KBPC3500 - KBPC3510: PRV: 50 - 1000 Volts Io: 35 Amperes BR50M
KBPC3500 - KBPC3510: PRV: 50 - 1000 Volts Io: 35 Amperes BR50M
KBPC3500 - KBPC3510: PRV: 50 - 1000 Volts Io: 35 Amperes BR50M
Io : 35 Amperes
0.570 (14.50) 0.685(16.70) 1.130(28.70)
FEATURES : 0.530(13.40) 0.618(15.70) 1.120(28.40)
Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V
Maximum Average Forward Current Tc = 55°C IF(AV) 35 A
Peak Forward Surge Current Single half sine wave
IFSM 400 A
Superimposed on rated load (JEDEC Method)
Current Squared Time at t < 8.3 ms. I 2t 660 A2S
Maximum Forward Voltage per Diode at IF = 17.5 A VF 1.1 V
Maximum DC Reverse Current Ta = 25 °C IR 10 μA
at Rated DC Blocking Voltage Ta = 100 °C IR(H) 200 μA
Typical Thermal Resistance (Note 1) RθJC 1.5 °C/W
Typical Thermal Resistance at Junction to Ambient RθJA 10 °C
Operating Junction Temperature Range TJ - 40 to + 150 °C
Storage Temperature Range TSTG - 40 to + 150 °C
Note :
1. Thermal Resistance from junction to case with units mounted on a 7.5" x 3.5" x 4.6" (19cm.x 9cm.x 11.8cm.) Al.-Finned Plate
Page 1 of 2 Rev. 03 : September 3, 2012
TH97/2478 TH09/2479 IATF 0113686
www.eicsemi.com SGS TH07/1033
28 400 TJ = 50 °C
AMPERES
21 300
14 200
HEAT-SINK MOUNTING, Tc
7.5" x 3.5" x 4.6" THK.
7 (19cm x 9cm x 11.8cm) 100
Al.-Finned plate
0 0
0 25 50 75 100 125 150 175 1 2 4 6 10 20 40 60 100
TJ = 100 °C
FORWARD CURRENT, AMPERES
REVERSE CURRENT,
MICROAMPERES
10 1.0
TJ = 25 °C
0.1 0.01
0 20 40 60 80 100 120 140