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Abstract— SRAM is designed to provide an interface based Cache memories and System-on-chips are
with CPU and to replace DRAMs in systems that commonly used. Due to device scaling there are several
require very low power consumption. Low power design challenges for nanometer SRAM design. As the
SRAM design is crucial since it takes a large fraction integration density of transistors increases, power
of total power and die area in high performance consumption has become a major concern in today’s
processors. A SRAM cell must meet the requirements processors and SoC designs. Considerable attention has
for the operation in submicron/nano ranges. The been paid to the design of low power and high-
scaling of CMOS technology has significant impacts performance SRAMs as they are critical components in
on SRAM cell – random fluctuation of electrical both handheld devices and high performance processors.
characteristics and substantial leakage current. The Different design remedies can be undertaken; a decrease
random fluctuation of electrical property causes the in supply voltage reduces quadratically the dynamic
SRAM cell to have huge mismatch in transistor power and reduces leakage power linearly to the first
threshold voltage. Consequently, the static noise order. A six transistors (6T) SRAM cell configuration is
margin (Read Margin) and the write margin are proposed in this paper which will be a solution to the
degraded dramatically. The SRAM cell tends to be encountered problems in deep submicron and nano scale.
unstable and the low power supply operation becomes Compared with the 8T and 10T SRAM cells, the 6T
hard to achieve. A 6T SRAM cell at 45 nm feature size SRAM cell offers significant advantages in terms of
in CMOS is proposed to accomplish low power power consumption.
memory operation. Initially, this paper presents design The objective of this paper is to investigate the
of 6T SRAM cell considering low power consumption. transistor sizing of the 6T SRAM cell for optimum power
The paper presents the design of SRAM array and delay. A bitline balancing scheme and transmission
involving the decoders, sense amplifiers, transmission gate scheme are proposed for high performance operation
gates using Cadence tools. of SRAM cell. Cadence simulation results confirm that
the proposed scheme achieves nearly 40% of power
Keywords: SRAM, Cadence, Virtuoso, Noise Margin, savings compared to other designs.
45 nm technology
II. OPTIMAL SIZING FOR 6T SRAM
CELL
I. INTRODUCTION
For nearly 40 years CMOS devices have been A. Sizing of 6T SRAM cell
scaled down in order to achieve higher speed,
performance and lower power consumption. Technology The SRAM cell should be sized as small as
scaling results in a significant increase in leakage current possible to achieve high density in memory design.
of CMOS devices. Static Random Access Memory However, issues related to robustness impose a sizing
(SRAM) continues to be one of the most fundamental and constraint to the conventional SRAM design. Fig. 1 shows
vitally important memory technologies today. the conventional 6T SRAM cell configuration. The
transistor ratio between M3 and M6 must be greater than
Because they are fast, robust, and easily 1.2 to keep a proper noise margin during the read
manufactured in standard logic processes, they are nearly operation. The proposed 6T SRAM cell uses 1v for its
universally found on the same die with microcontrollers operation when compared to 1.8V used by conventional
and microprocessors. Due to their higher speed SRAM
2040 | P a g e
K.Dhanumjaya,Dr.MN.Giri Prasad,Dr.K.Padmaraju,Dr.M.Raja Reddy / International Journal of
Engineering Research and Applications (IJERA) ISSN: 2248-9622
www.ijera.com
Vol. 1, Issue 4, pp.2040-2045
180 nm SRAM cell. In this paper, we propose transistor contents. The SRAM to operate in read mode and write
of size 45nm whose voltage of operation is less than 1V. mode should have "readability" and "write stability"
As the supply voltage used for operation is low, the power respectively. The three different states work as follows:
consumption is scaled down by maximum extent. Standby: If the word line is not asserted, the
access transistors M5 and M6 disconnect the cell
from the bit lines. The two cross coupled
Moreover, significant improvements in delay and inverters formed by M1 – M4 will continue to
power can be achieved by partitioning the cell array into reinforce each other as long as they are
smaller sub arrays, rather than having a single monolithic connected to the supply.
array.
Each bit in SRAM is stored on four transistors Reading: Assume that the content of the
that form two cross coupled inverters. This storage cell memory is a 1, stored at Q. The read operation is
has two stable states which are used to denote 0 and 1. done by using the sense amplifiers that pull the
Two additional transistors serve as the access transistors data and produce the output. The row decoders
to control the storage cell during the read and write and column decoders are used to select the
operations. Generally, fewer transistors needed per cell, appropriate cell or cells from which the data is to
the smaller each cell can be. Since the cost of processing be read and are given to the sense amplifiers
silicon wafer is relatively fixed, using smaller cells through transmission gate.
reduces the cost per bit of memory.
Access to the cell is enabled by the word line Writing: The start of a write cycle begins by
(WL in figure) which controls the two access transistors applying the value to be written to the bit lines.
M5 and M6 which, in turn, control whether the cell If we wish to write a 0, we would apply a 0 to
should be connected to the bit lines: BL and BL bar. They the bit lines, i.e. setting BL bar to 1 and BL to 0.
are used to transfer data for both read and write A 1 is written by inverting the values of the bit
operations. Although it is not strictly necessary to have lines. WL is then asserted and the value that is to
two bit lines, both the signal and its inverse are typically be stored is latched in. Note that the reason this
provided in order to improve noise margins. During read works is that the bit line input-drivers are
accesses, the bit lines are actively driven high and low by designed to be much stronger than the relatively
the inverters in the SRAM cell. weak transistors in the cell itself, so that they can
easily override the previous state of the cross-
coupled inverters.
B. Decoder Design
The decoder design depends on the size of the
SRAM array that we are going to design. For our
simulation, we have used 6to64 decoder. Using this, we
can also design larger array in the form of banks. The
schematic and symbol are as shown below.
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K.Dhanumjaya,Dr.MN.Giri Prasad,Dr.K.Padmaraju,Dr.M.Raja Reddy / International Journal of
Engineering Research and Applications (IJERA) ISSN: 2248-9622
www.ijera.com
Vol. 1, Issue 4, pp.2040-2045
VI. CONCLUSION
REFERENCES
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K.Dhanumjaya,Dr.MN.Giri Prasad,Dr.K.Padmaraju,Dr.M.Raja Reddy / International Journal of
Engineering Research and Applications (IJERA) ISSN: 2248-9622
www.ijera.com
Vol. 1, Issue 4, pp.2040-2045
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