Holtek BC2161 V182
Holtek BC2161 V182
Holtek BC2161 V182
Sub-1GHz OOK
Transmitter with Encoder
Abbreviation Notes
• TX: RF Transmitter
• SX: Synthesizer
• PA: Power Amplifier
• OOK: On-Off Keying
• PLL: Phase Lock Loop
• MMD: Multi-Mode Divider
• XTAL: External Crystal
Block Diagram
OOK Ramp
Modulator PA RFOUT
Control
PAVSS
D0/SDA/ICPDA
PAVSS PAVSS
Digital
Control
Logic DVDD DVDD
DVDD
D1/SCL/ICPCK Fuse
& Data GND VSS
LED Memory
GND GND
: Expose Pad
Pin Assignment
D0/SDA/ICPDA 1 16 D1/SCL/ICPCK
LED 2 15 D2
DVDD 3 14 D3
NC 4 VSS/ 13 D4/A0
RFOUT 1 8 DVDD VSS 5 EP 12 D5/A1
PAVSS 2 VSS/ 7 LED RFOUT 6 11 D6/A2
VDDRF 3 EP 6 D0/SDA/ICPDA PAVSS 7 10 D7/A3
XOSCIN 4 5 D1/SCL/ICPCK VDDRF 8 9 XOSCIN
BC2161 BC2161
8 SOP-EP-A 16 NSOP-EP-A
D0/SDA/ICPDA
D1/SCL/ICPCK
LED
D2
16 15 14 13
DVDD 1 12 D3
VSS 2 VSS/ 11 NC
RFOUT 3 EP 10 D4/A0
PAVSS 4 9 D5/A1
5 6 7 8
VDDRF
XOSCIN
D7/A3
D6/A2
BC2161
16 QFN-A
Pin Description
The function of each pin is listed in the following table. Note that where more than one package type exists the
table will reflect the situation for the 16-pin NSOP-EP package type.
Note: These are stress ratings only. Stresses exceeding the range specified under "Absolute Maximum Ratings"
may cause substantial damage to the device. Functional operation of this device at other conditions beyond
those has listed in the specification is not implied and prolonged exposure to extreme conditions may affect
device reliability.
D.C. Characteristics
Ta=25°C, VDD=3.3V, fXTAL=16MHz, OOK modulation with Matching circuit,
PAOUT is powered by VDD=3.3V, unless otherwise noted.
Symbol Parameter Description Min. Typ. Max. Unit
VDD Operating Voltage — 2.2 3.3 3.6 V
TA Operating Temperature — -40 — 85 °C
TFP FUSE Program Temperature — — 25 — °C
VIH High Level Input Voltage — 0.7VDD — VDD V
VIL Low Level Input Voltage — 0 — 0.3VDD V
VOH High Level Output Voltage @IOH=-5mA 0.8VDD — VDD V
VOL Low Level Output Voltage @IOL=5mA 0 — 0.2VDD V
ISleep in the Deep Sleep Mode — 0.4 — μA
Current Consumptions
IL Data low & PA off current — 6.0 — mA
POUT=0dBm — 10.5 —
Current Consumption @ 315MHz Band
POUT=10dBm — 18.5 — mA
(Data=1)
POUT=13dBm — 24.5 —
POUT=0dBm — 11.0 —
Current Consumption @ 433MHz Band
POUT=10dBm — 18.5 — mA
(Data=1)
POUT=13dBm — 25.0 —
IH
POUT=0dBm — 13.5 —
Current Consumption @ 868MHz Band
POUT=10dBm — 20.0 — mA
(Data=1)
POUT=13dBm — 24.5 —
POUT=0dBm — 12.5 —
Current Consumption @ 915MHz Band
POUT=10dBm — 19 — mA
(Data=1)
POUT=13dBm — 24 —
A.C. Characteristics
RF Characteristics
Ta=25°C, VDD=3.3V, fXTAL=16MHz, OOK modulation with Matching circuit,
PAOUT is powered by VDD=3.3V, unless otherwise noted.
Symbol Parameter Condition Min. Typ. Max. Unit
ZRF
315
433
fRF RF Operating Frequency Range — — — MHz
868
915
XTAL
fXTAL RF Operating XTAL Frequency General case — 16 — MHz
ESR XTAL Equivalent Series Resistance — — — 100 Ω
CL XTAL Capacitor Load — — 16 — pF
XTAL Tolerance(1) — — ±20 — ppm
tStartup XTAL Startup Time(2) — — 1 — ms
PLL
fSTEP RF Frequency Synthesizer Step — — 0.5 — kHz
Phase Noise @ 100k offset -78
PLL Phase Noise @ 433MHz — —
Phase Noise @ 1M offset -105 dBc/
PNPLL
Phase Noise @ 100k offset -68 Hz
PLL Phase noise @ 868MHz — —
Phase Noise @ 1M offset -100
Note: 1. This is the total tolerance including (1)Initial tolerance (2)Crystal loading (3)Aging and (4)Temperature
dependence.
2. Depend on crystal property.
I2C Characteristics
Ta=-40°C~85°C, Ta=25°C Typical
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I2C Characteristics
fSCL Serial Clock Frequency — — — 1 MHz
tBUF Bus Free Time between Stop and Start Condition SCL=1MHz 250 — — ns
tLOW SCL Low Time SCL=1MHz 500 — — ns
tHIGH SCL High Time SCL=1MHz 500 — — ns
tsu(DAT) Data Setup Time SCL=1MHz 100 — — ns
tsu(STA) Start Condition Setup Time SCL=1MHz 250 — — ns
tsu(STO) Stop Condition Setup Time SCL=1MHz 250 — — ns
th(DAT) Data Hold Time SCL=1MHz 100 — — ns
th(STA) Start Condition Hold Time SCL=1MHz 250 — — ns
tr(SCL) Rise Time of SCL Signal SCL=1MHz — — 100 ns
tf(SCL) Fall Time of SCL Signal SCL=1MHz — — 100 ns
tr(SDA) Rise Time of SDA Signal SCL=1MHz — — 100 ns
tf(SDA) Fall Time of SDA Signal SCL=1MHz — — 100 ns
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
VPOR VDD Start Voltage to Ensure Power-on Reset — — — — 100 mV
RRPOR VDD Rising Rate to Ensure Power-on Reset — — 0.035 — — V/ms
Minimum Time for VDD Stays at VPOR to Ensure
tPOR — — 1 — — ms
Power-on Reset
VDD
tPOR RRPOR
VPOR
Time
State Control
The device has integrated state machines that control the state transition between the different modes.
Power-on States
Power Off
No
No
No
No Copy FUSE to
CRC check No
EFPGM==0? registers & CRC Encoder==0?
fail?
Calculate
Yes Yes
Yes
After power on, if the ICPCK pin is kept at a High FUSE ICP Mode
level by the internal pull-high function and the
EFPGM bit state is high, the FUSE data will be
Power off
automatically copied to the corresponding registers
and will be also used for CRC calculation. If the
EFPGM bit state is low, the FUSE power will be Power on
turned off and the device will enter the I2C mode.
ICPCK=Low
Key Mode
If users want to enter the Key mode, the Fuse must
Yes
be programmed, the Encoder bit should be set high.
During the Standby mode, if there is no key trigger
Matching pattern
event, the device will enter the Deep Sleep Mode Det. In 32ms
after a 2ms delay. When a key trigger event occurs,
which is a level trigger generated by pressing a Yes
button for more than 1ms, the transmitter will start
to transfer data. The interval between data frames FUSE
can be figured out using the following equation: 2ms programming
× (FRAME_GAP[2:0]). The transmission will end
when the Frame counter stops. The device will then After powering on, the device checks the ICPCK pin
enter the Deep Sleep Mode after a fixed delay time state, which is active low but which will be pulled
of 2ms. In the Deep Sleep Mode, the clock stops and high by the internal pull high function. By adding this
register configurations will all be reset. The device procedure, the device can still enter the programming
can only be woken up by an edge detection, which interface to check the programmed value even if it has
is implemented by pulling the Key pins from high been programmed. For the 8-pin package applications,
to low. After this happens the FUSE memory will be it is recommended that the D0 pin should be used
automatically copied to the relevant registers and the as a Key. As the device clock frequency is 16MHz,
device will enter the Standby mode. the device will enter the ICP Mode for FUSE
programming after a delay time of 32ms. Note that
TX Copy FUSE to the FUSE can only be programmed once.
Transmit registers
No Key Trigger
I2C Mode
Encoder==0
I2C Mode
TX
Deep Sleep Light Sleep Standby
Transmit
The device will enter the I2C Mode if the Encoder bit I2C Serial Programming
is low. Note that in the I2C mode, the device should
be connected with an MCU and operate as an I2C In the I2C Mode, the MCU can configure the internal
slave. During the Light Sleep Mode, the timer will be relevant registers using I2C serial programming. The
on and will start counting. After a delay time of 10ms transmitter only supports the I 2C format for byte
the device will enter the Deep Sleep Mode. If a toggle write, page write, byte read and page read formats.
action occurs on the SDA or SCL pin, the timer will The transmission procedure is shown below.
be reset and will restart counting. The device can be It should be noted that the I2C is a non-standard I2C
woken up from the Deep Sleep Mode if a falling edge interface, which only supports a single device for
is detected on pin SCL or SDA. Here it should be connection.
noted that the high-to-low pulse should be maintained
for at least 1ms. In this situation the FUSE data will • Symbol definition
be copied to the registers again and the device will ♦ S: Start symbol
return to the Light Sleep Mode. In this way the MCU ♦ RS: Repeat Start
can generate a complete I2C format to initiate the ♦ P: Stop symbol
follow-up state machine. To start a data transmission,
the I2C write TX data procedure must be executed ♦ DADDR[6:0]: device address, 21h
first and when finished the TX transmission will be ♦ R/W: read write select, R(0):write, (1): read
initiated after the I2C stop. The frames are transmitted ♦ RADDR[7:0]: register address
continuously, the TX transmission ends when the
frame counter stops after which the device will return
♦ ACK: A(0): ACK, NA(1): NAK
to the Light Sleep Mode. ♦ Bus Direction:
♦ Host to device:
Deep Light
Sleep Wake up Sleep Device to host:
State
Byte Write
S DADDR[6:0] W A RADDR[7:0] A DATA A P
Page Write
S DADDR[6:0] W A RADDR[7:0] A DATA A DATA(n+1) A DATA(n+x) A P
Byte Read
S DADDR[6:0] W A RADDR[7:0] A RS DADDR[6:0] R A DATA NA P
Page Read
S DADDR[6:0] W A RADDR[7:0] A RS DADDR[6:0] R A DATA(n) A DATA(n+1) A DATA(n+x) NA P
SCL
SDA
th(DAT) tsu(DAT)
tBUF
th(STA) tsu(STA)
Stop
SDA
Programming
Pin Name Pin Description
Pilot code is 24λ → LEAD_CODE[2:0]=000b;
Function
Address: [155555h], Address Length is 22-bit →
ICPCK ICPCK ICP clock
ADDR_LEN[2:0]=100b;
ICPDA ICPDA ICP data/address
VDD VDDRF & DVDD Power supply
DATA: 2 Keys (D1/D0) → KEY_SEL[1:0]=00b;
PAVSS & VSS & End code is 4-bit → END_CODE[1:0]=01b;
VSS, EP Ground
Exposed-Pad
Bit format: Low to High → Waveform=0b ;
XTAL IN
XOSCIN IC system clock → 1λ low + 2λ high (Data=Zero) / 2λ low + 1λ high
(Adaptor)
(Data=One)
When programming the device needs to be located
Data
on a Socket with a 16MHz crystal connected between Pilot 22-bit Address D1D0 End-Code
pin XOSCIN and ground. Holtek provides an e-link Press D0
or e-WriterPro tool for communication with the PC.
Between the e-link and the device there are four Press D0&D1
interconnecting lines, namely VDD, VSS, ICPCK and simultaneously
ICPDA pins.
Packet Structure:
Example 3: HT6P427A
Leading
(Strat) Address Data (CRC) (End) Format:
Code
Pilot(32 λ) Address(20-bit) Data(4-bit)
In the above structure, the procedures enclosed in
brackets mean optional and can therefore be disabled. Pilot code is 32λ → LEAD_CODE[2:0]=001b;
The rest are leading code, address and data, which are Address: [99999h]; Address Length is 20-bit →
necessary parts of the packet. These parameters can ADDR_LEN[2:0]=011b;
be configured but can never be disabled.
DATA: 4 Keys (D3/D2/D1/D0) → KEY_SEL[1:0]=01b;
Bit format: High to Low → Waveform=1b;
→ 1λ high + 3λ low (Data=Zero) / 3λ high + 1λ low
(Data=One)
Format: Press D2
Internal External
Pilot(32 λ) Data(4-bit) Press D0&D1
Address(20-bit) Address(4-bit) simultaneously
Bit format: High to Low → Waveform=1b; Address: [55h]; Address Length is 8-bit → ADDR_
LEN[2:0]=000b;
→ 1λ high + 3λ low (Data=Zero) / 3λ high + 1λ low
(Data=One) DATA: 4 Keys (D3/D2/D1/D0) → KEY_SEL[1:0]=01b;
External 4-bit
Address Data
Bit format: Low to High → Waveform=0b;
Pilot Internal 20-bit Address
A3 A2 A1 A0 D3 D2 D1 D0
Press D0
A3A2A1A0 → 0110 → 1λ low + 2λ high (Data=Zero) / 2λ low + 1λ high
Press D2&D3 (Data=One)
simultaneously
A3A2A1A0 → 0110
Data
Pilot 8-bit Address D3D2D1D0
Example 5: HT6P237A
Press D2
Format:
Pilot(24 λ) Address(22-bit) Data(2-bit) End(4-bit) Press 4 Keys
simultaneously
Pilot code is 24λ → LEAD_CODE[2:0]=000b;
Example 8: Custom Format
Address: [3EEEEEh]; Address Length is 22-bit →
ADDR_LEN[2:0]=100b; Format:
Pilot Start Address Data CRC End
DATA: 2 Keys (D1/D0) → KEY_SEL[1:0]=00b; (16 λ) (6 λ) (8-bit) (4-bit) (8-bit) (4 λ)
End code is 4-bit → END_CODE[1:0]=01b;
Pilot code is 16λ → LEAD_CODE[2:0]=100b;
Bit format: Low to High → Waveform=0b;
Start code is 6λ → START_BIT[1:0]=01b;
→ 1λ low + 2λ high (Data=Zero) / 2λ low + 1λ high
(Data=One) Address: [93h]; Address Length is 8-bit → ADDR_
LEN[2:0]=000b;
Data
Pilot 22-bit Address
D1D0End-Code DATA: 4 Keys (D3/D2/D1/D0) → KEY_SEL[1:0]=01b;
Press D1
CRC: 8-bit → CRC[1:0]=10b;
Press D0&D1
simultaneously
End Code is 4λ → END_CODE[1:0]=10b;
Bit format: High to Low → Waveform=1b;
Example 6: HT6P247A
→ 1λ high + 3λ low (Data=Zero) / 3λ high + 1λ low
Format:
(Data=One)
Pilot(24 λ) Address(24-bit) Data(4-bit) End(4-bit)
Press D0
Pilot Start End
Pilot code is 24λ → LEAD_CODE[2:0]=000b; 16λ 6λ
Address: 4 bits Data: 4 bits CRC: 8 bits
4λ
If the Fuse is un-programmed, the BC2161 device will have a default state, determined by register initial values.
Operating Frequency: 433.92MHz TX Output Power: 10dBm
XTAL Capacitor Load: 14.85pF Encoding Format: HT6P427A
Symbol Rate: 4ksps Encoder: I2C Mode
Bit 7~4 D_K[3:0]: Fractional of dividend for MMD, which will be described later.
Bit 3~0 TXPWR[3:0]: RF output power stage selection
The device has several output power values which are 0, 5, 10 and 13dBm.
TXPWR[3:0] RF Output Power (Typ.)
0000 0dBm
0100 5dBm
1000 10dBm
1100 13dBm
Note that the adjusting range: Level 3 > Level 2 > Level 1 > Level 0
Note that the BAND_SEL only selects an approximate frequency range while the exact frequency
value is determined by the D_N and D_K bit fields. For example, the 433.92MHz belongs to 433MHz
frequency band in the BAND_SEL setting.
Bit 7~3 OOK Bit Rate[4:0]: Define the data bit rate (0.5k~6kbps)
OOK Bit Rate Data Rate tDW OOK Bit Rate Data Rate tDW
00000 0.5kbps 2ms 10000 2.1kbps 0.476ms
00001 0.6kbps 1.67ms 10001 2.2kbps 0.454ms
00010 0.7kbps 1.43ms 10010 2.3kbps 0.434ms
00011 0.8kbps 1.25ms 10011 2.4kbps 0.416ms
00100 0.9kbps 1.11ms 10100 2.5 kbps 0.4ms
00101 1.0kbps 1ms 10101 2.6kbps 0.384ms
00110 1.1kbps 0.91ms 10110 2.7kbps 0.37ms
00111 1.2kbps 0.83ms 10111 2.8kbps 0.357ms
01000 1.3kbps 0.77ms 11000 2.9kbps 0.344ms
01001 1.4kbps 0.72ms 11001 3.0kbps 0.333ms
01010 1.5kbps 0.667ms 11010 3.5kbps 0.285ms
01011 1.6kbps 0.625ms 11011 4.0kbps 0.25ms
01100 1.7kbps 0.59ms 11100 4.5kbps 0.222ms
01101 1.8kbps 0.55ms 11101 5.0kbps 0.2ms
01110 1.9kbps 0.53ms 11110 5.5kbps 0.181ms
01111 2.0kbps 0.5ms 11111 6.0kbps 0.166ms
23λ
16λ
Notes:
1. The high or low level of the 4λ END_CODE is the opposite of the previous symbol level.
• Example 1: Clear the Waveform to "0", no matter that whether the data is "1" or "0", the last sym-
bol will be High, here the 4λ must be 4λ Low.
Pilot(24 λ) Address(22-bit) Data(2-bit) End(4 λ)
Press D0
Press D0&D1
simultaneously
• Example 2: Set the Waveform to "1", no matter whether the data is "1" or "0", the last symbol will
be Low, here the 4λ must be 4λ High.
2. 2λ + 2λ: these two 2λ are opposite to each other, while the high or low level of the first 2λ is opposite
to the previous symbol level.
• Example 1: Clear the Waveform to "0", no matter whether the data is "1" or "0", the last symbol
will be High, and here the 2λ + 2λ must be 2λ Low + 2λ High.
Pilot(24 λ) Address(22-bit) Data(2-bit) End(2 λ+2 λ)
Press D0&D1
simultaneously
• Example 2: Set the Waveform to "1", no matter that the data is "1" or "0", the last symbol will be
Low, and here the 2λ + 2λ must be 2λ High + 2λ Low.
Bit 0 Waveform:
Waveform Format
Low to High
1λ 2λ
Bit "0"
tDW
0
(HT6P20B, HT12E, 1λ 2λ
HT6P2x7A)
Bit "1"
Address/Data bit
1λ low + 2λ high (data=Zero)
2λ low + 1λ high (data=One)
High to Low
1λ 3λ
Bit "0"
tDW
1
(HT6P4x7A) 1λ 3λ
Bit "1"
Address/Data bit
1λ high + 3λ low (data=Zero)
3λ high + 1λ low (data=One)
Bit 3~2 CRC_SEL[1:0]: Select the address + data for CRC processing
The unit is Bit (not λ), the address is used as the high order of CRC polynomial and the data is used as
the low order.
CRC_SEL Format Polynomial Initial Value Note
00 Disable — — OOK
4 Bits → Take the low nibble of the CRC8
01 — — OOK
calculated result
10 8 Bits → X8 + X5 + X4 + 1 0x31 0x00 OOK
11 Reserved — — —
In the I2C Mode, the TX transmitting data is determined by the I2C_DATA bit field while the transmitting
data bit format is determined by the KEY_SEL bit field. The Data bit formats is shown as below:
I2C Mode OOK
2 Keys xx
4 Keys xxxx
4 + 4 Keys AAAAxxxx
8 Keys xxxx_xxxx
For 2-key/4-key/8-key configurations the data bit can be 2 bits, 4 bits and 8 bits respectively. As the
above table shows, if the KEY_SEL bit field is set as “10” to select 4 Dipswitches + 4 Keys, then I2C
will transmit 8-bit data (bit 7 ~ bit 0) and the bit 7 ~ bit 4 is regarded as Address.
In the Key Mode, the TX transmitting data is determined by the keys while the transmitting data bit
format is determined by the KEY_SEL bit field. The Data bit formats is shown as below:
Key Mode OOK
2 Keys xx
4 Keys xxxx
4 + 4 Keys AAAAxxxx
8 Keys xxxx_xxxx
As the above table shows, if the KEY_SEL bit field is set as “10” to select 4 Dipswitches + 4 Keys,
the value of “A”is determined by Dipswitches and have no TX transmit trigger function. The data bit
format can be 2 bits, 4 bits and 8 bits when the KEY_SEL bit field is configured to select 2 keys, 4
keys and 8 keys respectively. When the bit field is set to select 4 Dipswitches + 4 Keys, then the low
nibble, bit 3~bit 0, is regarded as data and the 4-bit Dipswitches values is regarded as address.
LSB MSB
Internal Address
LSB MSB
Internal Address External Address (dipswitch) DATA
A0 A1 ~ An An+0 An+1 An+2 An+3 D3 D2 D1 D0
or
D0 D1 D2 D3
• HT6P427A
Pilot-code A0~A19 D0~D3
• HT6P437A
Pilot-code A0~A23 D0~D3
• HT6P237A
Pilot-code A0~A21 D1~D0 "0101"
• HT6P247A
Pilot-code A0~A23 D3~D0 "0101"
• HT6P20B
Pilot-code A0~A21 D1~D0 "0101"
• HT12E2Tx
Pilot-code A0~A7 D0~D3
The CFG17~CFG20 are reserved registers, whose default value must be fixed as 0xB0, 0xB1, 0xB2 and 0xB3
respectively.
Bit format:
1λ low + 2λ high → Data = Zero
2λ low + 1λ high → Data = One
Key State
Tx Packet Frame 1 Frame 2 Frame 3 Frame 4 Frame 1 Frame 2 Frame 3 Frame 4 Enter Stand-by
Key Trigger
Key State
Tx Packet Frame 1 Frame 2 Frame 3 Frame 4 Frame 1 Frame 2 Frame 3 Frame 4 Frame 1 Frame 2 Frame 3 Frame 4 Frame 1
:Key de-bounce
Example 2:
FRAME_CNTR[7:0]= 00b → Frame 1
MAX_FCNT[7:0] = 04b
When stuck key occurs, the power consumption caused by Tx continuous transmission can be avoided
by setting the MAX_FCNT[7:0] bits.
Total Frame Numbers = (FRAME_CNTR[7:0]+1) × MAX_FCNT[7:0]
Key Trigger
Key State
:Key de-bounce
For example:
Data filled in the address range of 00h~1Eh are listed below:
0x4F 0x03 0x99 0x48 0xAB 0xCD 0xEF 0x7B 0x33 0x44 0xAB 0xCD 0xEF 0x93 0xFA 0x00 0x45 0xA9 0xB8
0xC7 0xD6 0xE5 0xF4 0x03 0x12 0x03 0x03 0x08 0xB6 0x00 0x00
The online calculator should be setup with the following configuration:
1. CRC width: select "CRC-16"
2. CRC parametrization: select "Custom"
3. CRC detailed parameters: select "Input reflected"
4. Polynomial: 0x8005
5. Initial Value: 0xFFFF
6. Final Xor Value: 0x0
7. CRC Input Data: select "Bytes" and fill in the data
8. Click on "Calculate CRC!"
9. Result CRC Value: 0x768C
As the following on-line calculator web interface screenshot shows:
Bit 7~0 I2C_DATA[7:0]: Data and address to be transmitted in the I2C mode
As the I2C state machine shows, the TX transmission will only be initiated after the I2C_DATA[7:0] field
has been written and the I2C stop is executed. The relationship between this bit field and the KEY_SEL
field in the CFG16 is described as below:
1. If KEY_SEL selects 2 Keys, the I2C will only transmit the data of bit 0 and bit 1, namely 2-bit data.
2. If KEY_SEL selects 4 Keys, the I2C will only transmit the data of bit 0~bit 3, namely 4-bit data.
3. If KEY_SEL selects 4 Dipswitches + 4 Keys, the I2C will transmit the data of bit 0~bit 7, so the 4-bit
External Address (Bit 4~Bit 7) and 4-bit data (Bit 0~Bit 3).
4. If KEY_SEL selects 8 Keys, the I2C will transmit the data of bit 0~bit 7, namely 8-bit data.
5. It should be noted that in the I2C mode, D0~D7 have no trigger function, the data is all determined
by the I2C_DATA bit field while the bit number is controlled by the KEY_SEL bit field.
Application Circuits
3.3V
0.1µF
Matching Circuit
1 8
RFOUT DVDD
R
2 7
PAVSS LED
3 6
3.3V VDDRF D0/ICPDA
4 5
XOSCIN D1/ICPCK
Crystal
16MHz EP Key Input
Package Information
Note that the package information provided here is for consultation purposes only. As this information may
be updated at regular intervals users are reminded to consult the Holtek website for the latest version of the
Package Information.
Additional supplementary information with regard to packaging is listed below. Click on the relevant section to be
transferred to the relevant website page.
• Package Information (include Outline Dimensions, Product Tape and Reel Specifications)
• Carton information
Dimensions in inch
Symbol
Min. Nom. Max.
A ― 0.236 BSC ―
B ― 0.154 BSC ―
C 0.012 ― 0.020
C' ― 0.193 BSC ―
D ― ― 0.069
D1 0.076 ― 0.090
E ― 0.050 BSC ―
E2 0.076 ― 0.090
F 0.000 ― 0.006
G 0.016 ― 0.050
H 0.004 ― 0.010
α 0° ― 8°
Dimensions in mm
Symbol
Min. Nom. Max.
A ― 6.00 BSC ―
B ― 3.90 BSC ―
C 0.31 ― 0.51
C' ― 4.90 BSC ―
D ― ― 1.75
D1 1.94 ― 2.29
E ― 1.27 BSC ―
E2 1.94 ― 2.29
F 0.00 ― 0.15
G 0.40 ― 1.27
H 0.10 ― 0.25
α 0° ― 8°
Note: For this package type, refer to the package information provided here, which will not be updated by the
Holtek website.
E2
16 9
THERMAL VARIATIONS ONLY
Dimensions in inch
Symbol
Min. Nom. Max.
A — 0.236 BSC —
B — 0.154 BSC —
C 0.012 — 0.020
C’ — 0.390 BSC —
D — — 0.069
E — 0.050 BSC —
D1 0.152 — 0.186
E2 0.066 — 0.101
F 0.000 — 0.006
G 0.016 — 0.050
H 0.004 — 0.010
α 0° — 8°
Dimensions in mm
Symbol
Min. Nom. Max.
A — 6.00 BSC —
B — 3.90 BSC —
C 0.31 — 0.51
C’ — 9.90 BSC —
D — — 1.75
E — 1.27 BSC —
D1 3.86 — 4.72
E2 1.68 — 2.56
F 0.00 — 0.15
G 0.40 — 1.27
H 0.10 — 0.25
α 0° — 8°
D2
13 16
b
12 1
E2
E
e
9 4
8 5
A1
A3 L K
D
A
Dimensions in inch
Symbol
Min. Nom. Max.
A 0.028 0.030 0.031
A1 0.000 0.001 0.002
A3 — 0.008 REF —
b 0.007 0.010 0.012
D — 0.118 BSC —
E — 0.118 BSC —
e — 0.020 BSC —
D2 0.063 — 0.069
E2 0.063 — 0.069
L 0.008 0.010 0.012
K 0.008 — —
Dimensions in mm
Symbol
Min. Nom. Max.
A 0.70 0.75 0.80
A1 0.00 0.02 0.05
A3 — 0.203 REF —
b 0.18 0.25 0.30
D — 3.00 BSC —
E — 3.00 BSC —
e — 0.50 BSC —
D2 1.60 — 1.75
E2 1.60 — 1.75
L 0.20 0.25 0.30
K 0.20 — —