Safety and Reliability Requirement of Electronic Signalling Equipment

Effective from 14.03.2006 Specification no.
RDSO/ SPN/144/ 2006 Revision: 2

SAFETY AND RELIABILTY REQUIREMENT OF ELECTRONIC SIGNALLING EQUIPMENT
SAFETY AND RELIABILITY REQUIREMENT OF

ELECTRONIC SIGNALLING EQUIPMENT
SPECIFICATION No. RDSO/ SPN/ 144/2006
(Draft)
Pages 34
SIGNAL DIRECTORATE
RESEARCH DESIGN & STANDARDS
ORGANISATION
LUCKNOW – 226 011
Page 1 of 34
Effective from 14.03.2006 Specification no. RDSO/ SPN/144/ 2006 Revision: 2
DOCUMENT DATA SHEET
Designation Revision
RDSO/SPN/144/2006 2.0
Title of Document

Authors:
Shrikant Singh
Designation: Executive Director / Signal/ RDSO
Approved by
Name: Shri G. D. Bhatia

Designation: Sr. Executive Director/ Signal,
RDSO
Abstract
This document defines Safety and Reliability Requirement of Electronic Signalling

Equipment.
Page 2 of 34
DOCUMENT CONTROL SHEET
NAME ORGANIZATION FUNCTION LEVEL
Shrikant Singh RDSO Member Prepare
G.D. Bhatia RDSO Approve
Page 3 of 34
AMENDMENTS
Version Chapter/ Amendment Effective date

Annexure
RDSO/SPN 144 / 94 FIRST ISSUE 1994
RDSO/SPN 144 / 2004 Revision 1 25.05.2004
RDSO/SPN 144 / 2006 Revision 2 14.03. 2006
Page 4 of 34
Revision 2 ( Details )
S.No. Clause Type of Amendment

1. 0.2 (i) Modified
2. 0.2 (iii) Modified
3. 2.2 Modified
4. 2.4 Modified
5. 2.7 New Clause
6. 2.8 New Clause
7. 4.7 Modified
8. 5.1.1 Modified
9. 5.1.3 Modified
10. 5.1.4 Modified
11. 5.3 Modified
12. 5.3.2 Modified
13. 5.3.3 Modified
14. 5.4.1 Modified
15. 5.4.2 Modified
16. 5.4.3 Modified
17. 6.1 Modified
18. 6.2 Modified
19. 6.4 Modified
20. 6.5 Modified
21. 6.11 Modified
22. 6.12 Modified
23. 6.14 Deleted
24. 8.1 Modified
25. 8.2 Modified
26. 9.3 (4) Modified
29. 9.3 (11) Modified
30. 9.3 (14.1) Change Cl. number
31. 9.3 (14.2) Change Cl. number
32. 9.4 Modified
33. 9.4.1 (b) Modified
34. 9.5 Modified
35. 10.2 Modified
36. 11.1 to Modified
11.10
37. 12.4 Modified
38. 13.9 Modified
Page 5 of 34
TABLE OF CONTENTS
S.No. Item Page Number
0.0 Foreword 7
1.0 Scope 8
2.0 General 8
3.0 Requirements of Signal Engineering 11
Manual
4.0 Fail-safety requirement 12

5.0 Hardware 13
6.0 Printed Circuit Board 15
7.0 Software Requirements 17
8.0 Transmission of Signalling Information 18
9.0 Environmental and Climatic 19

Requirements
10.0 Power Supply Requirements 29

11.0 Lightning and Surge Protection for 29
Electronic Signalling Equipment
12.0 Marking 32
13.0 Documentation 33
14.0 Packing 34
15.0 Option to be specified by the 34
Purchaser
Page 6 of 34
GOVERNMENT OF INDIA
MINISTRY OF RAILWAYS
(RAILWAY BOARD)
INDIAN RAILWAY
STANDARD SPECIFICATION
FOR
(DRAFT)
Serial No. RDSO/ SPN/ 144/2006
0.0 FOREWORD
0.1 This specification is issued under the fixed serial no. RDSO/ SPN/ 144
followed by the year of original adoption as standard or in the case of
revision, the year of last revision.
0.2 This specification requires reference to the following Indian Railway

Standards specification (IRS) and Indian Standards Specification (IS). It
shall also be complied to the extent applicable.
(i) IRS: S 96 for DC-DC converters.

(ii) IRS: S 88 for Low maintenance Lead Acid Batteries.
(iii) IRS: S 93 for Valve Regulated Lead Acid Batteries.
(iv) IRS: S 86 for battery chargers.
(v) IS: 9000 for Basic Environmental Testing procedure for electronic
and electrical items.
(vi) IS: 9001 Guidance for Environmental Testing.
Page 7 of 34
(vii) IS: 2147 for Degrees of protection provided by enclosure for low
voltage switch gear and control gear.
(viii) IEC: 947/7/1 terminal blocks for copper conductors.
0.3 Whenever in this specification, any of the above mentioned specifications
are referred to by number only without mentioning the year of issue, the
latest issue of that specification is implied, otherwise particular issue
referred to is meant.
0.4 This specification is intended chiefly to cover the technical provisions and
does not include all the necessary provisions of a contract.
1.0 SCOPE
1.1 This specification covers the reliability and safety requirements for
electronic (including microprocessor / micro-controller/ processor based)
fail safe signalling equipment.
1.2 This specification shall be read with the main specification of the
equipment.
1.3 Any special requirement specified in the main specification of the

equipment shall override the requirements laid down in this specification.
2.0 GENERAL
2.1 The equipment shall be manufactured as per best engineering practices.
2.2 The cabinet shall be powder coated and good aesthetic appearance. It
shall conform to IP-31 class of protection as specified in table-I of IS:
2147.
2.3 The power portion of the equipment shall be clearly isolated and
protected to prevent accidental contact.
2.4 All non-current carrying metals parts including shields and screens shall be
bonded together and earthed. An earth terminal suitable for taking upto 4
mm dia copper wire shall be provided. The earth terminal shall be
indicated by letter ‘E’. Maximum earth resistance shall be 2 ohms.
2.5 Outsourcing, if any, of any sub-modules or PCB shall be indicated in the

‘Quality Assurance Plan’ and approval of RDSO, Lucknow shall be
obtained. Any outsourcing of safety related sub-module or PCB shall be
from ISO-9001 or ISO-9002 certified manufacturers only.
Page 8 of 34
2.6 Necessary provision shall be made in the hardware and software for
modular expansion of the equipment.
2.7 Version Control:
2.7.1 The version number of any equipment shall be as per the format given
below:
DXXSXXXHXX
DXX SXXX HXX

Basic Design Software Hardware
D: Design, S: Software, H: Hardware

XX and XXX are numeric two and three digit numbers
respectively.
Thus the initial version of any equipment will be D01S001H01.
In every case of modification/ upgradation/ improvement of
Basic Design, DXX will increment by one.
system Software (executive software), SXXX will increment by
one.
Hardware, HXX will increment by one.
2.7.2 Version number shall be engraved on each printed circuit board and will
also be displayed in the name plate of the equipment.
2.7.3 The software version number shall appear on the LCD display board
immediately after power ON and shall be displayed for 10 seconds. The
system shall display version number of the software for 10 seconds either
by giving suitable command or by pressing a button.
2.7.4 Each document/ manual of the manufacturer shall contain the history of
the changes in version along with accompanying changes in the manual, if
any.
Page 9 of 34
2.7.5 Signalling equipments which do not have any embedded software shall
follow the following format for version number.
DXXHXX
DXX HXX
Basic Design Change Hardware Change
D: Design, H: Hardware
XX are numeric two digit numbers.
Thus the initial version of any equipment will be D01H01.
In every case of modification/ upgradation/ improvement
of Basic Design, DXX will increment by one.
In every case of modification/ upgradation/ improvement
of Hardware, HXX will increment by one.
2.8 Change of system software
2.8.1 The system software and application software shall be stored in separate
EPROMs.
2.8.2 Any supply or installation of modified/ upgraded / improved system

software by a firm for an equipment shall only be done with prior approval
of Signal Directorate of RDSO, Lucknow. RDSO, while approving the
upgraded/ modified/ improved software with new version number, shall
verify the checksum of the system software as given by the manufacturer
and indicate the same along with version number of the equipment.
2.8.3 The Director (Q.A.)/ S&T will check the version number and also the
checksum of new version of the software before passing the same in the
acceptance test.
2.8.4 Version number and checksum of new version shall form part of
acceptance and routine tests also.
2.8.5 After the acceptance test by Director (Q.A.)/ S&T, stickers with software
version no. will be stuck/ pasted on the EPROMs. In case EPROMs
carrying new software version are to be supplied separately for replacing
in already supplied equipment, these will be sealed in a proper package
and stamped with RDSO's seal and stamp before the same are dispatched
to the consignee for installation. The version number and the checksum
will be clearly typed or written on the sealed cover and signed by the
inspecting authority.
Page 10 of 34
2.8.6 Firms shall supply and install only the latest approved version of the
equipment and software.
3.0 REQUIREMENTS OF SIGNAL ENGINEERING MANUAL
The equipment and its accessories shall comply with the requirements
pertaining to signalling circuits using electronic equipment as laid down in
Signal Engineering Manual (Para 7.121 to 7.130) which is reproduced
below:
3.1 Component failure shall be self-detecting by way of causing a signal to

display a most restrictive aspect as far as practicable.
3.2 Failure of components which are not self-detecting shall not cause any
unsafe failure of the equipment. Even simultaneous failures in different
components which are not self-detecting shall not cause any unsafe
failure of the equipment.
3.3 All fail-safe circuits shall work on continuous energisation principle such
that open circuits in wiring, relay contacts, etc., or loss of power supply
shall not cause unsafe conditions.
3.4 Common return shall not be used for vital circuits. In vital circuits, the
final stage shall use fail-safe signalling relays. A transformer isolation shall
be provided between the final stage fail-safe signalling relay and the
electronic device preceding it. The DC power supply shall not have any
galvanic connection with the coil of the final stage signalling relay.
3.5 All electronic equipment shall have a Mean Time Between Failures (MTBF)
as specified in the relevant equipment specification. Duplication of
components and parts of equipment or modules may be resorted to for
improvement of the reliability where necessary. Where components /
parts modules are duplicated, it is desirable that provision may be made
for cross checking the performance of one set by the other set and vice-
versa.
3.6 Due consideration shall be given to the effects of faults in fail-safe

electronic equipment to allow open or short circuit or earthing conditions
and variation in component values due to ageing, replacement of faulty
component with new components of specified tolerance, etc.. Safety shall
not be impaired as a result of multi-terminal devices failing - either open
Page 11 of 34
circuit, short circuit or with partial short circuit between any pair of
terminals or earthing.
3.7 Special care shall be taken in the design of amplifier circuit to eliminate
the possibility of self-oscillation. It is desirable that loss of safety
requirements is not caused should the amplifier go into self-oscillation due
to any unforeseen contingency.
3.8 Where specific frequencies are used for safety circuits, particular care
shall be taken to ensure that the frequency generating equipment is
producing only the desired frequency signal. Verification shall be carried
out using passive tuned filters in series with each frequency source.
3.9 The physical construction of fail-safe equipment shall be designed to

eliminate the possibility of external objects causing short circuits between
combinations of terminals in vital circuits. This may be achieved for
example, by adequate separation of terminals and by the fitting of
protective shrouds where necessary.
3.10 For the consideration of the fail-safe feature of an electronic safety

signalling device, failure of one component for all the modes of probable
faults indicated in paragraph 3.6, one at a time shall be considered. If the
failure of the component under examination is not self-detecting, then
simultaneous failure of other associated components shall be considered.
4.0 FAIL-SAFETY REQUIREMENT
4.1 The system shall be designed on fail safe principles. In case of any failure
whether in the hardware, software or any part of the equipment, the
system and the equipments controlled by it should fail on the safe side
and the system should change over to a more restrictive state.
4.2 No single failure shall result in an unsafe condition i.e. the system shall be
brought to a safe state as soon as a failure occurs.
4.3 It must be ensured that if a failure of equipment occurs which by itself

does not result in unsafe condition, but which in combination with a
second or subsequent failure could result in an unsafe condition, then the
design of the equipment must be such that the first failure is detected and
negated. The probability of occurrence of a second failure, while the first
failure has not been detected and negated, should be negligible so that
mean time between wrong side failures (MTBWSF) is more than 109
hours.
Page 12 of 34
4.4 The design of the equipment shall cater for detection and restoration of
system to a safer state in case of following faults if these are likely to
result in unsafe condition:
(i) Variation in power supply beyond its tolerance limits including its
momentary or prolonged failure;
(ii) Spikes in the power supply system, stray fields caused by traction
vehicles or standby diesel generator sets;
(iii) Insertion of PCBs in wrong card slots;
(iv) Earthing of any component or wire or a combination of such

earthing faults; and
(v) Broken wires, damaged or dirty contacts, failure of a component to

energise, loss of power supply or blown fuses etc.
4.5 The equipment shall be so constructed as to prevent unauthorized access.
4.6 Whenever power of the equipment is switched on, the equipment should
wait for a manual system reset before assuming normal operational mode.
4.7 System reset arrangement shall be provided as specified in relevant

specification. Manual reset switch, if provided, must have an non-
resettable electro-mechanical counter which should be incremented every
time a reset operation is performed. System reset switch must have a
locking arrangement to prevent unauthorised operation.
4.8 All vital relays, including the safe shutdown relays, shall be of approved
type for use in railway signalling.
5.0 HARDWARE
5.1 COMPONENT TYPES
5.1.1 ICs and other components used in the equipment shall be of such grade
that these can work satisfactorily in -400 to +850 C temperature range.
Capacitors used should be certified for atleast +105 deg. C. Source of
procurement of components shall be given in the Quality Assurance Plan.
5.1.2 Discrete components like diodes, transistors, SCRs etc. should conform to
HIREL program of CDIL or equivalent.
Page 13 of 34
5.1.3 All resistors and rectifiers used shall be rated for at least double the
power which is supposed to be dissipated in them. The voltage rating of
the capacitor shall be at least 50% above peak value. The resistors shall
be of tolerances not more than 5%. Tolerances of capacitors shall be as
under:
Metallised polycarbonate (MPCAR)- 5%

Polypropylene (PPSAR/ PSAR) - 5%
Polysterine (PFD) - 2%
Electrolytic - 20%
5.1.4 Where ICs are used, all power supplies on cards should be locally de-
coupled using a capacitor with good high frequency characteristics. The
value of chip decoupler ceramic capacitor shall be 0.1 to 1µF. The value of
board decoupler electrolytic capacitor shall be 10 to 100 µF placed near to
where power supply enters PC board.
5.2 PROTECTION AGAINST ELECTROMAGNETIC INTERFERENCE
To protect against the electromagnetic interference, at least the following

two levels of shielding should be provided:
(i) Shielding at card level by providing a metallic plate over the cards;
(ii) Shielding at chassis/ rack level.
5.3 DIAGNOSTIC FACILITY
In case of microprocessor based equipment, the system shall be provided

with a front-panel alpha numeric LED/ LCD display unit indicating various
failures. The error code should indicate type of the failure.
5.3.1 A trouble-shooting chart should be provided indicating the action required

to be taken for repair of the equipment corresponding to each error code.
5.3.2 Audiovisual alarm shall be provided to indicate failure. The audio alarm
should stop when acknowledged but the visual alarm should continue till
the fault is rectified.
5.3.3 If required by the purchaser, data logging facilities shall be provided as

per IRS: S-99 for on-line storage of data. It should be possible to retrieve
the logged data either on the VDU terminal or as a hard copy on a printer
5.4 HOUSING RACK
Page 14 of 34
5.4.1 19 ″ rack mountable and 3/4/6U high cabinets made of aluminum of

minimum thickness 2mm shall be used for housing the PCB cards. The
cabinet shall be powder coated. The front & back sides of the cabinets
shall have facility for completely locking the equipment. The rack should
have provision for natural ventilation. If required, provision for forced
cooling shall be made.
5.4.2 Connectors from WAGO, PHOENIX or any other firm recommended by

RDSO and confirming to IEC: 947/7/1 shall be provided. This should
include signaling inputs/output, data input/output and power supply
connections with in-built arrangement for connecting fuses where
required.
5.4.3 The equipment shall be housed in a rack with a transparent front panel.
The rack shall have provision for natural ventilation. Ventilation openings
shall be louvers of less than 3mm size covered with wire mesh for
protection against entry of rodents, lizards etc. The protection shall
conform to IP-31 type protection as specified in table 1 of specification
NO. IS: 2147.
5.4.4 Rack shall be earthed.
5.4.5 The layout of the components and wiring shall be such that all parts are
easily accessible for inspection, repairs and replacement.
5.4.6 The AC input portion shall be clearly isolated and protected to prevent
accidental contact.
5.4.7 Dummy slots for inserting spare PCBs shall be provided if space is
available in the rack.
6.0 PRINTED CIRCUIT BOARD
6.1 PCB MATERIAL: Material for the printed circuit board shall be copper clad
glass epoxy of grade FR-4 or equivalent. PCB shall normally be of
standard size (e.g.3/4/6U).
6.2 OUTLINE DIMENSIONS: PCBs shall be of standard size.
6.3 BOARD THICKNESS: The thickness of PCB cards and motherboard shall be
as per currently available technology. There should be no deformity in the
PCB cards or the motherboard due to mounting of heavy components or
due to ageing effect.
Page 15 of 34
6.4 TRACK WIDTH: The track width shall be 0.5 mm nominal. In no case it
should be less than 0.3 mm. Lesser width for use of SMD technology may
be considered.
6.5 SPACING BETWEEN TRACKS: Spacing between tracks shall be 0.5mm

nominal and in no case it shall be less than 0.3 mm. Lesser spacing for
use of SMD technology may be considered.
6.6 The printed circuit cards shall be specifically designed to suit the circuitry
used and no extra wires or jumpers shall be used for interconnection of
components on the PCB. No piggy-back PCB shall be connected to any
PCB. The components shall be soldered with wave-soldering machine. Any
exception to wave-soldering machine shall have specific approval of
RDSO, Lucknow.
6.7 The cards shall be provided with testing points and the corresponding
voltages / waveforms shall be indicated in the fault diagnostic procedure
and service manual to facilitate testing and fault tracing.
6.8 CONFORMAL COATINGS: Assembled & tested printed boards should be

given a conformal coating to enable them for functioning under adverse
environmental conditions. The coating material should be properly chosen
to protect the assembly from the following hazards:
(a) Humidity;
(b) Dust and dirt;
(c) Airborne contaminants like smoke and chemical vapours;
(d) Conducting particles like metal clips and filings;
(e) Accidental short circuit by dropped tools, fasteners etc.;
(f) Abrasion damage and
(g) Vibration and shock (to a certain extent).
6.9 The solder masks shall be applied on the solder side and component side
of the card.
6.10 Following description shall be etched on the component side of the PCB:
(i) Component outline in the proximity of the component.
(ii) Manufacturer’s name.
Page 16 of 34
(iii) PCB name.
(iv) Equipment name.
(v) Part number.
6.11 Following description shall be engraved on the PCB
(i) The manufacturing serial number.
(ii) Month and year of manufacture.
(iii) Version number.
6.12 Printed circuit cards shall be fitted with gold plated Euro/ D type plug in
connectors with locking arrangement. Mechanical arrangements e.g. a clip
or a screw to hold the PCB in inserted position shall be provided. Screws
should be countersunk and held on PCB when it is pulled out. The PCB
shall be mechanically polarized so that it is not possible to insert the PCB
into wrong slot. Suitable mechanical arrangement shall be provided
against wrong insertion of PCBs.
6.13 HEAT DISSIPATING COMPONENTS: All components dissipating 3W or

more power shall be mounted so that its body is not in contact with the
board unless a clamp, heat sink or other means are used for proper heat
dissipation.
6.14 The distribution of the power supply on the cards should be such that
different voltage tracks (0, 5V etc.) follow the same route as far as
possible. The track of power supplies should be as thick and wide as
possible.
7.0 SOFTWARE REQUIREMENTS
7.1 Software should be written in structured format. It should be developed in

such a way that it is possible to test and validate each module
independently.
7.2 The software shall be such that in case of variable data, the possibility of
using incorrect data does not exist. Further, the software should check
and reject –
Page 17 of 34
(a) Use of data which is obsolete or meant for some earlier state of the
system, and
(b) Corruption of the data.
7.3 As far as possible, program flow should be independent of the input data.
The program should preferably execute the same sequence of instructions
in each cycle.
7.4 The use of interrupts should be kept to a bare minimum.
7.5 SELF CHECK PROCEDURES
Software should include self check procedures to detect faults in the

hardware. The self check should include the following procedures:
(i) Memory containing the vital software and data should be checked
periodically so that probability of corrupted software jeopardizing the
safety of the equipment is minimized.
(ii) Components of the CPU, such as general purpose registers, program

counters, stack pointers, instruction register, instruction decoder, ALU,
etc., should be checked periodically as far as practicable.
7.6 Self check of the associated functional hardware as required by the

hardware design should be performed periodically.
7.7 Critical and non-critical software should be segregated in the memory area
so that special procedures to check the program flow may be adopted
during the self check process for the critical software.
8.0 TRANSMISSION OF SIGNALLING INFORMATION
In the systems requiring transmission of vital safety information, the

following requirements shall be fulfilled:
8.1 It shall be possible to transmit the safety information over commercial

voice channels / cables through use of proper multiplexers, unless other
modes of transmission are specified by the purchaser.
8.2 The transmission protocol shall ensure required integrity of safety related
information irrespective of transmission medium.
Page 18 of 34
8.3 The overall system design must ensure that if the transmission link
becomes inactive for more than a specified period, the safety information
drain (user) will assume a restrictive and fail-safe state.
8.4 For systems relying on error prevention, all transmission equipment such
as filters and amplifiers must be designated to meet specified fail safety
standards.
8.5 Errors introduced or not detected at a given level in the transmission

system must be detected at higher levels. Error detection methods used at
any level must take into account the characteristics of the lower levels.
8.6 Error detection techniques should permit the use of standard

telecommunication technology, which offers much more economic
solutions than the special hardware needed to implement error prevention
techniques.
Repetion
Parity Bits 8.7 Error detecting coding should not form the sole means of protection of
Checksums transmitted information, but should be combined with other methods such
as higher level procedures and protocols, and hardware redundancy or
CRC diversity.
Hash
8.8 Forward error correcting coding should not be used unless precautions are
taken at the higher level to prevent invalid corrections from being
If Error Detected, accepted at the higher level.
ARQ or
ECC / FEC 9.0 ENVIRONMENTAL/ CLIMATIC REQUIREMENTS
9.1 The equipment shall be capable of working in non-air conditioned

environment in the field.
9.2 The equipment shall be suitable for installation on AC/ DC electrified and
non-electrified sections. It shall be suitable in all areas including where
locomotives having thyristor controlled single phase or 3-phase induction
motors haul passenger or freight trains and where chopper controlled
EMU stocks are operated.
Page 19 of 34
9.3 The equipment shall meet the following climatic and environmental
requirements:
S. No Test Referenc Electronic Equipment

e Indoor Out-door On board
On Track Inside Outsid
Track side Cab e Cab
1. Change of temp test IS 9000 Yes Yes Yes Yes Yes
Part XIV
Low temp –10o C ± 3o C Sect. II
High temp +70o C ± 2o C
Rate of 1o C / min
change in
temperatur
e
Duration 7hrs at each temp. –
10 o C & +70 o C
Cycle 3
Condition Fully functional during
test
Page 20 of 34
S. No Test Referenc Electronic Equipment

e Indoor Out-door On board
On Track Inside Outside
Track side Cab Cab
2. Dry heat test IEC-571; Yes Yes Yes Yes Yes
IS:9000
Temp +70oC Part-III
Sect 3
Duration 16 hrs
Condition Fully functional
during test
3. Cold test IS 9000 Yes Yes Yes Yes Yes
Part II
Temp –10o C ± 3 o C Sect. III
Duration 2 hours
during test.
4. Damp heat test IS 9000 Yes Yes Yes Yes Yes
(Cyclic) Part V
Upper temp 40o C ± 2 o Sect. 2
C Variant 1
Humidity 95%
(+1%,
-5%)
Cycles 6
Condition Fully
functional
during one
hour
period
towards
end of
each cycle.
Stabilization
shall be
done at 25o
± 3oC
5. Damp heat test IS 9000 Yes Yes Yes Yes Yes

(Steady state storage) Part IV
Temp 40o ± 2 o C
Humidity 93% (+2% , -3%)
Severity 4 days
during test.
Page 21 of 34
S. No Test Reference Electronic Equipment

Indoor Out-door On board
Track side Cab Cab
6. Salt mist test IS 9000 Yes Yes Yes Yes Yes
Mist + Damp Procedure 2: 2 Part XI Procedu Proce- Proce- Proce- Proce-
heat hours + 7 days procedure re 3 dure 2 dure 2 dure 3 dure 2
Procedure 3: 2 3
hours + 22
hours
Temp 35o ± 3 o C
Humidity 93% (+2%, -

3%)
Hours 22
Cycle 3
Condition After this test,

electrical
parameters
shall be
monitored in
addition to
physical
checks.
7. Dust test IS 9000 Yes Yes Yes Yes Yes

Part XII
Duration 1hour

electrical
parameters
shall be
monitored in
addition to
physical
checks.
8. Water Immersion test IS 9000 No Yes No No No
Part XV
Head of 0.4 m Sect. 7
water
Duration 24 hours
Page 22 of 34

Track side Cab Cab
electrical
parameters shall
be monitored in
addition to
physical checks
(Ingress of
water).
9 Driving Rain test IS 9000 No Yes No No Yes
Part XVI
Water spray for 1 hour Test
condition ‘c’
electrical
parameters shall
be monitored in
addition to
physical checks.
10 Bump test IS 9000 Yes Yes Yes Yes Yes
Part VII,
PCBs/Modules/units in packed
Sec. 2
condition shall be subjected to
bump test as under:
No of bumps 1000
Peak 400 m/s2
acceleration
Pulse 6 ms
duration
No of axes 3
electrical
parameters
shall be
monitored in
addition to
physical
checks.
Page 23 of 34

Track side Cab Cab
11 Shock test IS 9000 No Yes Yes Yes Yes
(to simulate the effect of Part VII Severity Severity Severity Severity
shunting shock) Sec. 1 2 1 1 1
Severity 1:
The equipment in operation
shall be subjected for 2 minutes
to 50 Hz vibration of such
nature that the maximum
acceleration is equal to 30 m/s2
(amplitude a=0.3 mm). At the
end of the test, the assembly
shall be subjected to
performance test as specified in
relevant specification.
Severity 2: IS 9000
Part VII
Peak acceleration: 40 g. Sec. 1
Duration of the pulse: 11 Clause 9
m.sec.
No. of shocks: 18
Velocity change : Half sine
pulse
Equipment in unpacked
condition shall be subjected to
Bump test. In addition to
physical checks, the assembly
shall be subjected to
performance test.
12 Vibration test TEC (IPT Yes Yes Yes Yes Yes

1001A-
revised)
Up to & Over
including 75
75 Kgs. Kgs.
weight
Freq. 05-350 Hz 5-150
Range Hz
Page 24 of 34

Track side Cab Cab
Amplitu ± 6 mm ± 6
de constant mm
displacem consta
ent or nt
15m/ displac
Sec.2 ement
constant or
acceleratio 15m/
n. Sec.2
consta
nt
acceler
ation.
No. of 3 3
axes
No of 20 10
sweep
cycle
Total 105 min 105

duration min
If 10 min at 10 min
resonan each at each
ce is resonant resona
observe freq. nt freq.
d
Conditio After this test,
n electrical parameters
shall be monitored
in addition to
physical checks.
Page 25 of 34

Track side Cab Cab
13. Environmental Stress Yes Yes Yes Yes Yes
Screening tests (ESS) for
Printed Circuit Boards
(PCB) & sub systems
(The manufacturer shall carry

out the following ESS tests on
all modules on 100% basis
(except bump test) during
production / testing in the
sequence as follows. Suitable
records shall be maintained
regarding the compliance of
these tests. )
13.1 Thermal cycling Yes Yes Yes Yes Yes
The PCBs shall be subjected to
thermal cycling as per the
procedure given below.
The assembled boards are to
be subjected to rapid
temperature cycling as
mentioned below in the power
off condition.
! This temperature cycling
from 0° C to 700C, ½ Hours
at each temperature for 9
cycles and 1 hour at each
temp. for the 10th cycle.
Dwell time of 1 hour is
provided for the last cycle
in order to oxidize defective
solder joints exposed
through thermal stress.
Page 26 of 34
70° C, ½ 1 Hour
Hour
Ambient
r
0° C, ½ Hour
! The rate of rise / fall of
temp. shall be minimum 10°
C per minute.
! In addition to physical
checks, the electrical
parameters are also to be
monitored after this test.
13.2 Power cycling: The power Yes Yes Yes Yes Yes
supply modules shall be
subjected to 60 ON-OFF cycles
for 1 hour. The ON-OFF switch
usually provided in the modules
may not be used for this
purpose.
9.4 The system operation and its safety should not be affected by EMI
encountered in 25 KV AC electrified areas. For those outdoor equipment
which are used in 25 KV AC electrified areas and whose working is
susceptible to the effect of electrostatic and electromagnetic induction,
the following tests may be performed as given in relevant specification.
9.4.1 One sample of the test equipment shall be subjected to static discharge
test of 7 KV AC. Methodology of test is given below:
a) The equipment shall be functional and the chassis of the equipment shall
be firmly grounded.
b) A charged capacitor of 7 KV should be discharged by touching the chassis

by testing probe through 330Ω resistance and 150 pF capacitor.
c) The above discharge test should be repeated minimum 3 times.
d) After completion of the test, the equipment shall be able to continue its
normal operation.
e) If given in the relevant specification, the discharge test should be carried

out on individual card/ module also.
Page 27 of 34
For conducting 7 KV static discharge test, the NSG 200 Interference Simulator
equipment with plug-in NSG 222 module or its equivalent equipment may be
used.
9.4.2 Pantograph Interference Test: One prototype of the equipment shall be

installed in the actual field condition in AC electrified traction area. An AC
electric loco shall be placed in a position on the track such that distance
between nearest face of the equipment and point of catenary where
pantograph is touching, is about 4.0 meters.
The equipment shall be tested for its normal working during raising and
lowering of the pantograph. This test will be repeated for sufficient
number of times. The equipment will be tested for its normal operation
after completion of the test.
9.5 Insulation Resistance Test: This test shall be carried out –
(a) Before the high voltage test

(b) After the high voltage test
(c) After completion of the climatic test
There shall be no appreciable change (value more than 10 Mega ohms

and variation within 10%) in the values measured before and after high
voltage test. After the completion of climatic test, the values shall not be
less than 10 Mega ohms for the equipment at a temperature of 400 C and
relative humidity 60%. The measurement shall be made at a potential of
500V DC.
9.6 Applied High Voltage Test: The equipment shall withstand for one minute
without puncture and arcing a test voltage of 2000 volts rms applied
between:
(a) AC line terminals and earth

(b) DC line terminals and earth
The test voltage shall be alternating of approximately sinusoidal wave

form of any frequency between 50 Hz. and 100 Hz. Printed circuit cards
shall be removed.
Page 28 of 34
10.0 POWER SUPPLY REQUIREMENTS
10.1 The equipment shall work on nominal voltage 24V DC (+20%, -30%)
power supply or as specified in the relevant equipment specification or as
approved by the purchaser.
10.2 Where separate DC-DC converters are used to derive the required DC
voltages from the DC main input, these should conform to IRS
specification no. IRS: S-96 for axle counter.
10.3 The battery shall be used in float charge mode from the AC mains at
230V. The battery charger shall be of low ripple voltage output type as
specified in IRS: S-86 for axle counter.
10.4 A surge suppresser shall be provided in the battery charger to protect

against transient voltages, spikes etc.
11.0 LIGHTNING AND SURGE PROTECTION FOR ELECTRONIC

SIGNALLING EQUIPMENTS
11.1 The equipment shall be suitably protected against atmospheric voltage

surges both for common mode (voltage that appears between phase
conductors and earth) and differential mode (voltage that appears
between neutral & earth) in order to limit the harmful effects of lightning.
11.2 The IEC standards 61312, 61024, 61643, 62305 and VDE 0100-534
pertaining to protection against lightning and surges shall apply for all
IEC 60364 electronic equipment to withstand static electricity, electric fast transient
and surge voltage.
Earthing
Arrangements The power line of electronic signalling equipment shall have Class B & C
type 2-stage protection in TT configuration. Stage 3 protection is also
TT required for protection of power/signalling/data lines. Class B & class C
TN -C -S type protection devices shall preferably be pluggable type to facilitate
easy replacement.
IT
11.3 Stage 1 Protection (Power line protection at Distribution Level)
The protection of class 'B' type, against Lightning Electromagnetic Pulse

(LEMP) & other high surges shall be provided at the power distribution
panel. Wherever available, the modules shall have an indication function
to indicate the prospective life and failure mode to facilitate the
replacement of failed SPDs. The device shall be spark gap type and
certified as per the VDE 0675 A1/A2 & IEC 61643. It shall be provided
Page 29 of 34
with a 63 Amp fuse in phase line. The protection shall be in compliance of

IEC 61312, IEC 61024 & VDE 0100-534 with the following characteristics:
SN Parameters Limits
Line & Neutral &
Neutral Earth
1 Nominal Voltage (U0) 230V 230V
2 Maximum continuous operating voltage (Uc) ≥ 255V ≥ 255V
3 Lightning Impulse current between R, Y, B ≥ 50KA, --
& N (Imp) 10/350µs for
each phase
4 Lightning Impulse current between N & E -- ≥ 100KA,
(Imp) 10/350µs
5 Response time (Tr) ≤ 100 ñs ≤ 100 ñs
6 Voltage protection level (Up) between L 1.3KV
&N
7 Voltage protection level (Up) N & PE 1.5KV
8 Short circuit withstand and follow up
current extinguishing capacity without back
up fuse (Isc)
9 Operating temperature / RH C / 95% C / 95%
10 Mounted on
11.4 Stage 2 Protection (Power line protection at Equipment Level)
The protection of class 'C' type against low voltage surges shall be
provided at the equipment input level connected between line & neutral.
This shall have an indication function to indicate the prospective life and
failure mode to facilitate the replacement of failed SPDs. This shall be
thermal disconnecting type and equipped with potential free contact for
remote monitoring. The device shall be a single compact varistor of proper
rating and in no case a number of varistors shall be provided in parallel.
This protection shall be in compliance of IEC 61643-12, 61312 & 61024
and VDE 0100-534 with the following characteristics:
SN Parameters Limits
1 Nominal Voltage (U0) 230V
2 Maximum continuous operating voltage ≥ 300V
(Uc)
3 Nominal discharge current between ≥ 10KA, 8/20µs for each phase
R,Y,B & N (In)
4 Maximum discharge current between L ≥ 40KA, 8/20µs
& N (Imax)
5 Response time (Tr) ≤ 25 ñs
6 Voltage protection level (Up) at In ≤ 1.6 KV
7 Operating temperature / RH C/ 95%
8 Mounted on
Page 30 of 34
11.5 Stage 3 protection (Protection for Power /signalling / data lines)
All external Power/signalling/data lines (AC/DC) shall be protected by

using preferably pluggable stage 3 surge protection devices which consists
of a combination of varistors/suppressor diodes and GD tube with voltage
and current limiting facilities.
11.5.1 Power line Protection (Class D)
The device for power line protection shall be of Class D type. This shall
have an indication function to indicate the prospective life and failure
mode to facilitate the replacement of failed SPDs. This shall be thermal
disconnecting type and equipped with potential free contact for remote
monitoring. This protection shall be in compliance to IEC 61643-1 and
VDE -0675 Pt. 6 with following characteristics:
Nominal Voltage (U0) 24V 48V 60V 110V 230V
Max. continuous operating 30V 60V 75V 150V 253V
voltage (UC)
Rated load current (IL) 16A 16A 16A 16A 16A
Nominal discharge current ≥700A ≥700A ≥700A ≥2.0KA ≥2.5KA
(In) 8/20 µs
Max discharge current (Imax) ≥2KA ≥2KA ≥2KA ≥5KA ≥5KA
8/20 µs
Voltage protection level (UP) ≤200V ≤350V ≤500V ≤700V ≤1100V
Response time (Tr) ≤25 ñs ≤25 ñs ≤25 ñs ≤25 ñs ≤25 ñs
Note: Minor variations from above given parameters shall be acceptable.
11.5.2 Signalling/Data line protection
These devices shall preferably have an indication function to indicate the

prospective life and failure mode to facilitate the replacement of failed
SPDs. If the device has any component which comes in series with data/
signalling lines, the module shall have "make before break" feature so that
taking out of pluggable module does not disconnect the line. This
protection shall be in compliance to IEC 61643-21 & VDE 0845 Pt. 3 with
the following characteristics:
Page 31 of 34
Nominal Voltage(U0) 5V 12V 24V 48V

Arrester Rated Voltage(UC) 6V 13V 28V 50V
Rated load current(IL) ≥250mA ≥250mA ≥250mA ≥250mA
Total discharge current, 8/20 µs ( ≥20KA ≥20KA ≥20KA ≥20KA
In)
Lightning test current 10/350 µs ≥2.5KA ≥2.5KA ≥2.5KA ≥2.5KA
Voltage protection level (UP) ≤10V ≤18V ≤30V ≤70V
Note: Minor variations from above given parameters shall be acceptable.
11.5.3 If power supply /data / signalling lines (AC/DC) are carried through
overhead wires or cables above ground to any nearby building or any
location outside the equipment room, additional protection of Stage 2
(Class C) type shall be used at such locations for power supply lines and
Stage 3 protection for signal / data lines.
11.6 Coordinated type Class B & C arrestor shall be provided in a separate

enclosure adjacent to each other. This enclosure should be wall-mounting
type.
11.7 Length of all cable connection from input supply and earth busbar to
SPDs shall be minimum possible. This shall be ensured at installation time.
11.8 Stage 1 & Stage 2 (Class B & C) protection should be from the same
manufacturer/supplier. Manufacturer shall provide Stage 1 & Stage 2
protection. Stage 3 protection shall be got provided by Railways
separately.
11.9 The cross sectional area of the copper conductor for first stage protection
shall not be <16 mm2 and for second stage shall not be < 10mm2
11.10 Batch test report of OEM should be submitted by the manufacturer

/supplier of Lightning & Surge protection devices to the IPS manufacturer
at the time of supply of these devices. Copy of the same shall be
submitted by manufacturer to RDSO at the time of acceptance test of
equipment.
12.0 MARKING
12.1 All markings/ indications shall be easily legible and durable. Where the
marking is by use of labels, the labels shall be metallic and shall be firmly
fixed and shall not be capable of being removed by hand. Durability of
marking shall be checked by rubbing the marking by hand with a piece of
cloth soaked with petroleum spirit. This requirement shall also be met
after completion of climatic test.
Page 32 of 34
12.2 All markings/ indications shall be placed in the vicinity of the components
to which these refer and shall not be placed on removable parts, if these
parts can be replaced in such a way that the marking / indications can
become misleading.
12.3 The words ‘Indian Railway Property’ shall be etched, engraved or

embossed on the equipment at a conspicuous position. For it, the size of
the letters shall be chosen depending upon the equipment but shall not be
less than 20mm high in any case.
12.4 The anodized name plate shall be firmly attached to the equipment and
shall show the following information:
(a) Name or trade mark of the manufacturer.

(b) IRS number.
(c) Serial number of the equipment.
(d) Installation for which meant.
(e) Month and year of manufacture.
(f) Version number.
13.0 DOCUMENTATION
Two copies of the following manuals shall be supplied:
13.1 Instruction Manual

13.2 Installation and Maintenance Manual including Dos & Don’ts.
13.3 Mechanical drawings of each sub-system/ rack.
13.4 Guaranteed performance data, technical & other particulars of the
equipment.
13.5 Schematic block diagram showing mounting arrangement of various

components & details of each type of assembled PCB.
13.6 Trouble shooting procedures along with test voltages and waveforms at
various test points in the PCBs.
13.7 Details of software viz. Source code, algorithm, flow chart, machine code
along with test/ validation procedure used and the results thereof.
13.8 Details of Hardware e.g. schematic diagrams of the system circuits/

components, details for each type of assembled PCB and part-list.
13.9 Pre-commissioning check list.
Page 33 of 34
14.0 PACKING
14.1 The equipment and its sub assemblies shall be wrapped in bubble sheet
and then packed in thermocole boxes and the empty spaces shall be
filled with suitable filling material. All PCBs shall be enclosed in anti-static
shield cover. The equipment shall be finally packed in a wooden case of
sufficient strength so that it can withstand bumps and jerks encountered
in a road/ rail journey.
14.2 Each box shall be marked with code numbers, contents and name of
manufacturer. The upside shall be indicated with an arrow. Boxes should
have standard signages to indicate the correct position and precaution
“Handle with Care” with necessary instructions.
14.3 Printed circuit boards shall be separately and individually packed to

prevent damage.
15.0 OPTIONS TO BE SPECIFIED BY THE PURCHASER
15.1 Whether on line data logging facility is required. (Cl. 5.3.3).
15.2 Location of use of equipment so that applicability of various climatic and

environmental tests as per clause 9.3 is clear.
15.3 Whether 7 KV static discharge test & pantograph interference test is

required to be performed on the equipment or not. (Cl. 9.4).
15.4 Whether for use in RE area.
15.5 Operating voltage. ( Cl 10.1)
*****
Page 34 of 34

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Effective from 14.03.2006 Specification no.

RDSO/ SPN/144/ 2006 Revision: 2

SAFETY AND RELIABILITY REQUIREMENT OF

SPECIFICATION No. RDSO/ SPN/ 144/2006

DOCUMENT DATA SHEET

SAFETY AND RELIABILITY REQUIREMENT OF

Name: Shri G. D. Bhatia

This document defines Safety and Reliability Requirement of Electronic Signalling

DOCUMENT CONTROL SHEET

NAME ORGANIZATION FUNCTION LEVEL

Shrikant Singh RDSO Member Prepare

G.D. Bhatia RDSO Approve

Version Chapter/ Amendment Effective date

RDSO/SPN 144 / 94 FIRST ISSUE 1994

RDSO/SPN 144 / 2004 Revision 1 25.05.2004

RDSO/SPN 144 / 2006 Revision 2 14.03. 2006

S.No. Clause Type of Amendment

S.No. Item Page Number

4.0 Fail-safety requirement 12

9.0 Environmental and Climatic 19

10.0 Power Supply Requirements 29

Serial No. RDSO/ SPN/ 144/2006

0.2 This specification requires reference to the following Indian Railway

(i) IRS: S 96 for DC-DC converters.

1.3 Any special requirement specified in the main specification of the

2.1 The equipment shall be manufactured as per best engineering practices.

2.5 Outsourcing, if any, of any sub-modules or PCB shall be indicated in the

2.7 Version Control:

DXX SXXX HXX

D: Design, S: Software, H: Hardware

2.8 Change of system software

2.8.2 Any supply or installation of modified/ upgraded / improved system

3.0 REQUIREMENTS OF SIGNAL ENGINEERING MANUAL

3.1 Component failure shall be self-detecting by way of causing a signal to

3.6 Due consideration shall be given to the effects of faults in fail-safe

3.9 The physical construction of fail-safe equipment shall be designed to

3.10 For the consideration of the fail-safe feature of an electronic safety

4.0 FAIL-SAFETY REQUIREMENT

4.3 It must be ensured that if a failure of equipment occurs which by itself

(iii) Insertion of PCBs in wrong card slots;

(iv) Earthing of any component or wire or a combination of such

(v) Broken wires, damaged or dirty contacts, failure of a component to

4.5 The equipment shall be so constructed as to prevent unauthorized access.

4.7 System reset arrangement shall be provided as specified in relevant

5.1 COMPONENT TYPES

Metallised polycarbonate (MPCAR)- 5%

5.2 PROTECTION AGAINST ELECTROMAGNETIC INTERFERENCE

To protect against the electromagnetic interference, at least the following

(ii) Shielding at chassis/ rack level.

5.3 DIAGNOSTIC FACILITY

In case of microprocessor based equipment, the system shall be provided

5.3.1 A trouble-shooting chart should be provided indicating the action required

5.3.3 If required by the purchaser, data logging facilities shall be provided as

5.4 HOUSING RACK

5.4.1 19 ″ rack mountable and 3/4/6U high cabinets made of aluminum of

5.4.2 Connectors from WAGO, PHOENIX or any other firm recommended by

5.4.4 Rack shall be earthed.

6.0 PRINTED CIRCUIT BOARD