Datasheet

Ground Isolation Amplifier

BA3123F
General Description Key Specifications
BA3123F is a ground isolation amplifier developed for  Power Supply Voltage Range: 4V to 18V
car audio applications. This IC efficiently eliminates  Quiescent Current: 9.0mA (Typ)
problems caused by wiring resistance and removes  High Common-mode Rejection Ratio(1kHz):
noise generated by other electrical devices used in 57dB(Typ)
automobiles. The external capacitor values required for  Low Noise: VNO = 3.5µVrms(Typ)
this IC are so small that it allows for compact and  Low Distortion: THD = 0.002%(Typ)
reliable set design.  Operation Temperature Range: -40°C to +85°C

Features Package W(Typ) x D(Typ) x H(Max)

■ Large Capacitors not Required
■ High Common-Mode Rejection Ratio
■ Low Noise
■ Low Distortion
■ Two Channels

Applications
Car audio systems

SOP8
5.00mm x 6.20mm x 1.71mm

Typical Application Circuit

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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Block Diagram and Pin Configuration

TOP VIEW

VM1

VM2

Absolute Maximum Ratings (Ta=25°C)

Parameter Symbol Limit Unit
Power Supply Voltage VCC 18 V
(Note 1)
Power Dissipation Pd 0.45 W
Operation Temperature Topr -40 to +85 °C
Storage Temperature Tstg -55 to +125 °C
(Note 1) Reduced by 4.5mW in Ta of 1°C over 25°C .
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.

Recommended Operating Conditions (Ta=25°C)

Parameter Symbol Min Typ Max Unit
Power Supply Voltage VCC 4 12 18 V

Electrical Characteristics
(Unless otherwise noted, Ta = 25C, VCC = 12V, f = 1kHz, Rg = 1.8kΩ)
Parameter Symbol Min Typ Max Unit Conditions
Quiescent Current IQ 5.6 9.0 14.0 mA VIN＝0Vrms
Output Noise Voltage VNO － 3.5 8.0 μVrms BPF＝20Hz-20kHz
Voltage Gain GV -1.5 -0.04 +1.5 dB VOUT＝-10dBm, Rg＝0Ω
Maximum Output Voltage VOM 1.8 2.0 － Vrms THD＝0.1％, VCC＝8V
Total Harmonic Distortion THD － 0.002 0.02 ％ VOUT＝0.7Vrms
Common-mode Rejection Ratio CMRR 41 57 － dB
Common-made Voltage VCM 2.5 3.75 － Vrms VCC＝8V,CMRR＝40dB
fRR＝100Hz,VRR＝-10dBm,
Ripple Rejection Ratio RR 72 80 － dB
Rg＝0Ω
VIN＝-10dBm,
Channel Separation CS － 82 － dB
Rg＝1.8kΩ/OPEN
Slew Rate SR － 2.0 － V/μS
Input Resistance RIN 44 55 66 kΩ

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Typical Performance Curves

VIN = 0Vrms THD=0.1%

Maximum Output Voltage : VOM (Vrms)

RL = 10kΩ
f=1kHz
Quiescent Current : IQ (mA)

Power Supply Voltage : VCC (V) Power Supply Voltage : VCC (V)

Figure 1. Quiescent Current vs Figure 2. Maximum Output Voltage vs

Power Supply Voltage Power Supply Voltage
Output Noise Voltage : VNO (µVrms)

Voltage Gain : GV (dB)

Power Supply Voltage : VCC (V) Power Supply Voltage : VCC (V)

Figure 3. Output Noise Voltage vs Power Supply Figure 4. Voltage Gain vs Power Supply Voltage
Voltage

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Typical Performance Curves – continued

VCC=12V
VIN = -10dBm

Channel Separation : CS (dB)

Voltage Gain : GV (dB)

VCC=12V
VIN = -10dBm
Rg=1.8kΩ/Open
RL=10kΩ

10 20 50 100 200 500 1k 2k 5k 10k 20k 10 20 50 100 200 500 1k 2k 5k 10k 20k
Frequency : f (Hz) Frequency : f (Hz)

Figure 5. Voltage Gain vs Frequency Figure 6. Channel Separation vs Frequency

VCC = 12V
f=1kHz
Total Harmonic Distortion : THD (%)

RL=10kΩ
Ripple Rejection Ratio : RR (dB)

VCC = 12V
VRR=-10dBm
Rg=0Ω
RL=10kΩ

10 20 50 100 200 500 1k 2k 5k 10k 20k

Frequency : f (Hz) Output Voltage : VOUT (Vrms)

Figure 7. Ripple Rejection Ratio vs Frequency Figure 8. Total Harmonic Distortion vs Output
Voltage

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Typical Performance Curves – continued

VCC = 12V VCC=12V

Common Mode Rejection Ratio : CMRR (dB)

VOUT=0.7Vrms VN =-20dBm
RL=10kΩ Rg=1.8kΩ
Total Harmonic Distortion : THD (%)

(VM1, VM2)=(100µF, 47µF)

(VM1, VM2)=(47µF, 22µF)
(VM1, VM2)=(22µF, 10µF)

10 20 50 100 200 500 1k 2k 5k 10k 20k 10 20 50 100 200 500 1k 2k 5k 10k 20k
Frequency : f (Hz) Frequency : f (Hz)

Figure 9. Total Harmonic Distortion vs Frequency Figure 10. Common Mode Rejection Ratio vs Frequency

VCC = 8V
Common Mode Rejection Ratio : CMRR (dB)

f=1kHz
Rg=1.8kΩ

Input Noise Voltage : VCM (Vrms)

Figure 11. Common Mode Rejection Ratio vs Input Noise

Voltage

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Measurement Circuits

BA3123F

Figure 12

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Application Information

1. Circuit Operation

Figure 13. Flow of Noise in Car Audio Systems

Car audio systems are grounded to the car body. For

this reason, electrical noise generated by the car
electrical system can enter the power amplifier input
through the chassis and become audible.
BA3123Futilizes the common-mode rejection
characteristics of an operational amplifier to eliminate
this noise. Without BA3123F noise enters the power
amplifier inputs directly. With BA3123F, the CMRR of
operational amplifiers 1-A and 2-A eliminates the noise.

Principle of noise elimination:

To obtain the output voltage (eO)

Figure 14. The Principle of Noise Rejection
R4
Vi  e ①
R3  R4  2
R2 R  R2 ②
eO   e1  1  Vi
R1 R1
With BA3123F, the elimination level of
the noise is expressed as:
CMRR = 20log (eO/eI)(eI = e1 = e2)
Therefore, CMRR ≥ 41dB can be guaranteed.
From ① and ②
R R  R2 R4
eO  - 2 e1  1   e2
R1 R1 ( R3  R4 )

 e1 - e2   1 4 2 3  e2
R2 RR -R R
 -
R1 R1 ( R3  R4 )

Ideally, if R1R4 = R2R3, and e1 = e2, the noise voltage will

be zero. However, due to resistor mismatch, difference in the noise voltages (e1 and e2),
and tolerances in the operational amplifier, a noise voltage is generated.

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.

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Operational Notes – continued

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor Transistor (NPN)
Pin A Pin B B Pin B
C
Pin A E

P B C
P+ P+ P+ N P P+
N N N N Parasitic N N N
E
Elements
Parasitic
P Substrate P Substrate
Elements
GND GND GND GND
Parasitic Parasitic N Region
Elements Elements close-by
Figure 15. Example of monolithic IC structure

13. The capacitors of Pin2 (VM1), and Pin 6 (VM2) should maintain the ratio of 2:1 for ripple rejection characteristics.
Maintaining this ratio will prevent the significant decrease on ripple rejection even if the capacitance is reduced to half.

14. Setting the capacitor value to twice or half will make CMRR +6dB or -6dB respectively (Figure 10) in the low frequency
range.

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Ordering Information

B A 3 1 2 3 F - E2
Part Number Package Packaging and forming specification
F: SOP8 E2: Embossed tape and reel

Marking Diagram

SOP8 (TOP VIEW)

Part Number Marking

3 1 2 3
LOT Number

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name SOP8

(Max 5.35 (include.BURR))

(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1

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Revision History

Date Revision Changes

13.Nov.2015 001 New Release

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 Datasheet

Notice
Precaution on using ROHM Products
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OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
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Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
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(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
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CLASSⅣ CLASSⅢ

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5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
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Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification

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Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
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characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
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responsible for it and you must exercise your own independent verification and judgment in the use of such information
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Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

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1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
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3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

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General Precaution
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