EC-8001 Unit 1 PDF
EC-8001 Unit 1 PDF
EC-8001 Unit 1 PDF
UNIT-1
RUPESH KUMAR DUTTA
Assistant Professor, ECE Department
Unit-1
Introduction,
Size and complexity of Integrated Circuits,
The Microelectronics Field,
IC Production Process,
Processing Steps,
Packaging and Testing,
MOS Processes,
NMOS Process,
CMOS Process,
Bipolar Technology,
Hybrid Technology,
Design Rules and Process Parameters.
2 Assistant Professor Mr. Rupesh Kumar Dutta
VLSI: Enabling Technology
Automotive electronic systems
–A typical Chevrolet has 80 ICs (stereo systems, display
panels, fuel injection systems, smart suspensions,
antilock brakes, airbags)
SignalProcessing (DSP chips, data acquisition
systems)
Transaction processing (bank ATMs)
PCs, workstations
Medical electronics (artificial eye, implants)
Multimedia
Test
structure Wafer
p substrate
SiO2
p substrate
Spin on photoresist
Photoresist is a light-sensitive organic polymer
Softens where exposed to light
Photoresist
SiO2
p substrate
Photoresist
SiO2
p substrate
Photoresist
SiO2
p substrate
SiO2
p substrate
SiO2
n well
n well
p substrate
Polysilicon
Thin gate oxide
n well
p substrate
Polysilicon
Polysilicon
Thin gate oxide
n well
p substrate
n well
p substrate
n+ Diffusion
n well
p substrate
n+ n+ n+
n well
p substrate
n+ n+ n+
n well
p substrate
p+ Diffusion
p+ n+ n+ p+ p+ n+
n well
p substrate
Contact
n well
p substrate
Metal
Metal
Thick field oxide
p+ n+ n+ p+ p+ n+
n well
p substrate
VDD VDD
A A B C
metal1
c poly
ndiff
pdiff
Y
Y contact
GND GND
INV NAND3
The Babbage
Difference Engine
(1832)
25,000 parts
cost: £17,470
MODULE
+
GATE
CIRCUIT
DEVICE
G
S D
n+ n+