TLP187

Photocouplers Infrared LED & Photo Transistor

TLP187
1. Applications
• Programmable Logic Controllers (PLCs)
• I/O Interface Boards
• Home Electric Appliances

2. General
TLP187 is a photocoupler that consist of an infrared LED optically coupled to a darlington transistor. Housed in
a SO6 package, it has a high noise immunity and a high insulation. With the high breakdown voltage between
the collector and emitter, TLP187 is suitable in applications such as 100 VDC output modules of programmable
controllers.

3. Features
(1) Collector-emitter voltage: 300 V (min)
(2) Current transfer ratio: 1000 % (min)
(3) Isolation voltage: 3750 Vrms (min)
(4) Operation temperature range:-55 to 110 
(5) Safety standards
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)
CQC-approved: GB4943.1, GB8898 Japan and Thailand Factory

Note 1: When a VDE approved type is needed, please designate the Option (V4)
(V4).

4. Packaging and Pin Configuration

1: Anode
3: Cathode
4: Emitter
6: Collector

11-4M1S

Start of commercial production

2012-10
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5. Principle of Operation
5.1. Mechanical Parameters
Characteristics Min Unit

Creepage distances 5.0 mm

Clearance 5.0
Internal isolation thickness 0.4

6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )

Characteristics Symbol Note Rating Unit

LED Input forward current IF 50 mA

Input forward current derating (Ta ≥ 90 ) ∆IF/∆Ta -1.43 mA/
Input forward current (pulsed) IFP (Note 1) 1 A
Input reverse voltage VR 5 V
Input power dissipation PD 100 mW
Input power dissipation (Ta ≥ 90 ) ∆PD/∆Ta -2.86 mW/
derating
Junction temperature Tj 125 
Detector Collector-emitter voltage VCEO 300 V
Emitter-collector voltage VECO 0.3
Collector current IC 150 mA
Collector power dissipation PC 150 mW
Collector power dissipation (Ta ≥ 25 ) ∆PC/∆Ta -1.5 mW/
derating
Junction temperature Tj 125 
Common Operating temperature Topr -55 to 110 
Storage temperature Tstg -55 to 125
Lead soldering temperature (10 s) Tsol 260
Total power dissipation PT 200 mW
Isolation voltage AC, 60 s, R.H. ≤ 60 % BVS (Note 2) 3750 Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 100 µs, f = 1000 Hz
Note 2: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4 and 6 are
shorted together.

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7. Electrical Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics Symbol Note Test Condition Min Typ. Max Unit

LED Input forward voltage VF IF = 10 mA 1.1 1.25 1.4 V

Input reverse current IR VR = 5 V   10 µA
Input capacitance Ct V = 0 V, f = 1 MHz  30  pF
Detector Collector-emitter breakdown V(BR)CEO IC = 0.1 mA 300   V
voltage
Emitter-collector breakdown V(BR)ECO IE = 0.1 mA 0.3  
voltage
Dark Current IDARK VCE = 200 V  0.01 0.2 µA
VCE = 200 V, Ta = 85    20
Collector-emitter capacitance CCE V = 0 V, f = 1 MHz  12  pF

8. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 )

Characteristics Symbol Note Test Condition Min Typ. Max Unit

Current transfer ratio IC/IF IF = 1 mA, VCE = 1 V 1000 4000  %

Saturated current transfer ratio IC/IF(sat) IF = 10 mA, VCE = 1 V 500  
Collector-emitter saturation VCE(sat) IC = 10 mA, IF = 1 mA   1.0 V
voltage
IC = 100 mA, IF = 10 mA 0.3  1.2
OFF-state collector current IC(off) VF = 0.7 V, VCE = 200 V   20 µA

9. Isolation Characteristics (Unless otherwise specified, Ta = 25 )

Characteristics Symbol Note Test Conditions Min Typ. Max Unit

Total capacitance (input to CS (Note 1) VS = 0 V, f = 1 MHz  0.8  pF

output)
Isolation resistance RS (Note 1) VS = 500 V, R.H. ≤ 60 % 1012 1014  Ω
Isolation voltage BVS (Note 1) AC, 60 s 3750   Vrms

Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4 and 6 are
shorted together.

10. Switching Characteristics (Unless otherwise specified, Ta = 25 )

Characteristics Symbol Note Test Condition Min Typ. Max Unit

Rise time tr VCC = 10 V, IC = 10 mA,  40  µs

RL = 100 Ω
Fall time tf  15 
Turn-on time ton  50 
Turn-off time toff  15 
Turn-on time ton See Figure 10.1  5 
RL = 180 Ω, VCC = 10 V,
Storage time ts  40 
IF = 16 mA
Turn-off time toff  80 

Fig. 10.1 Switching Time Test Circuit and Waveform

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11. Characteristics Curves (Note)

Fig. 11.1 IF - Ta Fig. 11.2 PC - Ta

Fig. 11.3 IFP - DR Fig. 11.4 IF - VF

Fig. 11.5 ∆VF/∆Ta - IF Fig. 11.6 IFP - VFP

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Fig. 11.7 IC - VCEO Fig. 11.8 IC - IF

Fig. 11.9 IDARK - Ta Fig. 11.10 IC/IF - IF

Fig. 11.11 VCE(sat) - Ta Fig. 11.12 IC - Ta

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Fig. 11.13 Switching Time - RL

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.

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12. Soldering and Storage
12.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

Fig. 12.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used

• When using soldering flow

Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260  within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not
exceeding 350 
Heating by soldering iron must be done only once per lead.

12.2. Precautions for General Storage

• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.

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Package Dimensions
Unit: mm

Weight: 0.08 g (typ.)

Package Name(s)

TOSHIBA: 11-4M1S

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RESTRICTIONS ON PRODUCT USE

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA".
Hardware, software and systems described in this document are collectively referred to as "Product".

• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.

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written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

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EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
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• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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