Infineon IRF7476 DataSheet v01 - 01 EN
Infineon IRF7476 DataSheet v01 - 01 EN
Infineon IRF7476 DataSheet v01 - 01 EN
IRF7476PbF
HEXFET® Power MOSFET
3 6
S D
Benefits
4 5
G D
l Ultra-Low Gate Impedance
SO-8
l Very Low RDS(on) Top View
l Fully Characterized Avalanche Voltage
and Current
Thermal Resistance
Symbol Parameter Typ. Max. Units
RθJL Junction-to-Drain Lead ––– 20
RθJA Junction-to-Ambient ––– 50 °C/W
Avalanche Characteristics
Symbol Parameter Typ. Max. Units
EAS Single Pulse Avalanche Energy ––– 160 mJ
IAR Avalanche Current ––– 12 A
Diode Characteristics
Symbol Parameter Min. Typ. Max. Units Conditions
D
IS Continuous Source Current MOSFET symbol
––– ––– 2.5
(Body Diode) showing the
A
ISM Pulsed Source Current integral reverse G
1000 1000
VGS VGS
TOP 10V TOP 10V
8.0V 8.0V
100 5.0V 5.0V
100 4.5V
4.5V
3.5V 3.5V
2.7V 2.7V
10 2.0V 2.0V
BOTTOM 1.5V 10 BOTTOM 1.5V
1
1.5V
0.1
1.5V
0.1
0.01
20µs PULSE WIDTH 20µs PULSE WIDTH
Tj = 25°C Tj = 150°C
0.001 0.01
0.1 1 10 100 0.1 1 10 100
1000.00 2.0
I D = 15A
ID, Drain-to-Source Current (Α)
100.00 1.5
RDS(on) , Drain-to-Source On Resistance
T J = 150°C
(Normalized)
10.00 1.0
T J = 25°C
1.00 0.5
VDS = 10V
20µs PULSE WIDTH
V GS = 4.5V
0.10 0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
1.5 2.0 2.5 3.0 3.5 4.0
°
VGS, Gate-to-Source Voltage (V) Tj, Junction Temperature (°C)
100000 6
I D = 12A
VGS = 0V, f = 1 MHZ
Ciss = Cgs + Cgd, Cds SHORTED VDS = 9.6V
VDS = 6V
Crss = Cgd 5 VDS = 2.4V
Coss = Cds + Cgd
10000 4
3
Ciss
Coss
1000 2
Crss 1
100 0
0 5 10 15 20 25 30
1 10 100
QG, Total Gate Charge (nC)
VDS, Drain-to-Source Voltage (V)
1000 1000
OPERATION IN THIS AREA
LIMITED BY R DS(on)
ID, Drain-to-Source Current (A)
100 100
I SD , Reverse Drain Current (A)
100µsec
T J = 150 ° C
10 10 1msec
10msec
TJ = 25 ° C
1 1
Tc = 25°C
Tj = 150°C
V GS = 0 V Single Pulse
0.1 0.1
0.2 0.4 0.6 0.8 1.0 1.2 1.4
0 1 10 100
VSD, Source-to-Drain Voltage (V)
VDS, Drain-to-Source Voltage (V)
15
RD
VDS
12 VGS
D.U.T.
RG
+
-V DD
ID , Drain Current (A)
4.5V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
6
10%
Fig 9. Maximum Drain Current Vs. VGS
Case Temperature td(on) tr t d(off) tf
100
(Z thJA )
D = 0.50
0.20
10
0.10
Thermal Response
0.05
0.02 P DM
1 0.01
t1
SINGLE PULSE
(THERMAL RESPONSE) t2
Notes:
1. Duty factor D = t1/ t 2
2. Peak T J = P DM x Z thJA +T A
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
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IRF7476PbF
7.5 15.00
13.00
7.3
11.00
VGS = 4.5V
7.0
9.00
6.8 ID = 15A
7.00
6.5 5.00
0 20 40 60 80 100 120 2.0 4.0 6.0 8.0 10.0
Fig 12. On-Resistance Vs. Drain Current Fig 13. On-Resistance Vs. Gate Voltage
Current Regulator
Same Type as D.U.T.
QG
50KΩ VGS
12V .2µF
.3µF QGS QGD
+
V 400
D.U.T. - DS
VG ID
VGS TOP 5.4A
3mA Charge 9.6A
IG ID BOTTOM 12A
Current Sampling Resistors 300
EAS , Single Pulse Avalanche Energy (mJ)
15V
100
V(BR)DSS
tp L DRIVER
VDS
RG D.U.T +
V
- DD
0
IAS A 25 50 75 100 125 150
20V
tp 0.01Ω Starting Tj, Junction Temperature (°C)
I AS
Fig 14a&b. Unclamped Inductive Test circuit Fig 14c. Maximum Avalanche Energy
and Waveforms Vs. Drain Current
6 www.irf.com
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www.irf.com 7
IRF7476PbF
SO-8 Tape and Reel
Dimensions are shown in millimeters (inches)
TERMINAL NUMBER 1
12.3 ( .484 )
11.7 ( .461 )
8.1 ( .318 )
7.9 ( .312 ) FEED DIRECTION
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
330.00
(12.992)
MAX.
14.40 ( .566 )
12.40 ( .488 )
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
Notes: 2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
Repetitive rating; pulse width limited by Pulse width ≤ 400µs; duty cycle ≤ 2%.
max. junction temperature. When mounted on 1 inch square copper board.
Starting TJ = 25°C, L = 2.3mH
RG = 25Ω, IAS = 12A.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.04/2006
8 www.irf.com
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