Scribd Logo
Upload

Welcome to Scribd!

  • 378 views

    Automotive Electronics Council-Q200 Stress Test Qualification For Passive Components Syfer AEC-Q200-Rev C Qualification

    Uploaded by

    gubili
    This document provides information about Syfer Technology Limited, an electronics components manufacturer, and their qualification and testing of passive components according to the Automotive Electronics Council Q200 standard. It includes: - An overview of Syfer's product reliability levels and AEC-Q200 stress test qualification process. - Details of the temperature grades and qualification families as defined by AEC-Q200. - A list of the specific tests and requirements for AEC-Q200 qualification. - Information on standard and optional batch tests conducted by Syfer. - The ranges of surface mount and EMI capacitor products that are AEC-Q200 qualified.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd

    Automotive Electronics Council-Q200 Stress Test Qualification For Passive Components Syfer AEC-Q200-Rev C Qualification

    Uploaded by

    gubili
    378 views7 pages
    This document provides information about Syfer Technology Limited, an electronics components manufacturer, and their qualification and testing of passive components according to the Automotive Electronics Council Q200 standard. It includes: - An overview of Syfer's product reliability levels and AEC-Q200 stress test qualification process. - Details of the temperature grades and qualification families as defined by AEC-Q200. - A list of the specific tests and requirements for AEC-Q200 qualification. - Information on standard and optional batch tests conducted by Syfer. - The ranges of surface mount and EMI capacitor products that are AEC-Q200 qualified.

    Original Description:

    Technical Document

    Original Title

    AEC-Q200

    Copyright

    © © All Rights Reserved

    Available Formats

    PDF, TXT or read online from Scribd

    Did you find this document useful?

    Is this content inappropriate?

    This document provides information about Syfer Technology Limited, an electronics components manufacturer, and their qualification and testing of passive components according to the Automotive Electronics Council Q200 standard. It includes: - An overview of Syfer's product reliability levels and AEC-Q200 stress test qualification process. - Details of the temperature grades and qualification families as defined by AEC-Q200. - A list of the specific tests and requirements for AEC-Q200 qualification. - Information on standard and optional batch tests conducted by Syfer. - The ranges of surface mount and EMI capacitor products that are AEC-Q200 qualified.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    378 views7 pages

    Automotive Electronics Council-Q200 Stress Test Qualification For Passive Components Syfer AEC-Q200-Rev C Qualification

    Uploaded by

    gubili
    This document provides information about Syfer Technology Limited, an electronics components manufacturer, and their qualification and testing of passive components according to the Automotive Electronics Council Q200 standard. It includes: - An overview of Syfer's product reliability levels and AEC-Q200 stress test qualification process. - Details of the temperature grades and qualification families as defined by AEC-Q200. - A list of the specific tests and requirements for AEC-Q200 qualification. - Information on standard and optional batch tests conducted by Syfer. - The ranges of surface mount and EMI capacitor products that are AEC-Q200 qualified.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    You are on page 1of 7
    At a glance
    Powered by AI
    The document discusses AEC-Q200 which is a standard for qualifying passive components for use in automotive applications. It defines various reliability tests and temperature grades that components must pass to be considered qualified.

    AEC-Q200 is a standard established by the Automotive Electronics Council (AEC) to define minimum stress test requirements for passive components to qualify them for use in automotive applications without additional testing. Its goal is to ensure components can withstand the harsh automotive environment.

    AEC-Q200 defines 4 temperature range grades from -50°C to +150°C for the broadest range up to 0°C to +70°C for non-automotive applications. Each grade corresponds to a typical application temperature range.

    Syfer Technology Limited, Old Stoke Road,

    Arminghall, Norwich, Norfolk, NR14 8SQ,


    United Kingdom
    Tel: +44 (0) 1603 723300.
    Tel. (Sales): 01603 723310
    Fax: +44 (0) 1603 723301
    Email: [email protected]
    Web: www.syfer.com

    Automotive Electronics Council-Q200


    Stress Test Qualification for Passive Components
    Syfer AEC-Q200-Rev C Qualification
    Contents
    1. Introduction
    2. Syfer Product Reliability Guide
    3. AEC-Q200 Stress-Test Qualification
    3.1

    AEC-Q200 Temperature Range Grades

    3.2

    Qualification Families

    4. AEC-Q200 Stress Test Qualification Requirements


    5. Batch Tests (Standard & Optional Tests Available)
    6. AEC-Q200 Qualified Component Ranges
    7. Ordering Information

    AN0009 Issue 9

    CN# P105244

    1.

    Introduction

    The Automotive Electronics Council (AEC) Component Technical Committee is the standardization
    body for establishing standards for reliable, high quality electronic components. Components meeting
    these specifications are suitable for use in the harsh automotive environment without additional
    component-level qualification testing.
    The Component Technical Committee established AEC-Q200 Stress Test Qualification for Passive
    Components to define the minimum stress test driven qualification requirements for passive electrical
    devices including ceramic capacitors.
    This application note provides information on tests performed by Syfer in accordance with the AECQ200 specification.
    For further information regarding the Automotive Electronics Council and AEC-Q200, refer to
    website www.aecouncil.com.
    Note: Supply of AEC-Q200 qualified components is not limited to the automotive industry. Other
    industries are also recognising the benefits of AEC-Q200 qualified components.

    2.

    Syfer Product Reliability Guide

    Space
    Grade

    High Reliability
    (Space Quality)

    ESCC 3009(1)
    IECQ-CECC(2)
    AEC-Q200(3)
    MIL Grade(4)

    Standard Components

    Standard Reliability

    Notes:
    (1) Space Grade tested in accordance with ESCC 3009. Refer to Syfer specification S02A 0100.
    (2) IECQ-CECC. The International Electrotechnical Commission (IEC) Quality Assessment System for
    Electronic Components. This is an internationally recognised product quality certification. View Syfers
    IECQ-CECC approvals at http://www.iecq.org/certificates or at www.syfer.com
    (3) AEC-Q200. Automotive Electronics Council Stress Test Qualification For Passive Components.
    (4) MIL Grade. Released in accordance with US MIL standards available on request.

    AN0009 Issue 9

    Page 2 of 7

    3. AEC-Q200 Stress-Test Qualification

    Qualification is defined as successful completion of the test requirements defined in AEC-Q200.


    Approval is defined as user approval for use of the component within the customers application and,
    as such, is beyond the scope of AEC-Q200.
    3.1

    AEC-Q200 Temperature Range Grades

    Temperature range grades defined in AEC-Q200:


    Grade

    Temperature Range

    PASSIVE COMPONENT TYPE

    MINIMUM

    MAXIMUM

    Maximum capability

    -50C

    +150 C

    -40C

    +125 C

    -40C

    +105 C

    Flat chip ceramic resistors, X8R


    ceramic capacitors
    Capacitor Networks, Resistors,
    Inductors, Transformers,
    Thermistors, Resonators, Crystals
    and Varistors, all other ceramic
    and tantalum capacitors
    Aluminium Electrolytic capacitors

    -40C

    +85 C

    0C

    +70 C

    Film capacitors, Ferrites, R/R-C


    Networks and Trimmer capacitors

    TYPICAL/ EXAMPLE
    APPLICATION

    All automotive
    Most underhood

    Passenger compartment
    hot spots
    Most passenger
    compartment
    Non-automotive

    Syfer AEC-Q200 qualified components are rated from -55 C to +125 C. Corresponding AEC-Q200
    qualified grades are 1, 2, 3 and 4.
    3.2

    Qualification Families

    Syfer AEC-Q200 qualification has been conducted in accordance with AEC-Q200 qualification family
    guidelines. AEC-Q200 defines a qualification family as a group of components that share the same
    major process and material elements. All components categorized in the same family are qualified by
    association when one family member successfully completes qualification.
    Qualification test summary is available on request.

    AN0009 Issue 9

    Page 3 of 7

    4.

    AEC-Q200 Stress Test Qualification Requirements

    Stress
    Pre- and Post Stress
    Electrical Test
    Test Not Used
    High Temperature
    Exposure (Storage)
    Temperature
    Cycling
    Destructive
    Physical Analysis
    Moisture
    Resistance

    Test
    #

    Test Method

    User Spec.

    MIL-STD-202
    Method 108
    JESD22 Method
    JA-104

    3
    4
    5
    6

    Biased Humidity

    Operational Life

    External Visual

    Physical
    Dimension

    10

    Terminal Strength
    (Leaded)

    11

    EIA-469
    MIL-STD-202
    Method 106
    MIL-STD-202
    Method 103
    MIL-STD-202
    Method 108
    MIL-STD-883
    Method 2009
    JESD22 Method
    JB-100
    Not applicable for
    surface mount
    capacitors

    Resistance to
    Solvents

    12

    MIL-STD-202
    Method 215

    Mechanical Shock

    13

    MIL-STD-202
    Method 213

    Vibration

    14

    MIL-STD-202
    Method 204

    Resistance to
    Soldering Heat

    15

    Thermal Shock

    16

    ESD

    17

    Solderability

    18

    Sample size
    per lot
    All
    qualification
    parts submitted
    for testing
    -

    Accept on
    number failed

    Additional Requirements

    0
    -

    Unpowered
    1000 hours @ 150C

    77

    77

    1000 cycles (-55C to 125C)

    10

    10ea x 3 lots

    77

    77

    77

    Rated Voltage @ 125C

    All
    qualification
    parts submitted
    for testing

    Inspect device construction


    and workmanship. Electrical
    test not required.

    30

    Verify physical dimensions to


    the device specification

    30

    MIL-STD-202
    Method 210

    30

    MIL-STD-202
    Method 107

    30

    AEC-Q200-002
    J-STD-002
    (JESD22-B102(2))

    15
    15 each
    condition

    t = 24 hours/cycle.
    Unpowered.
    1000 hrs 85C/ 85%RH.
    1.5Vdc and Rated Voltage(1)

    Note: Add Aqueous wash


    chemical OKEM or
    equivalent. No banned
    substances.
    Figure 1 of Method 213
    SMD: Condition F.
    5 gs for 20 min., 12 cycles
    each of 3 orientations. Test
    from 10-2000Hz.
    Condition B No pre-heat of
    samples.
    -55C/+125C. 300 cycles.
    Max transfer time: 20s. Dwell
    time: 15minutes. Air-Air.

    Notes:
    1 Biased Humidity test conducted by Syfer with rated voltage or 200Vdc (whichever is the least) applied.
    2 JESD22-B102 150C dry bake preconditioning applied.

    AN0009 Issue 9

    Page 4 of 7

    Test
    #

    Stress
    Electrical
    Characterization
    Test not used

    Test Method

    Sample size
    per lot

    Accept on
    Number failed

    30

    20

    User
    specification
    -

    Board flex

    21

    AEC-Q200-005

    30

    Terminal strength
    Beam Load Test

    22
    23

    AEC-Q200-006
    AEC-Q200-003

    30
    30

    0
    0

    19

    Additional Requirements
    Parametrically test per lot at
    room temp & min, max temps
    2mm (min) for all except
    3mm for Class 1.
    Force of 1.8kg for 60s.

    Table 1 Stress Test Qualification Requirements

    5. Batch Tests (Standard & Optional Tests Available)

    Test

    Standard tests

    Test

    Optional tests

    Solderability

    100% Burn-In. (2xRV @125 for


    168hours).

    Resistance to soldering heat

    Load sample test @ 125C

    Humidity sample test.


    85 C/85%RH

    Hot IR sample test

    Axial Pull sample test (MILSTD-123)

    Insulation Resistance

    Breakdown Voltage sample test

    Capacitance Test

    Deflection (Bend) sample test

    Dissipation Factor Test

    SAM (Scanning Acoustic


    Microscopy)

    100% Visual Inspection

    Plating thickness verification


    (if plated)
    DPA (Destructive Physical
    Analysis)
    Voltage Proof Test (DWV &
    Flash)

    For further details, optional test quotations please contact Syfer Sales department.

    AN0009 Issue 9

    Page 5 of 7

    6. AEC-Q200 Qualified Component Ranges


    Surface Mount Capacitors
    Max
    Cap
    0603

    50V

    n/a

    n/a

    n/a

    n/a

    n/a

    n/a

    n/a

    8.2nF

    n/a

    n/a

    6.8nF 2.2nF 1.5nF

    1nF

    470pF

    33nF

    10nF

    4.7nF

    1210

    4.7nF 3.9nF

    1.8nF

    1nF

    680nF 680nF 470nF 220nF 100nF

    27nF

    15nF

    5.6nF

    3.3nF

    470nF 270nF 150nF

    56nF

    150nF 150nF

    C0G/
    NP0

    10nF

    5.6nF

    10nF

    C0G/
    NP0

    18nF

    C0G/
    NP0
    X7R

    10nF

    47nF

    27nF

    330nF 330nF 150nF 100nF

    X7R
    1812

    33nF

    C0G/
    2.7nF 2.7nF 1.8nF 680pF 330pF
    NP0

    X7R

    39nF

    18nF

    39nF

    1.5F 1.5F

    12nF

    27nF
    1F

    12nF

    10nF

    Balanced Line EMI Chip Ranges (E03)

    0805

    630V 1.0KV

    n/a

    33nF

    X7R
    1206

    100V 200V 500V

    C0G/
    470pF 470pF 330pF 100pF
    NP0
    X7R

    0805

    63V

    Max
    Cap

    50V

    100V

    C0G/
    NP0

    470pF

    330pF

    X7R

    33nF

    15nF

    1.5nF

    1nF

    150nF

    47nF

    5.6nF

    3.9nF

    330nF

    150nF

    10nF

    6.8nF

    560nF

    330nF

    C0G/
    1206 NP0
    X7R
    C0G/
    1410 NP0
    X7R
    C0G/
    1812 NP0
    X7R

    AN0009 Issue 9

    3 Terminal EMI Chips (E01)

    0805

    1206

    1806

    Max
    Cap

    50V

    100V

    C0G/
    NP0

    820pF

    560pF

    X7R

    47nF

    15nF

    C0G/
    NP0

    1.0nF

    1.0nF

    X7R

    100nF

    15nF

    C0G/
    NP0

    2.2nF

    2.2nF

    X7R

    200nF

    68nF

    Page 6 of 7

    7. Ordering Information
    Part Number Construction:
    Example: ..

    1210

    Y 100 0103

    T___

    Type No/Size ref


    Termination
    Y:
    termination base
    with Ni Barrier (100% matte tin
    plating). RoHS compliant.
    J: Silver base with Nickel Barrier
    (100% Matte Tin Plating). RoHS
    compliant. (J termination not
    available with X7R products.)

    Suffix code. Used for specific


    customer requirements.
    Packaging
    T: 178mm (7) reel
    R: 330mm (13) reel
    B: Bulk pack - tubs

    Voltage Rating d.c.

    Dielectric/ Release codes(1)


    A: C0G (1B)
    E: X7R (2R1)

    Capacitance Value

    Capacitance Tolerance code

    For questions or quotation please contact Syfer Sales department.

    AN0009 Issue 9

    Page 7 of 7

    You might also like