V

DD
SW
IN
IN+
AGND PGND
VOUT+
VOUT
V OUT
CC
V IN
CC
10 F m
22 F m
1 F m
ToBattery
Differential
Input
C
IN
C
IN
V FB
CC
SDb
SDd
ShutDownBoost
ShutDownClassD
GAIN
Gain(V /Float/GND)
CC
2.2to6.2 H m
GPIO
1 F m
R1
50k
R2
500k
TPA2013D1


w w w . t i . c o m

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V
CC
FB
S
W
S
W
V
C
C
O
U
T
V
C
C
I
N
S
D
b
I
N
+
I
N

P
G
N
D
P
G
N
D
SDd
V
DD
P
G
N
D
RGP (QFN)Package
(TopView)
TPA2013D1RGP
2
5
7 10
11
14
17 20
GAIN
AGND VOUT
VOUT
VOUT+
VOUT+
VOUT+
V
CC
FB
SW
V
CC
OUT V
CC
IN
SDb IN+ IN PGND
AGND SDd PGND VOUT
V
DD GAIN VOUT+
PGND
D1 D2 D3 D4
C1 C2 C3 C4
B1 B3 B4 B2
A1 A2 A3 A4
YZH (WCSP)Package
(TopView)
TPA2013D1YZH
18 19 16
13
12
15
3
4
1
8 9 6

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PWM
and
Level
Shifter
H-Bridge
Internal
Oscillator
Biases, Control,
and
References
Regulator
V
max
Control
Gate
Control
Anti-
Ringing
PGND
AGND
BGControl
PGND AGND
V OUT
CC
Vref
AGND
IN+
IN
SDb
V
DD
SW
V OUT
CC
V FB
CC
V IN
CC
VOUT+
VOUT
PGND
SDd
Res.
Array
GAIN

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TPA2013D1
IN+
IN
OUT+
OUT
V
DD
V
DD
GND
C
I
C
I
Measurement
Output
+
+

Load
30kHz
Low-Pass
Filter
Measurement
Input
+

1 F m

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P
O
Output Power W
0
20
40
60
80
100
0.0 0.5 1.0 1.5
E
f
f
i
c
i
e
n
c
y

%
G001
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 4.5 V
V
DD
= 4.2 V
V
DD
= 3.6 V V
DD
= 2.5 V
V
DD
= 1.8 V
P
O
Output Power W
0
20
40
60
80
100
0.0 0.5 1.0 1.5 2.0
E
f
f
i
c
i
e
n
c
y

%
G002
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 5.5 V
V
DD
= 4.2 V
V
DD
= 3.6 V V
DD
= 2.5 V
V
DD
= 1.8 V
P
O
Output Power W
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.0 0.5 1.0 1.5
P
D

P
o
w
e
r

D
i
s
s
i
p
a
t
i
o
n

W
G003
V
DD
= 3.6 V
V
DD
= 1.8 V
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 4.5 V
V
DD
= 2.5 V
V
DD
= 4.2 V
P
O
Output Power W
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.0 0.5 1.0 1.5 2.0
P
D

P
o
w
e
r

D
i
s
s
i
p
a
t
i
o
n

W
G004
V
DD
= 1.8 V
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 5.5 V
V
DD
= 2.5 V
V
DD
= 4.2 V
V
DD
= 3.6 V
P
O
Output Power W
0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.5 1.0 1.5
I
D
D

S
u
p
p
l
y

C
u
r
r
e
n
t

A
G005
V
DD
= 1.8 V
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 4.5 V
V
DD
= 2.5 V
V
DD
= 4.2 V
V
DD
= 3.6 V
P
O
Output Power W
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.0 0.5 1.0 1.5 2.0
I
D
D

S
u
p
p
l
y

C
u
r
r
e
n
t

A
G006
V
DD
= 1.8 V
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 5.5 V
V
DD
= 2.5 V
V
DD
= 4.2 V
V
DD
= 3.6 V
















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V
DD
Supply Voltage V
0.0
0.5
1.0
1.5
2.0
2.5
1.8 2.2 2.6 3.0 3.4 3.8 4.2 4.6
P
O

O
u
t
p
u
t

P
o
w
e
r

W
G007
Gain = 2 V/V
R
L
= 8 + 33 H
THD = 1%
V
CC
= 4.5 V
L = 2.2 H
L = 3.3 H L = 6.2 H
L = 4.7 H
V
DD
Supply Voltage V
0.0
0.5
1.0
1.5
2.0
2.5
1.8 2.2 2.6 3.0 3.4 3.8 4.2 4.6 5.0 5.4
P
O

O
u
t
p
u
t

P
o
w
e
r

W
G008
L = 3.3 H
L = 6.2 H
L = 4.7 H
Gain = 2 V/V
R
L
= 8 + 33 H
THD = 1%
V
CC
= 5.5 V
V
DD
Supply Voltage V
0.0
0.5
1.0
1.5
2.0
2.5
1.8 2.2 2.6 3.0 3.4 3.8 4.2 4.6
P
O

O
u
t
p
u
t

P
o
w
e
r

W
G009
Gain = 2 V/V
R
L
= 8 + 33 H
THD = 10%
V
CC
= 4.5 V
L = 2.2 H
L = 3.3 H L = 6.2 H
L = 4.7 H
V
DD
Supply Voltage V
0.0
0.5
1.0
1.5
2.0
2.5
1.8 2.2 2.6 3.0 3.4 3.8 4.2 4.6 5.0 5.4
P
O

O
u
t
p
u
t

P
o
w
e
r

W
G010
L = 6.2 H
L = 4.7 H
L = 3.3 H
Gain = 2 V/V
R
L
= 8 + 33 H
THD = 10%
V
CC
= 5.5 V
R
L
Load Resistance
0.0
0.5
1.0
1.5
2.0
2.5
3.0
4 8 12 16 20 24 28 32
P
O

O
u
t
p
u
t

P
o
w
e
r

W
G011
f = 1 kHz
Gain = 2 V/V
V
CC
= 4.5 V
THD = 1%
THD = 10%
R
L
Load Resistance
0.0
0.5
1.0
1.5
2.0
2.5
3.0
4 8 12 16 20 24 28 32
P
O

O
u
t
p
u
t

P
o
w
e
r

W
G012
f = 1 kHz
Gain = 2 V/V
V
CC
= 5.5 V
THD = 1%
THD = 10%

















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P
O
Output Power W
0.01 0.1 1 3
100
1
0.1
0.01
G013
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 4.5 V
10
V
DD
= 1.8 V
V
DD
= 2.5 V
V
DD
= 4.2 V
V
DD
= 3.6 V
T
H
D
+
N

%
0.01 0.1 1 3
P
O
Output Power W
1
0.1
0.01
G014
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 5.5 V
10
V
DD
= 1.8 V
V
DD
= 2.5 V
V
DD
= 4.2 V
V
DD
= 3.6 V
T
H
D
+
N

%
100
P
O
Output Power W
0.01 0.1 1 5
1
0.1
0.01
G015
Gain = 2 V/V
R
L
= 4 + 33 H
V
CC
= 5.5 V
10
V
DD
= 1.8 V
V
DD
= 2.5 V
V
DD
= 4.2 V
V
DD
= 3.6 V
T
H
D
+
N

%
100
f Frequency Hz
20 100 1k 20k
0.1
0.01
0.001
G016
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 4.5 V
V
DD
= 1.8 V
1
P
O
= 0.075 W
P
O
= 0.2 W
10k
P
O
= 0.025 W
T
H
D
+
N

%
10
f Frequency Hz
0.1
0.01
0.001
G017
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 4.5 V
V
DD
= 3.6 V
1
P
O
= 0.05 W
P
O
= 1 W
20 100 1k 20k 10k
P
O
= 0.25 W
T
H
D
+
N

%
10
20 100 1k 20k 10k
f Frequency Hz
0.1
0.01
0.001
G018
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 5.5 V
V
DD
= 1.8 V
1
P
O
= 0.075 W
P
O
= 0.025 W
P
O
= 0.2 W
T
H
D
+
N

%
10

















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20 100 1k 20k 10k
f Frequency Hz
0.1
0.01
0.001
G019
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 5.5 V
V
DD
= 3.6 V
1
P
O
= 0.05 W
P
O
= 1 W
P
O
= 0.25 W
T
H
D
+
N

%
10
20 100 1k 20k 10k
f Frequency Hz
0.1
0.01
0.001
G020
Gain = 2 V/V
P
O
= 250 mW
R
L
= 4 + 33 H
V
CC
= 4.5 V
1
V
DD
= 1.8 V
V
DD
= 2.5 V
V
DD
= 4.2 V
V
DD
= 3.6 V
T
H
D
+
N

%
10
20 100 1k 20k 10k
f Frequency Hz
0.1
0.01
0.001
G021
Gain = 2 V/V
P
O
= 250 mW
R
L
= 4 + 33 H
V
CC
= 5.5 V
1
V
DD
= 1.8 V
V
DD
= 2.5 V
V
DD
= 4.2 V
V
DD
= 3.6 V
T
H
D
+
N

%
10
120
100
80
60
40
20
0
f Frequency Hz
P
S
R
R

d
B
G022
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 4.5 V
20 100 1k 20k 10k
V
DD
= 3.6 V
V
DD
= 4.2 V
V
DD
= 2.5 V
V
DD
= 1.8 V
120
100
80
60
40
20
0
f Frequency Hz
P
S
R
R

d
B
G023
Gain = 2 V/V
R
L
= 8 + 33 H
V
CC
= 5.5 V
20 100 1k 20k 10k
V
DD
= 3.6 V
V
DD
= 2.5 V
V
DD
= 1.8 V
V
DD
= 4.2 V
120
100
80
60
40
20
0
f Frequency Hz
C
M
R
R

d
B
G024
Gain = 2 V/V
R
L
= 8
V
CC
= 4.5 V
20 100 1k 20k 10k
V
DD
= 3.6 V
V
DD
= 2.5 V
V
DD
= 1.8 V
V
DD
= 4.2 V

















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90
80
70
60
50
40
30
20
10
0
f Frequency Hz
C
M
R
R

d
B
G025
Gain = 2 V/V
R
L
= 8
V
CC
= 5.5 V
20 100 1k 20k 10k
V
DD
= 3.6 V
V
DD
= 1.8 V
V
DD
= 2.5 V
V
DD
= 4.2 V
50
55
60
65
70
75
80
85
90
95
100
I
O
Output Current A
0.01 0.1 1
V
CC
= 4.5 V
V
DD
= 1.8 V
V
DD
= 2.5 V
V
DD
= 3.6 V
V
DD
= 4.2 V
B
o
o
s
t

E
f
f
i
c
i
e
n
c
y

%
G026
50
55
60
65
70
75
80
85
90
95
100
I
O
Output Current A
0.01 0.1 1
V
CC
= 5.5 V
V
DD
= 1.8 V
V
DD
= 2.5 V
V
DD
= 3.6 V
V
DD
= 4.2 V
B
o
o
s
t

E
f
f
i
c
i
e
n
c
y

%
G027
V
DD
Supply Voltage V
50
60
70
80
90
100
1.8 2.2 2.6 3.0 3.4 3.8 4.2
I
CC
= 250 mA
L = 4.7 H
B
o
o
s
t

E
f
f
i
c
i
e
n
c
y

%
V
CC
= 4.5 V
V
CC
= 5.5 V
G028
V
DD
Supply Voltage (Boost) V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.8 2.2 2.6 3.0 3.4 3.8 4.2
L = 4.7 H
I
O
M

M
a
x
.

C
o
n
t
i
n
u
o
u
s

O
u
t
p
u
t

C
u
r
r
e
n
t

A
V
CC
= 4.5 V
V
CC
= 5.5 V
G029
t Time ms
2
1
0
1
2
3
4
5
6
0 2 4 6 8 10 12 14 16 18 20
V

V
o
l
t
a
g
e

V
V
CC
OUT
SDb, SDd
Start Time 7.5 ms
G030

















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CC
0.5 (R1 + R2)
V =
R1





CC
L CC
DD
V
I = I
V 0.8

DD CC DD
L CC
V (V V )
L =
I f V
boost
-
D

















S U R F A C E M O U N T I N D U C T O R S




T P A 2 0 1 3 D 1 I N D U C T O R E Q U A T I O N S

















































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S U R F A C E M O U N T C A P A C I T O R S



























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( )
CC CC DD
boost CC
I V V
C = 2
V f V
-

D

( )
CC CC DD
boost CC
I V V
C =
V f V
-
D



T P A 2 0 1 3 D 1 C A P A C I T O R E Q U A T I O N S


































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)
I I
1
f =
c
(2 RC p

































































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I
)
I
1
C =
(2 f R
c
p


1nF
Ferrite
ChipBead
OUTP
OUTN
1nF
Ferrite
ChipBead






































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TPA2032D1
V
DD
IN
IN+
GND
V
O+
SHUTDOWN
C
I
C
I
1 F m
V
O
V
DD
SW
IN
IN+
AGND PGND
VOUT+
VOUT
V OUT
CC
V IN
CC
22 F m
47 F m
1 F m
ToBattery
Left
Channel
Input
Right
Channel
Input
C
IN
C
IN
V FB
CC
SDb
SDd
ShutDownBoost
ShutDownClassD
GAIN
4.7 H m
GPIO
1 F m
R1
62.5k
R2
500k
TPA2013D1

GPIO
LXCL-PWF3
NDS355N
1 W
CKG57NX5R1C107M
V
DD
SW
IN
IN+
AGND PGND
VOUT+
VOUT
V OUT
CC
V IN
CC
22 F m
100 F m
1 F m
ToBattery
Differential
Input
C
IN
C
IN
V FB
CC
SDb
SDd
ShutDownBoost
ShutDownClassD
GAIN
Gain
6.2 H m
GPIO
1 F m
R1
50k
R2
500k
TPA2013D1










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Toko
1098AS-4R7M
ToshibaCRS06
SchottkyDiode
V
DD
SW
IN
IN+
AGND PGND
VOUT+
VOUT
V OUT
CC
V IN
CC
22 F m
22 F m
1 F m
ToBattery
Left
Channel
Input
C
IN
C
IN
V FB
CC
SDb
SDd
GAIN
4.7 H m
GND=Bypass
V =BoostMode
DD
1 F m
R1
50k
R2
500k
TPA2013D1
GPIO

JA
1 1
= = = 80.64 C/W
Derating Factor 0.0124
q









































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A J JA Dmax
T Max = T Max P = 150 80.64 (0.317) = 124 C - q -


Copper TraceWidth
Solder PadWidth
SolderMask Opening
Copper Trace Thickness SolderMask Thickness
































www.ti.com




















PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
TPA2013D1RGPR ACTIVE QFN RGP 20 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
TPA2013D1RGPRG4 ACTIVE QFN RGP 20 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
TPA2013D1YZHR ACTIVE DSBGA YZH 16 3000 Green (RoHS &
no Sb/Br)
SNAGCU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-May-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPA2013D1RGPR QFN RGP 20 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TPA2013D1YZHR DSBGA YZH 16 3000 178.0 8.4 2.35 2.35 0.81 4.0 8.0 Q1
TPA2013D1YZHR DSBGA YZH 16 3000 180.0 8.4 2.35 2.35 0.81 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA2013D1RGPR QFN RGP 20 3000 346.0 346.0 29.0
TPA2013D1YZHR DSBGA YZH 16 3000 217.0 193.0 35.0
TPA2013D1YZHR DSBGA YZH 16 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Dec-2011
Pack Materials-Page 2
D: Max =
E: Max =
2.31 mm, Min =
2.31 mm, Min =
2.25 mm
2.25 mm
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