Determining The Open Time of Hot Melt Adhesives (Manual Method)
Determining The Open Time of Hot Melt Adhesives (Manual Method)
Determining The Open Time of Hot Melt Adhesives (Manual Method)
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
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D 4497 – 94 (1999)
6.11 Weighted Rectangular Block, having at least one
smooth and flat wood face, 50 by 12.5 mm (2 by 0.5 in.)
weighing 100 g (3.5 oz), the mass being uniformly distributed.
6.12 Micrometer or Thickness Gage, capable of measuring
to the nearest 0.025 mm (1 mil).
7. Sampling
7.1 The test sample should be representative of the adhesive
being tested.
8. Procedure
8.1 Add 300 6 10 g of the adhesive to the 600-mL glass
beaker and cover with a watch glass. Place the beaker
containing the adhesive into the oven and heat until at the
application temperature recommended by the manufacturer.
8.2 Concurrently heat the film applicator in the same oven
to condition it to the sample temperature as in 8.1. FIG. 2 Strips Drawn Back to Allow Hot Melt Application
8.3 Perform testing in a relatively draft-free room. While the
sample is melting, prepare the substrates for testing as shown
in Figs. 1 and 2. 8.6 Fill the applicator reservoir to approximately a 1⁄4 -in.
8.3.1 Tape the long sides of a piece of primary standard level with conditioned hot adhesive.
substrate (see 6.4), minimum sheet size 100 by 280 mm (4 by 8.7 Move the applicator and the contained molten adhesive
11 in.), to a flat smooth surface of low thermal conductivity, with one smooth motion over the length of the paper taking
specifically to a larger piece of chipboard (such as from the approximately 2 s to complete the drawdown.
back of a tablet). Then tape the chipboard to an underlying
surface. NOTE 1—Approximately 2 s is satisfactory. The purpose is to standard-
ize on a reasonable rate and eliminate an excessively fast or slow
8.3.2 Place the strips of the secondary standard substrate
drawdown which will affect the results.
(see 6.5) across the width of the primary substrate, as shown in
NOTE 2—Trial applications should be made to determine the proper
Fig. 1, leaving approximately 6 mm (1⁄4 in.) between the strips. applicator gap to lay down a specified film thickness. Normally, a gap of
The top strip should be approximately 75 mm (3 in.) below the 0.50 mm (20 mil) will lay down a film of 0.25 mm (10 mil). Variations in
top edge of the primary substrate. Using pressure sensitive applied film thickness will occur because of differences in the hot flow
tape, attach one end of the strips to the primary substrate. Fold properties of the adhesive.
the unattached end of each strip back over the attached end so
8.8 Immediately after the film has been drawn down, start
that the primary substrate is exposed for application of the
the timer.
adhesive (see Fig. 2).
8.9 At 5 s on the timer, or a longer time if it is known that
8.4 Remove the sample from the oven, and by stirring with
an adhesive will have an open time longer than about 30 s, lay
the metal thermometer, quickly verify that the temperature is
the top piece of secondary substrate across the cooling film,
within6 3°C (65°F) of the manufacturers recommended
and continue sequentially at 5-s intervals. Use the weighted
application temperature.
block to apply immediately a momentary load of 5-s duration
8.5 Quickly remove the adhesive applicator from the oven,
to press the strips onto the adhesive, moving the block to
and center it above the top strip of the secondary substrate. The
successive strips as they are laid onto the adhesive. See Fig. 3.
0.5 mm (20-mil) gap should face down and be near the top end
The wood face of the block faces the substrate. Repeat this
of the primary substrate.
operation until it is obvious the adhesive film has solidified and
will not bond to the secondary substrate.
8.10 Allow the adhesive film to cool at ambient temperature
for 30 to 60 min before measuring.
8.11 Measure the combined thickness of the adhesive film
and the two substrates. Subtract the thickness of the two
substrates to determine the nominal adhesive thickness to the
nearest 0.025 mm (1 mil).
8.12 With a uniform motion, peel off each strip of secondary
substrate at an angle of 90° to the surface. Take about 10 s to
peel off each strip. If the paper tears near the initial edge, repeat
the peel from the opposite end of the strip. Record the percent
area of fiber tear for each strip and the time in seconds at which
that strip was laid onto the cooling adhesive.
FIG. 1 Secondary Substrate Strips on Primary Substrate Before 8.13 Repeat the entire test procedure in 8.1-8.12 for a total
Hot Melt Application of three determinations.
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D 4497 – 94 (1999)
9.2 Report the ambient temperature and relative humidity.
9.3 Report nominal adhesive thickness, to the nearest 0.025
mm (1 mil), as the mean of the three replicate determinations.
9.4 Report the application temperature used (see 8.4).
APPENDIX
(Nonmandatory Information)
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D 4497 – 94 (1999)
TABLE X1.2 95 % Repeatability and Reproducibility Intervals
95 % Repeatability 95 % Reproducibility
Adhesive Type Intervals Within Intervals Between
Laboratory, s Laboratories, s
Ethylene-Vinyl Acetate 3.3 7.6
Polyester 7.5 12.7
Polyethylene 4.7 8.2
Polypropylene 5.8 23.8
Polyamide 7.5 14.7
where:
Sr = estimated repeatability standard deviation within-laboratories for that
adhesive,
SL = estimated between-laboratory standard deviation for that adhesive,
Vr = estimated standard deviation within-laboratories as a percent of the
mean open time,
VL = estimated between-laboratories standard deviation as a percent of the
mean open time, and
SR = between-laboratory estimate of standard deviation including within-
and between-laboratory variability.
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