contain preliminary information and is subject to change by Hope Microelectronics without notice. Hope Microelectronics assumes no responsibility or liability for any use of the information contained herein. HOPE MICROELECTRONICS CO.,LTD Add:4/F, Tel: Fax: Email: Block B3, East Industrial Area, Huaqiaocheng, Shenzhen, Guangdong, China 86-755-82973805 86-755-82973550 [email protected] [email protected] Website: http://www.hoperf.com http://www.hoperf.cn http://hoperf.en.alibaba.com
2006, HOPE MICROELECTRONICS CO.,LTD. All rights reserved.
Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Hope Microelectronics or third parties. The products described in this document are not intended for use in implantation or other direct life support applications where malfunction may result in the direct physical harm or injury to persons. NO WARRANTIES OF ANY KIND, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MECHANTABILITY OR FITNESS FOR A ARTICULAR PURPOSE, ARE OFFERED IN THIS DOCUMENT.