INVENTEC

500 Main Street, Suite 18

PO Box 989
Deep River, CT 06417 USA

Toll Free: 800.435.0317

Phone: 860.526.8300

NC-559-ASM, No-Clean Solder Paste

Fax: 860.526.8243
www.amtechsolder.com

Product Data Sheet

Product Highlights Available Alloys
n ROL0 flux classification Alloy Temp °C Temp °F
n Exceptional print definition at high printing speeds 63Sn/37Pb 183 361
up to 100mm/sec 62Sn/36Pb/2Ag 179 354
n Long stencil life 62.8Sn/36.8Pb/0.4Ag 179-183 354-361
n Wide process window 60Sn/40Pb 183-191 361-376
n Clear residue 43Sn/43Pb/14Bi 144-163 291-325
n Low voiding 42Sn/58Bi 138 280
n Excellent wetting compatibility on most board 10Sn/88Pb/2Ag 268-290 514-554
finishes
n Compatible with enclosed print heads
n Compatible with high temperature alloys Packaging
(221-300 °C) 500 gram jars
n Print & Dispense grade solder paste available 500 gram cartridges
35 or 100 gram syringes
ProFlow cassettes

Test Results
Test J-STD-004 or Test Requirement Result
other requirements (as stated)
Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough
Corrosion IPC-TM-650: 2.6.15 L: No Corrosion
Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5%
Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop
(No-clean)
Surface Insulation Resistance 85 oC, IPC-TM-650: 2.6.3.7 L: ≥100 MΩ (No-clean)
85% RH @ 168 Hours
Tack Value IPC-TM-650: 2.4.44 54g
Viscosity - Malcom @ 10 RPM/25 C
o
IPC-TM-650: 2.4.34.4 Print: 210-300
(x103mPa/s)- Sn63/Pb37 T3/T4 Dispensing: 100-140
Visual IPC-TM-650: 3.4.2.5 Clear and free
from precipitation
Conflict Minerals Compliance Electronic Industry Citizenship Coalition (EICC) Compliant
REACH Compliance Articles 33 and 67 of Regulation May contain up to 1%
(EC) No 1907/2006 w/w of ethoxylated
4-nonylphenol
NC-559-ASM, No-Clean Solder Paste
Printer Operation Amtech Low Oxide Powder DistributionMicron Size
The following are general guidelines for stencil Micon Size Type Pitch Requirements
printer optimization with NC-559-ASM. Some 45 - 75µ Type-2 24 mil and above
adjustments may be necessary based on your 25 - 45µ Type-3 16 - 24 mil
process requirements. 20 - 38µ Type-4 12 - 16 mil
15 - 25µ Type-5 8 - 12 mil
Print Speed: 25-100 mm/sec 5 - 15µ Type-6 5 - 8 mil
Squeegee Pressure: 70-250g/cm of blade 2 - 11µ Type-7 < 5 mil
Under Stencil Wipe: Once every 10-25 prints, Note: Type-6 and Type-7 may not be available in certain alloys.
Other powder distributions are available on request.
or as necessary

Storage
Stencil Life
Solder paste should be stored between 3-8 °C
>12 hours @ 30-45% RH and 20-25 °C
(37-46 °F) to obtain the maximum refrigerated shelf
~ 4 hours @ 45-75% RH and 20-25 °C
life of six months. Unopened solder paste stored
at room temperature, 25 °C (77 oF) will have a one
Cleaning
month shelf life. Syringes and cartridges should
NC-559-ASM is a no-clean solder paste that can
be stored vertically in the refrigerator with the
be left on the board for many SMT assemblies.
dispensing tip down. Allow 4-8 hours for solder
For applications requiring cleaning, NC-559-ASM
paste to reach an operating temperature of 20-25 °C
can be cleaned using flux residue removers such as
(68-77 oF). Keep the solder paste container sealed
Inventec Disper 607 and Disper 610.
while warming the solder paste to operating
temperature. NEVER FREEZE SOLDER PASTE.

Recommended Profile
Profile for Sn63 and Sn62 Alloys
This profile is designed to serve
250°
as a starting point for process Topside Temperature of board
to be @ 212 – 230°C maximum

optimization using NC-559-ASM.

200°
To achieve better results with
Liquidus temperature for Sn63 and Sn62 alloys
179-183°
Topside Temperature of board
to be @ 170°C at finest
voiding or to reduce tombstoning, 150°
mil pitch in zone prior
to reflow
Flux Activation Temperature
consider using a longer soaking 140°
Temp. (ºC)

Time above liquidus should be

45 – 90 seconds depending on
zone, (140-180 oC) for 60-90 100°
board density, size & population

Temperature Ramp
seconds, with a rapid pre-heat @ < 3.0°C/Second

stage. If there is evidence of 50°

Quick Ramp
to 100°C

solder de-wetting, consider Pre-Heat Soak Reflow Cool

lowering the peak reflow 0°

temperature, or reduce the time

above liquidus to <60 seconds.

Revised December 9, 2015