Space Grade CCGA Presentation-1

Space Grade CCGA
Assembly
 A space-grade CCGA (ceramic column grid array) package is a type of
integrated circuit (IC) packaging technology designed to meet the
rigorous demands of the space applications
 High reliability , excellent thermal performance and resistance to

mechanical stress and environmental hazards encountered in space.
Features of CCGA
• CCGA IC packages are made with non-collapsible solder

columns for surface mount soldering on CPB to reduce
stress due to CTE mismatch.
• Solder columns are constructed of high melting point solder
alloys, which prevents collapse during reflow.
• Package have large ceramic substrate of 21mm to 52.5mm
with pitch typically 1.0mm to 1.27mm.
• Ideally the diameter of the solder column is roughly 75% of
the landing pad diameter to allow proper annular solder
fillet.
Constructional overview of CCGA
 Integrated Circuit (IC) Die Actual electronic components and circuits that perform
desired functions. attached to the ceramic substrate using die attach materials such as die
attach epoxy or solder.
 Ceramic Substrate (material like alumina (Al2O3) or aluminum nitride (AlN)- offer
high thermal conductivity and mechanical strength.
 Solder Columns Multiple solder columns arranged in a grid pattern. These columns
provide the electrical connections between the integrated circuit (IC) inside the package and
the external circuitry.
 Wire Bonding The IC die is wire bonded to the ceramic substrate using fine wires made
of gold or aluminum. Wire bonding provides electrical connections between the IC die and
the solder columns on the substrate.
 Encapsulation To protect the IC die and wire bonds from environmental factors and
mechanical stress, the package is encapsulated with a protective material such as epoxy resin
or silicone. The encapsulant also serves as a dielectric layer for electrical isolation.
 Hermetic Sealing Space-grade CCGA packages are hermetically sealed to prevent the
ingress of moisture and contaminants. Hermetic sealing ensures the long-term reliability and
performance of the IC in the space environment.
 Thermal Management Space-grade CCGA packages incorporate thermal management

features to handle the heat generated by the IC. These features may include the use of
thermal vias, metal heat spreaders, or thermal pads to enhance heat dissipation and ensure
proper thermal performance.
CCGA Package Design
Critical Requirement for Assembling Space Grade
CCGA’s in an EMS
 Quality Management System (QMS): ISO 9001 or AS9100

 Cleanroom Facilities: ISO 14644
 Compliance with Space Standards: NASA-STD-8739.1 or ECSS-Q-ST-70
 Good manufacturing Processes(automated system) and Controls.
 Environmental Testing : Conduct comprehensive environmental testing to simulate and validate the performance of the
CCGA assemblies under extreme conditions. Test for factors like temperature variations, mechanical stresses, vibrations,
and vacuum conditions to ensure the assemblies can withstand the demanding space environment.
Critical Requirement for Assembling Space Grade
CCGA’s in an EMS…. continued
• Component Inspection:
• Colpanarity: Less than +/-0.15mm (0.0059-inch)
• Single Column Tilt: An individual column shall not be bent more than 5° relative to other columns
• Multiple Column Tilt: Tilt is acceptable if all columns are tilted uniformly up to maximum 10°
• Visual Inspection: Use 10X magnification
• PWB Board Requirements:

• PWB Board Material: Polyimide recommended due to lower CTE compared with epoxy-class boards.
• PWB Allowed Finish: Tin-lead solder or Electroless-Nickel, Immersion Gold (ENIG). Maximum 0.254µm (10 micro-inch) gold.
• PWB Prohibited Finish: Pure tin or other lead free surface plating is not allowed.
• PWB Pad Diameter: Non-Solder Masked Defined pads (NSMD) minimum 120% of solder column diameter
• PWB Component Courtyard: 0.3-inch (7.62mm) minimum clearance to allow sufficient clearance for rework.
• Assembly Requirements:
• Underfill: Not allowed under the CCGA component.
• Solder Paste Stencil: Laser cut stencils are recommend, instead of chemical-etched stencils.
Summary
CCGA assembly is possible provided with all the listed requirement fulfilled

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Space Grade CCGA

 High reliability , excellent thermal performance and resistance to

• CCGA IC packages are made with non-collapsible solder

 Thermal Management Space-grade CCGA packages incorporate thermal management

 Quality Management System (QMS): ISO 9001 or AS9100

• PWB Board Requirements:

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