Intel Server Board S2600WF TPS 2 6
Intel Server Board S2600WF TPS 2 6
Intel Server Board S2600WF TPS 2 6
Product Family
Technical Product Specification
An overview of product features, functions, architecture, and support specifications.
Rev 2.6
October 2021
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Intel® Server Board S2600WF Product Family Technical Product Specification
Disclaimers
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© Intel Corporation
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Intel® Server Board S2600WF Product Family Technical Product Specification
Table of Contents
1. Introduction ............................................................................................................................................................... 11
1.1 Intel Server Board Use Disclaimer .......................................................................................................................... 12
1.2 Product Errata.................................................................................................................................................................. 12
2. Server Board Family Overview .............................................................................................................................. 13
2.1 Server Board Family Feature Set ............................................................................................................................. 15
2.2 Server Board Component/Feature Identification ............................................................................................. 17
2.3 Server Board Mechanical Drawings ........................................................................................................................ 21
2.4 Product Architecture Overview ................................................................................................................................ 25
2.5 System Software Stack ................................................................................................................................................ 26
2.5.1 Hot Keys Supported During POST .......................................................................................................................... 27
2.5.2 Field Replaceable Unit (FRU) and Sensor Data Record (SDR) Data ........................................................... 29
3. Processor Support.................................................................................................................................................... 32
3.1 Processor Socket and Processor Heat Sink Module (PHM) Assembly .................................................... 32
3.2 Processor Thermal Design Power (TDP) Support ............................................................................................ 34
3.3 Intel® Xeon® Processor Scalable Family Overview ........................................................................................... 35
3.3.1 Supported Technologies ............................................................................................................................................ 37
3.3.2 Intel® Xeon® Processor Scalable Family with Integrated Intel® Omni-Path Fabric ............................. 41
3.3.3 Intel®Omni-Path IFT Carrier Accessory Kits ........................................................................................................ 43
3.4 Processor Population Rules....................................................................................................................................... 45
3.5 Processor Initialization Error Summary ................................................................................................................ 46
4. Memory Support ....................................................................................................................................................... 48
4.1 Memory Subsystem Architecture ............................................................................................................................ 48
4.2 Intel® DDR4 DIMM Support Disclaimer ................................................................................................................. 49
4.2.1 Intel® Optane™ DC Persistent Memory Module Overview ............................................................................. 50
4.3 Supported Memory ....................................................................................................................................................... 51
4.4 General Support Rules for Memory ........................................................................................................................ 52
4.4.1 DIMM Population Guidelines ..................................................................................................................................... 54
4.5 Memory RAS Features .................................................................................................................................................. 56
4.5.1 DIMM Populations Rules and BIOS Setup for Memory RAS ........................................................................ 57
5. PCIe* Support ............................................................................................................................................................ 58
5.1.1 PCIe* Enumeration and Allocation ......................................................................................................................... 58
5.1.2 Non-Transparent Bridge ............................................................................................................................................. 59
6. System I/O ................................................................................................................................................................. 60
6.1 Intel® QuickAssist Technology (Intel® QAT) Support ...................................................................................... 60
6.2 PCIe* Add-in Card Support ........................................................................................................................................ 61
6.2.1 Riser Slot #1 and Riser Slot #2 Riser Card Options ......................................................................................... 62
6.2.2 Riser Slot #3 Riser Card Option (iPC – A2UX8X4RISER) ................................................................................ 64
6.2.3 Intel® Ethernet Network Adapter for OCP* Support ........................................................................................ 65
6.2.4 Intel® Integrated RAID Module Support................................................................................................................ 66
6.3 Onboard Storage Subsystem .................................................................................................................................... 66
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
List of Figures
Figure 1. Intel® Server Board S2600WF ........................................................................................................................................... 13
Figure 2. Intel® Server Board S2600WF with available onboard options.......................................................................... 14
Figure 3. Intel® Server Board S2600WFT(R) component/feature identification............................................................. 17
Figure 4. Intel® Server Board S2600WF external I/O connector layout ............................................................................. 18
Figure 5. Intel® Light-Guided Diagnostics DIMM fault LEDs .................................................................................................... 18
Figure 6. Intel® Light Guided Diagnostic – LED identification ................................................................................................. 19
Figure 7. Board configuration and recovery jumpers ................................................................................................................ 20
Figure 8. Intel® Server Board S2600WF primary side keep-out zone ................................................................................. 21
Figure 9. Intel® Server Board S2600WF hole and component positions .......................................................................... 22
Figure 10. Intel® Server Board S2600WF secondary side keep-out zone......................................................................... 23
Figure 11. Intel® Server Board S2600WF primary side height restrictions ....................................................................... 24
Figure 12. Intel® Server Board S2600WF product family architectural block diagram ............................................... 25
Figure 13. Intel® Server Board S2600WFQ(R) architectural block diagram ..................................................................... 26
Figure 14. Intel® Server S2600WF Product Family Sensor Position.................................................................................... 30
Figure 15. Processor heat sink module (PHM) components and processor socket reference diagram............... 32
Figure 16. Processor attached to the processor heat sink installation .............................................................................. 33
Figure 17. PHM to CPU socket orientation and alignment features .................................................................................... 33
Figure 18. Processor socket assembly and protective cover ................................................................................................. 34
Figure 19. Intel® Xeon® processor Scalable generation identification ................................................................................ 35
Figure 20. Intel® Speed Select Technology comparison .......................................................................................................... 40
Figure 21. Intel® OP HFI connector location .................................................................................................................................. 41
Figure 22. Multi-chip package (MCP) ................................................................................................................................................ 42
Figure 23. Dual processor configurations with one or two fabric processors ................................................................. 42
Figure 24. Intel® Omni-Path IFT Carrier Accessory Kit components ................................................................................... 43
Figure 25. Server board sideband connectors.............................................................................................................................. 44
Figure 26. IFT carrier board – rear view ........................................................................................................................................... 44
Figure 27. Memory subsystem architecture .................................................................................................................................. 48
Figure 28. Visual differentiation of traditional SDRAM DIMM and Intel® Optane™ DC persistent memory
module .................................................................................................................................................................................................. 48
Figure 29. Intel® Server Board S2600WF memory slot layout ............................................................................................... 52
Figure 30. Intel® Server Board S2600WF product family memory channel assignment ............................................ 54
Figure 31. Two systems connected through an NTB ................................................................................................................. 59
Figure 32. Intel® QAT cable ................................................................................................................................................................... 61
Figure 33. PCIe* add-in card support ............................................................................................................................................... 62
Figure 34. 1U one-slot PCIe* riser card (iPC – F1UL16RISER3APP)..................................................................................... 63
Figure 35. 2U three-slot PCIe* riser card (iPC – A2UL8RISER2) ............................................................................................ 63
Figure 36. 2U two-slot PCIe* riser card (iPC – A2UL16RISER2) ............................................................................................. 64
Figure 37. Low profile riser card (iPC – A2UX8X4RISER) .......................................................................................................... 64
Figure 38. Intel® Ethernet Network Adapter for OCP* connector ......................................................................................... 65
Figure 39. Intel® Integrated RAID module ....................................................................................................................................... 66
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Intel® Server Board S2600WF Product Family Technical Product Specification
List of Tables
Table 1. Reference documents ............................................................................................................................................................ 11
Table 2. Intel® Server Board S2600WF product family feature set ..................................................................................... 15
Table 3. POST hot keys .......................................................................................................................................................................... 27
Table 4. Intel® Server S2600WF Product Family Sensor List ................................................................................................. 31
Table 5. 1st Gen Intel® Xeon® processor Scalable family feature comparison................................................................. 35
Table 6. 2nd Gen Intel® Xeon® processor Scalable family feature comparison................................................................ 36
Table 7. Intel® Xeon® processor Scalable family with integrated Intel® OP HFI features ........................................... 41
Table 8. IFT carrier LED functionality................................................................................................................................................ 44
Table 9. Power level classification for QSFP+ modules............................................................................................................ 44
Table 10. Supported processor mixing – fabric vs non-fabric processors ....................................................................... 45
Table 11. Mixed processor configurations error summary ..................................................................................................... 46
Table 12. DDR4 DIMM Attributes Table for “Identical” and “Like” DIMMs....................................................................... 49
Table 13. 1st Gen Intel® Xeon® processor Scalable family traditional DDR4 SDRAM DIMM support guidelines
.................................................................................................................................................................................................................. 51
Table 14. 2nd Gen Intel® Xeon® processor Scalable family traditional DDR4 SDRAM DIMM support guidelines
.................................................................................................................................................................................................................. 51
Table 15. Maximum supported traditional SDRAM DIMM speeds by SKU level in MT/s (Mega
transfers/second) .............................................................................................................................................................................. 51
Table 16. Intel® Optane™ DC persistent memory module support guidelines ................................................................ 51
Table 17. Traditional DRAM DIMM-only population configurations ................................................................................... 54
Table 18. Traditional DRAM DIMM + Intel® Optane™ DC persistent memory module population configurations
.................................................................................................................................................................................................................. 55
Table 19. Supported DRAM types ...................................................................................................................................................... 55
Table 20. Traditional DRAM DIMMs compatible with Intel® Optane™ persistent memory module ....................... 55
Table 21. Memory RAS features ......................................................................................................................................................... 56
Table 22. CPU - PCIe* port routing .................................................................................................................................................... 58
Table 23. Riser slot #1 PCIe* root port mapping ......................................................................................................................... 62
Table 24. Riser slot #2 PCIe* root port mapping ......................................................................................................................... 62
Table 25. Riser slot #3 PCIe* root port mapping ......................................................................................................................... 62
Table 26. One-slot PCIe* riser card slot description .................................................................................................................. 63
Table 27. Three-slot PCIe* riser card slot description .............................................................................................................. 63
Table 28. Two-slot PCIe* riser card slot description .................................................................................................................. 64
Table 29. Low profile riser card slot description ......................................................................................................................... 64
Table 30. Supported Intel® Ethernet Network Adapters for OCP* ....................................................................................... 65
Table 31. Intel® VROC (VMD NVMe* RAID) upgrade key options .......................................................................................... 72
Table 32. SATA and sSATA controller feature support ............................................................................................................ 73
Table 33. SATA and sSATA controller BIOS setup utility options ........................................................................................ 74
Table 34. External RJ45 NIC port LED definition ......................................................................................................................... 77
Table 35.Serial-A connector pinout .................................................................................................................................................. 78
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
1. Introduction
This Technical Product Specification (TPS) provides a high level overview of the features, functions,
architecture and support specifications of the Intel® Server Board S2600WF product family.
Throughout this document, the Intel® Server Board S2600WFT(R), S2600WF0(R), and S2600WFQ(R) will be
collectively referred to as the Intel® Server Board S2600WF.
Note: Some of the documents listed in the following table are classified as “Intel Confidential”. These
documents are made available under a Non-Disclosure Agreement (NDA) with Intel and must be ordered
through your local Intel representative.
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: In 2019, Intel released the 2nd Gen Intel® Xeon® processor Scalable family. To enable support for the
new processor family, Intel created an updated system software stack, which includes the System BIOS and
other system firmware.
In support of the 2nd Gen Intel® Xeon® processor Scalable family, Intel began pre-loading the supporting
system software stack onto all server boards and systems that define the Intel® Server S2600WF product
family. All server board and systems with a pre-loaded system software stack compatible with the 2nd Gen
Intel® Xeon® processor Scalable family can be identified by a product order code ending in an ‘R’.
Existing server boards and systems that define the Intel® Server S2600WF product family with product codes
that do NOT end in an ‘R’ can be made to support the 2nd Gen Intel® Xeon® processor Scalable family by
updating the system software stack to one that supports this processor family. A System Update Package
(SUP) with the latest system software stack can be downloaded from the following Intel website:
https://downloadcenter.intel.com.
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Intel® Server Board S2600WF Product Family Technical Product Specification
Support for KR
based OCP
module options
Support for dual hot swap
power supply modules
80 mm M.2
PCIe*/SATA 1+0, 1+1, 2+0 configurations
80 mm M.2
PCIe*/SATA
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: Intel Server Systems based on this server board family may support a lower maximum Thermal
Design Power (TDP). See the appropriate Intel System TPS for maximum supported TDP.
Note: The maximum memory speed supported is dependent on the installed processor SKU and population
configuration.
Note: Intel® Optane™ DC persistent memory module memory is only supported in systems configured with
2nd Gen Intel® Xeon® processor Scalable family (Platinum, Gold, and select Silver SKUs)
Note: Intel® Optane™ DC persistent memory module memory is only supported with Board and System
products that include an ‘R’ at the end of the product order code.
Intel® C62x Series Intel® C624 Chipset Intel® C624 Chipset Intel® C628 Chipset
Chipset
Intel® Quick Assist No No Yes
Technology
Intel® Omni-Path Supported Supported Supported
Fabric
Onboard LAN Dual Port RJ45 10 GbE No No
OCP Module • Dual Port 10Gb RJ45 – • Quad Port 1Gb RJ45 – • Quad Port 1Gb RJ45 –
Support iPC 557T2OCPG1P5 iPC I357T4OCPG1P5 iPC I357T4OCPG1P5
• Dual Port SFP+ – • Quad Port SFP+ – • Quad Port SFP+ –
iPC 527DA2OCPG1P5 iPC X527DA4OCPG1P5 iPC X527DA4OCPG1P5
• Dual Port 10Gb RJ45 – • Dual Port 10Gb RJ45 –
iPC X557T2OCPG1P5 iPC X557T2OCPG1P5
• Dual Port SFP+ – • Dual Port SFP+ –
iPC X527DA2OCPG1P5 iPC X527DA2OCPG1P5
Intel® Integrated Supported Supported Supported
SAS Module
Onboard PCIe* • (4) – OCuLink connectors • (4) – OCuLink connectors • (2) – OCuLink connectors
NVMe* • Intel® VMD support • Intel® VMD support • Intel® VMD support
• Intel® VROC support • Intel® VROC support • Intel® VROC support (accessory
(accessory option) (accessory option) option)
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Intel® Server Board S2600WF Product Family Technical Product Specification
Intel® Server
iPC - S2600WFT(R) iPC - S2600WF0(R) iPC - S2600WFQ(R)
Board Feature
Onboard SATA • 12 x SATA 6 Gbps ports (6 Gb/s, 3 Gb/s and 1.5 Gb/s transfer • 4 x SATA 6 Gbps ports (6 Gb/s, 3
rates supported) Gb/s and 1.5 Gb/s transfer rates
o (2) – single port 7-pin SATA connectors supported)
o (2) – M.2 connectors – SATA / PCIe* o (2) – single port 7-pin SATA
o (2) – 4-port Mini-SAS HD (SFF-8643) connectors connectors
• Embedded SATA Software RAID o (2) – M.2 connectors –
o Intel® VROC (SATA RAID) SATA/PCIe*
o Intel® Embedded Server RAID Technology 2 1.60 with • Embedded SATA Software RAID
optional RAID 5 key support o Intel® VROC (SATA RAID)
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: Some features may not be present on Intel® Server Boards S2600WF0(R) and/or S2600WFQ(R).
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: See Appendix B for POST Code Diagnostic LED decoder information.
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
Figure 10. Intel® Server Board S2600WF secondary side keep-out zone
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Intel® Server Board S2600WF Product Family Technical Product Specification
Figure 11. Intel® Server Board S2600WF primary side height restrictions
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Intel® Server Board S2600WF Product Family Technical Product Specification
Figure 12. Intel® Server Board S2600WF product family architectural block diagram
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
• Front panel management – The BMC controls the system status LED and chassis ID LED. It supports
secure lockout of certain front panel functionality and monitors button presses. The chassis ID LED is
turned on using a front panel button or a command.
• DIMM temperature monitoring – New sensors and improved acoustic management using closed-loop
fan control algorithm taking into account DIMM temperature readings.
• Integrated KVM
• Integrated remote media redirection
• Intel® Intelligent Power Node Manager support
• Sensor and SEL logging additions/enhancements (e.g., additional thermal monitoring capability)
• Embedded platform debug feature, which allows capture of detailed data for later analysis by Intel
A complete system software stack is pre-programmed on the server board during the board assembly
process, making the server board functional at first power on. However, to ensure the most reliable system
operation, it is highly recommended to check http://downloadcenter.intel.com for the latest available system
updates.
System updates can be performed in a number of operating environments, including the UEFI Shell* using
the UEFI-only system update package (SUP), or under different operating systems using the Intel® One Boot
Flash Update (Intel® OFU) utility.
As part of the initial system integration process, system integrators must program system configuration data
onto the server board using the FRUSDR utility to ensure the embedded platform management subsystem is
able to provide the best performance and cooling for the final system configuration. The FRUSDR utility is
included in the SUP and OFU packages. For additional information, see Section 2.5.2.
Refer to the following Intel documents for more in-depth information about the system software stack and
their functions:
• Intel® Server Board S2600 Family BIOS External Product Specification – Intel NDA Required
• Intel® Server System Integrated Baseboard Management Controller (BMC) Firmware External Product
Specification for Intel® Servers Systems supporting the Intel® Xeon® processor Scalable family – Intel
NDA Required
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: With a USB keyboard, it is important to wait until the BIOS discovers the keyboard and beeps; until the
USB controller has been initialized and the keyboard activated, key presses are not read by the system.
When the BIOS setup utility is entered, the main screen is displayed initially. However, if a serious error
occurs during POST, the system enters the BIOS setup utility and displays the error manager screen instead
of the main screen.
For additional BIOS setup utility information, refer to Intel® Server Board S2600 Family BIOS Setup User
Guide.
2.5.1.4 BIOS Update Capability
To bring BIOS fixes or new features into the system, it is necessary to replace the current installed BIOS
image with an updated one. The BIOS image can be updated using a stand-alone IFLASH32 utility in the UEFI
Shell* or using the OFU utility program under a supported operating system. Full BIOS update instructions
are provided with update packages downloaded from the Intel website.
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Intel® Server Board S2600WF Product Family Technical Product Specification
The BIOS recovery takes place without any external media or mass storage device as it uses a backup BIOS
image inside the BIOS flash in recovery mode.
Note: The recovery procedure is included here for general reference. However, if in conflict, the instructions
in the BIOS release notes are the definitive version.
When the BIOS recovery jumper is set, the BIOS begins by logging a recovery start event to the system event
log (SEL). It then loads and boots with a backup BIOS image residing in the BIOS flash device. This process
takes place before any video or console is available. The system boots to the embedded UEFI Shell*, and a
recovery complete event is logged to the SEL. From the UEFI Shell*, the BIOS can then be updated using a
standard BIOS update procedure defined in update instructions provided with the system update package
downloaded from the Intel website. Once the update has completed, switch the recovery jumper back to its
default position and power cycle the system.
If the BIOS detects a partial BIOS update or the BMC asserts recovery mode GPIO, the BIOS boots in recovery
mode. The difference is that the BIOS boots up to the error manager page in the BIOS setup utility. In the
BIOS Setup utility, a boot device, Shell* or Linux*, for example, could be selected to perform the BIOS update
procedure under Shell* or OS environment.
Note: Before attempting a recovery boot, it is highly advisable to reference the BIOS Release Notes to verify
the proper recovery procedure.
2.5.2 Field Replaceable Unit (FRU) and Sensor Data Record (SDR) Data
As part of the initial system integration process, the server board/system must have the proper FRU and SDR
data loaded. This ensures that the embedded platform management system is able to monitor the
appropriate sensor data and operate the system with best cooling and performance. Once the system
integrator has performed an initial FRU SDR package update, subsequent auto-configuration occurs without
the need to perform additional SDR updates or provide other user input to the system when any of the
following components are added or removed:
• Processor
• Memory
• OCP module
• Integrated SAS/RAID module
• Power supply
• Fan
• Intel® Xeon Phi™ co-processor PCIe* card
• Hot swap backplane
• Front panel
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: The system may not operate with best performance or best/appropriate cooling if the proper FRU and
SDR data is not installed.
The FRU and SDR files included in the SUP or OFU utility describe the sensors in the board, chassis and
peripherals as shown in Figure 14 and Table 4.
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
3. Processor Support
The server board includes two Socket-P LGA3647 processor sockets compatible with the 1st and 2nd Gen
Intel® Xeon® processor Scalable families (standard and fabric options) and supports processor thermal
design power (TDP) of up to 205 W.
Note: Previous-generation Intel® Xeon® processors and their supported CPU heat sinks are not compatible
on server boards described in this document.
Note: The server board is capable of supporting processors with a maximum 205 W TDP. However, TDP
support may vary depending on the cooling capabilities of the chosen server chassis. Check the server
chassis or server system product specifications to determine maximum supported processor TDP.
3.1 Processor Socket and Processor Heat Sink Module (PHM) Assembly
This generation server board introduces the concept of the processor heat sink module (PHM). Figure 15
identifies each component associated with the processor assembly. The illustration does not represent the
processor installation process.
Figure 15. Processor heat sink module (PHM) components and processor socket reference diagram
Processor installation requires that the processor be attached to the processor heat sink prior to installation
onto the server board as shown in Figure 16.
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
The PHM is properly installed when it is securely seated over the two bolster plate guide pins and sits evenly
over the processor socket as shown in Figure 17. Once the PHM is properly seated over the processor socket
assembly, the four heat sink Torx* screws must be tightened in the order specified on the label affixed to the
top side of the processor heat sink.
Caution: Failure to tighten the heat sink screws in the specified order may cause damage to the processor
socket assembly. Heat sink screws should be tightened to 12 in-lbs torque.
Note: For detailed processor assembly and installation instructions, refer to the appropriate Intel product
family System Integration and Service Guide.
To protect the pins within a processor socket from being damaged, server boards with no processor or heat
sink installed must have a plastic cover installed over each processor socket, as shown in Figure 18.
Processor socket covers must be removed before processor installation (Figure 18 – B).
Disclaimer Note: Intel Server Boards contain a number of high-density VLSI and power delivery components
that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when
Intel® server building blocks are used together, the fully integrated system meets the intended thermal
requirements of these components. It is the responsibility of the system integrator who chooses not to use
Intel-developed server building blocks to consult vendor datasheets and operating parameters to determine
the amount of airflow required for the specific application and environmental conditions. Intel cannot be
held responsible if components fail or the server board does not operate correctly when used outside any of
its published operating or non-operating limits.
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
Table 6. 2nd Gen Intel® Xeon® processor Scalable family feature comparison
82xx 62xx 52xx 42xx 32xx
Feature
Platinum Gold Gold Silver Bronze
# of Intel® UPI
3 3 2 2 2
Links
UPI Speed 10.4 GT/s 10.4 GT/s 10.4 GT/s 9.6 GT/s 9.6 GT/s
2S-2UPI
2S-2UPI
2S-3UPI
Supported 2S-3UPI 2S-2UPI
4S-2UPI 2S-2UPI 2S-2UPI
Topologies 4S-2UPI 4S-2UPI
4S-3UPI
4S-3UPI
8S-3UPI
Node Controller
Yes Yes No No No
Support
# of Memory
6 6 6 6 6
Channels
Max DDR4 Speed
2933 2933 2666 2400 2133
1DPC
Max DDR4 Speed
2666 2666 2666 2400 2133
2DPC
Intel® Optane™ DC
Persistent Only Intel® Xeon®
Yes1 Yes1 Yes1 No
Memory Module Silver 42151
Support
1 TB 1 TB 1 TB
2 TB (select SKUs) 2 TB (select SKUs) 2 TB (select SKUs)
Memory Capacity 1TB 1TB
4.5 TB (select 4.5 TB (select 4.5 TB (select
SKUs) SKUs) SKUs)
RAS Capability Advanced Advanced Advanced Standard Standard
Intel® Turbo Boost
Yes Yes Yes Yes No
Technology
Intel® Hyper-
Threading Yes Yes Yes Yes No
Technology
Intel® AVX-512
Yes Yes Yes Yes Yes
ISA support
Intel® AVX-512 – #
2 2 1 1 1
of 512b FMA units
VNNI Yes Yes Yes Yes Yes
# of PCIe* Lanes 48 48 48 48 48
1 Intel® Optane™ DC persistent memory module is supported only by Intel® Server Boards S2600WFTR, S2600WF0R, and
S2600WFQR with a 2nd Gen Intel® Xeon® Scalable processor.
The 1st and 2nd Gen Intel® Xeon® processor Scalable families combine several key system components into a
single processor package, including the CPU cores, Integrated Memory Controller (IMC), and Integrated IO
Module (IIO).
The processor core features and technologies include:
• Intel® Ultra Path Interconnect (Intel® UPI) – up to 10.4 GT/s
• Intel® Speed Shift Technology
• Intel® 64 Architecture
• Enhanced Intel SpeedStep® Technology
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Intel® Server Board S2600WF Product Family Technical Product Specification
directives (that is, set a platform power budget). Intel® ME enforces these policy directives by controlling the
power consumption of underlying subsystems using available control mechanisms (such as processor P/T
states). The determination of the policy directive is done outside of Intel® ME either by intelligent
management software or by the IT operator.
Below are some of the applications of Intel® Intelligent Power Node Manager technology:
• Platform power monitoring and limiting – The Intel® ME/Intel® NM monitors platform power
consumption and holds average power over duration. It can be queried to return actual power at any
given instance. The power limiting capability is to allow external management software to address
key IT issues by setting a power budget for each server.
• Inlet air temperature monitoring – The Intel® ME/Intel® NM monitors server inlet air temperatures
periodically. If there is an alert threshold in effect, then Intel® ME/Intel® NM issues an alert when the
inlet (room) temperature exceeds the specified value. The threshold value can be set by policy.
• Memory subsystem power limiting – The Intel® ME/Intel® NM monitors memory power consumption.
Memory power consumption is estimated using average bandwidth utilization information.
• Processor power monitoring and limiting – The Intel® ME/Intel® NM monitors processor or socket
power consumption and holds average power over duration. It can be queried to return actual power
at any given instant. The monitoring process of the Intel® ME is used to limit the processor power
consumption through processor P-states and dynamic core allocation.
• Core allocation at boot time – Restrict the number of cores for OS/VMM use by limiting how many
cores are active at boot time. After the cores are turned off, the CPU limits how many working cores
are visible to the BIOS and OS/VMM. The cores that are turned off cannot be turned on dynamically
after the OS has started. It can be changed only at the next system reboot.
• Core allocation at run-time – This particular use case provides a higher level processor power
control mechanism to a user at runtime, after booting. An external agent can dynamically use or not
use cores in the processor subsystem by requesting Intel® ME/Intel® NM to control them, specifying
the number of cores to use or not use.
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
3.3.2 Intel® Xeon® Processor Scalable Family with Integrated Intel® Omni-Path Fabric
The 1st Gen Intel® Xeon® processor Scalable family includes SKUs which include an integrated Intel® Omni-
Path Host Fabric Interface (Intel® OP HFI) connector.
Table 7. Intel® Xeon® processor Scalable family with integrated Intel® OP HFI features
81XXF 61XXF
Feature
Platinum Gold
# of Cores ≥ 24 < 24
# of Intel® OP HFI Ports 1 1
# of Intel® UPI Links 2 2
Intel® UPI Speed 10.4 GT/s 10.4 GT/s
Supported Topologies 2S-2UPI 2S-2UPI
Node Controller Support No No
# of Memory Channels 6 6
Max DDR4 Speed 2666 2666
768 GB 768 GB
Memory Capacity
1.5 TB (select SKUs) 1.5 TB (select SKUs)
RAS Capability Standard Standard
Intel® Turbo Boost Yes Yes
Intel® HT Technology Yes Yes
Intel® AVX-512 ISA Support Yes Yes
Intel® AVX-512 - # of 512b FMA Units 2 2
# of PCIe* Lanes 48 48
The current fabric port count is one port per processor socket. Each Intel® OP HFI port supports four lanes of
25 Gbps, providing 100 Gbps of bandwidth in a single direction.
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Intel® Server Board S2600WF Product Family Technical Product Specification
Figure 23. Dual processor configurations with one or two fabric processors
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
The sideband cable connects the IFT carrier board to each fabric processor sideband connector on the
server board. The sideband connectors are shown in Figure 25.
Fabic Sideband
Fabic Sideband CPU2
CPU1
For external connection, the IFT carrier includes two QSFP+28 style connectors. The signal definition of
these connectors consists of the high speed diff pairs, miscellaneous sideband signals, and 3.3 V power. The
3.3 V power is used for the active logic within the QSFP+ modules. As noted in Table 9, QSFP+ modules have
four power classes that control how much power the active logic in the cable can consume.
Table 9. Power level classification for QSFP+ modules
Power Level Class Max Power (W)
1 1.5
2 2.0
3 2.5
4 3.5
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Intel® Server Board S2600WF Product Family Technical Product Specification
The server board has support for processor configurations where one or two installed processors may have
an Intel® OP HFI. In dual processor configurations, with at least one processor having support for Intel® OP
HFI, the following population rules apply:
• The base SKU number of both processor types must be the same.
o Example: Intel® Xeon® Platinum 8160F (Intel® OP HFI) + Intel® Xeon® Platinum 8160 (non-
fabric)
o Example: Intel® Xeon® Gold 6140F (Intel® OP HFI) + Intel® Xeon® Gold 6140F (Intel® OP HFI)
There is no restriction on which processor socket is populated with the fabric processor and which processor
socket is populated with the matching non-fabric processor.
Table 10. Supported processor mixing – fabric vs non-fabric processors
Note: The server board may support dual-processor configurations consisting of different processors that
meet the defined criteria below; however, Intel does not perform validation testing of this configuration. In
addition, Intel does not guarantee that a server system configured with unmatched processors will operate
reliably. The system BIOS does attempt to operate with processors, which are not matched but are generally
compatible. For optimal system performance in dual-processor configurations, Intel recommends that
identical processors be installed.
When using a single processor configuration, the processor must be installed into the processor socket
labeled “CPU_1”.
Note: Some server board features may not be functional unless a second processor is installed (see Figure
12).
When two processors are installed, the following population rules apply:
• Both processors must have the same number of cores.
• Both processors must have the same cache sizes for all levels of processor cache memory.
• Both processors must support identical DDR4 memory frequencies.
• Both processors must have identical extended family, extended model, processor type, family code
and model number.
• Processors with FPGA and processors with Intel® Omni-Path Fabric cannot be mixed.
Processors with different core frequencies can be mixed in a system, given that the prior rules are met. If this
condition is detected, all processor core frequencies are set to the lowest common denominator (highest
common speed) and an error is reported.
Processor stepping within a common processor family can be mixed as long as it is listed in the processor
specification updates published by Intel. Mixing of steppings is only validated and supported between
processors that are plus or minus one stepping from each other.
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Intel® Server Board S2600WF Product Family Technical Product Specification
Unrecoverable fatal error found. System will not boot until the error is
resolved
Press <F2> to enter setup
When the <F2> key on the keyboard is pressed, the error message is displayed on the error manager
screen and an error is logged to the system event log (SEL) with the POST error code.
The “POST Error Pause” option setting in the BIOS setup does not have any effect on this error.
If the system is not able to boot, the system generates a beep code consisting of three long beeps
and one short beep. The system cannot boot unless the error is resolved. The faulty component must
be replaced.
The system status LED is set to a steady amber color for all fatal errors that are detected during
processor initialization. A steady amber system status LED indicates that an unrecoverable system
failure condition has occurred.
• Major: An error message is displayed to the error manager screen and an error is logged to the SEL. If
the BIOS setup option “Post Error Pause” is enabled, operator intervention is required to continue
booting the system. If the BIOS setup option “POST Error Pause” is disabled, the system continues to
boot.
• Minor: An error message may be displayed to the screen or to the BIOS setup error manager and the
POST error code is logged to the SEL. The system continues booting in a degraded state. The user
may want to replace the erroneous unit. The “POST Error Pause” option setting in the BIOS setup
does not have any effect on this error.
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Intel® Server Board S2600WF Product Family Technical Product Specification
Error Severity System Action when BIOS Detects the Error Condition
If the frequencies for all processors can be adjusted to be the same:
• Adjusts all processor frequencies to the highest common frequency.
• Does not generate an error – this is not an error condition.
• Continues to boot the system successfully.
Processor
frequency If the frequencies for all processors cannot be adjusted to be the same:
Fatal
(speed) not • Logs the POST error code into the SEL.
identical • Alerts the BMC to set the system status LED to steady amber.
• Does not disable the processor.
• Displays 0197: Processor speeds unable to synchronize message in the error
manager.
• Takes fatal error action (see above) and does not boot until the fault condition is remedied
If the link frequencies for all Intel® Ultra Path Interconnect (Intel® UPI) links can be adjusted to be
the same:
• Adjusts all Intel UPI interconnect link frequencies to highest common frequency.
• Does not generate an error – this is not an error condition.
• Continues to boot the system successfully.
Processor
Intel® UPI link
Fatal If the link frequencies for all Intel UPI links cannot be adjusted to be the same:
frequencies not
• Logs the POST error code into the SEL.
identical
• Alerts the BMC to set the system status LED to steady amber.
• Does not disable the processor.
• Displays 0195: Processor Intel(R) UPI link frequencies unable to
synchronize message in the error manager.
• Takes fatal error action (see above) and does not boot until the fault condition is remedied.
• Logs the POST error code into the SEL.
• Displays 816x: Processor 0x unable to apply microcode update message in the
Processor
Major error manager or on the screen.
microcode
• Takes major error action. The system may continue to boot in a degraded state, depending on
update failed
the “POST Error Pause” setting in setup, or may halt with the POST error code in the error
manager waiting for operator intervention.
• Logs the POST error code into the SEL.
Processor • Displays 818x: Processor 0x microcode update not found message in the error
microcode Minor manager or on the screen.
update missing • The system continues to boot in a degraded state, regardless of the “POST Error Pause”
setting in setup.
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Intel® Server Board S2600WF Product Family Technical Product Specification
4. Memory Support
This chapter describes the architecture that drives the memory subsystem, supported memory types,
memory population rules, and supported memory reliability, accessibility, and serviceability (RAS) features.
Figure 28. Visual differentiation of traditional SDRAM DIMM and Intel® Optane™ DC persistent memory module
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Intel® Server Board S2600WF Product Family Technical Product Specification
Table 12. DDR4 DIMM Attributes Table for “Identical” and “Like” DIMMs
• DDR4 DIMMs are considered “Identical” when ALL listed attributes between the DIMMs match.
• Two or more DDR4 DIMMs are considered “Like” DIMMs when all attributes minus the Vendor, and/or
DIMM Part # and/or DIMM Revision#, are the same.
DIMM Size (GB) Match Match 8GB, 16GB, 32GB, 64GB, 128GB, 256GB
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: Use of memory type Intel® Optane™ DC persistent memory module is only supported when the
following are true:
Note: Server Boards and Systems that have non-(R) product codes but have had the system software
updated to support 2nd Gen Intel® Xeon® processor Scalable family, are not equivalent to server boards and
systems with product codes ending in (R). Server Boards and Systems with non-(R) product codes do NOT
have support for memory type Intel® Optane™ DC persistent memory module DIMMs.
Intel® Optane™ DC persistent memory module supports the following operating modes:
• Memory Mode
• App Direct mode
• Mixed mode
App Direct and Mixed modes require both driver and explicit software support. For more information
concerning OS compatibility, visit support.intel.com.
4.2.1.1 Intel® Optane™ DC Persistent Memory Module - Memory Mode (MM)
In Memory Mode (MM), Intel® Optane™ DC Persistent Memory works as the main large volatile (non-
persistent) system memory. While in Memory Mode, all available traditional DRAM within the same memory
controller functions as the write-back L4 cache for Intel® Optane™ DC persistent memory module. This
lowers the cost of total system memory capacity versus only traditional DRAM while maintaining near-DRAM
performance.
4.2.1.2 Intel® Optane™ DC Persistent Memory Module - App Direct (AD) Mode
App Direct (AD) mode allows Intel® Optane™ DC persistent memory module to work as persistent memory,
maintaining data integrity while power is lost for applications while sustaining near-DRAM performance.
While in App Direct mode, DRAM operates as normal system memory and Intel® Optane™ DC persistent
memory module functions as application storage.
4.2.1.3 Intel® Optane™ DC Persistent Memory Module - Mixed Mode
Mixed mode allows partial use of Intel® Optane™ DC persistent memory module’s capacity to work as a large
pool of volatile system memory, and for the remaining capacity to work as persistent memory for
applications with near-DRAM performance. The capacity dedicated to volatile system memory must meet the
Memory Mode population criteria, and any remaining capacity will be available as persistent memory for
application storage and must be supported by the OS, driver, and application.
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Intel® Server Board S2600WF Product Family Technical Product Specification
Table 14. 2nd Gen Intel® Xeon® processor Scalable family traditional DDR4 SDRAM DIMM support guidelines
Max Speed (MT/s); Voltage (V); Slots per
Ranks per DIMM Capacity (GB) Channel (SPC) & DIMMs per Channel (DPC)
Type DIMM and 2 Slots per Channel
Data Width DRAM Density 1DPC 2DPC
4 Gb 1 8 Gb 16 Gb 1.2 V 1.2 V
SRx8 4 GB 8 GB 16 GB
SRx4 8 GB 16 GB 32 GB
RDIMM
DRx8 8 GB 16 GB 32 GB
DRx4 16 GB 32 GB 64 GB
QRx4 N/A 2H-64 GB 2H-128 GB 2933 2666
RDIMM 3DS
8Rx4 N/A 4H-128 GB 4H-256 GB
LRDIMM QRx4 32 GB 64 GB 128 GB
QRx4 N/A 2H-64 GB 2H-128 GB
LRDIMM 3DS
8Rx4 N/A 4H-128 GB 4H-256 GB
Table 15. Maximum supported traditional SDRAM DIMM speeds by SKU level in MT/s (Mega transfers/second)
Platinum 8xxx Gold 6xxx Gold 5xxx Silver 4xxx Bronze 3xxx
1st Gen Intel® Xeon® processor Scalable Family 2666 2666 2400 2400 2133
2nd Gen Intel® Xeon® processor Scalable Family 2933 2 29332 2666 2400 2133
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Intel® Server Board S2600WF Product Family Technical Product Specification
Processor Family Processor SKU Level DIMM Capacity (GB) Speed (MT/s)
Bronze 32xx N/A N/A
1866
Silver 42xx 3 2133
128 GB 2400
2nd Gen Intel® Xeon® processor Scalable
Gold 52xx 256 GB 1866
Gold 62xx 512 GB 2133
2400
Platinum 82xx
2666
Note: Although mixed DIMM configurations are supported, Intel performs platform validation only on
systems that are configured with identical DIMMs installed.
On the Intel® Server Board S2600WF, a total of 24 DIMM slots are provided – 2 CPUs, 6 Memory
Channels/CPU, 2 DIMMs/Channel. Figure 29 identifies all DIMM slots on the server board.
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Intel® Server Board S2600WF Product Family Technical Product Specification
• Mixing DIMMs of different frequencies and latencies is not supported within or across processor
sockets. If a mixed configuration is encountered, the BIOS attempts to operate at the highest
common frequency and the lowest latency possible.
• When populating a quad-rank DIMM with a single- or dual-rank DIMM in the same channel, the quad-
rank DIMM must be populated farthest from the processor. Incorrect DIMM placement results in an
MRC error code. A maximum of 8 logical ranks can be used on any one channel, as well as a maximum
of 10 physical ranks loaded on a channel.
• The memory slots associated with a given processor are unavailable if the corresponding processor
socket is not populated.
• A processor may be installed without populating the associated memory slots, provided a second
processor is installed with associated memory. In this case, the memory is shared by the processors.
However, the platform suffers performance degradation and latency due to the remote memory.
• Processor sockets are self-contained and autonomous. However, all memory subsystem support
(such as memory RAS and error management) in the BIOS setup are applied commonly across
processor sockets.
• For multiple DIMMs per channel:
o For RDIMM, LRDIMM, 3DS RDIMM, 3DS LRDIMM; always populate DIMMs with higher electrical
loading in slot1, followed by slot 2.
• For best system performance in dual processor configurations, installed DIMM type and population
for DIMMs configured to CPU2 must match DIMM type and population configured to CPU1. See
section 4.2.1 for additional information.
Figure 30. Intel® Server Board S2600WF product family memory channel assignment
Table 17. Traditional DRAM DIMM-only population configurations
iMC1 iMC0
# of CH F CH E CH D CH C CH B CH A
DIMMs Slot 2 Slot 1 Slot 2 Slot 1 Slot 2 Slot 1 Slot 2 Slot 1 Slot 2 Slot 1 Slot 2 Slot 1
1 - - - - - - - - - - - DRAM
2 - - - - - - - - - DRAM - DRAM
3 - - - - - - - DRAM - DRAM - DRAM
4 - - - DRAM - DRAM - - - DRAM - DRAM
51 - - - DRAM - DRAM - DRAM - DRAM DRAM DRAM
6 - DRAM - DRAM - DRAM - DRAM - DRAM - DRAM
71 - DRAM - DRAM - DRAM - DRAM - DRAM DRAM DRAM
8 - - DRAM DRAM DRAM DRAM - - DRAM DRAM DRAM DRAM
91 - DRAM - DRAM - DRAM DRAM DRAM DRAM DRAM DRAM DRAM
101 - DRAM DRAM DRAM DRAM DRAM - DRAM DRAM DRAM DRAM DRAM
111 - DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM
12 DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM
1 Configuration not recommended. This is an unbalanced configuration, which will yield less than optimal performance.
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Intel® Server Board S2600WF Product Family Technical Product Specification
Table 18. Traditional DRAM DIMM + Intel® Optane™ DC persistent memory module population configurations
Symmetric Population per Processor Socket
iMC1 iMC0
Channel F Channel E Channel D Channel C Channel B Channel A
Modes Slot 2 Slot 1 Slot 2 Slot 1 Slot 2 Slot 1 Slot 2 Slot 1 Slot 2 Slot 1 Slot 2 Slot 1
AD PMM DRAM1 PMM DRAM1 PMM DRAM1 PMM DRAM1 PMM DRAM1 PMM DRAM1 2-2-2
MM PMM DRAM1 PMM DRAM1 PMM DRAM1 PMM DRAM1 PMM DRAM1 PMM DRAM1 2-2-2
AD +
PMM DRAM3 PMM DRAM3 PMM DRAM3 PMM DRAM3 PMM DRAM3 PMM DRAM3 2-2-2
MM
AD − DRAM1 − DRAM1 PMM DRAM1 − DRAM1 − DRAM1 PMM DRAM1 2-1-1
MM − DRAM2 − DRAM2 PMM DRAM2 − DRAM2 − DRAM2 PMM DRAM2 2-1-1
AD +
− DRAM3 − DRAM3 PMM DRAM3 − DRAM3 − DRAM3 PMM DRAM3 2-1-1
MM
AD − DRAM1 PMM DRAM1 PMM DRAM1 − DRAM1 PMM DRAM1 PMM DRAM1 2-2-1
MM − DRAM1 PMM DRAM1 PMM DRAM1 − DRAM1 PMM DRAM1 PMM DRAM1 2-2-1
AD +
− DRAM3 PMM DRAM3 PMM DRAM3 − DRAM3 PMM DRAM3 PMM DRAM3 2-2-1
MM
AD − PMM − DRAM1 − DRAM1 − PMM − DRAM1 − DRAM1 1-1-1
MM − PMM − DRAM1 − DRAM1 − PMM − DRAM1 − DRAM1 1-1-1
AD − PMM DRAM1 DRAM1 DRAM1 DRAM1 − PMM DRAM1 DRAM1 DRAM1 DRAM1 2-2-1
DRAM1 and DRAM2 types in Table 19 must meet the specifications listed in Table 20.
Table 20. Traditional DRAM DIMMs compatible with Intel® Optane™ persistent memory module
DIMM Type Ranks Width Density 3D Stack Height Size
1 4 8 1 16
1 4 16 1 32
RDIMM 2 8 8 1 16
2 8 16 1 32
2 4 8 1 32
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: RAS features may not be supported on all SKUs of a processor type.
4.5.1 DIMM Populations Rules and BIOS Setup for Memory RAS
• Memory sparing and memory mirroring options are enabled in BIOS setup.
• Memory sparing and memory mirroring options are mutually exclusive. Only one operating mode
may be selected in BIOS setup.
• If a RAS mode has been enabled, and the memory configuration is not able to support it during boot,
the system will fall back to independent channel mode and log and display errors.
• Rank sparing mode is only possible when all channels that are populated with memory that meet the
requirement of having at least two single-rank or double-rank DIMMs installed, or at least one quad-
rank DIMM installed, on each populated channel.
• Memory mirroring mode requires that for any channel pair that is populated with memory, the
memory population on both channels of the pair must be identically sized.
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Intel® Server Board S2600WF Product Family Technical Product Specification
5. PCIe* Support
The PCI Express* (PCIe*) interface of the Intel® Server Board S2600WF product family is fully compliant with
the PCIe* Base Specification, Revision 3.0 supporting the following PCIe* bit rates: Gen 3.0 (8.0 GT/s), Gen 2.0
(5.0 GT/s), and Gen 1.0 (2.5 GT/s).
For specific board features and functions supported by the PCIe* subsystem, see Chapter 6. Table 22
provides the PCIe* port routing information from each processor:
Table 22. CPU - PCIe* port routing
CPU 1 CPU 2
PCI Ports Onboard Device PCI Ports Onboard Device
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Intel® Server Board S2600WF Product Family Technical Product Specification
In addition, the NTB provides the ability to interrupt a processor in the remote system through a set of
Doorbell registers. A write to a Doorbell register in the local side of the NTB will generate an interrupt to the
remote processor. Since the NTB is designed to be symmetric, the converse is also true.
For additional information, refer to the Processor Family External Design Specification (EDS).
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Intel® Server Board S2600WF Product Family Technical Product Specification
6. System I/O
The server board input/output features are provided via the embedded features and functions of several
onboard components including: the Integrated I/O Module (IIO) of the Intel® Xeon® processor, the Intel®
C620 series chipset (PCH), and the I/O controllers embedded within the Aspeed* AST2500 management
controller. See Figure 12 for an overview of the features and interconnects of each of the major subsystem
components. Server board I/O features include:
• Intel® QuickAssist Technology (Intel® QAT) support (S2600WFQ(R) only)
• PCIe* riser card and add-in card support
• Intel® Ethernet Network Adapter for OCP* support
• Intel® Integrated RAID Module support
• Onboard storage subsystem
• External I/O port support
Note: For the Intel® Server Board S2600WF product family, only the S2600WFQ(R) SKU supports Intel® QAT.
Intel® QAT provides security and compression acceleration capabilities used to improve performance and
efficiency across the data center.
Intel® QAT supports the following:
• Cryptographic capabilities: 100 Gb/s IPSec & SSL
o Symmetric ciphers: (AES, AES-XTS, 3DES/DES, RC4, Kasumi, Snow3G, ZUC)
o Message digest/hash (MD5, SHA1, SHA2, SHA3)
o Authentication (HMAC, AES-XCBC)
o Authenticated encryption (AES-GCM, AES-CCM)
• Asymmetric (public key) cryptographic capabilities
o Modular exponentiation for Diffie-Hellman (DH)
o RSA key generation, encryption/decryption and digital signature generation/verification.
RSA(2K Keys) up to 100K Ops/sec
o DSA parameter generation and digital signature generation/verification
o Elliptic curve cryptography: ECDSA, ECDH
• Compression/decompression (deflate) up to 100Gb/s
On the Intel® Server Board S2600WFQ(R), there are three Intel® QAT engines incorporated into the Intel®
C628 chipset with a dedicated x16 PCIe* 3.0 link that allows for up to 100 Gbps aggregated bandwidth.
Intel® QAT bandwidth can be increased to 150 Gbps with the addition of an optional Intel® QAT bridge cable
connected between the onboard Mini-SAS HD connectors for SATA Ports 0–3 and 4–7, and two of the
onboard PCIe* x4 OCuLink connectors as shown in Figure 32.
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: For Intel® Server Board S2600WFQ(R), the Intel® QAT cable is included with the board and is not
available for sale separately.
Intel® QAT support requires that a driver be loaded for the installed operating system. Visit
http://downloadcenter.intel.com to download the latest available drivers.
Note: The riser card slots are specifically designed to support riser cards only. Attempting to install a PCIe*
add-in card directly into a riser card slot on the server board may damage the server board, the add-in card,
or both.
Note: A dual processor configuration is required when using Riser Slot #2 and Riser Slot #3, as well as the
bottom add-in card slot for 2U riser cards installed in Riser Slot #1.
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Intel® Server Board S2600WF Product Family Technical Product Specification
PCIe* Add-in
PCIe* Add-In Card PCIe* Add-in Card Card support
Support Support
Riser Slot #3
Riser #3
Riser #1
Riser #2
X12 PCIe* 3.0
Riser Slot #1 Riser Slot #2
x24 PCIe* 3.0 X24 PCIe* 3.0
X8 PCIe*
CPU #2
X16 PCIe* – CPU#1
+
+
X4 DMI
X8 PCIe* – CPU#2 X24 PCIe*– CPU #2
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: Add-in cards that exceed the PCI specification for ½ length PCI add-in cards (167.65mm or 6.6in) may
interfere with other installed devices on the server board.
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
Intel® Ethernet
Network
Adapter for
OCP*
Note: The quad-port SFP+ and quad-port 10 Gb RJ45 modules are only supported on the Intel® Server
Board S2600WF0(R) and Intel® Server Board S2600WFQ(R).
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
• Neither Intel® ESRT2 nor Intel® VROC (SATA RAID) have RAID support for PCIe* M.2 SSDs when
installed to the M.2 connectors on the server board.
Note: NVMe* RAID support using Intel® VROC (SATA RAID) and Intel VROC requires that the PCIe* bus lanes
be routed directly from the CPU. On this server board, the PCIe* bus lanes routed to the on-board M.2
connectors are routed from the Intel chipset (PCH).
Note: The Intel® ESRT2 option does not support PCIe* devices.
• Both Intel® ESRT2 and Intel® VROC (SATA RAID) provide RAID support for SATA devices (see Section
6.3.6).
• Neither embedded RAID option supports mixing of M.2 SATA SSDs and SATA hard drives within a
single RAID volume.
Note: Storage devices used to create a single RAID volume created using either Intel® VROC (SATA RAID) or
Intel ESRT2 cannot span across the two embedded SATA controllers nor is mixing both SATA and NVMe*
devices within a single RAID volume supported.
• The binary driver includes partial source files. The driver is fully open source using an MDRAID layer
in Linux*.
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Intel® Server Board S2600WF Product Family Technical Product Specification
PCIe* SSD1
(CPU 1)
PCIe* SSD0
(CPU 1)
PCIe* SSD3
(CPU 2)
PCIe* SSD2
(CPU 2)
NVMe* Support w/o Intel® VMD NVMe* Storage with Intel® VMD
PCIe* Processor
Intel® VMD
NVMe* NVMe*
SSDs SSDs
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Intel® Server Board S2600WF Product Family Technical Product Specification
Intel® VMD handles the physical management of NVMe* storage devices as a stand-alone function but can be
enhanced when Intel® VROC (VMD NVMe* RAID) support options are enabled to implement RAID based
storage systems.
The following is a list of features of the Intel® VMD technology:
• Hardware is integrated inside the processor PCIe* root complex.
• Entire PCIe* trees are mapped into their own address spaces (domains).
• Each domain manages x16 PCIe* lanes.
• Can be enabled/disabled in BIOS setup at x4 lane granularity.
• Driver sets up/manages the domain (enumerate, event/error handling)
• May load an additional child device driver that is Intel® VMD aware.
• Hot plug support - hot insert array of PCIe* SSDs.
• Support for PCIe* SSDs and switches only (no network interface controllers (NICs), graphics cards,
etc.)
• Maximum of 128 PCIe* bus numbers per domain.
• Support for MCTP over SMBus* only.
• Support for MMIO only (no port-mapped I/O).
• Does not support NTB, Quick Data Tech, Intel® Omni-Path Architecture, or SR-IOV.
• Correctable errors do not bring down the system.
• Intel® VMD only manages devices on PCIe* lanes routed directly from the processor. Intel® VMD
cannot provide device management on PCI lanes routed from the chipset (PCH)
• When Intel® VMD is enabled, the BIOS does not enumerate devices that are behind Intel® VMD. The
Intel® VMD-enabled driver is responsible for enumerating these devices and exposing them to the
host.
• Intel® VMD supports hot-plug PCIe* SSDs connected to switch downstream ports. Intel® VMD does
not support hot-plug of the switch itself.
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Intel® Server Board S2600WF Product Family Technical Product Specification
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Intel® Server Board S2600WF Product Family Technical Product Specification
Intel® VMD
Intel® VROC
NVMe* driver
Figure 45. Intel® VROC (VMD NVMe* RAID) basic architecture overview
Intel® VROC (VMD NVMe* RAID) supports the following:
• I/O processor with controller (ROC) and DRAM.
• No need for battery backup / RAID maintenance free backup unit.
• Protected write back cache – software and hardware that allows recovery from a double fault.
• Isolated storage devices from OS for error handling.
• Protected R5 data from OS crash.
• Boot from RAID volumes based on NVMe* SSDs within a single Intel® VMD domain.
• NVMe* SSD hot plug and surprise removal on CPU PCIe* lanes.
• LED management for CPU PCIe* attached storage.
• RAID / storage management using representational state transfer (RESTful) application programming
interfaces (APIs).
• Graphical user interface (GUI) for Linux*.
• 4K native NVMe* SSD support.
Enabling Intel® VROC (VMD NVMe* RAID) support requires installation of an optional upgrade key on to the
server board as shown in Figure 46. Table 31 identifies available Intel® VROC upgrade key options.
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Intel® Server Board S2600WF Product Family Technical Product Specification
Note: The on-board connector used to provide support for the Intel® VROC (VMD NVMe* RAID) upgrade key
options is also used to support the Intel® ESRT2 SATA RAID-5 upgrade key.
Table 31. Intel® VROC (VMD NVMe* RAID) upgrade key options
Standard Intel® VROC Premium Intel® VROC
NVMe* RAID Major Features (iPC VROCSTANMOD) (iPC VROCPREMMOD)
CPU attached NVMe* SSD – high perf. √ √
Boot on RAID volume √ √
Third party vendor SSD support √ √
RAID write hole closed (RMFBU replacement) - √
RAID Support – 0, 1, 10 √ √
RAID Support – 0, 1, 5, 10 - √
Hot plug/ surprise removal
√ √
(2.5” SSD form factor only
Enclosure LED management √ √
Note: Intel® VROC upgrade keys referenced in Table 31 are used for PCIe* NVMe* SSDs only. For SATA RAID
support, see Section 6.3.6.
The AHCI SATA controller provides support for up to eight SATA ports on the server board (Intel Server
Boards S2600WFT(R) and S2600W0 only):
• Four ports from the Mini-SAS HD (SFF-8643) connector labeled “SATA Ports 0–3” on the
server board.
• Four ports from the Mini-SAS HD (SFF-8643) connector labeled “SATA Ports 4-7” on the
server board.
Note: The onboard SATA controllers are not compatible with and cannot be used with SAS expander cards.
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The SATA controller and the sSATA controller can be independently enabled and disabled and configured
through the BIOS setup utility under the Mass Storage Controller Configuration menu screen. The following
table identifies supported setup options.
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Table 33. SATA and sSATA controller BIOS setup utility options
SATA Controller sSATA Controller Supported
AHCI AHCI Yes
AHCI Disabled Yes
AHCI Intel® VROC (SATA RAID) 6.0 Yes
AHCI Intel® ESRT2 Microsoft Windows* only
Disabled AHCI Yes
Disabled Disabled Yes
Disabled Intel® VROC (SATA RAID) 6.0 Yes
Disabled Intel® ESRT2 Yes
Intel® VROC (SATA RAID) 6.0 AHCI Yes
Intel® VROC (SATA RAID) 6.0 Disabled Yes
Intel® VROC (SATA RAID) 6.0 Intel® VROC (SATA RAID) 6.0 Yes
Intel® VROC (SATA RAID) 6.0 Intel® ESRT2 No
Intel® ESRT2 AHCI Microsoft Windows only
Intel® ESRT2 Disabled Yes
Intel® ESRT2 Intel® VROC (SATA RAID) 6.0 No
Intel® ESRT2 Intel® ESRT2 Yes
By default, onboard RAID options are disabled in BIOS setup. To enable onboard RAID support, access the
BIOS setup utility during POST. The onboard RAID options can be found under the sSATA Controller or
SATA Controller options under the following BIOS setup menu: Advanced > Mass Storage Controller
Configuration.
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By using Intel® VROC (SATA RAID), there is no loss of PCI resources (request/grant pair) or add-in card slot.
Intel® VROC (SATA RAID) functionality requires the following:
• The embedded RAID option must be enabled in BIOS setup.
• Intel® VROC (SATA RAID) option must be selected in BIOS setup.
• Intel® VROC (SATA RAID) drivers must be loaded for the installed operating system.
• At least two SATA drives needed to support RAID levels 0 or 1.
• At least three SATA drives needed to support RAID level 5.
• At least four SATA drives needed to support RAID level 10.
• NVMe* SSDs and SATA drives must not be mixed within a single RAID volume
With Intel® VROC (SATA RAID) software RAID enabled, the following features are made available:
• A boot-time, pre-operating-system environment, text-mode user interface that allows the user to
manage the RAID configuration on the system. Its feature set is kept simple to keep size to a
minimum, but allows the user to create and delete RAID volumes and select recovery options when
problems occur. The user interface can be accessed by pressing <CTRL-I> during system POST.
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• Boot support when using a RAID volume as a boot disk. It does this by providing Int13 services when
a RAID volume needs to be accessed by MS-DOS applications (such as NT loader (NTLDR)) and by
exporting the RAID volumes to the system BIOS for selection in the boot order.
• At each boot-up, a status of the RAID volumes provided to the user.
6.3.6.2 Intel® Embedded Server RAID Technology 2 (Intel® ESRT2) 1.60 for SATA
Intel® ESRT2 (powered by LSI*) is a driver-based RAID solution for SATA that is compatible with previous
generation Intel® server RAID solutions. Intel ESRT2 provides RAID levels 0, 1, and 10, with an optional
RAID 5 capability depending on whether a RAID upgrade key is installed.
Note: The embedded Intel® ESRT2 option has no RAID support for PCIe* NVMe* SSDs.
Intel® ESRT2 is based on LSI MegaRAID software stack and utilizes the system memory and CPU.
Supported RAID levels include.
• RAID 0 – Uses striping to provide high data throughput, especially for large files in an environment
that does not require fault tolerance.
• RAID 1 – Uses mirroring so that data written to one disk drive simultaneously writes to another disk
drive. This is good for small databases or other applications that require small capacity but complete
data redundancy
• RAID 10 – A combination of RAID 0 and RAID 1, consists of striped data across mirrored spans. It
provides high data throughput and complete data redundancy but uses a larger number of spans.
Optional support for RAID level 5 can be enabled with the addition of a RAID 5 upgrade key (iPN –
RKSATA4R5).
• RAID 5 – Uses disk striping and parity data across all drives (distributed parity) to provide high data
throughput, especially for small random access.
Figure 49. Intel® ESRT2 SATA RAID-5 upgrade key (iPN – RKSATA4R5)
Note: The on-board connector used to provide support for the Intel® ESRT2 SATA RAID-5 upgrade key is
also used to support the Intel® VROC (VMD NVMe* RAID) upgrade key options.
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6.4.2 RJ45 Network Interface Connectors (Intel® Server Board S2600WFT(R) only)
The Intel® Server Board S2600WFT(R) provides two RJ45 networking ports, “NIC #1” and “NIC #2”, in
addition to the RJ45 dedicated management port. The board includes the following onboard Intel® Ethernet
Controller:
• Intel® Ethernet Controller X557-AT2 10 GbE
Refer to the respective product data sheet for a complete list of supported Intel® Ethernet Controller
features.
Note: Pin 7 of the RJ45 Serial-A connector is configurable to support either a DSR (default) signal or a DCD
signal. Pin 7 signals are changed by moving the jumper on the jumper block labeled “J4A2“ from pins 1–2
(default) to pins 2–3 as shown in Figure 53.
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Serial-A
Pin 7 Config
Jumper
DSR: Pins 1-2
Pin 1
DCD: Pins 2-3
Serial-B Port
DH-10 Connector
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Type-A
USB 2.0
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2x port
front panel
USB 3.0
Note: The following USB ports are routed to this connector: USB 3.0 ports 1 and 2; USB 2.0 ports 11 and 13.
Table 37. Front panel USB 2.0/3.0 connector pinout (“FP_USB_2.0/ 3.0”)
Signal Name Pin# Pin# Signal Name
1 P5V_USB_FP
P5V_USB_FP 19 2 USB3_04_RXN
USB3_01_RXN 18 3 USB3_04_RXP
USB3_01_RXP 17 4 GROUND
GROUND 16 5 USB3_04_TXN
USB3_01_TXN 15 6 USB3_04_TXP
USB3_01_TXP 14 7 GROUND
GROUND 13 8 USB2_13_DN
USB2_10_DN 12 9 USB2_13_DP
USB2_10_DP 11 10 USB3_ID
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Front panel
video connector
Configurations with add-in video cards can get more complicated with a dual CPU socket board. Some multi-
socket boards have PCIe* slots capable of hosting an add-in video card, which are attached to the IIOs of
CPU sockets other than CPU Socket 1. However, only one CPU socket can be designated as legacy VGA
socket as required in POST. To provide for this, there is the PCI Configuration option Legacy VGA Socket.
The rules for this option are:
• The Legacy VGA Socket option is grayed out and unavailable unless an add-in video card is installed
in a PCIe* slot supported by CPU 2.
• Because the onboard video is hardwired to CPU socket 1, when Legacy VGA Socket is set to CPU
Socket 2, the onboard video is disabled.
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Table 41. Main power (slot 1) connector pinout (“MAIN PWR 1”)
Signal Name Pin # Pin# Signal Name
GROUND B1 A1 GROUND
GROUND B2 A2 GROUND
GROUND B3 A3 GROUND
GROUND B4 A4 GROUND
GROUND B5 A5 GROUND
GROUND B6 A6 GROUND
GROUND B7 A7 GROUND
GROUND B8 A8 GROUND
GROUND B9 A9 GROUND
P12V B10 A10 P12V
P12V B11 A11 P12V
P12V B12 A12 P12V
P12V B13 A13 P12V
P12V B14 A14 P12V
P12V B15 A15 P12V
P12V B16 A16 P12V
P12V B17 A17 P12V
P12V B18 A18 P12V
P3V3_AUX: PD_PS1_FRU_A0 B19 A19 SMB_PMBUS_DATA_R
P3V3_AUX: PD_PS1_FRU_A1 B20 A20 SMB_PMBUS_CLK_R
P12V_STBY B21 A21 FM_PS_EN_PSU_N
FM_PS_CR1 B22 A22 IRQ_SML1_PMBUS_ALERTR2_N
P12V_SHARE B23 A23 ISENSE_P12V_SENSE_RTN
TP_1_B24 B24 A24 ISENSE_P12V_SENSE
FM_PS_COMPATIBILITY_BUS B25 A25 PWRGD_PS_PWROK
Table 42. Main power (slot 2) connector pinout (“MAIN PWR 2”)
Signal Name Pin # Pin# Signal Name
GROUND B1 A1 GROUND
GROUND B2 A2 GROUND
GROUND B3 A3 GROUND
GROUND B4 A4 GROUND
GROUND B5 A5 GROUND
GROUND B6 A6 GROUND
GROUND B7 A7 GROUND
GROUND B8 A8 GROUND
GROUND B9 A9 GROUND
P12V B10 A10 P12V
P12V B11 A11 P12V
P12V B12 A12 P12V
P12V B13 A13 P12V
P12V B14 A14 P12V
P12V B15 A15 P12V
P12V B16 A16 P12V
P12V B17 A17 P12V
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Hot swap
backplane
connector
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OPT_12V_PWR OPT_12V_PWR
Table 44 provides the pinout values for the 12-V power connectors.
Table 44. Riser slot auxiliary power connector pinout ("OPT_12V_PWR”)
Signal Name Pin# Pin# Signal Name
P12V 3 1 GROUND
P12V 4 2 GROUND
Intel makes available a 12-V supplemental power cable that can support both 6- and 8-pin 12-V AUX power
connectors found on high power add-in cards. The power cable (as shown in Figure 64) is available as a
separate orderable accessory kit (iPC – AXXGPGPUCABLE).
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Figure 64. High power add-in card 12-V auxiliary power cable option
7.1.4 Peripheral Power Connector
The server board includes one 6-pin power connector intended to provide power for peripheral devices such
as optical disk drives (ODDs) and/or solid state devices (SSDs). On the server board, this connector is labeled
as “Peripheral_ PWR”. Table 45 provides the pinout for this connector.
Peripheral power
connector
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Figure 67. Example front control panel view (for reference purposes only)
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The pinout for both connector types, shown in Table 47, is identical.
Table 47. 30-pin front panel connector pinouts
Signal Name Pin# Pin# Signal Name
P3V3_AUX 1 2 P3V3_AUX
KEY 4 P5V_STBY
FP_PWR_LED_BUF_R_N 5 6 FP_ID_LED_BUF_R_N
P3V3 7 8 FP_LED_STATUS_GREEN_R_N
LED_HDD_ACTIVITY_R_N 9 10 FP_LED_STATUS_AMBER_R_N
FP_PWR_BTN_N 11 12 LED _NIC_LINK0_ACT_FP_N
GROUND 13 14 LED _NIC_LINK0_LNKUP_FP_N
FP_RST_BTN_R_N 15 16 SMB_SENSOR_3V3STBY_DATA_R0
GROUND 17 18 SMB_SENSOR_3V3STBY_CLK
FP_ID_BTN_R_N 19 20 FP_CHASSIS_INTRUSION
PU_FM_SIO_TEMP_SENSOR 21 22 LED_NIC_LINK1_ACT_FP_N
FP_NMI_BTN_R_N 23 24 LED_NIC_LINK1_LNKUP_FP_N
KEY KEY
LED_NIC_LINK2_ACT_FP_N 27 28 LED_NIC_LINK3_ACT_FP_N
LED_NIC_LINK2_LNKUP_FP_N 29 30 LED_NIC_LINK3_LNKUP_FP_N
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Pin 1
Fixed Mount Fan
Figure 68. Dual-rotor fixed mount fan pin connector orientation
Table 50. Dual-rotor fixed mount fan connector pinout
Signal Description Pin#
LED_FAN 10
LED_FAN_FAULT 9
SYS FAN PRSNT 8
GROUND 7
GROUND 6
FAN_TACH_# 5
P12V_FAN 4
P12V_FAN 3
FAN PWM 2
FAN_TACH_#+1 1
Pin 1
Each connector is monitored and controlled by on-board platform management. On the server board, each
system fan connector pair is labeled “SYS_FAN #”, where # is 1 through 6. Figure 70 shows the location of
each system fan connector on the server board.
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Riser 2
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Table 53. Hot swap backplane I2C connector – SMBUS 4-pin (J1K1)
Pin Signal
1 SDA
2 Ground
3 SCL
4 RST_PCIE_SSD_PERST
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On the server board, the Intel® RMM4 Lite key is installed at the location shown in Figure 72.
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The embedded web user interface supports strong security – authentication, encryption, and firewall support
– since it enables remote server configuration and control. Encryption using 128-bit SSL is supported. User
authentication is based on user ID and password.
The user interface presented by the embedded web server authenticates the user before allowing a web
session to be initiated. It presents all functions to all users but grays out those functions that the user does
not have privilege to execute. For example, if a user does not have privilege to power control, then the item is
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disabled and displayed in gray font in that user’s display. The web interface also provides a launch point for
some of the advanced features, such as keyboard, video, and mouse (KVM) and media redirection. These
features are grayed out in the GUI unless the system has been updated to support these advanced features.
The embedded web server only displays US English or Chinese language output.
Additionally, the web interface can:
• Present all the basic features to the users.
• Power on, power off, and reset the server and view current power state.
• Display BIOS, BMC, ME and SDR version information
• Display overall system health.
• Display configuration of various IPMI over LAN parameters for both IPV4 and IPV6.
• Display configuration of alerts (SNMP and SMTP).
• Display system asset information for the product, board, and chassis.
• Display BMC-owned sensors (name, status, current reading, enabled thresholds), including color-code
status of sensors.
• Provide ability to filter sensors based on sensor type (voltage, temperature, fan, and power supply
related).
• Automatically refresh sensor data with a configurable refresh rate.
• Provide online help
• Display/clear SEL (display is in easily understandable human readable format).
• Support major industry-standard browsers (Microsoft Internet Explorer* and Mozilla Firefox*).
• Automatically time out GUI session after a user-configurable inactivity period. By default, this
inactivity period is 30 minutes.
• Provide embedded platform debug feature, allowing the user to initiate a “debug dump” to a file that
can be sent to Intel for debug purposes.
• Provide a virtual front panel with the same functionality as the local front panel. The displayed LEDs
match the current state of the local panel LEDs. The displayed buttons (for example, power button)
can be used in the same manner as the local buttons.
• Display Intel® ME sensor data. Only sensors that have associated SDRs loaded are displayed.
• Save the SEL to a file.
• Force HTTPS connectivity for greater security. This is provided through a configuration option in the
user interface.
• Display processor and memory information that is available over IPMI over LAN.
• Get and set Intel® Node Manager (Intel® NM) power policies
• Display the power consumed by the server.
• View and configure VLAN settings.
• Warn user that the reconfiguration of IP address can cause a disconnect.
• Block logins for a period of time after several consecutive failed login attempts. The lock-out period
and the number of failed logins that initiates the lock-out period are configurable by the user.
• Force into BIOS setup on a reset (server power control).
• Provide the system’s Power-On Self Test (POST) sequence for the previous two boot cycles, including
timestamps. The timestamps may be displayed as a time relative to the start of POST or the previous
POST code.
• Provide the ability to customize the port numbers used for SMASH, http, https, KVM, secure KVM,
remote media, and secure remote media.
For additional information, refer to the Intel® Remote Management Module 4 and Integrated BMC Web
Console User Guide.
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KVM redirection feature supports the following resolutions and refresh rates:
• 640x480 at 60 Hz, 72 Hz, 75 Hz, 85 Hz
• 800x600 at 60 Hz, 72 Hz, 75 Hz, 85 Hz
• 1024x768 at 60 Hz, 72 Hz, 75 Hz, 85 Hz
• 1152x864 at 75 Hz
• 1280x800 at 60 Hz
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• 1280x1024 at 60 Hz
• 1440x900 at 60 Hz
• 1600x1200 at 60 Hz
8.3.1.1 Availability
The remote KVM session is available even when the server is powered off (in stand-by mode). No restart of
the remote KVM session is required during a server reset or power on/off. A BMC reset – for example, due to
a BMC watchdog initiated reset or BMC reset after BMC firmware update – does require the session to be re-
established.
KVM sessions persist across system reset, but not across an AC power loss.
8.3.1.2 Security
The KVM redirection feature supports multiple encryption algorithms, including RC4 and AES. The actual
algorithm that is used is negotiated with the client based on the client’s capabilities.
8.3.1.3 Usage
As the server is powered up, the remote KVM session displays the complete BIOS boot process. The user is
able to interact with BIOS setup, change and save settings, and enter and interact with option ROM
configuration screens.
8.3.1.4 Force-enter BIOS Setup
KVM redirection can present an option to force-enter BIOS Setup. This enables the system to enter BIOS
setup while booting, which is often missed by the time the remote console redirects the video.
8.3.2 Media Redirection
The embedded web server provides a Java applet to enable remote media redirection. This may be used in
conjunction with the remote KVM feature or as a stand-alone applet.
The media redirection feature is intended to allow system administrators or users to mount a remote IDE or
USB CD-ROM, floppy drive, or a USB flash disk as a remote device to the server. Once mounted, the remote
device appears to the server just like a local device, allowing system administrators or users to install
software (including operating systems), copy files, update BIOS, or boot the server from this device.
The following list describes additional media redirection capabilities and features.
• The operation of remotely mounted devices is independent of the local devices on the server. Both
remote and local devices are usable in parallel.
• Either IDE (CD-ROM, floppy) or USB devices can be mounted as a remote device to the server.
• It is possible to boot all supported operating systems from the remotely mounted device and to boot
from disk IMAGE (*.IMG) and CD-ROM or DVD-ROM ISO files. See the tested/supported operating
system list for more information.
• Media redirection supports redirection for both a virtual CD device and a virtual floppy/USB device
concurrently. The CD device may be either a local CD drive or else an ISO image file; the Floppy/USB
device may be either a local Floppy drive, a local USB device, or else a disk image file.
• The media redirection feature supports multiple encryption algorithms, including RC4 and AES. The
actual algorithm that is used is negotiated with the client based on the client’s capabilities.
• A remote media session is maintained even when the server is powered off (in standby mode). No
restart of the remote media session is required during a server reset or power on/off. A BMC reset (for
example, due to a BMC reset after BMC FW update) requires the session to be re-established
• The mounted device is visible to (and usable by) managed system’s OS and BIOS in both pre-boot
and post-boot states.
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• The mounted device shows up in the BIOS boot order and it is possible to change the BIOS boot
order to boot from this remote device.
• It is possible to install an operating system on a bare metal server (no OS present) using the remotely
mounted device. This may also require the use of KVM-r to configure the OS during install.
USB storage devices appear as floppy disks over media redirection. This allows for the installation of device
drivers during OS installation.
If either a virtual IDE or virtual floppy device is remotely attached during system boot, both the virtual IDE
and virtual floppy are presented as bootable devices. It is not possible to present only a single-mounted
device type to the system BIOS.
8.3.2.1 Availability
The default inactivity timeout is 30 minutes and is not user-configurable. Media redirection sessions persist
across system reset but not across an AC power loss or BMC reset.
8.3.3 Remote Console
The remote console is the redirected screen, keyboard, and mouse of the remote host system. To use the
remote console window of the managed host system, the browser must include a Java* Runtime
Environment (JRE) plug-in. If the browser has no Java support, such as with a small handheld device, the
user can maintain the remote host system using the administration forms displayed by the browser.
The remote console window is a Java applet that establishes TCP connections to the BMC. The protocol that
is run over these connections is a unique KVM protocol and not HTTP or HTTPS. This protocol uses ports
#7578 for KVM, #5120 for CD-ROM media redirection, and #5123 for floppy and USB media redirection.
When encryption is enabled, the protocol uses ports #7582 for KVM, #5124 for CD-ROM media redirection,
and #5127 for floppy and USB media redirection. The local network environment must permit these
connections to be made; that is the firewall and, in case of a private internal network, the Network Address
Translation (NAT) settings have to be configured accordingly.
For additional information, reference the Intel® Remote Management Module 4 and Integrated BMC Web
Console User Guide.
8.3.4 Performance
The remote display accurately represents the local display. The feature adapts to changes in the video
resolution of the local display and continues to work smoothly when the system transitions from graphics to
text or vice versa. The responsiveness may be slightly delayed depending on the bandwidth and latency of
the network.
Enabling KVM and/or media encryption does degrade performance. Enabling video compression provides
the fastest response while disabling compression provides better video quality. For the best possible KVM
performance, a 2 Mbps link or higher is recommended. The redirection of KVM over IP is performed in
parallel with the local KVM without affecting the local KVM operation.
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The system ID LED on the server board is tied directly to the system ID LED on system front panel, if present.
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System ID System
BMC Boot/Reset State Comment
LED Status LED
Blinking green indicates degraded state (no manageability), blinking
3 Hz blinking 1 Hz blinking blue indicates u-Boot is running but has not transferred control to
BMC in u-Boot
blue green BMC Linux*. Server will be in this state 6–8 seconds after BMC reset
while it pulls the Linux* image into flash.
After an AC cycle/BMC reset, indicates that the control has been
BMC booting Linux* Solid blue Solid green passed from u-Boot to BMC Linux* itself. It will be in this state for
10-20 seconds.
End of BMC boot/reset
Indicates BMC Linux* has booted and manageability functionality is
process. Normal system Off Solid green
up and running. Fault/status LEDs operate as per usual.
operation
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If the Power On Password function is enabled in BIOS setup, the BIOS halts early in POST to request a
password (administrator or user) before continuing POST.
10.1.3 Authorized System User Password Rights and Restrictions
When the correct user password is entered, the user has the ability to perform the following actions:
• Access the BIOS setup utility.
• View, but not change, any BIOS setup options in the BIOS setup utility.
• Modify system time and date in the BIOS setup utility.
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If the Power On Password function is enabled in BIOS setup, the BIOS halts early in POST to request a
password (administrator or user) before continuing POST.
Configuring an administrator password imposes restrictions on booting the system, and configures most
setup fields to read-only if the administrator password is not provided. The boot popup menu requires the
administrator password to function, and the USB reordering is suppressed as long as the administrator
password is enabled. Users are restricted from booting in anything other than the boot order defined in
setup by an administrator.
If front panel lockout is enabled, system power off and reset must be controlled via a system management
interface.
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• Verifies operator physical presence. Confirms and executes operating system TPM administrative
command requests.
• Provides BIOS setup options to change TPM security states and to clear TPM ownership.
For additional details, refer to the TCG PC Client Specific Implementation Specification, the TCG PC Client
Specific Physical Presence Interface Specification, and the Microsoft Windows* BitLocker* Requirements
documents.
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OS, or an application. In addition, Intel® TXT requires the system to include a TPM v1.2, as defined by the
Trusted Computing Group TPM PC Client Specifications, Revision 1.2.
When available, Intel® TXT can be enabled or disabled in the processor by a BIOS setup option. For general
information about Intel® TXT, visit http://www.intel.com/technology/security/.
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Note: This jumper does not reset administrator or user passwords. To reset passwords, the password clear
jumper must be used.
6. During POST, press <F2> to access the BIOS setup utility to configure and save desired BIOS options.
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After resetting BIOS options using the BIOS default jumper, the Error Manager Screen in the BIOS setup
utility displays two errors:
• 0012 System RTC date/time not set
• 5220 BIOS Settings reset to default settings
11.3 Intel® Management Engine (Intel® ME) Firmware Force Update Jumper Block
When the Intel® ME firmware force update jumper is moved from its default position, the Intel® ME is forced
to operate in a reduced minimal operating capacity. This jumper should only be used if the Intel® ME
firmware has gotten corrupted and requires re-installation.
Note: System update files are included in the system update packages (SUP) posted to Intel’s download
center website at http://downloadcenter.intel.com.
To use the Intel® ME firmware force update jumper, perform the following steps:
1. Turn off the system and remove the AC power cords.
Note: If the Intel® ME force update jumper is moved with AC power applied to the system, the Intel®
ME will not operate properly.
Note: System update files are included in the SUP posted to Intel’s download center website at
http://downloadcenter.intel.com.
To use the BMC force update jumper, perform the following steps:
1. Turn off the system and remove the AC power cords.
Note: If the BMC FRC UPD jumper is moved with AC power applied to the system, the BMC will not
operate properly.
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Note: The BIOS Recovery jumper is only used to re-install a BIOS image in the event the BIOS has become
corrupted. This jumper is not used when the BIOS is operating normally to update the BIOS from one version
to another.
Note: System update files are included in the SUP posted to Intel’s download center website at
http://downloadcenter.intel.com.
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This chapter provides a high level overview of the platform management features and functionality
implemented on the server board.
The Intel® Server System BMC Firmware External Product Specification (EPS) and the Intel® Server System
BIOS External Product Specification (EPS) for Intel® Server Products based on the 1st and 2nd Gen Intel® Xeon®
processor Scalable-2600 v5 product families should be referenced for more in-depth and design level
platform management information.
See also the Intelligent Platform Management Interface Specification Second Generation v2.0.
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Additionally, the BMC firmware may create virtual sensors that are based on a combination or aggregation of
multiple physical thermal sensors and the application of a mathematical formula to thermal or power sensor
readings.
12.3.3 Standard Fan Management
The BMC controls and monitors the system fans. Each fan is associated with a fan speed sensor that detects
fan failure and may also be associated with a fan presence sensor for hot-swap support. For redundant fan
configurations, the fan failure and presence status determines the fan redundancy sensor state.
The system fans are divided into fan domains, each of which has a separate fan speed control signal and a
separate configurable fan control policy. A fan domain can have a set of temperature and fan sensors
associated with it. These are used to determine the current fan domain state.
A fan domain has three states: sleep, boost, and nominal. The sleep and boost states have fixed (but
configurable through OEM SDRs) fan speeds associated with them. The nominal state has a variable speed
determined by the fan domain policy. An OEM SDR record is used to configure the fan domain policy.
The fan domain state is controlled by several factors. The factors for the boost state are listed below in order
of precedence, high to low. If any of these conditions apply, the fans are set to a fixed boost state speed.
• An associated fan is in a critical state or missing. The SDR describes which fan domains are boosted in
response to a fan failure or removal in each domain. If a fan is removed when the system is in fans-off
mode, it is not detected and there is not any fan boost until the system comes out of fans-off mode.
• Any associated temperature sensor is in a critical state. The SDR describes which temperature-
threshold violations cause fan boost for each fan domain.
• The BMC is in firmware update mode, or the operational firmware is corrupted.
A fan domain’s nominal fan speed can be configured as static (fixed value) or controlled by the state of one
or more associated temperature sensors.
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Notes:
1
For fan speed control in Intel chassis
2
Temperature margin to max junction temp
3
Absolute temperature
4
PECI value or margin value
5
On-die sensor
6
Onboard sensor
7
Virtual sensor
8
Available only when PSU has PMBus
9
Calculated estimate
Figure 78 shows a high-level illustration of the fan speed control structure that determines fan speed.
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System behaviors
Memory
Fan
throttle
speed
settings
Intel Server Systems supporting the 1st and 2nd Gen Intel® Xeon® processor Scalable families support a type
of CLTT, called a hybrid CLTT, for which the integrated memory controller estimates the DRAM temperature
in between actual reads of the TSODs. Hybrid CLTT is used on all Intel Server Systems supporting the Intel®
Xeon® processor Scalable family that have DIMMs with thermal sensors. Therefore, the terms Dynamic-CLTT
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and Static-CLTT are really referring to this “hybrid” mode. Note that if the IMC’s polling of the TSODs is
interrupted, the temperature readings that the BMC gets from the IMC are these estimated values.
12.3.4.2 Dynamic (Hybrid) CLTT
The system supports dynamic (memory) CLTT for which the BMC firmware dynamically modifies thermal
offset registers in the IMC during runtime based on changes in system cooling (fan speed). For static CLTT, a
fixed offset value is applied to the TSOD reading to get the die temperature; however this does not provide
results as accurate when the offset takes into account the current airflow over the DIMM, as is done with
dynamic CLTT.
To support this feature, the BMC firmware derives the air velocity for each fan domain based on the PWM
value being driven for the domain. Since this relationship is dependent on the chassis configuration, a
method must be used which supports this dependency (for example, through OEM SDR) that establishes a
lookup table providing this relationship.
BIOS has an embedded lookup table that provides thermal offset values for each DIMM type and air velocity
range (three ranges of air velocity are supported). During system boot, BIOS provides three offset values
(corresponding to the three air velocity ranges) to the BMC for each enabled DIMM. Using this data the BMC
firmware constructs a table that maps the offset value corresponding to a given air velocity range for each
DIMM. During runtime the BMC applies an averaging algorithm to determine the target offset value
corresponding to the current air velocity and then the BMC writes this new offset value into the IMC thermal
offset register for the DIMM.
12.3.5 Power Management Bus (PMBus*)
The Power Management Bus (PMBus*) is an open standard protocol that is built upon the SMBus* 2.0
transport. It defines a means of communicating with power conversion and other devices using SMBus-
based commands. A system must have PMBus-compliant power supplies installed in order for the BMC or
Intel® ME to monitor them for status and/or power metering purposes.
For more information on PMBus, see the System Management Interface Forum website,
http://www.powersig.org/.
12.3.6 Component Fault LED Control
Several sets of component fault LEDs are supported on the server board (see Figure 74 and Figure 75). Some
LEDs are owned by the BMC and some by the BIOS. A description of these LEDs is in Table 61 below.
• DIMM fault LEDs – The BMC owns the hardware control for these LEDs. The LEDs reflect the state of
BIOS-owned event-only sensors. When the BIOS detects a DIMM fault condition, it sends an IPMI
OEM command (Set Fault Indication) to the BMC to instruct the BMC to turn on the associated DIMM
Fault LED. These LEDs are only active when the system is in the ‘on’ state. The BMC does not activate
or change the state of the LEDs unless instructed by the BIOS.
• HDD status LEDs – The HSBP PSoC* of supported Intel and non-Intel chassis owns the hardware
control for these LEDs and detection of the fault/status conditions that the LEDs reflect.
• CPU fault LEDs – The BMC owns control for these LEDs. An LED is lit if there is an MSID mismatch
where the CPU power rating is incompatible with the board.
Table 61. Component fault LEDs
Component Owner State Description
Solid amber Memory failure – detected by BIOS
DIMM Fault LED BMC
Off DIMM working correctly
Solid amber HDD Fault
HDD Fault LED HSBP PSoC*
Blinking amber Predictive failure, rebuild, identify
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8h 4h 2h 1h 8h 4h 2h 1h
Note: Diagnostic LEDs are best read and decoded when viewing the LEDs from the back of the system.
In the following example, the BIOS sends a value of AC to the diagnostic LED decoder. The LEDs are decoded
as shown in Table 62, where the upper nibble bits represented by the amber LEDs equal 1010b or Ah and the
lower nibble bits represented by the green LEDs equal 1100b or Ch. The two are concatenated as ACh.
Table 62. POST progress code LED example
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Should a major memory initialization error occur, preventing the system from booting with data integrity, a
beep code is generated, the MRC displays a fatal error code on the diagnostic LEDs, and a system halt
command is executed. Fatal MRC error halts do not change the state of the system status LED and they do
not get logged as SEL events. Table 64 lists all MRC fatal errors that are displayed to the diagnostic LEDs.
Note: Fatal MRC errors display POST error codes that may be the same as BIOS POST progress codes
displayed later in the POST process. The fatal MRC codes can be distinguished from the BIOS POST progress
codes by the accompanying memory failure beep code of three long beeps as identified in Table 67.
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Note: For 0048 “Password check failed”, the system halts and then, after the next reset/reboot, displays the
error code on the error manager screen.
• Fatal: If the system cannot boot, POST halts and display the following message:
Unrecoverable fatal error found. System will not boot until the error is
resolved
Press <F2> to enter setup
When the <F2> key on the keyboard is pressed, the error message is displayed on the error manager
screen and an error is logged to the system event log (SEL) with the POST error code. The system
cannot boot unless the error is resolved. The faulty component must be replaced. The “POST Error
Pause” option setting in the BIOS setup does not have any effect on this error.
Note: The POST error codes in the following table are common to all current generation Intel server
platforms. Features present on a given server board/system determine which of the listed error codes are
supported.
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8525 Memory failed test/initialization CPU1_DIMM_B3 Remove the disabled DIMM. Major
8526 Memory failed test/initialization CPU1_DIMM_C1 Remove the disabled DIMM. Major
8527 Memory failed test/initialization CPU1_DIMM_C2 Remove the disabled DIMM. Major
8528 Memory failed test/initialization CPU1_DIMM_C3 Remove the disabled DIMM. Major
8529 Memory failed test/initialization CPU1_DIMM_D1 Remove the disabled DIMM. Major
852A Memory failed test/initialization CPU1_DIMM_D2 Remove the disabled DIMM. Major
852B Memory failed test/initialization CPU1_DIMM_D3 Remove the disabled DIMM. Major
852C Memory failed test/initialization CPU1_DIMM_E1 Remove the disabled DIMM. Major
852D Memory failed test/initialization CPU1_DIMM_E2 Remove the disabled DIMM. Major
852E Memory failed test/initialization CPU1_DIMM_E3 Remove the disabled DIMM. Major
852F Memory failed test/initialization CPU1_DIMM_F1 Remove the disabled DIMM. Major
8530 Memory failed test/initialization CPU1_DIMM_F2 Remove the disabled DIMM. Major
8531 Memory failed test/initialization CPU1_DIMM_F3 Remove the disabled DIMM. Major
8532 Memory failed test/initialization CPU1_DIMM_G1 Remove the disabled DIMM. Major
8533 Memory failed test/initialization CPU1_DIMM_G2 Remove the disabled DIMM. Major
8534 Memory failed test/initialization CPU1_DIMM_G3 Remove the disabled DIMM. Major
8535 Memory failed test/initialization CPU1_DIMM_H1 Remove the disabled DIMM. Major
8536 Memory failed test/initialization CPU1_DIMM_H2 Remove the disabled DIMM. Major
8537 Memory failed test/initialization CPU1_DIMM_H3 Remove the disabled DIMM. Major
8538 Memory failed test/initialization CPU2_DIMM_A1 Remove the disabled DIMM. Major
8539 Memory failed test/initialization CPU2_DIMM_A2 Remove the disabled DIMM. Major
853A Memory failed test/initialization CPU2_DIMM_A3 Remove the disabled DIMM. Major
853B Memory failed test/initialization CPU2_DIMM_B1 Remove the disabled DIMM. Major
853C Memory failed test/initialization CPU2_DIMM_B2 Remove the disabled DIMM. Major
853D Memory failed test/initialization CPU2_DIMM_B3 Remove the disabled DIMM. Major
853E Memory failed test/initialization CPU2_DIMM_C1 Remove the disabled DIMM. Major
853F Memory failed test/initialization CPU2_DIMM_C2 Remove the disabled DIMM. Major
(Go to 85C0)
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85C0 Memory failed test/initialization CPU2_DIMM_C3 Remove the disabled DIMM. Major
85C1 Memory failed test/initialization CPU2_DIMM_D1 Remove the disabled DIMM. Major
85C2 Memory failed test/initialization CPU2_DIMM_D2 Remove the disabled DIMM. Major
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85C4 Memory failed test/initialization CPU2_DIMM_E1 Remove the disabled DIMM. Major
85C5 Memory failed test/initialization CPU2_DIMM_E2 Remove the disabled DIMM. Major
85C6 Memory failed test/initialization CPU2_DIMM_E3 Remove the disabled DIMM. Major
85C7 Memory failed test/initialization CPU2_DIMM_F1 Remove the disabled DIMM. Major
85C8 Memory failed test/initialization CPU2_DIMM_F2 Remove the disabled DIMM. Major
85C9 Memory failed test/initialization CPU2_DIMM_F3 Remove the disabled DIMM. Major
85CA Memory failed test/initialization CPU2_DIMM_G1 Remove the disabled DIMM. Major
85CB Memory failed test/initialization CPU2_DIMM_G2 Remove the disabled DIMM. Major
85CC Memory failed test/initialization CPU2_DIMM_G3 Remove the disabled DIMM. Major
85CD Memory failed test/initialization CPU2_DIMM_H1 Remove the disabled DIMM. Major
85CE Memory failed test/initialization CPU2_DIMM_H2 Remove the disabled DIMM. Major
85CF Memory failed test/initialization CPU2_DIMM_H3 Remove the disabled DIMM. Major
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8606 NVRAM variable space was corrupted and has been Major
reinitialized
Recovery boot has been initiated. Fatal
8607 Note: The Primary BIOS image may be corrupted or the
system may hang during POST. A BIOS update is required.
DXE Boot Services driver: Not enough memory available to Disable oprom at SETUP to save Minor
A6A0 shadow a Legacy Option ROM. runtime memory.
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The Integrated BMC may generate beep codes upon detection of failure conditions. Beep codes are sounded
each time the problem is discovered, such as on each power-up attempt, but are not sounded continuously.
Codes that are common across all Intel server boards and systems that use same generation chipset are
listed in Table 68. Each digit in the code is represented by a sequence of beeps whose count is equal to the
digit.
Table 68. Integrated BMC beep codes
Code Reason for Beep Associated Sensors
1-5-1-2 VR Watchdog Timer sensor assertion VR Watchdog Timer
The system does not power on or unexpectedly power off and a
1-5-1-4 power supply unit (PSU) is present that is an incompatible model PS Status
with one or more other PSUs in the system
1-5-2-1 No CPUs installed or first CPU socket is empty CPU Missing Sensor
1-5-2-2 CPU CAT Error (IERR) assertion CPU ERR2 Timeout Sensor
1-5-2-3 CPU ERR2 timeout assertion CPU ERR2 Timeout Sensor
1-5-2-4 CPU Icc max Mismatch CPU Icc max Mismatch Sensor
1-5-2-5 CPU population error CPU 0 Status Sensor
1-5-4-2 Power fault: DC power is unexpectedly lost (power good dropout). Power unit – power unit failure offset
1-5-4-4 Power control fault (power good assertion timeout). Power unit – soft power control failure offset
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Note: Table 69 does not identify volatile and non-volatile memory components for devices, which may be
installed onto or may be used with the server board. These may include: system boards used inside a server
system, processors, memory, storage devices, or add-in cards.
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Table 70. Intel® Server System R1000WF product family feature set
Feature Description
Chassis Type 1U rack mount chassis
Server Board Intel® Server Board S2600WF product family
Maximum Supported Processor
Up to 165 W for select SKUs – see Intel® Server System R1000WF product family TPS
Thermal Design Power (TDP)
External I/O Connections • DB-15 video connectors
o Front and back
• RJ-45 serial port A connector on back panel
• Dual RJ-45 network interface connectors (S2600WFT(R)-based systems only)
• Dedicated RJ-45 server management port on back panel
• (3) – USB 3.0 connectors on back panel
• (2) – USB 3.0 connectors on front panel (non-storage system configurations only)
Internal I/O • (1) – Type-A USB 2.0 connector
Connectors/Headers • (1) – DH-10 serial port B connector
System Fans • (6) – managed 40 mm dual rotor system fans
• One power supply fan for each installed power supply module
Riser Card Support Support for two riser cards:
• Riser #1 – PCIe* 3.0 x24
• Riser #2 – PCIe* 3.0 x24
With two riser cards installed, up to two possible add-in cards can be supported (one x16
PCIe* 3.0 add-in card slot per riser card):
• (2) full height/half-length add-in cards via Risers #1 and #2
Power Supply Options The server system can have up to two power supply modules installed, providing support for
the following power configurations: 1+0, 1+1 redundant power, and 2+0 combined power.
(2) power supply options:
• AC 1300W Titanium
• AC 1100W Platinum
• DC 750W Gold
Drive Support • R1304WFxxx – 4 x 3.5” hot swap drive bays + SAS/SATA backplane
• R1208WFxxx – 8 x 2.5” hot swap drive bays + SAS/SATA/NVMe* combo backplane
Supported Rack Mount Kit • AXXELVRAIL – Enhanced value rack mount rail kit – 424 mm max travel length
Accessory Options • A1UFULLRAIL – Tool-less rack mount rail kit with CMA support – 780 mm max travel length
• A1USHRTRAIL – Tool-less rack mount rail kit – 780 mm max travel length (no CMA support)
• AXX2POSTBRCKT – Two post fixed mount bracket kit
• AXX1U2UCMA2– Cable management arm (supported with AXXFULLRAIL only)
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Feature Description
Riser Card Support Support for three riser cards:
• Riser #1 – PCIe* 3.0 x24 - up to 3 PCIe* slots
• Riser #2 – PCIe* 3.0 x24 - up to 3 PCIe* slots
• Riser #3 – PCIe* 3.0 x16 – up to 2 PCIe* slots – Low profile cards only (optional)
With three riser cards installed, up to eight possible add-in cards can be supported:
• (4) full height/full-length + (2) full height/half-length add-in cards via Risers #1 and #2
• (2) low profile add-in cards via riser #3 (option)
Power Supply Options The server system can have up to two power supply modules installed, providing support for
the following power configurations: 1+0, 1+1 redundant power, and 2+0 combined power.
(3) power supply options:
• AC 1100W Platinum
• AC 1300W Titanium
• DC 750W Gold
Drive Bay Options Hot Swap Backplane Options:
• 8 x 3.5” SAS/ SATA
• 8 x 2.5” combo backplane – SAS/SATA/NVMe*
• 8 x 2.5” Dual Port SAS
• 12 x 3.5” SAS/ SATA (supports up to 2 NVMe* drives)
Note: All available backplane options have support for SAS 3.0 (12 Gb/sec).
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Regulatory Certification
RCM DoC Australia & New Zealand
CB Certification & Report (International - report to
include all CB country national deviations)
Only applicable to select OEM defined
China CCC Certification
SKUs
CU Certification (Russia/Belarus/Kazakhstan)
Europe CE Declaration of Conformity
Germany GS Certification
Only applicable to select OEM defined
India BIS Certification
SKUs
International Compliance – CISPR32 & CISPR24
Japan VCCI Certification
Korea KC Certification
Mexico Certification
NRTL Certification (USA & Canada)
South Africa Certification
Taiwan BSMI Certification (DOC)
Ukraine Certification
Table Key
Not Tested / Not Certified
Tested / Certified – Limited OEM SKUs only
Testing / Certification (Planned) (Date)
Tested / Certified
4An L9 system configuration is a power-on ready server system with NO operating system installed.
An L6 system configuration requires additional components to be installed in order to make it power-on ready. L3 are
component building block options that require integration into a chassis to create a functional server system.
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In compliance with the EU Directive 2019/424 (Lot 9) materials efficiency requirements, Intel makes available
all necessary product collaterals as identified below:
• Product Serviceability Instructions
o Intel® Server System R1000WF Product Family System Integration and Service Guide
o https://www.intel.com/content/www/us/en/support/articles/000024289/server-
products.html
o Intel® Server System R2000WF Product Family System Integration and Service Guide
o https://www.intel.com/content/www/us/en/support/articles/000024479/server-
products.html
• Product Specifications
o Intel® Server Board S2600WF Product Family Technical Product Specification (This document)
o Intel® Server System R1000WF Product Family Technical Product Specification
o Intel® Server System R2000WF Product Family Technical Product Specification
o https://www.intel.com/content/www/us/en/support/articles/000023750/server-
products/server-boards.html
• System BIOS/Firmware and Security Updates – Intel® Server Board S2600WF family
o System Update Package (SUP) – uEFI only
o Intel® One Boot Flash Update (OFU) – Various OS Support
o https://www.intel.com/content/www/us/en/support/topics/server-bios-firmware.html
• Intel Solid State Drive (SSD) Secure Data Deletion and Firmware Updates
o Note: for system configurations that may be configured with an Intel SSD
o Intel® Solid State Drive Toolbox
o https://downloadcenter.intel.com/download/29205?v=t
5An L9 system configuration is a power-on ready server system with NO operating system installed.
An L6 system configuration requires additional components to be installed in order to make it power-on ready. L3 are
component building block options that require integration into a chassis to create a functional server system
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Appendix G. Glossary
Term Definition
BMC Baseboard Management Controller
BIOS Basic Input/Output System
CMOS Complementary Metal-oxide-semiconductor
CPU Central Processing Unit
DDR4 Double Data Rate 4th edition
DIMM Dual In-line Memory Module
DPC DIMMs per Channel
EDS External Design Specification
EPS External Product Specification
FP Front Panel
FRB Fault Resilient Boot
FRU Field Replaceable Unit
GPGPU General Purpose Graphic Processing Unit
I2C Inter-integrated Circuit bus
iPC Intel Product Code
LED Light Emitting Diode
LRDIMM Load Reduced DIMM
LSB Least Significant Bit
MSB Most Significant Bit
NIC Network Interface Card
NMI Non-maskable Interrupt
OCuLink Optical Copper Link
PCI Peripheral Component Interconnect
PCIe* Peripheral Component Interconnect Express*
PMM Persistent Memory Module
POST Power-on Self-Test
PSU Power Supply Unit
RAID Redundant Array of Independent Disks
RAM Random Access Memory
RDIMM Registered DIMM
ROC RAID On Chip
SAS Serial Attached SCSI
SATA Serial Advanced Technology Attachment
SCA Single Connector Attachment
SCSI Small Computer System Interface
SDR Sensor Data Record
SSD Solid State Device
TPM Trusted Platform Module
TPS Technical Product Specification
Intel® TXT Intel® Trusted Execution Technology for servers
VLSI Very Large Scale Integration
Intel® VROC Intel® Virtual RAID on CPU
VSB Voltage Standby
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