PNP Switching Silicon Transistor: 2N2904 (A) and 2N2905 (A)
PNP Switching Silicon Transistor: 2N2904 (A) and 2N2905 (A)
MAXIMUM RATINGS
Value
Parameters / Test Conditions Symbol 2N2904 2N2904A Unit
2N2905 2N2905A
Collector-Emitter Voltage V CEO 40 60 V
Collector-Base Voltage V CBO 60 V
MSC – Lawrence
Emitter-Base Voltage V EBO 5.0 V 6 Lake Street,
Thermal Resistance Junction-to-Ambient R ӨJA 195
o
C/W Lawrence, MA 01841
o Tel: 1-800-446-1158 or
Thermal Resistance Junction-to-Case R ӨJC 50 C/W (978) 620-2600
Collector Current IC 600 mA Fax: (978) 689-0803
(1)
Total Power Dissipation @ T A = +25 °C 0.8
(2) PT W MSC – Ireland
@ T C = +25 °C 3.0 Gort Road Business Park,
TJ & Ennis, Co. Clare, Ireland
Operating & Storage Junction Temperature Range -65 to +200 °C Tel: +353 (0) 65 6840044
T stg
Fax: +353 (0) 65 6822298
Notes: 1. For derating, see figures 1 and 2.
Website:
2. For thermal impedance, see figures 3 and 4. www.microsemi.com
PART NOMENCLATURE
V CB = 50 V 2N2904, 2N2905 20 nA
I CBO2
2N2904A, 2N2905A 10 nA
(1)
ON CHARACTERISTICS
Forward-Current Transfer Ratio
I C = 0.1 mA, V CE = 10 V 2N2904 20
2N2905 35
2N2904A 40
2N2905A 75
I C = 1.0 mA, V CE = 10 V 2N2904 25 175
2N2905 50 450
2N2904A 40 175
2N2905A 100 450
I C = 10 mA, V CE = 10 V 2N2904 h FE 35
2N2905 75
2N2904A 40
2N2905A 100
(1) Pulse Test: Pulse Width = 300 µs, duty cycle ≤ 2.0%.
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions Symbol Min. Max. Unit
Small-Signal Short-Circuit Forward-Current
Transfer Ratio
I C = 1.0 mA, V CE = 10 2N2904 25
V, f = 1.0 kHz 2N2905 h fe 50
2N2904A, 2N2905A 40
Small-Signal Short-Circuit Forward-Current
Transfer Ratio
|h fe | 2.0
I C = 50 mA, V CE = 20 V,
f = 100 MHz
Output Capacitance
V CB = 10 V, I E = 0, C obo 8.0 pF
100 kHz ≤ f ≤ 1.0MHz
Iutput Capacitance
V EB = 2.0 V, I C = 0, C ibo 30 pF
100 kHz ≤ f ≤ 1.0MHz
SWITCHING CHARACTERISTICS
Parameters / Test Conditions Symbol Min. Max. Unit
t
Turn-On Time on 45 ns
t
Turn-Off Time off 300 ns
T a (°C) (Ambient)
FIGURE 1
Derating (R θJA ) PCB
DC Operation Maximum Rating (W)
Tc (ºC) (Case)
FIGURE 2
Derating (R θJA ) PCB
GRAPHS (continued)
Theta ( C/W)
o
Time (s)
FIGURE 3
Thermal impedance graph (R θJA )
Theta ( C /W)
o
Time (s)
FIGURE 4
Thermal impedance graph (R θJA )
PACKAGE DIMENSIONS
Dimensions
Symbol Inch Millimeters Note
Min Max Min Max
CD 0.305 0.335 7.75 8.51
CH 0.240 0.260 6.10 6.60
HD 0.335 0.370 8.51 9.40
LC 0.200 TP 5.08 TP 6
LD 0.016 0.021 0.41 0.53 7, 8
LL 0.500 0.750 12.70 19.05 7, 8, 12
LU 0.016 0.019 0.41 0.48 7, 8
L1 0.050 1.27 7, 8
L2 0.250 6.35 7, 8
P 0.100 2.54
Q 0.050 1.27 5
TL 0.029 0.045 0.74 1.14 4
TW 0.028 0.034 0.71 0.86 3
r 0.010 0.25 10
α 45° TP 45° TP 6
NOTES: