Freescale Semiconductor Document Number: MPxx5004

Data Sheet: Technical Data Rev. 12.1, 05/2015

MPxx5004, 0 to 3.92 kPa, Differential MPXV5004

and Gauge, Integrated Pressure MPVZ5004
Sensor
Freescale’s MPxx5004 series piezoresistive transducer is a state-of-the-art Top view
monolithic silicon pressure sensor designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This sensor combines a highly sensitive implanted strain gauge with advanced DNC 5 4 VOUT

micromachining techniques, thin-film metallization, and bipolar processing to DNC 6 3 GND

provide an accurate, high level analog output signal that is proportional to the DNC 7 2 VS
applied pressure.
DNC 8 1 DNC
Features
• 1.5% maximum error for 0 to 100 mm H2O over +10 °C to +60 °C with
Pin 1 identification,
autozero notch on first pin or chamfered corner.
• 2.5% maximum error for 100 to 400 mm H2O over +10 °C to +60 °C with
autozero Pinout
• 6.25% maximum error for 0 to 400 mm H2O over 10 °C to +60 °C without
autozero
• Temperature compensated over 10 °C to 60 °C
• Available in gauge surface mount (SMT) or through-hole (DIP) configurations
• Durable thermoplastic (PPS) package
Applications
• Washing machine water level
• Ideally suited for microprocessor or microcontroller-based systems
• Appliance liquid level and pressure measurement
• Respiratory equipment

Small outline packages, through-hole

MPVZ5004G7U MPXV5004GC7U MPVZ5004GW7U

Case 98ASB17758C Case 98ASB17759C Case 98ASA10611D

Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© 2006-2009, 2015 Freescale Semiconductor, Inc. All rights reserved.
 Small outline packages, surface mount

MPVZ5004G6U/6T1 MPXV5004GC6T1/6U, MPVZ5004GC6U MPXV5004DP

Case 98ASB17756C Case 98ASB17757C Case 98ASA99255D

MPXV5004GVP MPVZ5004GW6U MPXV5004GP/GPT1

Case 98ASA99302D Case 98ASA10686D Case 98ASA99303D

Ordering Information
# of Ports Pressure type Device
Part number Shipping Package
None Single Dual Gauge Differential Absolute marking

Small outline package (MPXV5004 series)

MPXV5004DP Tray 98ASA99255D • • MPXV5004DP

MPXV5004GC6T1 Reel 98ASB17757C • • MPXV5004G

MPXV5004GC6U Rail 98ASB17757C • • MPXV5004G

MPXV5004GC7U Rail 98ASB17759C • • MPXV5004G

MPXV5004GP Tray 98ASA99303D • • MPXV5004GP

MPXV5004GPT1 Reel 98ASA99303D • • MPXV5004GP

MPXV5004GVP Tray 98ASA99302D • • MPXV5004GVP

Small outline package (Media resistant gel) (MPVZ5004 series)

MPVZ5004G6T1 Reel 98ASB17756C • • MPVZ5004G

MPVZ5004G6U Rail 98ASB17756C • • MPVZ5004G

MPVZ5004G7U Rail 98ASB17758C • • MPVZ5004G

MPVZ5004GC6U Rail 98ASB17757C • • MPVZ5004G

MPVZ5004GW6U Rail 98ASA10686D • • MZ5004GW
MPVZ5004GW7U Rail 98ASA10611D • • MZ5004GW

MPxx5004

Sensors
2 Freescale Semiconductor, Inc.
Contents
1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Pressure (P1)/Vacuum (P2) side identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Related Documentation
The MPXV5004G device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1. Go to the Freescale homepage at:
http://www.freescale.com/
2. In the Keyword search box at the top of the page, enter the device number MPXV5004G.
3. In the Refine Your Result pane on the left, click on the Documentation link.
MPxx5004

Sensors
Freescale Semiconductor, Inc. 3
1 General Description
1.1 Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

VS

Thin Film Gain Stage #2

Temperature and
Sensing Compensation Ground VOUT
Element
and Calibration Reference
Circuitry Shift Circuitry

Pins 1, 5, 6, 7, and 8 are internal device connections.

Do not connect to external circuitry or ground.
GND

Figure 1. Integrated pressure sensor schematic

1.2 Pinout

DNC 5 4 VOUT

DNC 6 3 GND

DNC 7 2 VS

DNC 8 1 DNC

Pin 1 identification,
notch on first pin or chamfered corner.

Figure 2. Device pinout (top view)

Table 1. Pin functions

Pin Name Function

1 DNC Do not connect to external circuitry or ground. Pin 1 is notated by the notch in the lead or chamfered corner.
2 VS Voltage supply
3 GND Ground
4 VOUT Output voltage
5 DNC Do not connect to external circuitry or ground.
6 DNC Do not connect to external circuitry or ground.
7 DNC Do not connect to external circuitry or ground.
8 DNC Do not connect to external circuitry or ground.

MPxx5004

Sensors
4 Freescale Semiconductor, Inc.
2 Mechanical and Electrical Specifications
2.1 Maximum ratings
Table 2. Maximum ratings(1)
Rating Symbol Value Unit

Maximum pressure (P1 > P2) PMAX 16 kPa

Storage temperature TSTG –30 to +100 °C

Operating temperature TA 0 to +85 °C

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

2.2 Operating characteristics

Table 3. Operating characteristics (VS = 5.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Units

3.92 kPa
Pressure range POP 0 —
400 mm H2O

Supply voltage(1) VS 4.75 5.0 5.25 VDC

Supply current IS — — 10 mAdc

Span @ 306 mm H2O (3 kPa)(2) — 3.0 —

VFSS V
Full-scale span @ 400 mm H2O (3.92 kPa)(2) — 3.92 —
Offset(3) VOFF 0.75 1.0 1.25 V

Sensitivity V/P — 1.0 — V/kPa

%VFSS with
Accuracy (4) (5) 0 to 100 mm H2O (10 °C to 60 °C) — — — ±1.5
autozero
%VFSS with
100 to 400 mm H2O (10 °C to 60 °C) — — — ±2.5
autozero
%VFSS without
0 to 400 mm H2O (10 °C to 60 °C) — — — ±6.25
autozero
1. Device is ratiometric within this specified excitation range.
2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated
pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure, using endpoint method, over the specified
pressure range.
Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25 °C.
TcSpan: Output deviation over the temperature range of 10 °C to 60 °C, relative to 25 °C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 °C to 60 °C, relative to
25 °C.
Variation from nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS, at 25 °C.
5. Autozero at factory installation: Due to the sensitivity of the MPxx5004G, external mechanical stresses and mounting position can affect the
zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output
during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of
±5 °C between autozero and measurement.

MPxx5004

Sensors
Freescale Semiconductor, Inc. 5
3 On-chip Temperature Compensation and Calibration
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation,
calibration and signal conditioning circuitry onto a single monolithic chip.
Figure 3 illustrates the gauge configuration in the basic chip carrier (case 98ASB17756C). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm.
The MPxx5004 series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air,
may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and
other media, are available from the factory. Contact the factory for information regarding media tolerance in your application.
Figure 4 shows the recommended decoupling circuit for interfacing the output of the MPxx5004 to the A/D input of the
microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
Typical, minimum and maximum output curves are shown for operation over a temperature range of 10 °C to 60 °C using the
decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range.

Fluorosilicone Stainless
Gel Die Coat Die Steel Cap

P1
Thermoplastic
Wire Bond Case

Lead Frame

P2
Differential Sensing Element Die Bond

Figure 3. Cross-sectional diagram (not to scale)

+5 V

VOUT OUTPUT
VS

IPS

1.0 μF 0.01 μF GND 470 pF

Figure 4. Recommended power supply decoupling and output filtering

(For additional output filtering, please refer to AN1646.)

MPxx5004

Sensors
6 Freescale Semiconductor, Inc.
 5.0
TRANSFER FUNCTION:
Vout = VS*[(0.2*P) + 0.2] ± 6.25% VFSS
4.0 VS = 5.0 Vdc
TEMP = 10 °C to 60°C
3.0
MAX

Output (V)
TYPICAL
2.0

MIN
1.0

0
0 1.0 2.0 3.0 4.0
Differential Pressure (kPa)

Figure 5. Output vs. pressure differential

at ±6.25% VFSS (without autozero, Table 3, note 5)

5.0
TRANSFER FUNCTION:
Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS
4.0 VS = 5.0 Vdc
TEMP = 10 to 60°C

3.0
MAX
Output (V)

TYPICAL
2.0
MIN

1.0

0
0 1.0 2.0 3.0 4.0
Differential Pressure (kPa)

Figure 6. Output vs. pressure differential

at ±2.5% VFSS (with autozero, Table 3, note 5)

MPxx5004

Sensors
Freescale Semiconductor, Inc. 7
4 Package Information
4.1 Pressure (P1)/Vacuum (P2) side identification
Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side.
The pressure (P1) side is the side containing silicone gel which isolates the die from the environment.
The Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The pressure (P1) side may be identified by using the table below.

Table 4. Pressure (P1)/Vacuum (P2) side identification table

Part number Case number Pressure (P1) side identifier
MPXV5004DP 98ASA99255D Side with part marking
MPXV5004GC6U/6T1,
98ASB17757C Side with port attached
MPVZ5004GC6U
MPXV5004GC7U 98ASB17759C Side with port attached
MPXV5004GP/GPT1 98ASA99303D Side with port attached
MPXV5004GVP 98ASA99302D Stainless steel cap
MPVZ5004G6U/6T1 98ASB17756C Stainless steel cap
MPVZ5004G7U 98ASB17758C Stainless steel cap
MPVZ5004GW6U 98ASA10686D Vertical port attached
MPVZ5004GW7U 98ASA10611D Vertical port attached

4.2 Minimum recommended footprint for surface mounted applications

Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the
packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask
layer to avoid bridging and shorting between solder pads.

0.100 TYP 6X
0.660 2.54
16.76

0.060 TYP 8X
1.52 0.300
7.62

0.100 TYP 8X inch

2.54 mm SCALE 2:1

Figure 7. SOP footprint (case 98ASB17756C)

MPxx5004

Sensors
8 Freescale Semiconductor, Inc.
4.3 Package Dimensions
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17756C.pdf.

Case 98ASB17756C, small outline package, surface mount

MPxx5004

Sensors
Freescale Semiconductor, Inc. 9
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf.

–A– D 8 PL NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
4 0.25 (0.010) M T B S A S Y14.5M, 1982.
5 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
N –B– 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
G
8 INCHES MILLIMETERS
1 DIM MIN MAX MIN MAX
A 0.415 0.425 10.54 10.79
B 0.415 0.425 10.54 10.79
S C 0.500 0.520 12.70 13.21
W D 0.038 0.042 0.96 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
V K 0.061 0.071 1.55 1.80
M 0 7 0 7
N 0.444 0.448 11.28 11.38
C S 0.709 0.725 18.01 18.41
V 0.245 0.255 6.22 6.48
H W 0.115 0.125 2.92 3.17
J
–T–
PIN 1 IDENTIFIER SEATING
M PLANE
K

Case 98ASB17757C, small outline package, through-hole

This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17758C.pdf.

–A–
NOTES:
4 1. DIMENSIONING AND TOLERANCING PER ANSI
5 Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
–B– PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
G 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
8 6. DIMENSION S TO CENTER OF LEAD WHEN
1 D 8 PL FORMED PARALLEL.
0.25 (0.010) M T B S A S
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
DETAIL X A 0.415 0.425 10.54 10.79
S
B 0.415 0.425 10.54 10.79
C 0.210 0.220 5.33 5.59
PIN 1 IDENTIFIER D 0.026 0.034 0.66 0.864
N
G 0.100 BSC 2.54 BSC
J 0.009 0.011 0.23 0.28
K 0.100 0.120 2.54 3.05
C M 0 15 0 15
SEATING N 0.405 0.415 10.29 10.54
–T– PLANE S 0.540 0.560 13.72 14.22
K
M
J
DETAIL X

Case 98ASB17758C, small outline package, through-hole

MPxx5004

Sensors
10 Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17759C.pdf.

FREESCALE

Case 98ASB17759C, small outline package, through-hole

MPxx5004

Sensors
Freescale Semiconductor, Inc. 11
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99255D.pdf.

PAGE 1 OF 2

Case 98ASA99255D, small outline package, surface mount

MPxx5004

Sensors
12 Freescale Semiconductor, Inc.
 PAGE 2 OF 2
Case 98ASA99255D, small outline package, surface mount

MPxx5004

Sensors
Freescale Semiconductor, Inc. 13
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99302D.pdf.

PAGE 1 OF 3

Case 98ASA99302D, small outline package, surface mount

MPxx5004

Sensors
14 Freescale Semiconductor, Inc.
 PAGE 2 OF 3
PAGE 2 OF 3
Case 98ASA99302D, small outline package, surface mount

MPxx5004

Sensors
Freescale Semiconductor, Inc. 15
 PAGE 3 OF 3
PAGE 3 OF 3

Case 98ASA99302D, small outline package, surface mount

MPxx5004

Sensors
16 Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99303D.pdf.

PAGE 1 OF 2
PAGE 1 OF 2
Case 98ASA99303D, small outline package

MPxx5004

Sensors
Freescale Semiconductor, Inc. 17
 PAGE 2 OF 2
PAGE 2 OF 2
Case 98ASA99303D, small outline package

MPxx5004

Sensors
18 Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA10611D.pdf.

PAGE 1 OF 3

Case 98ASA10611D, small outline package

MPxx5004

Sensors
Freescale Semiconductor, Inc. 19
 PAGE 2 OF 3

Case 98ASA10611D, small outline package

MPxx5004

Sensors
20 Freescale Semiconductor, Inc.
 PAGE 3 OF 3

Case 98ASA10611D, small outline package

MPxx5004

Sensors
Freescale Semiconductor, Inc. 21
This drawing is available at http://cache.freescale.com/files/shared/doc/package_info/98ASA10686D.pdf

PAGE 1 OF 3

Case 98ASA10686D, small outline package

MPxx5004

Sensors
22 Freescale Semiconductor, Inc.
 PAGE 2 OF 3

Case 98ASA10686D, small outline package

MPxx5004

Sensors
Freescale Semiconductor, Inc. 23
 PAGE 3 OF 3

Case 98ASA10686D, small outline package

MPxx5004

Sensors
24 Freescale Semiconductor, Inc.
5 Revision History
Table 5. Revision history

Revision Revision
Description
number date
• Updated format.
12.1 05/2015 • Table 3: Updated Full-scale span Typ value, was 4.0 to 3.92. Updated Linearity defintion in note 4.
• Updated package drawings with current versions.

MPxx5004

Sensors
Freescale Semiconductor, Inc. 25
How to Reach Us: Information in this document is provided solely to enable system and software
implementers to use Freescale products. There are no express or implied copyright
Home Page:
freescale.com licenses granted hereunder to design or fabricate any integrated circuits based on the

Web Support: information in this document.

freescale.com/support Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for each
customer application by customer’s technical experts. Freescale does not convey any
license under its patent rights nor the rights of others. Freescale sells products pursuant
to standard terms and conditions of sale, which can be found at the following address:
freescale.com/salestermsandconditions.

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,
Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their
respective owners.
© 2006-2009, 2015 Freescale Semiconductor, Inc.

Document Number: MPxx5004

Rev. 12.1
05/2015