IEC 61215-1

Edition 2.0 2021-02

INTERNATIONAL
STANDARD
NORME
INTERNATIONALE A * c o lo u r
ins ide

T er r est
est r i al pho t ovo l t ai c (P
(P V)
V) modul es - D e
esi
si gn q ual i f i ca
catt i on and t ype appr
appr o val -
Part 1: 1: Test requ irements

Modul es ph ot ov ol t ai ques ( PV
PV ) pour appl i cat i ons t er r est r es - Q ual i f i ca
catt i on de l a
conception et homologation -
Partie 1: Exigences d'essai
 IEC 61215-1
Edition 2.0 2021-02

INTERNATIONAL
STANDARD
NORME
INTERNATIONALE colour
ins ide

T er r est
est r i al ph ot ovo l t ai
aicc (P V)
V) modul es - D e
esi
si gn q ual i f i ca
catt i on and t ype appr oval -
Part 1: 1: Test requ irements

Modul es phot ovol t a aii 'que

'ques s ( P V)
V) pour appl i cat i ons t er r est r es - Q ual i f iicat
cat i on de l a
c o n c e p t i o n e t h o m o l o g a ti
ti o n -
Partie 1: Exigences d'essai

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION

COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE

ICS 27.160 ISBN 978-2-8322-9367 -6

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e.

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 - 2 - IEC 6 1215-1:2021 © IEC 2021
IEC

CONTENTS

F O R E W O R D .........
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IN T R O D U C T IO N ........
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1 S co p e .........
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2 N or m at ive re fe re n c e s ........
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3 Te rm s, def in itio ns and ab bre via te d te rm s ........
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4 T es t s a m p le s .........
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5 M ar kin g an d d o cu m e n ta ti o n .........
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5.1 N a m e p la te .........
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5.2 D o cu m e n ta tio n .................
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5.2.1 M inim um re q u ir e m e n ts .........
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5.2 .2 Inf or m atio n to be give n in the d oc u m en ta tio n ........
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5. 2. 3 As se m bl y in s tr u c ti o n s ..................
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6 T e s ti n g ........
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7 Pa ss c r it e r ia ........
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7.1 G e n e ra l............
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7.2 Po we r ou tp ut and ele ctr ic c ir c u it ry ........
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7.2.1
7.2.1 Identifi
Identification
cation of rated values and tole ran ce s .........
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7.2 .2 V er ific a tio n o f ra te d lab el va lue s —> G at e No. 1 ....
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7.2.3 Maximum power degrada tion during type approval testing -» Gate No. 2 ......... 23
7. 2. 4 El e ct ric al c ir c u it r y ..................
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7.3 V is ua l d e fe c ts .........
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7.4 E le ct ric al s a fe ty ........
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8 M ajo r vis ua l d e fe ct s.................
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9 R e p o rt .........
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10 M o d if ic a ti o n s ........
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11 T es t flo w and p ro c e d u re s .........
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A n ne x A (i n fo rm a titive
ve ) C ha ng es fr
from
om p re vi o u s e d it io n ..................
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A.1 G e n e ra l.......
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A .2 P ro ce d ur es fo r b if ac ia l m o d u le s ...................
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A .3 U se o f re p re se n ta titive
ve s a m p le s ...............
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A .4 A d d ititio
io n o f d yn a m ic m e ch an ic a l loa d t e s t ..................
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A .5 A d d ititio
io n o f te st fo r p o te n tia
ti a l in du ce d d e g ra d a ti o n ...............
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A .6 S im u la to r re q u ir e m e n ts ..................
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A .6.1 G e n e r a l.....
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A .6 .2 R at io n a le fo r ch a n ge s to sp e ct ra l re q u ir e m e n ts ...............
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A .6 .3 R at io n a le fo r ch a n ge s to u n ififo
o rm itityy re q u ir e m e n ts ...................
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A .7 R ef er e n ce s to re te st g u id e lilin
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A .8 W e ig h t on ju n c ti o n b o x e s .................
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A .9 C o rr ec titio
o n to m o n o lilith
th ic a lly -i n te g ra te d h o t- s p o t e n d u ra n ce t e s t .........
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A .1
.100 N um be r o f m o d ul e s in s e q u e n c e ..................
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A .1 1 R em ov al o f n om in al m od ul e o pe ra tin g te m p e ra tu re (N M O T ) .........
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A. 12 V e ry lo
loww cu rr en ts d ur in g th in -f il m t e s t s ..................
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A .1
.133 L im it by pa ss d io de te st in g to th re e d io d e s ..................
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A. 14 R ev er t th e in su la tio n te s t to 20 05 v e r s io n ..................
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A .1
.155 Be nd in
ingg te s t........................
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IEC 61215-1:2021 © IEC 2021 -3 -

A .1 6 S ta b ili za tio
ti o n o p tio
ti o n fo r bo ro n o xy ge n LI
LIDD (M Q T 1 9 . 3 ) ...................
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B ib lio g ra p h y................
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Figure 1 - Ge om etry tha t show s rad ius o f curvatu re o f a flexible m od ule ..

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Figure 2 - Full test flow for desi design gn qu alifialification
cation and type type ap proval of photovoltaic
m o d u le s................
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Figure 3 - Examples of hypothetical partial nameplates (left column), datasheets

(center column),
column), and derived rat
rated
ed values and tolerances (right colu m n) ..................................... 20
Figure A.1 A.1 - Derived temperature coefficients (a) for ni nine
ne different mc-Si products
ty p e s .................
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Ta ble 1 - Re qu ired co m po ne nt te s ts ........

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Ta ble 2 - Su m m ary o f Gate No. 1 re q ui re m en ts ........
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Ta ble 3 - Su m m ary o f te st le v e ls ........
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Table A.1
A.1 - Published un certainty val
values
ues as a ffunction
unction of simulator u n iiff o rm
rm i t y c l a s s ................ 35
Table A.2 - Summ ary of foil placement during insulation insulation test iin n three different
ve rs io n s................
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 -4 - IE C 6 1 2
21
1 5 --1
1 ::2
2021 © IEC 2021
21

INTERNATIONAL ELECTROTECHNICAL COMMISSION

TERRESTRIAL PHOTOVOLTAIC (PV) MODULES -

D E S IG
IG N Q U A L I F IIC
CATION AND TYPE APPROVA L -

Part 1: Test requirements

FOREWORD
1) The International Electrotechnical Com mission (IEC) iiss a worldwide
worldwide organ ization
ization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an internati
international
onal
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.

3) IEC Publications have the form of recom men dations for internationa l use and are accepte d by IEC National
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Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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Publications
ons
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between any IEC Publication
Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No lliability
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.

8) Attention is drawn
indispensable to co
for the tthe
he Normative
rrect references
application cited inon.
this publicati
o f this publication.
publicati publication.
on. Use of the referenced publications
publications is

9) At te nt io n is dr aw n to th e po ss ib ilit y th at so me of the ele m en ts o f th is IEC Pu bli ca tio n m ay be the subje ct of

patent rights. IEC shall not be held responsible for identifying any or all such patent ri rights.
ghts.

International Standard IEC 61215-1 has been prepared by IEC technical committee 82: Solar
photovoltaic energy systems.

This second e dition of IEC 61215-

61215-11 cancels and replaces the first edition of IEC 61215-1,
published in 2016: it constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous
edition:

a) Ad dition of a test taken from IEC TS 62782.

b) Ad dition of a test taken from IEC TS 62804-1.
c) Addition of test methods required for fflexible
lexible modules. This includes the addition
addition of the
bending test (MQT 22).
d) Addition of defi
definitions,
nitions, references and instructions
instructions on how to perfor
perform
m the IEC 61215
design qualification
qualification and type approval o on
n bifaci
bifacial
al PV modules
modules..
IEC 61215-1:2021 © IEC 2021 -5 -

e) Clarification of the rrequireme

equireme nts rel
related
ated to power output measurements.
f) Addition of weights to junction box duri
during
ng 200 thermal cycl
cycles.
es.
g) Requ irement tthat
hat retesting be performed according to IIEC
EC TS 62915.
h) Removal of the nominal module operating test (NMOT), and associated test of
performance at NMOT, from the IEC 61215 series.

Informative Annex A explains the background and reasoning behind some of the more
substantial changes that were made in the IEC 61215 series in progress
progressing
ing from edition 1 to
edition 2.

The text of this International Standard is based on the following documents:

FDIS Report on voting

8 2 /1 8 2 8 A /F D IS 8 2 / 1 8 4 8 /R V D

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A lis t o f all p ar ts in th e IE
IECC 61 21 5 se rie s, p u b lis h ed u n d er th e g en er al tititltl e Terrestrial
p h o to vo l ta i c ( P V ) mo d u l e s - De si g n q u a l i ffii ca ti
tio l, can be found on the IEC
o n a n d typ e a p p r o va l,
website.

The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under " http://webstore.iec.ch " in the data related to
the specific document. At this date, the document will be

• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPO
IMP O RTA NT - Th e ' co l o u r i n si d e ' l o g o o n th e co ve r p a g e o f th i s p u b l i ca ti o n i n d i ca te s th a t i t
co n ta i n s co l o u r s wh i ch a r e co n si d e r e d to b e u se fu l fo r th e co r r e ct u n d e r sta n d i n g o f i ts
co n te n ts. Use r s sh o u l d th e r e fo r e p r i n t th i s d o cu m e n t u si n g a co l o u r p r i n te r .
 -6 - IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IEC 2021

INTRODUCTION

W hereas Part 1 of this standards seri

series
es describes requirem ents (both in general and specific
with respect to
to device technology ), the sub-parts of Part 1 define technology variations and
Part 2 defines a set of test procedures necessary for design qualification and type approval.
The test procedures described in Part 2 are valid for all device technologies.
IE C 6 1 2 1 5 - 1 : 2 0 2 1 © I E C 2 0 2 1 - 7 -

TERRESTRIAL PHOTOVOLTAIC (PV) MODULES -

D E SI
S I GN
GN Q U A L I FI
F I CA
CA T I O N A N D T Y P E A P P R O V A L -

Part 1: Test requirements

1 Sco pe

This document lays down requirements for the design qualification of terrestrial photovoltaic
modules suitable for long-term operation in open-air climates. The useful se rvic rvice
e lif
life
e of
modules so qualified will depend on their design, their environment and the conditions under
which they are operated. Test results are not construed as a quantitative prediction of module
lifetime.

In clima tes wh ere 98 th perce ntile op erating tem pera tures e xceed 70 °C, use rs are
recommended to consider testing to higher temperature test conditions as described in
IEC TS 63126. Users desiri
desiring
ng qualification of PV products with lesser lifetim
lifetim e e xpectations
are recommended to consider testing designed for PV in consumer electronics, as described
in IEC TS 631 63 (unde r deve lopment). Users wishing to gain confidence that the
characteristics tested in IEC 61215 appear consistently in a manufactured product may wish
to utilize IEC 62941 regarding quality systems in PV manufacturing.

This document is intended to apply to all terrestrial flat plate module materials such as
crystalline silicon module types as well as thin-film modules. It does not apply to systems that
are not long-term applications, such as flexible modules installed in awnings or tenting.

This document does not apply to modules used with concentrated sunlight although it may be
utilized for low concentrator modules (1 to 3 suns). For low concentration modules, all tests
are performed using the irradiance, current, voltage and power levels expected at the design
concentration.

This document does not address the particularities of PV modules with integrated electronics.
It may however be used as a basis for testing such PV modules.

The objective of this test sequence is to determine the electrical characteristics of the module
and to show, as far as possible within reasonable constraints of cost and time, that the
module is capable of withstanding prolonged exposure outdoors. Accelerated test conditions
are empirically based on those necessary to reproduce selected observed field failures and
are applied equally across module types. Acceleration factors may vary with product design,
and thus not all degradation mechanisms may manifest. Further general information on
accelerated test m ethods including definitions of terms
terms may be found in IEC 62506.

Some long-term degradation mechanisms can only reasonably be detected via component
testing, due to long times required to produce the failure and necessity of stress conditions
that are expensive to produce over large areas. Component tests that have reached a
sufficient level of maturity to set pass/fail criteria with high confidence are incorporated into
the IEC 61215 series via addition to Table 1. In contrast, the tests procedures described in
this series, in IEC 61215-2, are performed on modules.

2 Normative references

The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
 - 8 - IE C 6 1
1221
155 --1
1 :2
:2 0
022 1 © IEC 2021

IEC 60269-6, Low-voltage fuses - P a r t 6 : S u p p l e me n ta r y r e q u iirr e me n ts fo r fu se - l iin

n ks fo r th e
p r o te ctio
ctio n o f so l a r p h o to vo l ta i c e n e r g y syste ms

IEC 60891, P h o to vo l ta ic ic d e vi ce s - P r o ce d u r e s fo r te mp e r a tu rre

e a n d i r r a d iia
a n ce co r r e cti
ctio
o n s to
me a su r e d l - V c h a r a cte r isti
istics
cs

IEC 60904-1, P h o to vo l ta i c d e vi ce s - P a r t 1: Me a su r e m e n t o f p h o to vo l ta i c cu r r e n t- vo lta

lta g e
characteristics

IEC TS 60904-1-2:2019, P h o to vo l ta i c d e vi ce s - P a r t 1 --2

2 : Me a su r e me n t o f cu r r e n t-vo
t-vo l ta g e
cha racteristics of bifacial pho tovo ltaic (PV) devices

IEC 60904-3, P h o to vo l ta ic
ic d e vi ce s - P a r t 3 : Me a su r e me n t p r i n ci p le
le s fo r te r re
re str i a l
photovoltaic (PV) solar devices with reference spectral irradiance data

IEC 60904-10, P h o to vo l ta ic
ic d e vi ce s - P a r t 1 0 : Me th o d s o f l in
in e a r d e p e n d e n ce a n d l iin
n e a r i ty
me a su r e me n ts

IEC TS 60904-13, P h o to vo l ta i c d e vi ce s - Part 1 3:

3: E l e ctr o llu
u mi n e sce n ce o f p h o to vo l tta
aic
mo d u l e s

IEC 61140, P r o te ctio

ctio n a g a i n st e l e ctr
ctrii c sh o ck - Co mmo n a sp e cts fo r iin
n sta l la
la ti o n and
e q u i p me n t

IEC 61215-2, Terrestrial photovoltaic (PV) modules - Design q ualifi

ualification
cation an d type approva l -
Part 2: Test procedures

IEC 61730-1, P h o to vo l ta i c ( P V)
V) mo d u l e sa fe ty q u a l i fi
fi ca ti
tio
on - Part 1: Re q u i r e me n ts fo r
construction

IEC 61730-2, P h o to vo l ta i c ( P V ) mo d u l e sa fe ty q u a l i fica

fica ti o n - P a r t 2 : Re q u i r e me n ts fo r te sti
stin
ng

IEC TS 61836, S o l a r p h o to vo l ta i c e n e r g y syste ms - Te rms,

rms, d e fi n iti
itioo n s a n d symb o l s

IEC 61853-1, P h o to vo l ta i c ( PV PV ) mo d u l e p e r fo rrma

ma n ce te stistin
n g a n d e n e r g y r a ti
tin
ng - P a r t 1:
Ir ra
ra d i a n ce a n d te m p e r a tu re
re p e r fo r ma n ce me a su r e m e n ts a n d p o we r ra
ra ti
tinng

IEC TS 62782, P h o to vo l ta i c (P
(P V ) mo d u l e s - Cycl i c ( d yn a
ami
mi c) m e ch a n i ca l lo
lo a d te sti
stinng

IEC 62790, Ju n cti o n b o xe s fo r p h o to vo l ta i c mo d u l e s - S a fe ty r e q u i re

re me n ts a n d te st
sts
s

IEC TS 62804-1, P h o to vo l ta i c ( P V ) mo d u l e s - Te st me th o d s fo r the

the d e te cti o n o f p o te n ti a ll--
induced deg radation - Part 1: Crystalli
Crystalline
ne silicon

IEC 62852, Co n n e cto rs

rs fo r DC - a p p l ica
ica ti o n i n p h o to vo l ta ic
ic syste ms - S a fe ty r e q u ir
ir e me n ts a n d
tests

IEC TS 62915, Pho tovoltaic (PV) modu les - Type approval, design and safety qualification
qualification -
Retesting

IEC 62941, Te r r e stri

stri a l p h o to vo l ta i c (PV) mo d u l e s - Q u a l i ty syste m fo r PV mo d u le
le

ma n u fa ctu r i n g
IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IE C 2 02 1 - 9 -

IE
ECC TS 6316
63
3 : - 1Te r r e str ia
ia l p h o to vo l tta
a i c ( P V ) mo d u l e s fo r co n su me r p r o d u cts - De si g n
qualification and type approval

ISO/I EC Guide 98-3, Un ce r ta i n ty o f me a su r e m e n t - P a r t 3 : G u i de

de to th e e xp r e ssio
ssio n o f
u n ce r ta i n ty in
in me a su r e m e n t ( G UM:1 9 9 5 )

3 Terms, defin itio ns and abbr eviated terms

For the purposes of this document, the terms and definitions in IEC TS 61836 apply, as well
as the following.

ISO and IEC m aintain terminological databases for use iin

n stand ardization at the following
addresses:

• IE
IEC
C Electropedia: available at http://www.elec tropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp

3.1
bins of p ower classes
power (typically maximum power) sorting criteria from the PV module manufacturer

3.2
tolerances <on label>
value range of electrical parameters on the label of the PV module as given by the
manufacturer

3.
3.33
M QT
Module Quality Test

3.4
type approval
conformity test made on one or more items representative of the production

[SOURC E: IEC 60050-581:2008, 58 1-21-08 - Type ttest)

est)

3.
3.55
reproducibility <of measurements>
closeness of agreement between the results of measurements of the same value of a
quantity, when the individual measurements are made under different conditions of
measurement:

- princ
principl
iple
e of meas urement
urement,,
- method of meas urement
urement,,
- obs erv
erver,
er,
- meas uri
uring
ng instrument
instrumentss ,
- refer
referenc
enc e s tan
tandards
dards ,
- labor
laborator
atoryy ,

1 Under preparation. Stage at the time of publication: ADTS.

 -10- IEC 6 1215-1:2021 © IEC 2021
IEC

- under conditions of use of the iinstruments,

nstruments, different from those
those customarily used,
after intervals of time relatively long compared with the duration of
ofaasingle measurement,
[consistent with the International V ocabulary of Metrology (VIM), 3.7]

Note 1 to entry: The concepts of "princi

"principle
ple of measurem ent” and "method of measurem ent" are respectively
defined in VIM 2.3 and 2.4.

Note 2 to
to entry: The term "reprodu cibili
cibility"
ty" also appli
applies
es to the instance where only certain of the
the above conditions
are taken into account, provided that these are stated.
Note 3 to
to entry: It iiss recommended that laboratories determine their reprod ucibility
ucibility according to the formulas
formulas and
principles in ISO 5725-2.

[SOURCE: IEC 60050-311:2001, 311-06-07]

3.6
flexible module
PV module that exhibits a radius o f curvature o f 500 mm or less in at least one direction
according to the manufacturer’s specification and is capable of bending to conform to a flat or
curved surface

Note 1 to entry: A curved module with a rigid shape iis

s not cons idered a flexible mod ule.

Note 2 to entry: Radius of curvature is defined as shown in Figure 1. During testing, the app lied radius of
curvature is no smaller than that specified by the m anufacturer.

Figure 1 - Geometry that shows radius of curvature of a flexible mod ule

3.7
representative sample
sample that includes all the components of the module, except some repeated parts

Note 1 to entry: The repre senta tive samp les shall use all
all key ma terials and subassem blies, as detailed in
Clause 4.

3.8
very large module
module that exceeds the size of standard 2,2 m * 1,5 m commercially-available simulators

Note 1 to entry:
entry: A very lar
large
ge module exceeds 2,2 m in length or width, or exceeds 1,5 m iin
n both dimensions. Thus
a 3 m x 0.3 m module is considered very large, as is a 2,2 m * 2,2 m module.

Note 2 to entry: Very large modules are exempt from class A simulator spatial
spatial irradiance uniformity requirements,
as detailed in IEC 61215-2 MQT 02.

Note 3 to entry:
entry: During test sequences representative samples may be substituted for very lar
large
ge m odules, within
within
the limits described in Clause 4.

Note 4 to entry: In future ed itions, the size threshold to be considered a very large module will likely increase to
larger dimensions.

3.9
bifacial PV modules
modules that can convert irradiation received on both the front-side and rear-side into electric
energy by means of the photovoltaic effect
IE C 6 1 2 1 5 - 1 : 2 0 2 1 © I E C 2 0 2 1 - 1
11
1 -

3.10
bifaciality coefficients
ratios between the I- V characteristics of the rear-side and the front-side of a bifacial module
each m easured under Standard T est Cond iti itions
ons (STC - IEC TS 61836), nam ely tthe he short-
circu it curre nt b ifac iality co effic ien t <p|SC, the op en -circ uit volta ge b ifac iality c oe fficie nt ccp
pVoc
and the ma ximum pow er bifa cia lity coe fficie nt <pPmax

Note 1 to entry: Bifacia lity coe fficients are fully defined in

in IEC TS 60904 -1-2:20 19, 6.2.

3.11
bifacial nameplate irradiance
B NP I
higher irradiance at which nameplate verification is performed for bifacial modules,
corresponding to 1 000 W/m 2 on the module fr
front
ont and 135 W/m 2 on the module rear
rear,, applied
in any method allowed by IEC TS 60904-1-2

3.12
bifacial stress irradiance
B SI
higher irradiance at which currents for stress are measured on bifacial modules,
corresponding to 1 000 W/m2 on the module front and 300 W/m 2 on the module rear, appli
applied
ed
by any method allowed in IEC TS 60904-1-2, I- V characteristic at which may be extrapolated
from lower irradiances

4 Test samples

The PV module samples shall have been manufactured from specified materials and
components in accordance with the relevant drawings and process sheets and have been
subjected to the manufacturer’s normal inspection, quality control and production acceptance
procedures. The PV modules shall be complete in every detail and shall be accompanied by
the manufacturer’s handling, mounting, and connection instructions. When the PV modules to
be tested are prototypes of a new design and not from production, this fact shall be noted in
the test report (see Clause 9).

The number of test samples required is derived from the applicable test sequences
(see Clause 11).

Special test samples may be required for tests such as the bypass diode test MQT 18

(see IEC 61215-2).

For qualification of multiple bins of power classes within the boundaries given in
IEC TS 62915 at least 2 modules each, from the lower end, m edian and higher end pow er
class shall be used for testing. If median power class does not exist the next higher class
shall be used. If qualification of a single power class shall be extended to further bins of
pow er classes within the bo unda ries given in IEC TS 62915 then at least 2 modules each,
from the lower end and higher end power class shall be used for label verification (see Gate
No.1 in 7.2.1). If a power class is extended only towards higher (or lower) bins, then modules
only from the higher (or lower) bins, respectively, shall be used for verification of rated label
values.

Qualification to multiple bins of power classes does not increase the minimum requirement of
one control sample used in 7.2.3.

It is advisable to provide additional spare samples meeting the same output power
requirements.
 -12- IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IEC 2021

If applicable, the test samples shall be used to represent a group or family of products, or
variations in the materials, or production processes used to produce the modules. The
additional samples required for the test programme are then derived from IEC TS 62915.

For very large modules (as defined in 3.8), representative samples (as defined in 3.7) may be
used for all qua lification tests g iven in Clause 11 and IEC 6121 5-2. D uring the design and
manufacturing of the representative samples, attention should be paid to reach the maximum
similarity to the full-size product in all electrical, mechanical, and thermal characteristics
related to quality and reliability. The cell, encapsulation methods, interconnects, terminations,
clearance and creepage distances around all edges, and distance through solid insulation
(relied upon insulation and cemented joints) shall be the same as on the actual full-size
products. Limits are placed on how much one may reduce the dimensions of a very large
module in making representative samples for qualification testing. The reduced dimension(s)
shall be no less than one half the dimensions that define a very large module. In other words,
when reducing the shorter dimension, the representative sample shall be at least 0,75 m wide.
In reducing the longer dimension, the representative sample shall be at least 1,1 m long. If
representative samples are used for any test, the test report shall include a table listing the
dimensions of the product being qualified, and for each MQT, the dimensions of the samples
tested. The table shall contain the statement, "Smaller samples were used for some tests as
noted above. Use of smaller samples may affect test results." For determination of maximum
power degradation during testing (7.2.3) on a representative sample, Pmax(Lab_GateNo.1)
refers to the representative sample’s initial stabilized measured power output. However, for
verification of rated label values (7.2.2) a standard production product shall be measured,
either at the test facility or utilizing a test at the manufacturer monitored by the testing entity.

If representative samples are utilized in Sequence E, then one extra module, full-sized, is
required, and shall be subjected only to MQT 16 (static mechanical load test) and the
requirements therein.

Any
A ny re p re se n ta tive
ti ve sa m p le us ed fo r M Q T 09 (h o t- sp o t e nd u ra n ce te st ) sh a ll co n ta in th e sa m e
number of cells per bypass diode (i.e. the same substring size) as the full-size product.

NOTE It isis preferable in any ttest

est to measure a full-size
full-size sample, rather than a representative sample, when
equipment size allows.

Prior to beginning the qualification test, care should be taken not to damage the samples in
transit. Such care may include adherence to best practices in packing and shipping,[1]2 as
well as electroluminescence imaging according to IEC TS 60904-13 before and after shipping
to make sure cracks have not developed in transit.

For the requirements in the IEC 61215 series, a module shall be considered "bifacial " if the
manufacturer claims bifaciality on the nameplate or datasheet, or if the module exhibits a
maxim um pow er bifac iality coefficie nt > 20 %. If a module is to be tested as a m onofacial
module, the test laboratory shall verify that the module is monofacial by at least one of the
following methods:

a) Information fr
from
om the man ufacturer showing that tthe
he rear of the cell iiss ful
fully
ly metallized;
b) Spe ctrall
ctrally-resolved
y-resolved backshe et transmission
transmission data ffrom
rom the module ma nufacturer; o
orr
c) Determ ination of bifaciality
bifaciality coefficient on one
one sam ple according to tthe
he procedure in
IEC TS 60904-1-2.

2 Numbers iin
n ssquare
quare brackets refer to the Bibliography.
Bibliography.
IEC 61215-1:2021 © IEC 2021 -13-

5 Marking and doc um entation

5.
5.1
1 Nam e plate

Each module shall include the following clear and indelible markings. Unless otherwise
indicated, all the electrical parameters refer to STC:

a) name, register
registered
ed tr
trade
ade name or registered trade mark of ma nufacturer;
b) type or model numbe r designation;
c) serial num ber ((unless
unless marked on other part of pr
product);
oduct);
d) date and place of manufacture; alterna tively seri
serial
al num ber al
allowing
lowing to trace the date an
and
d
place of manufacture;
e) maximum system voltage;
f) class of protection aga inst electrical shock (as defined in IEC 61140 and IEC 61730-1);
g) voltage at ope n-circuit or Voc including tolerances. For bi bifacial
facial m odules, open -circuit
voltage shall be reported at two irradiance levels. The first required irradiance level is
1 000 W/m2. The second requir
required
ed irradiance iiss BNPI
BNPI,, as defined iin
n 3.
3.11.
11.
h) current at sho rt-circuit or Isc iincluding
ncluding tolerances. For bifaci
bifacial
al mo dules, short-circuit
curre nt shall be reported at two irrad iance leve ls, defined in 5.1g).
i) mod ule maxim um pow er or Pmax including binning and toleran ces as defined in 3.3.1
1 and
3.2. For bifacial modules, Pmax shall be reported at the two irradiance levels, defined in
5.1g).
j) Fo r b ififac
ac ia l m od ul e s th e fo llo w in g in fo rm a tio
ti o n in cl u d in g to le ra n c e s, sh a ll b e given on the
nam eplate: The values for the short-circuit current b ifaciali ifaciality
ty coe ffici
fficient
ent tpl
tplsc
sc,, the
theopen-
open-
circuit voltage bifaciality coefficient cpVoc, and the maximum power bifaciality coefficient
cpPmax, measured at STC as defined in IEC TS 60904-1-2.
k) For flexible modules, the mini
minimum
mum radius of curvature.

For items a) throu gh i) al

alll electrica l data sh all be shown as relative to STC (1 000 W/m 2,
25 °C,
°C, AM1.5 according to IEC TS 61836), e xcept for bifacial mod ules where two irradiance
irradiance
levels are required, as defined in 5.1g).

International symbols shall be used where applicable.

Compliance of marking is checked by inspection and MQT 06.1.

5.2 Documentation

5 ..2
2 ..1
1 Minimu m requirem ents

Modules shall be supplied with documentation describing the methods of electrical and
mechanical installation as well as the electrical ratings of the module. The documentation
shall state the class of protection against electrical shock under which the module has been
qualified and any specific limitations required for that class. The documentation shall assure
that installers and operators receive appropriate and sufficient documentation for safe
installation, use, and maintenance of the PV modules.

NOTE It is
is considered to be sufficient
sufficient that one set of documentation is suppli
supplied
ed with the module shipping unit
unit..

5 . 2.
2. 2 Inform ation to be given in the doc um entation
a) all information required u nder 5.
5.1
1 e) to ii),
), and iin
n addition j) ffor
or bifacial mo dules and k) for
flexible modules;
b) reverse current overload rating iin
n accord ance with IE
IEC
C 6173 0-2 MST 26;
 - 14 - IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IEC 2021

- overcu rrent protection de vice type and rating are e.g. given in IEC 60269-6.
Overcu rrent protection devices with a 1 h, 1,35 /n overload rating, whe re /n is
is the
the rated
value of the overcurrent protection device, are recommended;
- recommen ded maximum series/parallel PV module configurations;
c) m anufacturer’s stated tolerance for Voc, /sc and maximum power output under standard
test cond itions;
itions;
d) tempe rature coefficient for voltage at ope n-circuit;
e) tempe rature coefficient for maximum power;
f) tempe rature coefficient for short-circuit current.

All
A ll e le ct ri
ricc a l da ta m en tion
ti on ed ab ov e sh al l be sh ow n as re la tiv
ti v e to st a nd a rd te st co n d ititio
io n s
(1 000 W/m2, 25 °C, AM 1.5 a ccording to IEC TS 61836). M oreover the following parame ters
shall be specified:

g) performance at low irradiance ((MQT

MQT 07)
07)..

International symbols shall be used where applicable.

Compliance is checked by inspection and MQT 04 through MQT 07.

The electrical docum entation shall include a detailed de scripti

scription
on of the electrical install
installation
ation
wiring method to be used. This description shall include:

h) the minimum cable diameters for modules int

intended
ended for field
field wir
wiring;
ing;
i) any li
limitations
mitations on wiring methods and wire man agem ent tthat
hat apply to tthe
he wiri
wiring
ng
compartment or box;
j) th e si
size
ze , ty p e, m a te ri
riaa l and
an d te m p e ra tu re ra ting
ti ng o f th e co n d u ct o rs to be us ed ;
k) type of terminals for field wir
wiring;
ing;
I) specific PV connec tor model/types and man ufacturer to which the module connectors shall
shall
be mated. Statement of the connector type only (such as "MC4 compatible ") is not
sufficient information to satisfy this requirement. Connector model/types and
manufacturers shall be included;
m) the bonding method(s) to be used (if app licable); al
alll provided or specified hardware shal
shalll
be identified in the documentation;
n) the ttype
ype and ratings of bypass diode to be used (if app licable);

o) limitati
limitations
ons to tthe
he mounting situation (e.g.
(e.g.,, slope, orientation, mounting means, cooling);
p) a state m ent indicating the fi
fire
re rating(s) and the applied standard as well as the limitations
to that rating (e.g., installation slope, sub structure or other applicable installation
information);
q) a statement indicating the desi
design
gn load per each mechanical m eans for securing the
module as evaluated during the static mechanical load test according to MQT 16. At
discretion of the m anufacturer the test load an d/or the safety factor ym may be noted, too.

To allow for increased output of a module resulting from certain conditions of use, the
installation instructions shall include relevant parameters specified by manufacturer or the
following statement or the equivalent:

"Under normal conditions, a photovoltaic module is likely to experience conditions that

produce more current and/or voltage than reported at standard test conditions. Accordingly,
th e va l u e s o f Isc a n d Vo c ma r ke d o n th i s mo d u l e sh o u l d b e m u l tip
tip l i e d b y a fa cto r o f 1 ,2 5
when determining com ponen t voltage voltage ratings, con ducto r current ratings, and size of controls
co n n e cte d to th e P V o u tp u t."
IEC 61215-1:2021 © IEC 2021 -15-

5 ..2
2 ..3
3 Ass embly instruction s

These shall be provided with a product shipped in subassemblies, and shall be detailed and
adequate to the degree required to facilitate complete and safe assembly of the product.

6 Testing

The test laboratory shall use a laboratory simulator control module to be able to detect drifts
in their measurement results. The laboratory simulator control module is different than the
control module from sequence A, which is taken from the modules under test and is described
in 7.2.3 related to the reproducibility r. The laboratory simulator control module is a stable
module used on a periodic basis to check simulator output after calibration to a specific
irradiance.

The modules shall be divided into groups and subjected to the qualification test sequences in
Figure 2. Qualification test sequences are to be carried out in the order specified. The MQT
designations in tthe
he boxes refer to the corresp onding test definitions in IEC 61215-2.
Technology-specific test details are listed in the respective parts of this standard. Required
module component tests are listed in Table 1. For each component qualification, the test
report shall note the test laboratory name and date when the requirement was met. Prior
certifications may be used to fulfill these requirements, as long as the certifications were
performed in accordance with all conditions noted in Table 1.

Intermediate measurements of maximum power (MQT 02) and insulation test (MQT 03) are
not required, but they may be used to track changes.

A ny si ng le te st e xe cu te d in d e p e n d e n tly
tl y o f a te s t se qu en ce , e. g. , on sp e ci a l te st sa m p le s fo r
MQT 09 and MQT 18, shall be preceded by the initial tests of MQT 01, MQT 02, MQT 03, and
MQT 15 as appropriate.

In carrying out the tests, the tester shall strictly observe the manufacturer's handling,
mounting, and connection instructions. Sequence A may be omitted if the module type has
been tested according to IEC 61853-1. In this case the relevant test results from IEC 61853-1
shall be stated or referenced in the final report. For bifacial modules Sequence A cannot be
omitted until IEC 61853-1 has been amended to take bifacial modules into account.

Test conditions are summarized in Table 3. The test levels in Table 3 are the minimum levels
required for qualification. If the laboratory and the module manufacturer agree, the tests may
be performed with increased severities. In this case this shall be noted in the test report.

For flexible modules (see 3.6), the mounting substrate and adhesive or attachment means
shall also be included in the test. If more than one mounting substrate or adhesive or
attachment means is allowed per the manufacturer's specification, then the tests shall use the
combination that is considered to be the worst case. The chosen combination(s) shall be
reported, as per Clause 9, j).
 -16- IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IEC 2021

i
1 Module 1 Module 2 Modules 2 Modules
Sequence A Sequence B Sequence 0 Sequence E
____L____
_L ___ I
MQT07
MQT 08 Outdoor MQT 10 MQT 11 MQT 13
Performance
Exposure Test UV preconditioning test Thermal cycling test Damp heat test
at low
60 kWh/mJ 15 kWh/m2 200 cycles 1 OOOh
irradiance d
-40 *C to 85 "C 85 ’ C / 85 % RH
1 ;
MQT04 MQT 18 1 MQT 20
Measurement of Bypass diode Cyclic (dynamic) mechanical
temperature thermal
thermal test a load test
coefficientsa 1 000 cycycles
cles at 1000 Pa
1 Module ‘ 1 Module
MQT 19.2
Final Stabilization MQT 11 MQT 16 MQT 17
Thermal cycling test Static mechanical Hail test
50 cycles load test
MQT 06 1 -4 0 °C to 85 aC (design load)
Performance at STC
MQT 12
Humidity freeze test
10 cycles MQT 22
MQT 09 Bending test
- 4 0 °C to 85 *C
Hot-spot Flexible module only
85 % RH
endurance test' 25 cycles

MQT 18 2
Bypass diode
functionality test MQT 14.1
Retention of junction
box test

1 Module
measured together with modules
from sequences B-E as control
and to determine reproducibility r

MQT 19.2
Final stabilization

MQT 06 1
Performance at STC

MQT 03
Insulation test

MQT 15
Wet leakage current test

a If the bypass diodes are not acce ssible in the standard mod ules, a special samp le can be prepared fo r the
bypass diode thermal test (MQT 18.1). The bypass diode should be mounted physically as it would be in a
standard module, with lead wires attached, as required in MQT 18 of IEC 61215-2:2021. This sample does not
have to go through the other tests in tthe
he sequence.
b In sequence B, a differe nt module may be used for the Hot-spot enduran ce test (MQT 09) than is
is used for the
bypass thermal diode test (MQT 18.1). For this separate module the following test sequence is permissible:
MQT 01, MQT 19.1, MQT 06.1 (gate 1), MQT 03, MQT 15, MQT 09, and MQT 18.2.
IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IE C 2 02 1 - 1
177 -

c The initi
initial
al stabilization MQT 19.1 may include the verification o f an alterna te stabilization proce dure (see
IEC 61215-2:2021).

d In Seque nce A. tests MQ T 0

07,
7, and MQT 0 04
4 may be
be performe d in any order. These tests may also be
be perform ed
on separate modules (rather than sequential tests on one module), provided that each module used has
proceeded through the entire test flow preceding sequence A.

6 If repr esen tative samples are utili

utilized
zed in Sequen ce E, one extra module, full-sized, is required, and shall be
subjected only to MQT 16 and the requirements therein.

F i g u r e 2 - F u ll
ll t e s t f l o w f o r d e s i g n q u a l i f i c a t i o n a n d t y p e a p p r o v a l
o f p h o t o v o l t a iic
c module es s

T a b le
le 1 - R e q u i r e
edd co mp onent tests

Co m p o n en t S h a l l p as s t h i s t e s t

J un
un ct
ct io
io n b o
oxx IE C 6 1
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155 -2
-2 :2
:2 01
01 x M Q
QTT 1
14
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hiic h c itit es
es IE
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e o
obb ta
ta iin
need
d w itit h th
th e cco
onnn
neec
c to
to r in co
co m bi
bi n a
att io
io n wi
wit h
the same cable size and type as used in the modules under test.

7 Pass cr iteria

7.1 General

Modules under test are subject to several types of requirements. These include required
markings (detailed in Clause 5), comparison of measured electrical quantities with the
namep late ( "gate No. 1 ”, detai
detailed
led in tthis
his clause), comparison of measured pow er before and
after stress ( "gate No. 2 ", detailed in this clause), component requirements (detailed in
Table 1), and the requirements of each MQT (summarized in Table 3 and Figure 2).

The design is deemed to have met the qualification requirements of 7.2.2 gate No. 1, if they
meet the requirements of Table 2:

Table 2 - Sum m ary of Gate No. 1 requirem ents

S a m p l e s i z e (i n m o d u l e s ) R eq u i r em en t

<1 0 A l l m o d u le s s h a ll p a s s . N o f a i l u r e is a l lo w e d .

>1 0 A s i n g le f a i lu r e is a llo w a b le . A ll o t h e r m o d u le s s h a ll p a s s .

NOTE A sample size

size <10 is only encountered during
during retesting.

If modules fail to meet the requirements listed in Table 2 then two new samples shall be
tested for each
each of tthe
he m odules that fail
failed
ed to meet the gate No. 1 criteria. If a new
failure occurs, the module supplier has two options. The first option is that the module labels
for the existing sample set shall be redefined such that the requirements of Table 2 are met,
and testing on that same sample set shall continue to the next step. The second option is that
the design is deemed not to have met the qualification requirements, and any further testing
constitutes a new attempt at qualification and thus requires a completely new batch of
modules. Module labels shall be redefined and samples shall be resubmitted for testing.
 -18- IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IEC 2021

In addition, if two or more modules fail to meet the remaining test criteria (7.2.3 Gate No. 2,
7.2.4 electrical circuitry, 7.3 visual defects and 7.4 electrical safety), the design shall be
deemed not to have met the qualification requirements. If one module fails any test, two
additional modules meeting the requirements of Clause 4 shall be subjected to the entire
series of tests of the respective test sequence. The requirement for two additional modules
applies for tests where originally only one module was required, as well as for tests where
originally two modules were required. For example, a failure in the hot-spot endurance test
requires a test repetition with two additional modules. A single failure in the 50 thermal cycles
test (one module not meeting the test requirements) requires a test repetition with two
additional modules as well.

If one or both of these modules also fail, the design shall be deemed not to have met the
qualification requirements. If, however, both modules pass the test sequence, the design shall
be judged to have met the qualification requirements.

The module design shall meet the requirements of all criteria to be deemed as qualified
according to this docume nt. Each test sample shall be subject to the foll
following
owing crit
criteria.
eria.

7 ..2
2 Power outpu t and electric circuitry

7 ..2
2 ..1
1 Identificatio n of rated values and toleranc es

Gate No. 1 criteria detail

detailed
ed in the ffollowing
ollowing su bclauses require use of rated values an and
d
tolerances from the nameplate and product datasheet. This clause describes in detail, with
examples, how to identify the relevant information. Application of the information in this clause
results in consistent requirements when extraneous information is given, or when information
appears to be missing or conflicting. Rated values and tolerances shall each be identified for
module power, short-circuit current, and open-circuit voltage. Thus, this clause details how to
identify these six pieces of information.

NOTE 1 Historically, some products have quoted quoted multiple components of uncertainty, or have used different
different
terminology for uncertainty, such as "tolerance," "production tolerance," "measurement uncertainty,” etc. Also,
some products have not provided a tolerance, which might be interpreted as 0 % tolerance or as missing
information. While a manufacturer is not prohibited from providing additional information, or having 0 % tolerance,
application
application o f the rules in this clause provide a cons istent manner to interpret such situations.

Information identified in this clause relates to STC current-voltage measurements, obtained in

the manner prescribed by following the flow chart of Figure 2. Thus, the obtained values are
those measured only after initial stabilization performed according to IEC 61215-2 MQT 19.1.
Required stabilization procedures may differ from one product to the next, as specified in the
technology-specific parts IEC 61215-1-x. The calculation of tolerances is the responsibility of
the module manufacturer. Each tolerance (^, t2 and /3) shall be explicitly stated as a single
value for each of the performance parame ters (Z ^ x , Pqc ar ar,d
,d c rrespectively).
espectively). For bifaci
bifacial
al
modules, the six pieces of information (values and tolerances for module power, short-circuit
current, and open-circuit voltage) shall also be identified at BNPI to evaluate Gate No. 1.

NOTE 2 ISO Guide 98-3

98-3 provides further guidance regarding how to combine m ulti
ultiple
ple sources of uncertainty.
uncertainty.

Formulas (1) and (2) in 7.2.2 verify that the modules produce at least as much power as the
minimum indicated by combining the nameplate rating and tolerance. The minimum nameplate
power rating, Pmax(NP) is the module power output specified on the nameplate. If a single
value for module power is stated on the nameplate, /’maxCNP) is simply that value. If a range
of module
module powers is s tated
tated on tthe
he nameplat
nameplate,
e, ^ ^ ( N P ) is th
the
e power at the lowes t end of that
range. Subclause 5.2.2 requires that power binning and tolerance information from the
nam eplate is reprod uced in the data shee t. In the case that />max(NP) derived from the
datasheet is different than that on the nameplate, the module shall be judged as not satisfying
5.2.2 and thus does not meet the requirements of IEC 61215-1.
IEC 61215-1:2021 © IEC 2021 -19-

The tolerance, /1t is the tolerance in % for Pmax stated on the nameplate and datasheet, as
required by 5 5.1
.1 i) and 5.2.2a ). If the toleran ce is asymm etric abo ut ^ max(N
x(NF F>)« the toleran ce
referring to the low pow er limit shall be utilized as ^ . If the toleran ce is not st stated
ated on the
namep late or is not stated on the datashee t, then / 1 = 00.. If tolerance is not rreduced
educed to a single
value on the nameplate or data sheet (for example, if multiple tolerances or measurement
uncertainty components are specified) the smallest number, not a combination of multiple
numbers, shall be utilized.

Formulas (3) and (4) verify, for safety reasons, that the module does not produce more
voltage at open circuit, or current at short-circuit, than the maximum indicated by combining
the nameplate rating and tolerance. The maximum open circuit voltage ^0C(NP) and maximum
sho rt-circuit curre nt /S
/SC
C(NP) are those spe cified on the na me plate. If a range for ope n-circu it
voltage s or sho rt-circu it currents is st
stated
ated on the nam eplate, ^0^0C
C(NP) or /S/SC
C(NP) is to be taken
as the highest value in that range. The tolerance (/2 for open circuit voltage, or /3 for short-
circuit current) is that specified on the nameplate and in the product documentation, as
required by 5.1g), 5.1 h), and 5.2.2 c). If t2 (or /3) is asym m etric a bo ut K0C(NP) (or /S
/SC
C(NP )), the
tolerance referring to the higher end of the range shall be utilized. If t2 or /3 is not stated in
the documentation and on the nameplate, that tolerance shall be identified as 0. In the case
that K0C(NP), / SC(NP), or the tolera nce s in these q uan tities are d ifferen t when de rived from the
datasheet than from the nameplate, the module shall be judged as not satisfying 5.2.2 and
thus does not meet the requirements of IEC 61215-1. If a tolerance is not reduced to a single
value on the nameplate or data sheet (for example, if multiple tolerances or measurement
uncertainty components are specified) the smallest number, not a combination of multiple
numbers, shall be utilized.

Figure 3 shows partial nameplates, datasheets, and derived values for four hypothetical
products. These examples illustrate the rules for identifying rated values and tolerances that
were described in the preceding subclauses.
 - 20- IEC 61215-1:2021 © IEC 2021

Product Z300W Product 2 series

Electrical Data at STC
Maximum power { P ^ ) 300 W
±3% Peak power watts ±3 % - /' (1M(W) 300 305 310
Maximum
Maximum power voltage (F^ ) 37 V Maximum power voltage - »'^ (V) 37 37.2 37.5
^ (N
(NP)
P) = 3
300
00 W: /, = 3 %
Maximum power current (7„J 8.1 A Maxim um po
power curre nt ((7
7^,) (A) 8.1 82 8.27 »'K (NP) = 45,9 V; i, = 5 %
Open circuit
circuit voltage1(K J Open circuit voltage" - (V ) 45.9 45,9 45.9 /k (N
(NP)
P) = 8.9A ./, = 5%
45.9 V
Short circuit current* (/K) Short circuit current* - Ix ((A
A) 8.9 8.92 8.98
8.9 A
Ma
axxi mu
mu m DC ssyy sstt em
em vvo
ol ta
ta ge
ge 1 0 00
00 V Module efficiency - (%) 14 14.2 14.4

1+5 % / - 0 % tolerance tS % /-0 % ttole

oleran
rance
ce on / and »'
»'

Product X series
Product X300W Electrical Data at STC

Manm um power ( / >niM) 29 6 t o Peak

Peak pow
power
er wat
watts*
ts* - ^ ( W ) 296 to 301 to 306 to ^ (N
(NP)
P) = 2
296
96 W; /, = 0 %
300 W 300 305 310 Vm (NP) = 45.9 V; r2= 4 %
Maxim um
um po
pow e
err vvo
olt ag
ag e ( F ^)
^) 37 V Ma
axxi mu
mu m po we
we r vo lt ag
ag e - J’^ f V ) 37 37.2 37.5 A* (NP) = 8.9 A; /, = 4 %
Maxim um
um po
pow e
err cu
cu rrrre n
ntt (7
(7 ^^)) 8.1 A Maximum power current (7„J (A) 8,1 8.2 8.27
Open cciir cuit voltage* (l
(l '„'„ ) 4 5 .9 V Open circuit voltage* - Vm ((VV) 45.9 45. 9 45,9 If /, is not specified, it is
Short circuit current* ( /K) 8. 9 A Short orcwt current*
current* - lv ((A
A) 8, 9 8.92 8,98 taken to be 0.
Ma
axx «
«n
nuum
mDDC
C sy
sys te
tem v ol
ol ta
tag e 1 0 00
00 V Module efficiency - rjm(%) 14 14.2 14,4
1±4 % productio n tolerance * 14 % production tolerance

Product Y series
Product Y300W Electrical Data at STC
Maximum
Maximum power
power ( f ^ ) 300 W Peak power watts - P ^ ( W ) 3C0 305 310
±3 % / -0 (NP) = 300 W; /, = 0 %
Power output toleranc e (%) ■0
0// +
+3
3 - 0/
0/ + 3 - 0 //+
+3 VK (NP) = 45.9 V; r2= 2%
Maximum pow er voltage ( 37 V Maximum power voltage - J ' ^^ff V
V)) 37 37.2 37.5 Ac (NP) = 0.9 A: / j = 2 %
Maximum p poow er current ( / ^ 8.1 A Maximum power
power curr
current
ent (/ ^) (A) 8.1 8.2 8,27
Op e
en
n cciircui t vo lt ag
ag e * b (1
(1'^) 455.. 9 V t3 is not reduced to a single
Open circuit voltage * b• Vx ((V
V) 45.9 45.9 45,9 value. Thus, the smaller
Short circuit c urrent **■ (/m) 89 A Sh o
orrt c ircu it ccu
u rrrre n
ntt * “ - / „ ( A
A)) 8, 9 8.92 8,98 value is chosen
chosen The same
Ma
axxi mu
mu m DC sy
sy sstt em
em vvo
o lt ag
ag e 1 0 00
00 V Module efficiency - n„ (%) 14 14.2 14,4 situation exists for t3
t3..
* ±2 % measurement uncertainty
* ±2 % measurement uncertainty
• ±10 % tolerance
tolerance on /„ and Vx *•HO % tolerance on Ix and

Product T300W Product T series

Electri cal Data at STC
Maximum power ( P ^ ) 300 W
Power selection (±5 W) Peak power watts* - (W) 300 310
Max
Max imum
m um p
po
o we
we r v olt
olta
a ge
ge ( T^) 37 V Maximum pow er voltage - r ^ ((V
V) 37 37.5
Farts to meet requirements
Maximum power current (/^J 8.1 A Maximum power current (1 ^ ((A
A) 8,1 8.27 of IEC 61215-1 5.2.2.
Open circuit voltage ( 1^1^ ) 4 5 .9 V Open circu it voltage* - r K ((V
V) 45. 9 45. 9 low er edge of power bin is
Shor t circuit cu
current (7
(7k ) 8. 9 A 295 W on nameplate, but
Short a r c u it curre nt* - (A) 8, 9 8.98
is 300 W on datasheet
Ma
Maxi
ximum
mum DC sy
syst
stem
em volt
voltag
age
e 1000 V Module efficiency - ijn (%) 14 14.4
±3 % tolerance on Ix ,
* ±3 % tolerance on P ^ , I K
K,, ^

IEC

F i g u r e 3 - E x a m p l e s o f h y p o t h e t i c a l p a r t i a l n a m e p l a t e s ( le
l e f t c o l u m n ) , d a t as
as h e e t s ( c e n t e r
column), and derived rated values and tolerances (right column)

7 .2 .2
.2 V e r i f i ca t i o n o f r a te d l a b e l va l u e s —> G a te No . 1

All
A ll m od ul e s sh a ll be st a b ililiz
iz e d fo llo w in g m et h od MQ T 19.1 fr om IE C 61 21 5- 2 :2 0 21 (f or
technology specific requiremen ts, see sub-pa rts of IEC 61215 -1). After stabilization the
mo dules shall be m easured in acco rdan ce with M QT 6. 6.1
1 (/ >max(
max(Lab
Lab )) and shall meet the
foll
following
owing criteri
criteria:
a:

/'
/'max
max verification :

Each individual module shall meet the following criterion:

Pmax(La h) X ( l + > PmaA N P ) x ( l - j ^ ) ( 1)

IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IE C 2 02 1 -2 1 -

where

P max (Lab) is the measured maximum power at STC of each module in the stabilized state;

/'max (NP) is the minimum rated nameplate power of each module without tolerances;

'"1 is the measurement uncertainty in % of laboratory for Pmax (expanded

combined uncertainty (k=2), ISO/IEC Guide 98-3); the factor 1,65/2 is used to
convert the confidence intervals from
from tw o-sided to one -sided at 95 % level of
confidence; m shall include a component from spectral mismatch, based either
on measured spectral response or the worst-case possibility for a given
technology type; m -j shall be less than stated in the tech nolo gy sp ecific parts of
this standards series;
^ is the m anufa cturer’s rate
rated
d lower tolerance in % for Pmax.

F o r ,Pmax(Lab) the following criterion shall apply:

Pn a x { l a b ) x ( l + ^ > Pm a x (N
(N P ) (2 )

where

Pmax(Lab ) is the arithmetic average of the measured maximum S

STC
TC power of the modules
in stabilized condition.

For multiple bins of power classes this formula has to be applied to each power class under
investigation.

NOTE Formula (2) iis s not intended

intended for power verifi
verification
cation of a batch iin
n mass production as systematic dif
differences
ferences
between different labs and reference devices are unavoidable. In such cases, formula (1), which includes the
relevant uncertainties, better d escribes the application
application to average values.

VOC ve rifi
VOC rification:
cation:

Each individual module shall meet the following criterion:

Ifc O a b ) x ( l + < IU N P) x (

where

vo c (Lab) is the measured maximum ^o c of each module in the stabilized

stabilized sstate;
tate;
»OC (NP) is the maxim um rated nam eplate v o c of each module without tolerances;
m2 is the measurement uncertainty in % of laboratory for V O C ’ (expanded
uncertainty (k=2), ISO/IEC Guide 98-3); the factor 1,65/2 is used to convert the
confidence intervals from two-sided to one-sided at 95 % level of confidence;
t2 is the ma nufacture r’s rated upper tolerance in % for ^oc-

If Voc cannot be measured due to module-integrated electronics (such as MOSFETs), the

module is exempt from the Voc verification requirement. This exemption shall be noted in the
test report. Voc shall not be determined by any means other than direct measurement, such as
extrapolation.

/sc verification:
 -22- IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IEC 2021

Each individual module shall meet the following criterion:

/sc(La b ) x (4)

where

^sc (Lab) is the measured maximum I s c of each module in the stabilized state;

/ SC (NP) is the maximum rated nameplate I s c of each module without tolerances:

is the measurement uncertainty in % of laboratory for I s c \ (expanded
uncertainty (k=2), ISO/IEC Guide 98-3); the factor 1,65/2 is used to convert the
confidence intervals ffrom
rom tw o-sided to one-sided at 95 % level of confidence:
is the manufacturer’s rated upper tolerance in % for I s c .

If /sc cannot be m easured due to m odule-integrated e lectronics (such as MO SFETs), the

module is exempt from the /sc verification requirement. This exemption shall be noted in the
test report. /sc shall not be determined by any means other than direct measurement, such as
extrapolation.

/\nax verification of lowest power class:

Each individual module that is used for the qualification of low end power classes shall meet,
in addition to the previous stated criteria for P max, Vo c and /sc, the following criterion relating
to an upper power limit:

(5)

where

Pmax4 (Np) is the maximum rated

rated nam eplate power of each lowest power class module, without
tolerances;
is the manufacturer’s rated upper tolerance in % for Pmax4(NP). i A is selected
subject to the same rules as for /1 (see Figure 3), except that if the tolerance is
asymmetric about /,maX4 (NP)> the tolerance referring to the high power limit shall be
utilized.

The last criterion ensures that the modules of the lowest power class stay within the upper
tolerance of that class. The last criterion is only applicable for the qualification of the lowest
power class. It ensures that a module manufacturer can make modules in the lowest power
class that are free from major flaws, and thus the lowest power class is not used as a
repository for damaged modules after qualification is obtained using severely underrated
modules.

For bifacial modules, Pmax, /sc, and Voc shall each be measured at the two irradiances
specified in 5.1. The Gate No. 1 criteria for Pmax
Pmax,, /sc, and Voc shall be applied at both
irradiances.

A sy st e m a tic
ti c va ri
riaa tio n to e it h e r hi g he r or lo w e r ou tp u t p ow er o r b if a c ia lility
ty co e ff ic ie n t w ill be
stated in the final report.
IEC 61215-1:2021 © IEC 2021 - 23-

7 . 2.
2. 3 M a x i m u m p o w e r d e g r a d a t i o n d u r i n g t y p e a p p r o v a l t e s t i n g —>
—> G a t e N o . 2

At th e en d o f ea ch te st se qu en ce or fo r se qu e nc e B a ft e r b yp a ss d io d e te st , th e m ax im um
power output drop of each module Pmax (Lab_GateNo. 2) shall be less than 5 %, referenced
to the module’s initial measured output power Pmax (Lab_GateNo. 1). Each test sample shall
meet the following criterion:

Pmax( L a b _ G a t e N o . 2 ) > 0 ,,9

9 5 X Pmax ( L a b .G
.G a t e N o . 1 ) • ( l - ^ ) (6)

The reproducibility /• in % shall be determined for Pmax and shall be used in the formula. The
reproducibility shall be less than or equal to that stated in the technology specific parts of this
standards series.

The reproducibility /• is verified by comparing the control module(s) from sequence A after
initial stabilization (beginning of the test) and after final stabilization (end of tests from
sequence B to E). The second test shall be performed after completing all tests. The following
applies:

a) All modules from sequ ence s B (after MQT 18.1), C, D and E are measu red toge ther with
one control module from Sequence A.
b) If a) cannot be use
used
d due to test flflow
ow (different completion time of sequence or ccustomer
ustomer
requests restrictions) the following applies:
For each sequence B (after MQT 18.1), C, D and E one control module from sequence A
shall be defined. The control module is stabilized and measured together with the modules
from the applicable sequence B (after MQT 18.1), C, D or E. For each determined value r
the requirement for r shall be fulfilled.

The reproducibility parameter r is not equal to the total measurement uncertainty of

MQT 06.1. It is advisable that the same solar simulator is used for Pmax (Lab_Gate No. 1) and
Pmax (Lab_Gate No. 2).

If the measured /- exceeds the technology specific limit for the control module the laboratory
needs to check with its own internal reference module(s) whether the test equipment is faulty,
or the module under test is responsible for the poor reproducibility, or it is not in a stable state
after applied procedure MQT 19.1. If all checks confirm the measurement equipment is
performing correctly, this indicates that the control module has drifted by more than the
technology sp ecific li
limit.
mit. In this case, proceed by usin
using
g the techn ology sp ecific li
limit
mit for r.

For bifacial modules, Gate No. 2 shall each be assessed only at the larger irradiance (BNPI)
spe cified in 5.1 g).

7 . 2.
2. 4 Electrical circu itry

Samples are not permitted to exhibit an open-circuit during the tests.

7 ..3
3 Visual defects

There is no visual evidence of a major visual defect, as defined in Clause 8.

7.4 Electrical safety

a) The insulati
insulation
on test (MQT 03) requirem ents are met at the beginning and the en
end
d of eac
each
h
sequence.
b) The wet leakage current ttest
est (MQT 15) requirements are met at the beginning and the
the end
end
of each sequence.
c) Specific requirements of the iindividual
ndividual ttests
ests are met.
 -24- IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IEC 2021

8 Major visu al defects

The purpose of the visual inspection is to detect any visual defects that may cause a risk of
reliability loss, including power output.

In some instances more detailed inspection may be required to finally decide if major visual
defects e xist or not.

For the purpose of design qualification and type approval the following observations are
considered to be major visual defects:

a) Broken, cr
cracked,
acked, or torn external surf
surfaces.
aces.
b) Bent or misaligned external surfaces, including superstrates, substrates, frames and
ju n c ti o n bo xe s to th e e xt e n t th a t th e o pe ra tio
ti o n o f th e PV m od ul e w ou ld be im p ai re d .
c) Bubbles or delam inations forming a continuous path between electric circuit and the
the edge
of the module.
d) If the mech anical iintegrity
ntegrity depends on lamination or other means of adhesion,
adhesion, the sum
sum of
the area of all
all bubbles shall not exceed 1 % of tthe
he total module area.
e) Evidence of any molten or burned encapsulant, backsheet, frontsheet, diode or act
active
ive PV
component.
f) Loss of mechanical integrity to tthe
he extent tthat
hat the iinstallati
nstallation
on and operation of the module
would be impaired.
g) Cracked/broken cells whic
whichh can remove m ore tha than
n 10 % of the cell’s photovoltaic act
active
ive
area from the electrical circu it of the PV m odule.
h) Voids in, or vi
visible
sible corrosion of any of the layers of the active (live)
(live) circuitry of the module
extending over more than 10 % of any cell.
i) Broken interconnections, joints or terminals.
j) A ny s h o rt -c ir
ircc u itite
e d liv e p ar ts o r ex po se d liv e e le ct ri
rica
ca l pa rts .
k) Module m arkings (l
(label)
abel) are no llonger
onger attached or the information is unreadable.

9 Report

Following type approval, a report of the qualification tests, with measured perform ance
characteristics and details of any failures and re-tests, shall be prepared by the test agency.

The
leastreport shall contain
the following the detail specification for the module. Each test report shall include at
information:

a) a title;
b) name and address of the test llaboratory
aboratory and location where the test
testss were carri
carried
ed out;
c) unique iden tification of the report and of each page;
d) name and addr
address
ess of client, where appropriate;
e) des cription and iden tification of the iitem
tem tested, including indica tion if iitt has bee
been
n
evaluated for bifaciality and/or w hether it is
is has been evaluated asa
asa flexible module;
f) characterization and condition of the test item;
item;
g) date of receipt of test it
item
em and date(s) of test
test,, where appropriate;
h) identification of test methods used
used;;
i) reference to sampling procedure, where re
relevant;
levant;
j) an y d e vi a titio
o n s fr om , a d d ititio
io n s to , o r e xc lu si o n s from
fr om , th e te st m et ho d an d an y o th e r
information relevant to specific tests, such as environmental conditions, or the irradiation
dose in kWh/m2 at which stability is reached;
IEC 61215-1:2021 © IEC 2021 - 25-

k) mea surements, examina tions an

andd derived resul
results
ts supported by tables, graphs, sketches
and photographs as appropriate including:
- tempe rature coefficients of sho rt-circuit current, open-circuit voltage an
and
d peak power,
- power at STC and low irradiance,
- bifaciality coefficients at STC a
and
nd llow
ow ir
irradiance
radiance (for bifaci
bifacial
al modules),
- the maxi
maximum
mum shaded ccell
ell tempe rature observed duri
during
ng tthe
he hot-spot endurance test,
- spectrum of the llamp
amp used for the UV preconditioning ttest,
est,
- mounting method(s) util
utilized
ized iin
n the static mecha nical load test,
test,

- the positive/negative test lloads

oads and tthe
he safety factor ym used in the static
staticmechanical
mechanical
load test,
- hail ball diame ter a
and
nd velocity us
used
ed iin
n the
the hail test,
- maximum power lloss
oss observed after all of the tests,
- for flexible modules, the di
diam
am eter of the cyl
cylinder
inder over which the module was be
bent
nt
during performance of MQT 22, and
- conditions of potential induced degrada tion (PI
(PID)
D) ttest
est ((MQT
MQT 21) includi
including
ng applied rrated
ated
system voltage, polarities, and mounting configuration;
- choice of test method where procedures allow more than one oneoption
option (e.g.
(e.g.Method
Method A or
B in MQT 18.2; final stabilization method in MQT 19.2, etc.)

- if open -circuit voltage, short-circuit current, or associated ttem

em perature coefficients
cannot be measured due to module-integrated electronics, these quantities shall be
reported as "not measurable due to module-integrated electronics." Any resulting
exem ptions from Gate 1 requiremen ts on /sc or Voc shall also be noted.
I) any failures observed an
and
d any rretests
etests performed;
m) a representation of the markings of the module type including manufacturer's power
tolerances;
n) the ttest
est lab na
name
me and date, for each compo nent qualification required in Table 1;
o) a sum ma ry of results from all pass criteria defined in Clause 7 in abso lute and relative
change. If tenden cies to either higher or lower values are observed this has tto
o be incl
included
uded
in the report. The used stabilization procedure (irradiance, temperature, time) needs to be
stated in detail;
p) a st
statem
atem ent of tthe
he estimated u ncertainty of tthe
he test results (where relevant); state the
reproducibility r from the control module that is used for Gate No. 2.
q) a signature and tit
title,
le, or equivalent identifi
identification
cation of the person(s) accepting
accepting res pons ibility
ibility
for the content of the report, and the date of issue;
r) where relevant, a statement to tthe
he effect that the results rrelate
elate only to tthe
he items tested;
tested;
s) a st
statem
atem ent that the report shall not b
be
e reproduced e xcept in ffull,
ull, without the writt
written
en
approval of the laboratory.

10 Modifications

Changes in material selection, components and manufacturing process can impact the
qualification
qualification of tthe
he m odifi
odified
ed product.

Retesting shall be performed according to IEC TS 62915. The recommended test sequences
have been selected to identify adverse changes to the modified product.

During retesting, tests that are performed on representative samples do not need to be
repeated if the only change to a product is one of size, and the change in product size still
allows use of the same representative sample size already tested.
 -26- IEC 6 1215-1:2021 © IEC 2021
IEC

The number of samples to be included in the retesting program and the pass/fail criteria are to
be taken from the relevant clauses/subclauses of this document.

11 Test flow and procedur es

For design qualification and type approval the following test flow and procedures apply.
Table 3 summarizes the different tests. The full test flow is given in Figure 2. A description of
the tests and test procedures is given
given in IEC 61215 -2:2021. T echno logy-relevant differences
are described in the respective technology specific part of this standards series.

T a b le
le 3 - S u m m a r y o f t e s t l e v e
ell s

T es t S u b c l a u s e in Title T es t c o n d i t i o n s
IEC 61215-
2:2021

M Q T 01 4.1 V i s u a l i n s p e c t io n S e e l i s t o f m a j o r v i s u a l d e f e c t s in C la u s e 8
M Q T 02 4.2 Maximum power See IEC 60904-1 for monofacial modules and
determination IEC TS 60904-1-2 for bifacial modules
MQT 03 4. 3 I n s u la t i o n te s t T e s t le v e ls v a r y b e t w e e n 50
50 0 V mi
min im u m an
an d
1,35 x (2000 + 4 x Fsys) maximum depending on system
voltage, module class, and presence of cemented joints.
See MQT 03 procedure for further detail.
MQT 04 4.4 M e a s u re m e n t of See IEC 60891
temperature coefficients See IEC 60904-10 for guidance
MQ T 4.6 P e r fo r m a n c e a t S T C C e l l t e m p e r a t u r e o f 2 5 °C a t S T C
06.1 Irradianc e: 1 000 W/m 2 (and BNPI, for bifacial m odules)
with IEC 60904-3 reference solar spectral irradiance
distribution
Requirements see Clause 7
MQT 07 4.7 P e r f o r m a n c e a t lo w Cell temperature: 25 °C
irradiance
Irradiance: 200 W/m 2 with IEC 60904-3 reference
solar spectral irradiance distribution
distribution
M Q T 08 4.8 O u t d o o r e x p o s u r e te s t 6 0 k W h /m 2 t o t a l s o la r i r r a d i a t i o n
M Q T 09 4.9 H o t - s p o t e n d u r a n c e te s t E x p o s u r e t o i r r a d i a n c e in w o
orr s t - c a s e h o t - s p o t c o n d it io n a s
per the technology specific part and IEC 61215-2. For
mon ofacial mod ules, irradiance is 1 000 W/m2. For bifacial
modules the irradiance is BSI.
M Q T 10 4.1 0 U V p rre
eco
on
n d iitt iio
o n iin
ng 15 k W h /m
/m 2 t ot
ot al
al UV
UV ir
ir rra
a d iia
a ttii o
onn i n t he
he w
waave
ell e
enn g tth
h rra
anng
ge
from 280 nm to 400 nm, with 3 % to 10 % UV irradiance in
the wavelength range from 280 nm to 320 nm, at a module
temperature of 60 °C. For bifacial modules, exposure is
repeated on the rear side.
MQT 11 4.11 T he
he rrm
m a l c yyc
c lilin g te
te s t 5 0 ( Se
Se q u
ue
ennc
c e C)
C) or
or 2
20
0 0 ( Se
Se q ue
ue n
ncc e D)
D) cy
cy cl
cl e
es
s fr
fr o
om
m - 4 0 °C
to +85 °C with current as per technology specific part up to
+80 °C, with 5 N weight hanging from the junction box.
M Q T 12 4 .1 2 H u m id it y f r e e z e te s t 10 c y c le s f r o m + 8 5 ° C , 8 5 % R H t o - 4 0 °°C
C
with circuitry con tinuity monitoring
monitoring
M Q T 13 4.1 3 D a m p h e a t te s t 1 0 0 0 h a t + 8 5 °C , 8 5 % RH
M Q T 14 4 .1 4 R o b u s tn e s s o f Test of junction box retention and cord anchorage.
termination
M Q T 15 4.1 5 W e t le a k a g e c u r r e n t Test voltage increase at a rate not exceeding 500 V/s to
test 500 V or the maximum system v oltage for the m odule,
odule,
whichever is greater. Maintain the voltage at this level for
2 min. Solution temperature is (22 ± 2) °C.
M Q T 16 4 .1 6 S t a t i c m e c h a n i c a l lo a d Three cycles of uniform load specified by the

test man ufactu

turn. rer, app
Minimum test lied
load:for2 1400
h toPa
front and back surfaces in

M Q T 17 4.1 7 H a il te s t I c e b a ll im p a c t d i r e c t e d a t 11 l o c a t i o n s . R e q u ir e d m in im u m
ice ball diameter of 25 mm and speed of 23,0 m/s.
M Q T 18 4.1 8 B y p a s s d io d e t h e r m a l MQT 18.1: Bypass diode thermal test:
test
IEC 61215-1:2021 © IEC 2021 - 27-

T es t S u b c l a u s e in Title Tes t c o n d i ti o n s
IEC 61215-
2:2021

1 h at Isc and 75 °C
1 h at 1,25 times I3C and 75 °C
MQT 18.2: Bypass diode functionality test
At 25 °C pe rf or m vo lta ge an d cu rr en t m ea su re m en ts

For bifacial modules, /sc in the conditions above is that

measured at elevated irradiance BSI.
M Q T 19 4.1 9 S t a b il iz a t io n T h r e e c o n s e c u t iv e o u t p u t p o w e r m e a s u r e m e n t s P i, P? and
P3 using MQT 02. STC output power is determined using
procedure MQT 06.1.
M Q T 20 4.2 0 C y c l ic ( D y n a m ic ) IEC TS 62782
Mechanical load test
1 000 cycles at 1 000 Pa
M Q T 21 4 .2 1 Potential induced IEC TS 62804-1
degradation test
+85 °C, 85 % RH at maximum system voltage for 96 h
M Q T 22 4 .2 2 B ending
ending test - for 25 cycles rolled up (without damage) around a cylinder
flexible modules only
flexible with a diameter specified by the module manufacturer over
which the flexible modules can be bent
 -28- IEC 6 1215-1:2021 © IEC 2021
IEC

A n n ex A
(informative)

Changes from previous edition

A.1 Gen er al

This anne x is iincluded

ncluded with ed ition 2 of the IEC 61215 se ries to better exp lain the project
team’s reasoning in developing some of the changes made since edition 1. This annex is
informative, describing the development history and rationale. This annex does not modify or
complete any of the test procedures found in the IEC 61215 series.

The following changes are discussed in this annex:

• Procedures for bifacial modules

• Use of represen tative samples
• Addition of dynam ic mech anical load
load test
• Addition of test for potential induced degradation
• Simu lator requirements

• References to retest guidelines

• W eight on junction boxes
• Correction to mo nolithically-
nolithically-integrated
integrated hot-spot endurance test
• Num ber of modules in sequence
• Removal of nominal module operating tempe rature (NMO T)
• Very low currents during thin-fil
thin-film
m test
tests
s
• Limit bypass diode testing to three diodes
• Revert the iinsulation
nsulation test to 2005 version
• Bending test
• Stabilization option for boron oxygen LID (MQT 19.3)
19.3)

To create edition
edition 2, a num ber of minor correcti
corrections
ons and clarif
clarifications
ications to tthe
he editi
edition
on 1 wording
were also made. These minor changes are not discussed in this annex.

A .2 Pr o c ed u r es f o r b if ac ia l m o d u le
less

The IEC 61215 new editi

edition
on includes text rrelated
elated to bifaci
bifacial
al modules,
modules,ww h e rre
e a s e d i ttii o
on
n 1 d iid
d
not. The new edition includes several instructions related to bifacial modules:

• Procedures for measuring bifacial modu les are included viareferences

via references to
IEC TS 60904-1-2.
• Wh ere test levels
levels need
need to be adjusted for bifacial modules due to potentially
potentially higher
currents during operation, these increased values are specified.
• Additional reporting requireme nts (e.g.
(e.g. bifacialit
bifaciality
y coefficients) are
aredescribed.
described.
• Tests tthat
hat may be omitted because ref
referenced
erenced standards have not yet been mod ified
ified to
account for bifaciality are noted.
IEC 61215-1:2021 © IEC 2021 - 29-

Qualification of bifacial modules requires measurement of several quantities beyond those

required for m onofa cial mo dules. The sh ort-c ircuit curren t bifacia lity coefficie nt çç>
>)sc,
)sc, the open-
circuit voltage bifaciality coefficient (Pyoc and the maximum power bifaciality coefficient <Ppmax
shall be listed
listed on the na me plate, as per IEC 612 15-1 :2021 , 5.1j). These coe fficients are
measured as part of IEC 61215-2:2021. MQT 6.1. Any sign ificant deviation deviation between the
measured and listed values shall be noted in the test report, as per IEC 61215-1:2021, 7.2.2.
MQT 07, performance at low irradiance, also requires calculation of the bifaciality coefficients
at low irradiance.

Qualification of bifacial modules requires performance measurement (MQT 06.1) at three

irradiances. These irradiances are

• 1 000 W/m 2 (the irradiance

irradiance at S
STC,
TC, as defined iin
n IIEC
EC TS 61836)
61836),,
• cond itions
itions equ ivalent to 1 000 W/m 2 on the front side an
and
d 135 W/m2 on the back side
(BNPI, as defined in 3.11), and
• conditions equivalent to
to 1 000 W/m2 on the front side an
and
d 300 W/m2 on the back side
(BSI, as defined in 3.12).

BNPI and BSI m ay be app lied in any meth od allow ed by IEC TS 609 04-1-2, such as single
side illumination at equivalent irradiance, or double-side illumination. If single-side illumination
is utilized, the simulator setting depends on the module bifaciality through the equivalent
irradiance defined in 60904-1-2. Extrapolation of performance parameters at BSI from the
values of 1 000 W/m2 on fr front
ont and 30
300
0 W/m 2 on back iiss possibl
possible
e if the fflasher
lasher is unabl
unable
e to
achieve high enough irradiance for BSI.

BNPI is used for nameplate verification. 135 W/m2 rear irradiance is chosen for BNPI based
on several published studies that find, with typical module spacing and light-colored soil, the
rear-side irradiance is in the
the range of 100-150 W/m 2 when 1 000 W/m 2 iiss incident on the ffront
ront
side .[2] [3] [4] [5] [6] BNPI thus conveys an app roxim ation o f typical p owe r gain due to
bifaciality.

BSI is used to measure quantities that determine applied stress conditions. A 300 W/m2 rear
irradiance in BSI is used to represent worst case (most stressful) conditions with a reflective
(0,5 albedo) ground cover.[7] To ensure safe products, this worst case condition is used to set
the stress levels.

For bifacial modules, measurements at both STC and BNPI are used for Gate No. 1, while
only measurements at BNPI are utilized for and Gate No. 2 criteria. For final Gate No. 2
measurements (post stress,) STC measurement and re-evaluation of bifaciality coefficients
are not required, in orde r tto
o keep cost of qua lifying b ifacial mod ules reasona ble. Instead ,
Gate No. 2 is evaluated only at the more stringent condition, BNPI, where possible series
resistance and other fill factor losses induced by stress are expected to be largest. By not
requiring STC measurement or re-evaluation of the bifaciality coefficients for the final Gate
No. 2 measurement, time-consuming (expensive) steps of re-calibration simulators at multiple
intensities, only to obtain a less stringent test, is avoided. Requirements for measurement
intensities and evaluation of bifaciality coefficients requirements are stated in
IEC 61215-1:2021, 7.2.2 and 7.2.3, and in IEC 61215-2:2021, 4.6.3 "Measuring at STC (MQT
06.1)".

For several tests, stress levels are increased from values based on one-sun front side
illumination, in order to account for potentially higher currents during bifacial module
operation with backside illumination.

• The test curre nt iiss increased for tthe

he bypass diode therm al test MQT 18.1. For bifacial
modules, MQT 18.1 specifies 1,25 times the module short-circuit current at the elevated
irradiance BSI. Use of this higher current is required in IEC 61215-2:2021,4.18.1.4b).
• The test
test current iiss also increased iin
n the
the same manne r for the bypass diode functiona lity
lity
test MQT 18.2, as specified in IEC 61215-2:2021,4.18.2.3.2 b).
 - 30- IEC 61215-1:2021 © IEC 2021

• In MQT 1 11
1 the tech no logy -spe cific curre nt to be applied during thermal cycling is
is larger for
bifacial modules. IEC 61215-1-1:2021 specifies that the technology specific current which
needs to be applied according to test MQT 11 of IEC 61215-2:2021, shall be equal to the
peak power current at the elevated irradiance BSI.
• In MQT 0 09,
9, determina tion of the ccell
ell shading perce nt a
and
nd the
the prolonged expo sure are
are
performed at tthe
he elevated irradiance BSI. If double-side ill
illum
um ination is use
used
d to produce
BSI, both the back and the front of the cell are shaded in the same way. During cell
selection, any cell that is permanently shaded by a module feature (such as the junction
box) is added to the list of selected cells.

A .3 Us
Usee o f r ep r es en t at iv e s am p le s

At
A t p re se n t, th er e ar e p ro du ct s in te nd ed to be q u a lif ie d via
vi a IEC
IE C 6 12 15 , th a t ar e m uc h la rg er
(e.g. 6 m in one dimension) than typical test equipment. Requiring a test lab to obtain custom
test equipment for one product is prohibitively expensive and would create an unfair barrier to
qualification. Thus, representative samples may be used for applying stress and evaluating
Gate No. 2 on very large modules. A representative sample is one that includes all the
components of the module, except some repeated parts, and is therefore smaller than the
actual product. A full-sized
full-sized samp le is sti still
ll required for nam eplate verifi
verification
cation (Gate No. 1) 1)..

A re p re se n ta tive
ti ve sa m p le m ay be u til iz e d if a m od ul e is "v e ry la rg e ," as d e fin e d in
IEC 61215-1:2021. A "very large" module is taken to be anything that will not fit on the largest

commercially-available AAA simulator,

largest commercially-available or in seldom
AAA simulators the necessary environmental
exceed dimensions chambers.
of 2,6 The
m * 2,1 m. A
survey of test labs by project team members showed that environmental chamber sizes
currently impose a size limit for IEC 61215 qua lif lification
ication in various test labs ranging from
2.2 m to 2,4 m in module length, and 1,2 to 1,9 m in module width. The project team decided
that defining a very large module as 2,2 m * 1,5 m is a reasonable compromise between not
providing a barrier to certification for large products, but encouraging certification on full-size
products when possible. By this definition, a module is considered very large if it exceeds
2.2 m in any dimension, or exceeds 1,5 m in both dimensions.

Limits are placed on how much one may reduce the dimensions of a very large module in
making representative modules for qualification testing. The reduced dimension(s) shall be no
less than
than one h alf the dime nsions that define a very large m odule. In other words, when
reducing the shorter dimension, the representative sample shall be at least 0,75 m wide. In
reducing the longer dimension, the representative sample shall be at least 1,1 m long. Thus, a
manufacturer is not allowed to use, for example, a one-cell mini-module for qualification

testing. The use and dimensions of representative samples shall be noted in the test report.

If representative samples are utilized in Sequence E, then one extra module, full-sized, is
required, and shall be subjected only to MQT 16 (the static load test) and the requirements
therein. The extra module is required because mechanical load on a representative sample is
not the same as doing it on a full-size module. (To give an extreme example, a 10 m * 10 m *
5 mm glass
glass pane may coll collapse
apse under it itss own weight, wherea s a 1 m x 1 m * 5 mm glass p pane
ane
may resist the 2 400 Pa loading.) However, a general way to convert load requirements from
one sample size to the next, for all product designs, does not exist at the time of publication.
A ls o, be ca us e o f sp ac e lilim
m itita
a ti o n s in th e da m p he at ch am be r, th e fu ll- s iz e m od ul e ca n n o t be
required to undergo the entire sequence E. Thus, as a compromise, an extra full-size module
in sequence E to supplement the representative sample. The full-size module will be
evaluated for structural and safety failures (e.g. broken glass) via the visual inspection (MQT
01) that is embedded in MQT 16. If a design is susceptible to MQT 16 failures that involve DH
(for example, a glue that debonds after DH), such effects are best detected using the
representative sample.

If there are MLT failures that involve DH (for example, a glue that is not strong after DH), such
effects will be captured by the test on the representative sample.
IE C 6 1 2 1 5 - 1 : 2 0 2 1 © I E C 2 0 2 1 -3 1 -

The project team considered whether more thermal cycles should be required when MQT 11
is performed on a representative sample. It was considered that thermomechanical fatigue
tends to increase with sample size, and therefore extra thermal cycles might be needed to
qualify a full-size product while stressing a smaller representative sample. However, finite
element modelling concluded that the cell size, not the module size, is the critical dimension
for thermomechanical fatigue, and thus extra thermal cycles are not warranted.

A .4 A d d it io n o f d y n am ic m ec h an ic al lo ad te s t

A D yn am ic M ec h an ic al Lo ad (D M L ) te st ha s be en ad de d in th e IEC
IE C 61 2 15 ne w e d ititio
io n an d is
performed according to IEC TS 62782. The DML test was developed to evaluate the potential
for cell breakage within PV modules[8]. The goal was to find a load that would break cells that
were already damaged prior to the stress, but would not break intact cells during the stress.
During experiments, a load level of 1 000 Pa was sel selected.
ected. E ffect on the celcells
ls appeared to
saturate at 1 000 cycles. These results fformed ormed the basis ffor or the st
stress
ress levels util utilized
ized in
IEC TS 62782 and the IEC 61215 new edition. DML has subsequ ently been the subject of
other studies.[9], [10], [11] The DML test is intended to detect cell damage that is inherent in
processing (such as a tabber that applies too much pressure and cracks cells during module
assembly). The DML test is not intended to introduce new cracks into the cells, nor to
measure susceptibility of the module to mishandling, abuse, or extreme weather.

Several publications (e.g. [12], [13]) have noted that cracking cells in a module, then applying
either DML or thermal cycles, can lead to power loss. However, there are several reasons to
be cautious when considering applying DML or thermal cycling after mechanical stress for this
qualification standard:

• Not all modules wil

willl experience ext
extreme
reme weathe r or mishand ling.
ling. Qua lification
lification testing tthat
hat
tests for performance retention under these circumstances may lead to costly overdesign.
• There is not yet docume nted fi field
eld correlati
correlation
on to determine over what ttime
ime period power
loss from mechanically-cracked cells occurs. Early studies how long it takes cracks to
open up, and therefore (even roughly) what time period is relevant for the sequence: hail
test + DML or TC. Some published studies are underway, but haven’t seen cracks further
affect powe r in
in the first 1 to 2 years. [14], [15]
• For people who just want tto o know relative performance without requiri
requiring
ng relationship to
field performance, static load + DML is in IEC TS 63209-1 for relative comparison.
• It is recom me nded to fi
first
rst develop and gain experien ce with a TS related to hail-
resistance, module handling, and related performance losses. Such a document should

consider that thermal cycles might be more effective than DML.

A .5 A d d it io n o f t es t f o r p o te n t ia l in d u c ed d eg r ad at io n

Potential induced degradation (PID) has been observed to cause power output degradation in
some fielded modules. Examples of such reports can be found in the literature.[16], [17], [18],
[19], [20] Thus, an accelerated test to screen for PID susceptibility has been added in
edition 2 of the IEC 61215 series, as MQT 21.

The PID test, MQT 21, is performed in parallel with other tests, in a new Sequence F.
Sequence F requir
requires
es two m odules per install
installation
ation polarity allowed
allowed by the m anufacturer. If only
one installation polarity is allowed, only two modules receive PID stress. However, all four
modules are
are subject
subjected
ed to Gate No
No.. 1 verificati
verification,
on, in order to keep Gat
Gate
e No. 1 statisti
statistics
cs
independent of the number of allowed installation polarities.
 - 32- IEC 61215-1:2021 © IEC 2021

The test proced ure for MQT 21 is base

basedd on the previously published IEC TS 62804-1. The
85 °C / 8 85
5 % RH / 96 h stress ("8 5/85 /96") stress u tilized in IEC 61215 edition 2 is one of
three stress level options in IEC TS 62804-1. Numerous accelerated test studies preceded the
developm ent of IEC TS 62804-1. PID has been studied to the extent that reviews of PID,
including experimental dependencies, derived acceleration, and underlying mechanisms, can
be found in the literature.[21], [22] Literature reports vary regarding acceleration factors.
Equivalent outdoor exposure for the 85/85/96 stress utilized in IEC 61215 edition 2 has been
estimated by different groups between 2 to 20 years,[23], [24], [25], [26], [27] for the effect of
a humid climate (e.g. Florida, USA) on a crystalline Si module. The differences in the
literature reports may reflect a need for utilization of different physical models in some
studies, experimental uncertainty, and different behavior among the products tested.

A ll p ro d u ct s (m o d u le s ba se d on cr ys ta llllin
in e Si ce lls , or th in fil m ce lls ) ar e su b je ct e d to th e
same stress conditions when executing MQT 21. The same stress conditions are applied even
though it is likely that acceleration factors differ from one product to the next, particularly for
thin film modules, where the underlying physical mechanism for PID is different than that in x-
Si modules. It is estimated that the acceleration factors for thin film modules are substantially
smaller than that of typical c-Si modules.[28], [29], [30] The methodology of defining stress
levels that are empirically observed to separate failed versus successful fielded products,
then applying these conditions to all modules, is rooted in the JPL block buy study,[31] which
formed the basis for several of the IEC 61215 series stress tests. A few sentences explicitly
stating the methodology of the IEC 61215 series (constant stress conditions across products)
were added to the scope.

The 85 °C / 85 % RH / 96 h level is probably more stressful (in terms of years of equivalent

exposure) than some other MQT’s, for c-Si in most use environments. However, this relatively
harsh condition was selected because:

• Data show thin

thin fil
film
m modules need a higher accelerated st
stress
ress level than Si modules to
reproduce early-life PID failures.
• Prior to the inclusion of a PID test iin
n IEC 61215 , severa l major module man ufactu rers had
alread y selecte d the 85 °C / 85 % RH / 96 h stress level fo r intern al q ualification
programs.
• Use of a light soak may llead
ead tto
o some power recovery, therefore justifying increasing the
stress level.
• Increased us
use
e of modules iin
n potentially harsh PID-prone envir
environm
onm ents, such as very rrainy
ainy
climates, may warrant a harsher test.

The way in which modules are mounted has been observed to affect PID.[32]’ [33] Thus,
during the chamber test in IEC 61215 (and IEC TS 62804-1), on request by the manufacturer,
modules might be mounted as described in the installation manual during testing, if the
manufacturer states that PID resistance is achieved via mounting method.

PID stress on CIGS may be applied with a modest forward voltage bias applied across the
internal circuit. These are the same conditions approved for the damp heat test (MQT 13) in
IEC 6121 5-1-4:2021. The voltage bias prevents effects that do not occur when stress is
applied under field-representative illumination.

A w et le a ka g e cu rr e n t te st (M Q T 15 ) is p ar t o f th e fin
fi n al m ea su re m e nt s w it h in M QT 21.
21 . Th is
wet leakage current test is to be performed within 8 hours of the end of the PID stress, as in
IEC TS 6280 4-1. The inclusion o f tthe he test, with a time limit, is m otivated by the increase in
leakage current seen in some modules during in-situ monitoring, and may have a time scale
for reversibility that is similar to the PID.

A fin
fi n a l s ta b ili z a tio
ti o n , M Q T 19 .2
.2,, is pe rf or m ed p ri
rioo r to ga te 2 on all m od ul es th a t ha ve be en
subjected to PID stress. The conditions for this final stabilization are described in the
technology-specific parts (IEC 61215-1-x).
IEC 61215-1:2021 © IEC 2021 -33-

For crystalline Si modules, the final stabilization is a short light soak (2,0 kWh/m2) meant to
reverse the effects of PID-polarization, which results from the movement of charge within the
module,[34] as opposed to PID-shunting (PID-s), which results from movement of Na within
the module, a slower process. Tests on some modules show that PID-polarization (PID-p)
does not occur when PID stress is applied with field-representative illumination,[35] and thus
should not be allowed to cause design qualification failure when administering a dark PID
stress test. UV has been shown to be important in reversing PID-p.[36] Thus, the class CCC
solar listed as required apparatus in MQT 19.2 shall fulfill the class C spectral requirements
over at least the short-wavelength portion of the e xte n d e d wavelength range described in
IEC 6090 4-9, for stabilizatio ns perform ed afte r PID testing . For bifacial mod ules, light is
applied to the rear side during this stabilization.[37] Since a small amount of PID-s may
reverse during a short light soak,[38] the light soak is applied to the front of monofacial
modules, to obtain a consistent comparison of test results across module types.

For thin-film modules, the final stabilization is included to put metastabilities into the light-
soaked state and obtain an accurate Gate No. 2 performance measurement. Thus, the thin-
film light soak is performed in nearly the same manner as other thin-film final stabilizations
(MQT 19.2). One additional requirement exists for final stabilization of thin-film modules after
PID stress: Once the stabilization criterion is met, the light soak shall be terminated within two
irradiation intervals (as defined in the technology-specific parts of MQT 19). This time limit is
included to prevent attempts to reverse Na migration with extremely long light soaks that are
many times that needed to account for metastability.

A ft e r th e coBetween
controlled. m p le ti o nthese
o f MQ T 21
test , m odthe
steps, ul e modules
st o ra ge are
co n dtoititio
iobe
n s maintained
b et w ee n su b se q u e in
indoors, n t the
te st sdark,
are
and at temperatures 25 °C or below. No more than 48 h elapse between the end of MQT 21
and the beginning of MQT 19.2. There is also time limit between MQT 19.2 and MQT 06.1: It
is either 48 h or the time limit specified in the technology-specific stabilization procedure,
whichever is shorter. These controls are intended to prevent attempts to reverse Na migration
before Gate No. 2 via anomalous storage time and conditions.

A .6 Si m u l at o r r eq u i r em en t s

A .6 .1 G en er al

Edition 2 revises both the spectral and uniformity requirements for simulators. (Notation for
simulator classifications are defined according to IEC 60904-9. The AM1.5 spectral match is
denoted by the first letter of the three-letter simulator classification. For example, a CBA
simulator is categorized with a type C spectral match, a type B spatial uniformity, and a type A
temporal stability.) The revision applies to simulator requirements in MQT 02 (maximum
power determ ination), M QT 6.6.1
1 (performance a t STC), and MQT 07 (performance at low
irradiance).

IEC 61215-2:2016 allowed three options for simulators during the measurement listed above:

a) a class BBA or bette r simulato r plus a reference device of the same size and cell
technology as the test sample,
b) a BBA or bett
better
er simulator, plus tthe
he spectral respo nsivity of the module, plus tthe
he spectral
distribution of tthe
distribution he solar simulator, and a data correction according to IEC 60904-7, or
c) a AAA simulator. Several changes have be
been
en made tto
o tthese
hese requirements:
• Type A spatial uniformity is required.
• A simu lator with ttype
ype C or better spectral cl
class
ass may be util
utilized.
ized.

• There are more possibilit

possibilities
ies for ho
how
w one obtains data to us
use
e iin
n a spectral mismatch
correction (IEC 60904-7). T he spectral response data m ay be taken by any test lab
that is accredited for that measurement. The sample used to obtain the spectral
response data may be the test module or may be a reference cell made with the same
bill of materials as the test module.
 -34- IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IEC 2021

• It is specifically st
stated
ated that the com ponen t of uncertainty due tto o spectral mismatch
shall be included w1t the uncertainty used in evaluating Gate No. 1. Maximum
allowable values for are specified
specified iin
n the techno logy-spe cific part
parts.
s.
• Use of either spectral mismatch correction or a matched ref
reference
erence m odule (or cell) iis
s
required.

The procedures in MQT 02 and MQT 6.1 are based on the most accurate measurement

protocols
for that are practical
the nameplate with
verification current
and designtechnology. This
qualification of high level of However,
IEC 61215. accuracy other
is appropriate
types of
docum ents refer to IEC 61215 maximum power determ ination. Such do cuments incl include
ude
warranties, quality assurance documents, and extended stress tests. A note has been
included to remind users that less stringent requirements may be appropriate for non-
IEC 61215 applications. The note reads: "MQT 02 measurement procedures are intended for
minimal uncertainty, as performed by an accredited testing laboratory. Lesser requirements,
such as use of CAB class simulators, may be appropriate for other applications, such as
quality control in the factory. Applications that only require repeatability, such as comparing
module performance before and after an extended stress, may wish to relax spectral
mismatch correction requirements."

A .6 .2 R a t i o n al e f o r c h a n g e s t o s p e c t r a l r e q u i r em e n t s

Revisions to the spectral requirements were made to limit possible spectral mismatch in a
systematic manner, while still allowing test labs several practical choices as to how to achieve

an acceptably accurate measurement.

The previous text of IEC 61215 allowed using a solar simulator with Class A spectral match
for power rating measurements without spectral correction. This option was originally intended
to provide one way to achieve a low spectral mismatch. However, more recent work has
shown that requiring a Class A spectrum is neither necessary nor sufficient for low spectral
mismatch.[40], [41], [42], [43] In other words, using a Class A spectrum does not guarantee a
smaller spectral mismatch error than using a Class B or Class C spectrum. In some cases,
spectral mismatch errors can even be larger for a Class A spectrum compared to
Class C.[44], [45] The actual spectral mismatch error depends on the procedures, reference
samples, and test samples used.

Therefore, the revised text of IEC 61215 has relaxed the spectral requirement to Class C, but
includes wording regarding procedures to reduce spectral mismatch errors. The wording is
basically the same as IEC 60904-7: either the solar simulator irradiance is calibrated using a
reference sample having spectral response that is similar to the device under test, or a full
calculation of the spectral mismatch error is made per IEC 60904-7.

Support for this position can be found in several literature studies. Excerpts from some of
these studies are reproduced here (with bold type added for emphasis):

• . . . c l a s s i f i c a t i o n of a solar simulator d o e s n o t p r o v i d e a n y i n f o r m a t i o n a b o u t
m e a s u r e m e n t e r r o r s . ..related to photovoltaic performance measurements...such errors
are dependent on the actual measurement devices and procedures used.[40]
• . .... s p e c t r a l c l a s s of a solar simulator i s n o t n e c e s s a r i l y a n i n d i c a t o r f o r t h e p r e c i s i o n
o f m e a s u r e m e n t . With appropriate reference devices and measurement procedures also
class C spectral match yields a good comparability for c-Si PV modules.[41]
• ...the simulator with t h e b e s t s p e c t r a l m a t c h ( A + ) n e
eee d n o t y i e l d t h e b e s t M M F [spectral
mismatch factor].[42]
• N o b e n c h m a r k i n g o f s o l a r s i m u l a t o r s i s therefore p o s s i b l e b a s e
edd o nly on the spectral

m a t c h information.[42]
...not always the spectrum of higher class would lead to the lower [spectral] mismatch factor.
[43]
IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IE C 2 02 1 -35-

It is specifically stated that the component of uncertainty due to spectral mismatch shall be
included in /w1t and maximum allowable values for m^ are specified in the technology-specific
parts. As stated in IEC 6121 5-1:2 021 , mm--, is to be calculated based e ither on m easured
spectral response or the worst-case possibility for a given technology type. Worst case
possibilities can be evaluated from a combination of published data and the lab’s database of
meas urements .

This approach
response provides
system, several uncertainty
while keeping options for within
test labs unable to
reasonable investvia
bounds in limits
a module spectral
on m1. A lab
may choose reference modules such that no spectral mismatch correction is needed. Size
requirements on the matched reference module have been removed. The lab may also
measure cell spectral response, where a reference cell with the same bill of materials as the
test module is available. The lab may also obtain spectral response data on such a reference
cell, or on the test module, from another accredited test lab.

A .6 .3 R at i o n al e f o r c h an g es t o u n i f o r m i t y r e q u i r em e n t s

The change in simulator uniformity requirements from B to A was made based on an analysis
of uncertainty in power rating which includes contributions from several factors including
irradiance nonuniformity, current mismatch between cells within a module, spectral mismatch,
module temperature, contact resistance, and the procedure(s) used to calibrate simulator
irradiance. Uncertainty values listed below (in Table A.1) are from Figure 7 of the referenced
work,[46] using a coverage factor k = 2.

T a b le
l e A .1
.1 - P u b l i s h e d u n c e r t a iin
nty v alue
ess as a function of simu lator uniform ity class

A p p ro x im a te p o w e r ra ti n g u n c e rt a in ty du e to a ll e ff e c ts , w h en s im u la to r
Irradi ance i r ra
ra d i a n c e i s c a l ib
ib r a t e d u s i n g a r e f e r e n c e m o d u l e ’ s . ..
..
nonuniformity
...maximum power ...short-circuit current

2 % (c l a s s A l i m i t ) 2 .6 % 3 .2 %

5 % (c l a s s B l i m i t ) 3 .2 % 6 .2 %

For modules with higher fill factor, such as new high-efficiency Si modules, effects of
irradiance non uniformity m ay be greater, since higher fill ffactor
actor imp li
lies
es that a change in
current changes the module power output more sharply. Based on this information, the project
team decided the uncertainties for 5 % irradiance nonuniformity would be too large for some
measurements, such as the maximum power determination of Gate No. 1.

Polls of working group 2 m embers represen ting test labs were performed during a working
group 2 meeting and during a IEC 61215 new edition project team meeting. All such members
in attendance indicated that they already use simulators with class A uniformity.

The new edition includes one exception to the new uniformity requirement. For evaluation of
Gate No. 2, "very large " modu les (as defined in IIEC EC 612 15-1 :2021 , 3.8) may be measured
with a class B uniformity simulator. It is recognized that class A uniformity simulators larger
than 2,2 m * 1,5 m are rarely commercially available at present, and thus imposing use of a
class A uniformity simulator on a very large module creates an unfair barrier to qualification.
At
A t p re se n t, on ly a sm al l fr a ct io n o f th e m a rk e t is e xp e ct e d to u tiliz
ti liz e th e e xe m pt io n fo r ve ry
large modules. In future years, as module sizes and availability of very large simulators
evolves, the size definition for a very large module should be adjusted accordingly.
 -36- IEC 6 1215-1:2021 © IEC 2021
IEC

A .7 Re
Refe
fe r en c es to r et es t g u i d el in es

IEC 61215 Edition 2 requires the use of IEC TS 62915 to determine if a retesting is needed.
This requirement is stated as, "Retesting shall be performed according to IEC TS 62915." To
avoid any future contradiction between IEC 61215-1 and IEC TS 62915, all further description
of conditions that might generate the need for retesting have been removed from
IEC 61215-1:2021.

A .8 W ei g h t on ju n c t i o n bo x es

Poor adhesion of the junction box tto o the m odule has been observed in both fi fielded
elded modules
and accelerated tests.[47], [48], [49], [50] Thus, in edition 2, the thermal cycling test (MQT 11)
is modified to include a 5N weight hanging from the junction box.

A .9 Co r r ec ti o n to m o n o l i t h i c al l y -i n t eg r at ed h o t -s p o t en d u r an c e t es t

IE
IEC
C 61215-2 Edition 2 revises a portion of the m ono litlithically-i
hically-integrated
ntegrated (MLI) hot spot
endurance test to correct errors in IEC 61215-2:201 6. In IEC 61215-2:201 6, incompa tibl
tible
e
procedures for testing wafer-based vs. MLI modules were inadvertently mixed in some of the
MLI sections. Minor revisions were also made in places where the procedure was unclear or
impossible to perform.

The hot-spot endurance test (MQT 09) is designed to determine the ability of the module to
withstand hot-spot heating effects, such as those that could be caused by mismatched cells or
shadowing. While there are test variations for different module types and circuitry, the test
has certain commonalities across all module types:

• A worst-case sshading
hading condition is determined.
• This condition causes a current near /m
/mp
p (for unshaded con ditions) tto
o fl
flow
ow through the
short-circuited module.
• The module is exposed to elevated temperature (50 °C) and
and the worst-case shading
c ondition
ondition for at leas
leas t 1 h.
• Afte r stress, the mod ule shall have no visual defects, a functio nal I- V curve, insulation
resistance meeting the requirements of MQT 03, and wet leakage current meeting the
requirements of MQT 15.

NOTE 1 Tests are derived from

from earlier edit
editions
ions of IEC
IEC 61215-2 a
and
nd IEC 61646.

Despite these commonalities, some differences in test procedure between modules containing
singulated or wafer-based cells and those containing MLI cells are necessary for the following
reasons:

a) It is difficu lt to shade a single MLI cell reprodu cibly, since cells have high aspect ratio
(e.g. 0,5 cm * 1 m dimensions), and there are reflections inside the g lass that m ake
shading around edges not sharp. The wafer-based cell procedures involve shading a
single cell.
b) Some MLI cells may experience a decrease iin n shunt resistance
resistance when shad ed.[51], [52]
For the wafer-based modules, shading of individual cells is performed as a way to select
cells that have certain pre-existing shunt resistances (low or high). For MLI cells, the act
of shading individual cells is not likely to screen the cells, but rather to alter them. Thus, it
is logical to apply shading stress to MLI cells, but not in an attempt to select which cells to
test, as in the wafer-based procedure.
IEC 61215-1:2021 © IEC 2021 - 37-

c) Thin fil
film
m cells often have a differe nt nature of reverse bias chara cterist ics than do Si cells.
Thin-film reverse bias characteristic are in many cases not linear,[53], [54], [55] or are
only linear over a voltage range that is too small for a comparison of shunt resistances
according to the method of IEC 61215-2:2016, Figure 4. Thus, even if items a) and b) on
this list could be overcome, it is still unlikely that one could use the method of Figure 4 to
select cells of highest and lowest shunt resistance.
d) The Si cel
celll method assum es that shading one cel
celll can reduce the current generated by

the short-circuited module to /mp (measured under full irradiance) or an even lower
current. However, this reduction may not be achievable by fully shading one MLI cell. The
difficulty occurs because there are typically many more MLI cells in a module, and the
cells may be more conductive at a lower reverse bias compared to Si cells.

Because of the differences listed above, the thin film hot-spot test has relied upon shading
blocks of cells, and finding how many cells shall be shaded to achieve the current reduction
noted in the above list as d).

NOTE 2 This method of shading blocks o f cells

cells was utilized in IEC 61646:2008 (10.9) and IEC 61215-2:2016
(4.9.5.3.2. 4.9.5.3.4, and 4.9.5.3.5).

However, some errors were included in the MLI portion of IEC 61215-2:2016 MQT 09:

• 4.9.5.3.3 (MLI, SP case) erroneously call

called
ed for the wafer-base d single-cell sshading
hading
method. (The single-cell shading method cannot be performed on MLI modules for
reasons a) to d) listed above.)
• Three different MLI sections describing
describing how to dodo the
the hot spot test on MLI SSPP modules
were included in edition 1, but the three different SP cases actually require the same
procedure. These three subclauses fr from
om editi
edition
on 1 are 4.9.5.3.3 "Case SP", 4.9.5.3.4
"Case SP with inaccessible cell circuit and internal reverse bias protection", and
and4.9.5.3.5
4.9.5.3.5
"Case SP with inaccessible cell circuit and no reverse bias protection". In all cases, the
MLI cell circuit is treated as inaccessible, so there should be no distinction between
4.9.5.3.3 and 4.9.5.3.5. Furthermore, in MLI products, a single external bypass diode is
utilized. Lateral conduction in the high aspect ratio MLI devices is limited by the
conductivity of the transparent conducting thin film, so MLI products do not use internal
bypass diodes. The test procedure is performed with the module short-circuited, making
the external bypass diode irrelevant to the test procedure. (It turns on only when the
module is in reverse bias.) Thus, there is no need to distinguish between cases 4.9.5.3.3
and 4.9.5.3.4.

These errors are corrected in tthe

he new e diti
dition
on o f IEC 61215-2:202 1. Several changes w ere
made to do so:

• 4.9.5.3.3, 4.9.5.3.4, and 4.9.5.3.5 from IEC 61215-2:201 6 are combined into a single
single
"Case SP" section. Thus, in the new edition of IEC 61215-2:2021, there are three cases
for MLI modules in MQT 09: S, SP, and PS. These are the same three cases formerly
utilized in IEC 61646:2008.
• The single-cell shading method used for the wafer-base d mo dules is not uti
utili
lized
zed for any
case in MLI modules.
• In some places, m inor changes to wording were made to clari
clarify,
fy, but not modify, the test
procedure.

Minor revisions were also made in places where the MLI hot-spot endurance procedure was
unclear or impossible to perform:

- The symbol "N" rather than "P" is used tto

o denote the number of parallel
parallel stri
strings
ngs to avoi
avoid
d
confusion with power, which is also denoted by "P."

- The acceptable range for currents is nownow based on / mp,

mp, not Pmp. These two ways of
specifying the range yield nearly the same results, and specifying the current is much
clearer. IEC 61215-2:201 6 was not explicit regarding how to determine the range in
translating from P to I. (For example, is the tester allowed to interpolate between points
using a previously-measured I- V curve?)
 - 38- IEC 61215-1:2021 © IEC 2021

- The acceptable window for current during extended

extended stress iis
s widened by cchanging
hanging the
lower limit from 99 % to 95 % of the maximum. If the simulator irradiance can change by
± 2 % over the test (as is explicitly stated), it is not reasonable to ask to keep the current
within a 1 % window. For ssome
ome m odules, it was observed tha t shading
shading even one celcelll
dropped the current below the specified range.
- A minimum m ask ssizeize of two cell widths is specified. For rreason
eason a) descri
described
bed e arlier iin
n tthis
his
section, test repro ducibility suffers if the
the mask size is reduced further.
- When moving the mask across the module, a minimum num ber of steps iis
s specifi
specified.
ed.
- The acceptable irr
irradiance
adiance range for cell selection wiwith
th an optional simulator iiss modifi
modified
ed
from "800 to
to 1 000 W/m2" previously tto
o "800 tto
o 1 100 W /m2" in the new edit
edition.
ion. With tthis
his
c hange,
hange, any irradi
irradianc
anc e produc ed by the requi
required
red s imulator for 1 h s tres tres s (at
1 000 ±10 0 W /m2) is also acceptable for cell selection procedures.
- Other ssmall
mall clarif
clarifying
ying changes tto
o the wording have been made.

A .10 Nu m b er o f m o d u le
less in s eq u en c e

Sequence A, as defined in either IEC 61215-1:201 6 o r IEC 612 15-1:20 21, iiss comp rised
rised o f
MQT 07 (performance at low irradiance) and M QT 04 (m easurem ent of temperature
coefficients). Two changes were made to sequence A to allow it to be performed more
efficiently, but without losing valuable information.

First, the number of modules required for sequence A has been reduced from three in
IEC 61215-1:2016, to one in IEC 61215-1:2021. A study of temperature coefficients showed
that for modules of a given cell technology, one cannot distinguish between the temperature
coefficients of different products. For sample sets of three to five modules of each product
type, the variability of temperature coefficients within each product type is as large as the
difference between the products. The variability may be due either due to measurement
uncertainty or product inconsistency. An example of data from this study is shown in
Figure A.1. Boxes represent the variability within each product type, and the error bars show
the m easurem ent uncertainty. As the purpose of the IEC 61215 series is design qua li
lification,
fication,
not forecasting energy production, it is not defensible to require the measuring of many
modules in sequence A in an attempt to reduce the uncertainty on the derived quantities.
Furthermore, decreasing the number of modules in sequence A by two does not worsen the
statistics on modules passing Gate No. 1, since four modules have been added to
sequence F.

Second, it is explicitly stated in edition 2 that the measurements of sequence A may be

performed in any order, or may be performed on two separate modules, if desired.

5T
2. mc-Si (poly)
® 0,07%

CL

I 0 ,0
,0 6
6%
%

0,05 % LEp.j S t a : ® :
0,04 %

Sample size: 3-5 modules per type

0,03 % i i —i i---------- 1------------ 1------------ i--------

Poly #1 Poly #2 Poly #3 Poly #4 Poly #5 Poly #6 Poly #7 Poly #8 Poly #9 IEC

F i g u r e A .1 r i v e d t e m p e r a t u r e c o e f f i c i e n t s (a) f o r n i n e d i f f e r e n t m c - S i p r o d u c t s t y p e s
.1 - D e ri
IE C 6 1 2 1 5 - 1 : 2 0 2 1 © I E C 2 0 2 1 -39-

A.11 Rem o v al o f n o m in al m o d u le o p er at in g t em p er at u r e (NM OT)

Edition 1 of tthe
he IE
IEC
C 61215 series (published in 2016) was the
the first time
time that NMO T has been
required for PV module d esign qu alifi
alification.
cation. Earlier versi
versions
ons of IEC 61215 and similar
standards required only nominal operating cell temperature (NOCT). In 2017, a number of test
laboratories around the world reported that the strict data filtering required by the NMOT
procedure was causing NMOT measurements to take more than 6 months in some locations,
an unacceptable time period for IEC 61215 qualification. The NMOT procedure is described in
IEC 61853-2, which is referenced by IEC 61215-2:2021.

To rectify the unacceptable measurement time, three alternatives were proposed:

a) Put exception s to the N MOT data filtering (as specified in IIEC

EC 618 53-2 ) into tthe
he
IEC 61215 test, making the test completion time shorter when performed as a part of
IEC 61215.
b) Amend IEC 61853-2 tto
o allow tthe
he test tto
o be completed more quickl
quickly.
y.
c) Remove the NMOT test from IEC 61215 edition
edition 2
2..

In choosing between these alternatives, the project team considered the following information:

• It is undesirable to create ttwo

wo different versions of tthe
he same test by putt
putting
ing many
exceptions in the referencing standard. Upkeep on the test procedure shall be performed
in both locations, and the two tests yield information that is named the same but is not
equivalent.
• The purpose of the IEC
IEC 61853 series is to "characterize the modules at a wide range of
temperatures, irradiances, angles of incidence, and spectra," in order to "accurately
predict the energy production of the modules under various field conditions," as taken from
the IEC 61853-2:201 6 introduction. The IEC 61853 series defines a method ology for
energy prediction.
• The goal of IE
IECC 61215 is module design qualif
qualification,
ication, i.e.
i.e. whethe r a module of a particul
particular
ar
design is likely to last in the field.
• Thus, NMOT does not relate to the objective of IEC 61215.
• NMO T tests have an unc ertain ty (typically ± 4 °C) that iis
s larger
larger than the actua l ope rating
temperature difference between most module types.
• Datasheet NM OT and NOCT values are not heavily us used.
ed. It is more common to ususe
e
thermal model coefficients (such as those provided with PVsyst, for example) to account

for thermal effects in energy generation.

• To make NMOT a useful measurement, it may be be requi
required
red tto
o incr
increase
ease - not decrease -
data collection time, or to perform data collection in individualized side-by-side tests
designed for comparing a small set of different module types.
• Thus, lim iting the data collection time in IEC 6185 3-2 in order to keep IEC 61215
qualification time reasonable may prevent the NMOT test from ever yielding meaningful
data.

The above points led the project team to remove the NMOT test (MQT 05) and the associated
"performance at NMOT" test (MQT 06.2).
 - 40- IEC 61215-1:2021 © IEC 2021

A .12 Ver
Ve r y lo w c u r r en ts d u r in g t h in -f il m tes
te s t s

Edition 2 contains revisions to mitigate the difficulty of controlling very low currents in thin film
modules during some tests. In two testtests,
s, a fracti
fraction
on of the mo dule’s STC peak power current
(/mp) is applied during a test. This application of current occurs during the humidity-freeze test
(MQT 12), and during the thermal cycling test (MQT 11). In MQT 12, 0,5 % /mp is applied, as
spe cified in IEC 6121 5-2. In MQT 11 11,, the applied curre nt is spe cified in tne techn ology -
specific parts. For CdTe, a-Si, or CIGS, the applied currents are 0,1 /mp, as specified in
IEC 61215-1-2:2021, IEC 61215-1-3:2021, and IEC 61215-1-4:2021. For smaller cells, these
specified currents may be so small that they are impractical to monitor and control. Thus, the
wording in each of these cases has been revised to call for the previously-designated fraction
of /mp, or 100 mA, whichever is larger.

A .13 L im it b y p as s d io d e t es t in g to t h r ee d i o d es

Edition 2 contains a revision to keep the bypass diode testing procedure

procedurepractica
practica l, even in
some newe r module desi
designs
gns that have dozens of bypass
bypassdiodes
diodes embedded in thelaminate.
the laminate.
The edition 1 bypass di diode
ode test (MQT 18) requir
required
ed repe tition
tition of the test procedure on al alll
bypass diodes, and electrical access to each diode. If a standard production module did not
allow electrical access to each diode, the manufacture needed to provide a special module
with electrical access to the diodes to complete the test. The procedure was written to suit
modules having a few diodes in a junction box. All diodes were tested, since the positioning of

the diode within the junction box (e.g. edge or middle) is likely to be important in determining
the thermal environment when the diodes are flowing current. However, for newer designs
containing dozens of bypass diodes embedded in the module package, making a special
sample that allows access to each diode is no longer practical. Furthermore, the individual
testing of each diode is very-time consuming, without yielding useful information beyond what
one obtains from testing a few diodes. Thus, in edition 2, for modules containing four or more
bypass diodes, MQT 18 is only performed on three of them. The three diodes are selected for
test based on their location, which may be important to the thermal environment. Selecting the
diodes for test based on location has precedent in IIECEC 62108:201 6, 10.11
10.11 for CPV m odule
and assembly design qualification.

A .14 Re
Revv er t th e in s u l at io n t es t to 2005
20 05 v er s io n

Changes were made to the insulati

insulation
on test (MQT 03) from the IEC 61215:200 5 to
IE
IEC
C 61215-2:2016. These ch anges involved how foil covering is use
used
d during the test, as

summarized in Table A.2.

Table A .2 - Summ ary of foil placement du ring ins ulation test in three different versions.

Mo d u le ty p e IE C 6 1 2 1 5 : 2 0 0 5 IEC 61215-2:2016 IEC 61215-2:2021

F o i l p l a c e me n t F o i l p l a c e me n t F o i l p l a c e me n t

F r a m e le s s E d g e s an d b a c k E d g e s , p lu s a l l p o ly m e r ic Edges
surfaces

F ra m e
ed
d w iitt h po
po o r c on
on du
du c to
to r E d g e s an d b a c k E dg es, p
pllu s a l l p o lly
ym e
err ic Edges
surfaces

F ra m e d None A ll p o l y m e r ic s u r f a c e s None

A m a jo r co n ce rn a ss o ci a te d w ith th e IE
IECC 6 1 2 1 5 -2 :2 0 1 6 fo il co n fi g u ra tio
ti o n is th e in a b ililitity
y to
detect surface tracking when all polymeric surfaces are covered, since one of the test

requirementsintroduced
capacitance is "no dielectric breakdown
by covering or area
a large surface tracking."
disables It is equipment’s
the test also undesirable that the
arc discharge
detection. As arc discharge is a precursor to dielectric breakdown, useful information is lost. It
is also possible that various test laboratories may approach covering the junction box with foil
differently, thus causing variability in the test. Edition 2 therefore reverts to the 2005 version
IE C 6 1 2 1 5 - 1 : 2 0 2 1 © I E C 2 0 2 1 -4 1 -

of the test, and also removes the 2005 requirement of covering the entire back of a frameless
module with foil.

The applied levels in MQT 03 have been harmonized with IEC 61730. Thus, a module that is
undergoing simultaneous safety and design qualification need not have the test performed
twice under slightly different conditions. Furthermore, a module cannot pass design
qualification if it would fail an insulation test necessary for safety.

A .15 B en d in g tes
te s t

Edition 2 adds a bending test (MQT 22) for modules that are described as "flexible" on the
manufacturer label or datasheet. The modules are bent around a cylinder to the minimum
radius specified on the label or datasheet.

A .16 St ab i li za
zatt io n o p t io n f o r b o ro n o x y g en LID (MQ T 19.3)

Boron-oxygen light-induced degradation (BO-LID) is a well-known effect in Si.[61] Recently,

published studies have indicated that temporary changes in the states of BO-LID defects may
impact IEC 61215 qualification tests. Data suggest that thermal cycling may cause a transition
from the degraded state to the regenerated state,[62] causing an apparent increase in
performance after thermal cycling for modules shipped in a with BO-LID defects in the initial

("A”) or degraded ("B") state. Furthermore, damp heat may cause modules shipped in the
stabilized state ("C") to undergo an apparent decrease in performance that is not field-
representative.[62],[63] Damp heat may also cause degraded BO-LID defects to transition
from B to A for modules that are not stabilized, causing an apparent performance increase.

The project team unanimously agreed that the IEC 61215 series should deal with stabilization
of modules with BO-LID defects more comprehensively than the previous version. However,
before making large changes, the project team would like to complete an experimental study
of each option for stabilization suggested by team members. Thus, this edition of the
IEC 61215 series only addresses the most urgent case: modules that may fail a test because
of BO-LID changes that are not field-representative. To address this case, BO-LID
stabilization (MQT 19.3) is intr
introduced
oduced in IEC 61215-2:202 1, following conditions
recommended in the literature.[63] Performing this stabilization after damp heat testing is
required for Si modules in IEC 61215-1-1:2021.

The important, but less urgent, cases of modules that may exhibit an apparent performance
increase due to BO-LID effects during stress tests will be addressed in a future amendment.
 -42- IE C 6 1 2 1 5 - 1 : 2 0 2 1 © IEC 2021

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