Dec 05, 2024/2 min read Collaboration for Innovation: How Synopsys and TSMC are Advancing Chip Design By Sween Kang Tags: Multi-Die System, Chip Design Insights, Design, Manufacturing, Foundation IP, HPC, Data Center, Silicon IP, 3DIC Compiler
Oct 30, 2024/3 min read Flash Forward: MRAM and RRAM Bring Embedded Memory and Applications into the Future By Rahul Thukral, Daryl Seitzer Tags: Memory, Chip Design Insights, Foundation IP, Silicon IP
Jan 23, 2023/5 min read Why eMRAMs are the Future for Advanced-Node SoCs By Rahul Thukral, Bhavana Chaurasia Tags: Chip Design Insights, Internet of Things, Foundation IP, Silicon IP
Jul 11, 2022/5 min read What is a SmartNIC? By Rita Horner Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, Security IP, Foundation IP, HPC, Data Center, Silicon IP, Verification, 3DIC Compiler
Apr 12, 2022/6 min read What is Edge Computing and How is AI Driving its Growth? By Ron Lowman Tags: Cloud, AI & Machine Learning, Chip Design Insights, Internet of Things, Foundation IP, Processor Solutions, Silicon IP