RDC 19222
RDC 19222
The velocity output (VEL) from the RDC-19220 Ser ies, which can be
used to replace a tachometer, is a 4 V signal (3.5 V with the +5 V only
option) referenced to ground with a linearity of 0.75% of output voltage.
The full scale value of VEL is set by the user with a single resistor.
APPLICATIONS
With its low cost, small size, high accuracy and versatile performance,
the RDC-19220 Series converter is ideal for use in modern high-per-
formance industrial and militar y control systems. Typical applications
include motor control, r adar antenna positioning, machine tool con-
trol, robotics , and process control. MIL-PRF-38534 processing is
available for military applications.
FOR MORE INFORMATION CONTACT:
Technical Support:
Data Device Corporation
1-800-DDC-5757 ext. 7771
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com © 1999 Data Device Corporation http://www.Datasheet4U.com
www.ddc-web.com
Data Device Corporation
+REF -REF BIT
-VSUM
SIN C BW
-S - C BW
+S + 10 RB
R1
CONTROL
COS TRANSFORMER GAIN DEMODULATOR VEL
-C -
+C + INTEGRATOR RV
HYSTERESIS
A B
+5C
-VCO
2
16 BIT VCO
+CAP -5 V
UP/DOWN &
-CAP INVERTER RS
COUNTER TIMING
-5C
E RC
A GND
+5 V DATA
GND LATCH
-5 V
INH EM BIT 1 EL A B CB
THRU
BIT 16
RDC-19220 SERIES
R-12/05-0
FIGURE 1. RDC-19220 SERIES BLOCK DIAGRAM
TABLE 1. RDC-19220 SERIES SPECIFICATIONS TABLE 1. RDC-19220 SERIES SPECS (CONT’D)
These specifications apply over the rated power supply, temperature These specifications apply over the rated power supply, temperature
and reference frequency ranges, and 10% signal amplitude variation and reference frequency ranges, and 10% signal amplitude v ariation
and harmonic distortion. and harmonic distortion.
PARAMETER UNIT VALUE PARAMETER UNIT VALUE
RESOLUTION Bits 10, 12, 14, or 16 DYNAMIC (at maximum bandwidth)
ACCURACY Min 4 or 2 + 1 LSB (note 3) CHARACTERISTICS
REPEATABILITY LSB 1 max Resolution bits 10 12 14 16
Tracking Rate (max)(note 4) rps 1152 288 72 18
DIFFERENTIAL LINEARITY LSB 1 max in the 16th bit Bandwidth(Closed Loop) Hz 1200 1200 600 300
REFERENCE (+REF, -REF) (max) (note 4)
Type Differential Ka (Note 7) 1/sec2 5.7M 5.7M 1.4M 360k
Voltage: A1 1/sec 19.5 19.5 4.9 1.2
differential VP-P 10 max A2 1/sec 295k 295k 295k 295k
single ended VP ±5 max A 1/sec 2400 2400 1200 600
overload V ±25 continuous, 100 transient B 1/sec 1200 1200 600 300
Frequency Hz DC to 40,000 (note 4 & note 9) Acceleration (1 LSB lag) deg/s2 2M 500k 30k 2k
Input Impedance Ohm 10M min // 20 pf Settling Time(179° step) msec 2 8 20 50
SIGNAL INPUT (+S, -S, SIN, +C, -C, COS) VELOCITY
Type Resolver, differential, groundbased CHARACTERISTICS
Voltage: operating Vrms 2 ±15% Polarity Positive for increasing angle
overload V ±25 continuous Voltage Range(Full Scale) V ±4 (at nominal ps)
Input impedance Ohm 10M min//10 pf. Scale Factor Error % 10 typ 20 max
DIGITAL INPUT/OUTPUT (Note 6) Scale Factor TC PPM/C 100 typ 200 max
Logic Type TTL/CMOS compatible Reversal Error % 0.75 typ 1.3 max
Inputs Logic 0 = 0.8 V max. Linearity % 0.25 typ 0.50 max
Logic 1 = 2.0 V min. Zero Offset mv 5 typ 10 max
Loading =10 µA max pull-up cur- Zero Offset TC µV/C 15 typ 30max
rent source to +5 V //5 pF max. Load kΩ 8 min
CMOS transient protected Noise (Vp/V)% 1 typ . 125 min 2 max
Inhibit (INH) Logic 0 inhibits; Data stable (note 5)
POWER SUPPLIES
within 0.3 µs +5 -5
Nominal Voltage V
Enable Bits 1 to 8 (EM) Logic 0 enables;Data stable with % ± 5 ±5
Voltage Range
Enable Bits 9 to 16 (EL) -in 150 ns (logic 0=Transparent) +7 -7
Max Volt. w/o Damage V
Logic 1 = High Impedance mA 14 typ, 22 max (each)
Current
Data High Z within 100 nS
Resolution and Mode TEMPERATURE RANGE
Control (A & B) Mode B A Resolution Operating (Case)
(see notes 1 and 2. resolver 0 0 10 bits -30X °C 0 to +70
pre-set to logic 1 note 6) " 0 1 12 bits -20X °C -40 to +85
"1 0 14 bits -10X °C -55 to +125
"1 1 16 bits -A0X °C -40 to +125
LVDT -5 V 0 8 bits Storage
" 0 -5 V 10 bits plastic package °C -65 to +150
"1 -5 V 12 bits ceramic package °C -65 to +150
" -5 V -5 V 14 bits MOISTURE SENSITIVITY
Outputs LEVEL MQFP JEDEC 2
Parallel Data (1-16) 10, 12, 14, or 16 par allel lines; RDC-19224
natural binary angle positive
THERMAL RESISTANCE
logic (see TABLE 2)
Junction-to-Case (θjc)
Converter Busy (CB) 0.25 to 0.75 µs positive pulse
40-pin DDIP (ceramic) °C/W 4.6
leading edge initiates counter
44-pin J-Lead (ceramic) °C/W 2.4
update.
Zero Index Logic 1 at all 0s (ENL to -5 V);
(Zl) LSBs are enabled PHYSICAL
Built-in-Test (BIT) Logic 0 for BIT condition. CHARACTERISTICS
±100 LSBs of error typ. with a Size: 40-pin DDIP in(mm) 2.0 x 0.6 x 0.2 (50.8 x 15.24 x 5.08)
filter of 500 µS, or total Loss-of- 44-pin J-Lead in(mm) 0.690 square (17.526)
Signal (LOS) 44-pin MQFP in(mm) 0.394 square (10.0)
Drive Capability 50 pF +
Logic 0; 1 TTL load, 1.6 mA at
Weight: Plastic Cer amic
0.4 V max
40-pin DDIP oz(g) n/a 0.24 (6.80)
Logic 1; 10 TTL loads, = 0.4 mA
44-pin J-Lead oz(g) n/a 0.065 (1.84)
at 2.8 V min
44-pin MQFP oz(g) 0.017 (0.5) n/a
Logic 0; 100 mV max driving CMOS
Logic 1; +5 V supply minus 100mV
min driving CMOS, High Z;
10 uA//5 pF max
C BW /10 RV
RS
50 pf
C VCO
CT
RESOLVER R1 16 BIT
+
INPUT GAIN DEMOD VCO UP/DOWN
(θ) 1 ±1.25 V COUNTER
- CS FS THRESHOLD
11 mV/LSB
DIGITAL
H=1 OUTPUT
(φ)
where A is the gain coefficient and A 2= A1A2 Power supplies are ±5 V dc. For lowest noise performance it
is recommended that a 0.1 µF or larger cap be connected
and B is the frequency of lead compensation. from each supply to g round near the con verter pac kage.
When using a +5V and -5V supply to po wer the con verter,
The components of gain coefficient are error gradient, integrator RDC-19222 pins 22, 23, 25, 26 m ust be no connection, and
gain and VCO gain. These can be broken down as follows: on RDC-19224 pins 20, 40, 16, 11, m ust be no connection.
Also, the 10uF cap is not connected to +cap and -cap pins .
- Error Gradient = 0.011 volts per LSB (CT + Error Amp + Demod
with 2 Vrms input) 3) This con verter has 2 inter nal g round planes , which reduce
noise to the analog input due to digital g round currents. The
- Integrator Gain = Cs Fs volts per second per volt
1.1 CBW resolver inputs and v elocity output are ref erenced to A GND.
The digital outputs and inputs are ref erenced to GND . The
- VCO Gain = 1 LSBs per second per volt AGND and GND pins m ust be tied together as close to the
1.25 RV CVCO
converter pac kage as possib le. Not shor ting these pins
where: Cs = 10 pF
Fs = 67 kHz when Rs = 30 kΩ together as close to the con verter pac kage as possib le will
Fs = 100 kHz when Rs = 20 kΩ cause unstable converter results.
Fs = 134 kHz when Rs = 15 kΩ
CVCO = 50 pF
RV, RB, and C BW are selected by the user to set velocity scaling
and bandwidth.
-1
2d
b/o
(CRITICALLY DAMPED)
c
t
GAIN = 4
VELOCITY 2A
OUT OPEN LOOP ω (rad/sec)
ERROR PROCESSOR B A -6
db 10B
VCO (B = A/2) /oc
CT t
+ A1 S + 1 A2 DIGITAL
RESOLVER e B
INPUT S POSITION GAIN = 0.4
(θ) S S +1
- 10B OUT (φ)
f BW = BW (Hz) = 2A
π
H=1
2A 2 2A
CLOSED LOOP ω (rad/sec)
6) Setup of bandwidth and velocity scaling for the optimized crit- (-5c) -5V (+5c) +5V
ically damped case should proceed as f ollows:
- Select the desired f BW (closed loop) based on overall
system dynamics.
.01uF .01uF
- Select f carrier ≥ 3.5f BW
+
- Select the applications tracking rate (in accordance with TABLE 3),
and use appropriate values for R SET and R CLK
Note: DDC has software available to perform the previous calcu- When using the -5 V inverter, the max. tracking rate should be
lations. Contact DDC to request software or visit our web- scaled for a velocity output of 3.5V max.Use the following equa-
site at www.ddc-web.com to download software. tion to determine tracking rate used in the formula on page 5:
The carrier frequency should be 1/10, or less, of the sampling fre- • The Bandwidth value of the converter should be chosen based
quency in order to have many samples per carrier cycle. The con- on the r ate of change of the system’ s input amplitude v ariation,
verter will work with reduced quadrature rejection at a carrier fre- and should be large enough so to minimize it’s effect on the sys-
quency up to 1/4 the sampling frequency . Carrier frequency should tem dynamics. Note that if the bandwidth is too high the system
be at least 3.5 times the BW in order to eliminate the chance of .jitter will be more susceptible to noise.
REDUCED POWER SUPPLY CURRENTS • The accuracy of the converter using a DC input will be degrad-
When Rs = 30 kΩ (tracking rate is not being pushed), nominal po wer ed from the r ated accur acy. Consider the best case where the
supply current can be cut from 14 to 9 mA b y setting Rc = 53 kΩ. input is single ended and no additional DC offsets are present on
the input con verter - the accur acy will deg rade by about 2 arc
minutes. IE:, If a par t is r ated at 2 arc min utes, a DC input will
degrade the accuracy to approximately 4 arc minutes.
1 3 4 5 11 12 14 15 1 3 4 5 11 12 14 15
0.81 MAX 0.81 MAX
(20.57) (20.57)
T1A T1B 0.600 T1A T1B 0.600
(15.24) (15.24)
10 9 8 7 6 20 19 18 17 16 10 9 8 7 6 20 19 18 17 16
0.115 MAX 0.115 MAX
(2.92) (2.92)
SIDE VIEW 0.100 (2.54) TYP SIDE VIEW 0.100 (2.54) TYP
BOTTOM VIEW BOTTOM VIEW
TOL NON CUM TOL NON CUM
TERMINALS TERMINALS
0.025 ±0.001 (6.35 ±0.03) DIAM BOTTOM VIEW 0.025 ±0.001 (6.35 ±0.03) DIAM BOTTOM VIEW
PIN NUMBERS FOR REF. ONLY PIN NUMBERS FOR REF. ONLY
0.125 (3.18) MIN LENGTH 0.125 (3.18) MIN LENGTH
SOLDER PLATED BRASS SOLDER PLATED BRASS
Dimensions are shown in inches (mm). Dimensions are shown in inches (mm).
T1A T1A
1 6 -SIN S1 1 6 -SIN
S1
5
3 10 3 10
S3 +SIN S3 +SIN
SYNCHRO RESOLVER
RESOLVER RESOLVER
INPUT INPUT
OUTPUT T1B OUTPUT
T1B
11 16 -COS 11 16 -COS
S4
15 20 S2 15 20 +COS
S2 +COS
FIGURE 5A. TRANSFORMER LAYOUT AND FIGURE 5B. TRANSFORMER LAYOUT AND
SCHEMATIC (SYNCHRO INPUT - 52034/52035) SCHEMATIC (RESOLVER INPUT - 52036/52037/52038)
1 2 3 5
0.600 0.81 MAX (RH) (RL) (V) (+R) (-Vs)
T1A (15.24) (20.57) S2
* V +C -Vs
• + • • •
10 9 8 7 6 (BOTTOM VIEW)
0.42
0.13 ±0.03 (10.67)
0.105 (2.66) (3.30 ±0.76) MAX.
SIDE VIEW 0.100 (2.54) TYP 0.21 ±0.3
TOL NON CUM (5.33 ±0.76)
TERMINALS 0.175 ±0.010 (4.45 ±0.25)
BOTTOM VIEW NONCUMULATIVE
0.025 ±0.001 (6.35 ±0.03) DIAM TOLERANCE
0.125 (3.18) MIN LENGTH 0.040 ±0.002 DIA. PIN.
SOLDER PLATED BRASS
SOLDER-PLATED BRASS
5 10
V -Vs V -Vs
(Analog (-15 V) (Analog (-15 V)
Gnd) Gnd)
The mechanical outline is the same f or the synchro input tr ansformer (52039) and
the reference input transformer (24133), except for the pins. Pins for the reference
transformer are shown in parenthesis ( ) below. An asterisk * indicates that the
pin is omitted.
FIGURE 5C. TRANSFORMER LAYOUT AND FIGURE 5D. 60 HZ SYNCHRO AND REFERENCE
SCHEMATIC (REFERENCE INPUT - B-426) TRANSFORMER DIAGRAMS
(SYNCHRO INPUT - 52039 / REFERENCE INPUT - 24133)
EXTERNAL
REFERENCE
LO HI
1 6 RB CBW
B-426 10
5 CBW/10 RV
SYNCHRO INPUT
RESOLUTION
CONTROL
S1 +S
RL RH 1 10
S3
3 TIA
5 6
+C
11 20
S2 TIB
15 AGND
16
GND
52034(11.8V)
OR
52035(90V)
EXTERNAL
REF
LO HI
R1 R2
R3 R4
S3 10k Ω (1%) +S
-R +R
-S
SIN Note: The five external BW components as
S1 COS shown in FIGURE 1 and 2 are necessar y
-C for the R/D to function.
+C
S2 10k Ω (1%)
S4 A GND
RESOLVER GND
Notes:
1) Resistors selected to limit Vref peak to between 1 V and 5 V.
2) External reference LO is grounded, then R3 and R4 are not
needed, and -R is connected to GND.
3) See thin film network DDC-55688-1.
R1
S3 -S SIN
+S
R2
S1
R2
S4 A GND
-C COS
R2 = 2
R1 + R2 X Volt
R1 + R2 should not load the Resolv er too much; it is recommended to use a R2 = 10k.
Rf
Ri -S
S1 -
Ri +S
S3 +
Rf
Note: The five external BW components as
RESOLVER A GND shown in FIGURE 1 and 2 are necessar y
INPUT COS for the R/D to function.
Rf
Ri -C
S4 -
Ri +C
S2 +
8 10
Rf
CONVERTER
SIN
3
Rf
Ri -S
1 -
S1
2
Ri +S
S3 6 +
5
Rf
RESOLVER A GND 4
INPUT COS
13 Note: The five external BW components as
Rf shown in FIGURE 1 and 2 are necessary
Ri -C for the R/D to function.
16
S4 -
15
Ri +C
7 +
S2
8 10
Rf
12
CONVERTER
S1 and S3, S2 and S4, and RH and RL should be ideally twisted shielded, with the shield tied to GNDat the converter. For DDC-49530
or DDC-57470: Ri = 70.8 kΩ, 11.8 V input, synchro or resolver. For DDC-49590: Ri = 270 kΩ, 90 V input, synchro or resolver. Maximum
addition error is 1 minute using recommended thin film pac kage.
Note on DC Offset Gains: Input options affect DC offset gains and theref ore affect carrier frequency r ipple and jitter. Offsets gains
associated with differential mode, (offset gain for differential configuration = 1 + RF/RI) and direct mode (offset gain f or direct config-
uration = 1), sho w differential will alw ays be higher . Higher DC offsets cause higher carr ier frequency r ipple due to demodulati on
process. This carrier frequency ripple because it is r iding on the top of the DC error signal causes jitter . A higher carrier frequency vs
bandwidth ratio will help decrease r ipple and jitter associated with offsets . Summary: R/D’s with differential inputs are more su scepti-
ble to offset problems than R/D’s in single ended mode. RD’s in higher resolutions, such as 16 bit, will further compound offset issues
due to higher inter nal voltage gains. Although the differential configuration has a higher DC offset gain, the diff erential configuration’s
common mode noise rejection mak es it the pref erred input option. The tradeoffs should be considered on a design to design basis .
Also refer to FAQ-GIQ-021.
FIGURE 8B. DIFFERENTIAL RESOLVER INPUT, USING DDC-49530, DDC-57470 (11.8 V),
DDC-73089 (2V), OR DDC-49590 (90 V)
Data Device Corporation RDC-19220 SERIES
www.ddc-web.com 11 R-12/05-0
SIN
Rf
Ri -S
S1 -
Ri +S
S3 + Note: The five external BW components as
shown in FIGURE 1 and 2 are necessar y
Rf for the R/D to function.
A GND
COS
Ri
Rf / 3
Ri
-C
-
Ri /2 +C
S2 +
Rf / 3
CONVERTER
SIN
3
Rf
Ri -S
1
S1 -
2
Ri +S
6 +
S3
5
Rf Note: The five external BW components as
shown in FIGURE 1 and 2 are necessary
A GND 4 for the R/D to function.
COS
Ri 14
16
Rf / 3
Ri 8 -C
7
-
15 15
Ri /2 +C
9
S2 +
10
Rf / 3
11
CONVERTER
S1, S2, and S3 should be tr iple twisted shielded; RH and RL should be twisted shielded, In both cases the shield should be tied to GND at the converter.
90 V input = DDC-49590: Ri = 270 kΩ, 90 V input, synchro or resolver.
11.8 V input = DDC-49530 or DDC-57470: Ri = 70.8 kΩ, 11.8 V input, synchro or resolver.
Maximum addition error is 1 min ute.
FIGURE 9B. SYNCHRO INPUT, USING DDC-49530/DDC-57470 (11.8 V), DDC-73089 (2V) OR DDC-49590 (90 V)
Data Device Corporation RDC-19220 SERIES
www.ddc-web.com 12 R-12/05-0
tor to an inverting integrator with a 50 pF nominal feedback capac- Magnitude of Error is in r adians
itor. When it integ rates to -1.25 V, the con verter counts up 1 LSB Quadrature Voltage is in volts
and when it integrates to +1.25 V, the con verter counts do wn 1 Full Scale signal is in v olts
LSB. When a count is taken, a charge is dumped on the capaci α = signal to REF phase shift
RDC-19220 Ser ies specifications f or v elocity scaling, re versal Let: Quadrature Voltage = 11.8 mV
error and offset are contained in TABLE 1. Velocity scaling and Let: F.S. signal = 11.8 V
offset are e xternally tr immable for applications requir ing tighter Let: α = 6°
specifications than those a vailable from the standard unit. FIG-
URE 10 sho ws the setup f or tr imming these par ameters with Then: Magnitude of Error = 0.36 min @ 1 LSB in the 16th bit.
external pots. It should also be noted that when the resolution is
changed, VEL scaling is also changed. Since the VEL output is Note: Quadrature is composed of static quadr ature which is
from an integrator with capacitor feedback, the VEL voltage can- specified by the synchro or resolver supplier plus the speed
not change instantaneously . Therefore, when changing resolu- voltage which is deter mined by the following formula:
tion while moving there will be a tr ansient with a magnitude pro-
portional to the v elocity and a dur ation deter mined by the con- Speed Voltage = (rotational speed/carr
ier frequency) • F.S. signal
verter bandwidth.
Where:
INCREASED TRACKING/DECREASED SETTLING
(GEAR SHIFTING) Speed Voltage is the quadrature due to rotation.
Connecting the BIT output to the resolution control lines (A and Rotation speed is the rps (rotations per second) of the synchro
B) will change the resolution of the con verter down (“gear shift”) or resolver.
and make the con verter settle f aster and tr ack at higher r ates. Carrier frequency is the REF in Hz.
The converter bandwidth is independent of the resolution.
PHASE SHIFT COMPENSATION
ADDITIONAL ERROR SOURCES FIGURE 11 illustr ates a circuit to LEAD or LA G the ref erence
Quadrature voltages in a resolver or synchro are b y definition the into the con verter that will compensate f or phase-shift betw een
resulting 90° fundamental signal in the nulled out error voltage (e)
in the converter. This voltage is due to capacitive or inductive cou- LAG
C
Where: + REF + REF
R
- REF - REF
RDC-19220
Xc
tan ϕ =
+5 V R
100 RV
100 kΩ
(OFFSET) Where ϕ = desired phase-shift
-5 V
-VCO 0.8 R V 1
Xc =
2πfc
0.4 RV (SCALING)
Where f = carrier frequency
VEL Where c = capacitance
Notes;
C1 = C2, set for phase lag = phase lead through the L VDT. 1. R 10kΩ
2. Consideration for the value of R is LVDT loading.
3. RMS values given.
4. Use the absolute values of Va and Vb when subtracting per the formula for calculating
resistance values, and then use the calculated sign of "Va and Vb" for calculating SIN
FIGURE 12A. 2-WIRE LVDT DIRECT INPUT and COS. The calculations shown are based upon full scale travel being to the Va side
of the LVDT.
5. See the RDC application manual for calculation examples.
6. Negative voltages are 180˚ phase for the reference.
-S SIN
+S
b= 1 = 1
A GND VAnull VBnull
LVDT RDC-19220
-REF RDC-19220 OUTPUT a=
2
(VA - VB )max.
INPUT
2V SIN
+REF VA a
SIN=-1V+ (V - VB )
2 A 1V
+C VB
-C COS a
COS=-1V - (VA - VB ) COS
+FS NULL -FS 2
-FS NULL +FS
FIGURE 12B. 3-WIRE LVDT DIRECT INPUT FIGURE 12C. 3-WIRE LVDT SCALING CIRCUIT
Data Device Corporation RDC-19220 SERIES
www.ddc-web.com 14 R-12/05-0
as overrange indicators. Positive overrange is indicated b y code the timing to CB “Figure 15” before setting the INH latch.
“01” and negativ e o verrange is indicated b y code “11” (see Therefore, there is no need to monitor the CB line when
TABLE 7). applying an inhibit signal to the con verter.
The Converter Busy (CB) signal indicates that the tr acking con- BIT will also be set low for a detected total Loss-of-Signal (LOS).
verter output angle is changing 1 LSB. As shown in FIGURE 15, The BIT signal ma y pulse dur ing cer tain error conditions (i.e .,
output data is v alid 50 ns maxim um after the middle of the CB converter spin around or signal amplitude on threshold of LOS).
pulse. CB pulse width is 1/(40 x Fs), which is nominally 375 ns .
LOS will be detected if both sin and cos input v oltages are less
Note: The converter INH may be applied regardless of the CB than 800 mV peak. The LOS has a filter on it to filter out the ref-
line state. If the CB is b usy the converter INH will wait for erence. Since the lowest specified frequency is 47hz (-27ms) the
filter m ust ha ve a time constant long enough to filter this out.
Time constants of 50ms or more are possib le.
INHIBIT
ENCODER EMULATION
300 ns max The RDC-19220 ser ies can be made to em ulate incremental
optical encoder output signals , where such an interf ace is
desired. This is accomplished b y tying EL to -5 V, whereby CB
DATA
DATA VALID becomes Zero Index (Zl) Logic 1 at all 0s , the LSB+1 becomes
A, and the exclusive-or of the LSB and LSB+1 becomes B em u-
FIGURE 13. INHIBIT TIMING lating A QUAD B signals as illustrated in FIGURE 16A. Also, the
LSB byte is always enabled.
ENABLE
1/ (40 x FS )
(375 nsec nominal)
150 ns MAX
100 ns MAX CB
*
DATA HIGH Z DATA HIGH Z
VALID 50 ns
B
LSB
EL
-5 V
FIGURE 16A. INCREMENTAL ENCODER EMULATION
R2 U2D
2k 74AC86
13
C2 11
RDC-19220 220 pF A
12
U2A
74AC86 R1 U2B
LSB +1 2 2k 74AC86
3 4
1 C1 6 B
LSB 220 pF 5
R3 U2C
2k 74AC86
9
CB/NRP
C3 8
120 pF 10 NRP
EL
D1
1N4148
-5 V
NOTE: CMOS LOGIC IS RECOMMENDED. TTL AND TTL
COMPATIBLE LOGIC WILL SKEW THE DELAYS.
1 40
20 21
6 40 5
200
3,
Q
UED
IN .155 MAX .020 MIN
NT (3.94)
O
SC
0.690 SQ. ±.005
DI
(17.53) .620 SQ
± .010
0.650 SQ. NOM LCC (15.75)
(16.51) P
.016 ± .005 (.41)
0.075 ±0.010
(1.91 ±0.25) 0.040 x 45˚
CHAMFER
0.500 ±0.010 (1.02)
0.020 x 45˚ (12.70 ±0.25) (3 PLACES)
0.143 ± 10 (REF)
(0.51) (3.63)
CHAMFER 0.050 TYP
(ORIENTATION (1.27) 0.095 ±0.007
MARK) (2.413 ±0.18)
6 1 40
7 39
0.017 TYP
(0.43)
17 29
18 28 PIN NUMBERS
FOR REF ONLY
0.075 ±0.010
(1.91 ±0.25) 0.650 SQ ±0.010
(16.51 ±0.25)
D1
E E1
c
TOP VIEW
0.012 R (TYP)
(0.30)
A2 A
.009 (0.23) MAX
.005 (0.13) MIN
A1 L
0.008 R (TYP)
(0.20)
A A1 A2 D D1 E E1 L c b
.092 0.0039 0.0098 .078 .520 .394 .520 .394 .035 .0315 .0138
INCHES + .004 ± .010 ± .004 + .006
± .010 ± .004 BSC +.0020
MAX MIN MAX
- .002 - .004
2.35 .10 .25 2.00 13.20 10.00 13.20 10.00 .88 .80 .35
MM + .10 ± .25 ± .10 ± .25 ± .10 + .15 BSC +.05
MAX MIN MAX
- .05 - .10
Accuracy:
2= 4 minutes + 1 LSB
3 = 2 minutes + 1 LSB
Process Requirements:
0 = Standard DDC Processing, without Bur n-In
1 = MIL-PRF-38534 Compliant
2 = Standard DDC Processing, with Bur n-In
3 = MIL-PRF-38534 Compliant, with PIND testing
4 = MIL-PRF-38534 Compliant, with Solder Dip (Not a vailable in lead free.)(Note 4)
5 = MIL-PRF-38534 Compliant, with PIND testing, and Solder Dip (Not a vailable in lead free.)(Note 4)
6 = Standard DDC Processing, with PIND testing, and Burn-In
7 = Standard DDC Processing, with Solder Dip , and Burn-In (Not available in lead free.)(Note 4)
9 = Standard DDC Processing, with Solder Dip , without Burn-In (Not available in lead free.)(Note 4)
Notes:
1. For Process Requirement "B*" (refer to ordering information), devices may be non-compliant with
MIL- STD-883, Test Method 1015, Paragraph 3.2. Cont act factory for details.
2. When applicable.
3. Consult factory for lead-time of lead free product.
4. Solder dip options contain tin-lead solder finish as applicable to solder dip requirement s.
Accuracy:
2 = 4 minutes + 1 LSB
3 = 2 minutes + 1 LSB
Process Requirements:
0 = No Bur n-In
9 = Solder Dip, without Burn-In (Note 3)
Temperature Grade:
2 = -40 to +85°C
3 = 0 to +70°C
A = -40 to +125°C
Package Type:
2 = PLCC 44-Pin J-Lead (Discontin ued Q3, 2005)
4 = MQFP 44-Pin (Available January 3, 2006)
Note 1: The lead-free option is available with a Matte Tin finish. DDC can provide the reliability
and tin whisker growth data associated with these products ; however, tin whisker growth is
dependent on the application enviornment and customers should collect their o wn reliability data
and perform a risk assesment based on their individual requirements .
Note 2: DDC does not recommend Tape and Reel due to potential lead damage .
Note 3: Solder DIP is not available on the MQFP package.
Description
DDC converters such as the RDC-19220 ser ies require closely matched 2Vrms Sin/Cos input voltages to minimize digital error. DDC
has custom thin film resistor networks that provide the correctly matched 2Vrms converter outputs for 11.8Vrms Resolver/Synchro or
90Vrms synchro applications.
Any imbalance of the resistance ratio between the Sin/Cos inputs will create errors in the digital output. DDC’s custom thin film resis-
tor networks have very low imbalance percentages. The networks are matched to 0.02%, which equates to 1LSB of error f or a 16-bit
application.
THIN FILM RESISTOR INPUT VOLTAGE OUTPUT VOLTAGE
PACKAGE TYPE
NETWORK (VRMS) (VRMS)
Please visit our web site at www.ddc-web.com for the latest information.
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ST
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DATA DEVICE CORPORATION
REGISTERED TO ISO 9001:2000
FILE NO. A5976