Engineering Manual

LOCTITE GC 10 T3 Solder Paste

Suitable for use with: Standard SAC Alloys

GC 10 – The Game Changer

Contents
1. Performance Summary
2. Introduction: Properties, Features & Benefits
3. Operating Parameters
• Printing: Process Window
• Printing: Continuous and Abandon Time Testing
• Slump Testing
• Tack-Life Force
• Reflow Process Window
• Reflow Performance Testing
• Voiding Data
4. Reliability and Specification Testing
5. Operating Parameters: Storage
• Printing & Reflow Performance
6. Product Summary

2 January 26, 2016 Engineering Manual GC 10 Solder Paste

Contents
1. Performance Summary
2. Introduction: Properties, Features & Benefits
3. Operating Parameters
• Printing: Process Window
• Printing: Continuous and Abandon Time Testing
• Slump Testing
• Tack-Life Force
• Reflow Process Window
• Reflow Performance Testing
• Voiding Data
4. Reliability and Specification Testing
5. Operating Parameters: Storage
• Printing & Reflow Performance
6. Product Summary

3 January 26, 2016 Engineering Manual GC 10 Solder Paste

GC 10: Performance Summary

Flux
• Halogen-free flux: passes IC with pretreatment IPC-TM-650
2.3.34/EN14582
• Halogen-free flux classification: ANSI/J-STD-004 Rev. B for
a type ROL0 classification

Paste
• Suitable for printing up to 125mm/s (5”/s)
• Optimized for long hot soak reflow profiles
• Excellent coalescence in air & nitrogen atmosphere
• Excellent humidity resistance
• Excellent solderability on challenging surface finishes,
including CuNiZn
• Colourless residues for easy post-reflow inspection
• Long 12 month shelf-life when stored below 25C

4 January 26, 2016 Engineering Manual GC 10 Solder Paste

Contents
1. Performance Summary
2. Introduction: Properties, Features & Benefits
3. Operating Parameters
• Printing: Process Window
• Printing: Continuous and Abandon Time Testing
• Slump Testing
• Tack-Life Force
• Reflow Process Window
• Reflow Performance Testing
• Voiding Data
4. Reliability and Specification Testing
5. Operating Parameters: Storage
• Printing & Reflow Performance
6. Product Summary

5 January 26, 2016 Engineering Manual GC 10 Solder Paste

Introduction
Basic Solder Paste Properties

Flux Description GC 10
Alloy SAC305
Henkel Powder Size Type 3
Powder Size range, m 45-25
Metal Content, % 88.5
Malcom Viscosity, 10rpm Pa.s 207
TI 0.50
IPC slump @182C (0.33mm x 2.03mm) 0.15
first space no bridge
IPC Solder Balling preferred

6 January 26, 2016 Engineering Manual GC 10 Solder Paste

Introduction
GC 10 Features & Benefits

Product Attribute Process Benefit

Halogen Free • No added halogen
• Measured <900ppm chlorine and bromine and <1,500ppm total by
oxygen (O2) bomb test
Halide Free • Flux classification ROL0 in accordance to J-STD-004B
Application • Designed for printing and pin-in-paste
• Excellent wetting to a broad range of metallisations, even through
long hot soak profiles in an air atmosphere
• Compatible with existing halogen free solutions
• Suitable for medium to large board assemblies
• Designed for long 12 month shelf-life stability without impact to
printing or reflow

7 January 26, 2016 Engineering Manual GC 10 Solder Paste

Introduction
GC 10 Features & Benefits

Product Attribute Process Benefit

Technology Printing • Wide process window for printing and minimal slump
Advantages • Abandon time of up to 2 hours; work life > 16 hours
• Excellent print capability and reduction in print related defects
• Suited for high throughput production, where yield consistency on print
deposits is key
• Improved paste transfer efficiency
• Allows on line paste utilisation protocols to be re-written
Technology Reflow • Optimised for long hot soak reflow processes
Advantages • Very shiny Pb-free solder joints over wide range of reflow
• Excellent coalescence
• Excellent humidity resistance
• Excellent solderability on challenging surface finishes (ENIG, Copper OSP,
CuNiZn and Imm Ag)
Low Voiding • Low void levels increases solder joint reliability
• New chemistries allow pursuit of class 3 void levels in accordance to IPC7095B
on industry surface finishes: ENIG, Copper OSP, CuNiZn and Imm Ag
• Low voiding in CSP/BGA
Residues • Clear, transparent and colourless
• Pin testable after 4x reflows

8 January 26, 2016 Engineering Manual GC 10 Solder Paste

Contents
1. Performance Summary
2. Introduction: Properties, Features & Benefits
3. Operating Parameters
• Printing: Process Window
• Printing: Continuous and Abandon Time Testing
• Slump Testing
• Tack-Life Force
• Reflow Process Window
• Reflow Performance Testing
• Voiding Data
4. Reliability and Specification Testing
5. Operating Parameters: Storage
• Printing & Reflow Performance
6. Product Summary

9 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Print Process Window (LOCTITE GC 10 SAC305 T3 885V)

• Excellent printing in Contour Plot of 0.8mm BGA (0.4mm aperture) Cpk Contour Plot of 0.5mm CSP (0.31mm aperture) Cpk

the range 30 – 0.8BGA Cpk

< 1.33
0.5CSPCpk
< 1.33

120mm/s, 0.4mm to 1.33 – 1.67

1.67 – 2.00
1.33 – 1.67
1.67 – 2.00
0.04 > 2.00 0.04 > 2.00
0.27mm round
apertures Pressure kg/mm

Pressure kg/mm
0.03 0.03

0.02 0.02

40 60 80 100 120 40 60 80 100 120

Speed mm/s Speed mm/s

Contour Plot of 0.30mm diam circles Cpk Contour Plot of 0.5mm BGA (0.27mm aperture) Cpk
0.30mm 0.5BGA Cpk
diam Cpk < 1.33
< 1.33 1.33 – 1.67
1.33 – 1.67 1.67 – 2.00
0.04 1.67 – 2.00 0.04 > 2.00
> 2.00
Pressure kg/mm

Pressure kg/mm
0.03 0.03

0.02 0.02

40 60 80 100 120 40 60 80 100 120

Speed mm/s Speed mm/s

0.8mm, 0.5mm & 0.4mm pitch round apertures, (120µm stencil )

10 January 26, 2016 Engineering Manual GC10 Solder Paste
 Operating Parameters
Print Process Window (LOCTITE GC 10 SAC305 T3 885V)
Contour Plot of 0.28mm diam circles Cpk Contour Plot of 0.25mm diam circles Cpk
0.28mm 0.25mm

• Excellent printing in
diam Cpk
< 1.33
1.33 – 1.67
diam Cpk
< 1.33
1.33 – 1.67
the range 30 – 0.04 1.67 – 2.00
> 2.00
0.04 1.67 – 2.00
> 2.00

120mm/s, 0.28-
Pressure kg/mm

Pressure kg/mm
0.22mm round 0.03 0.03
apertures

• Limited process 0.02 0.02

window with
0.20mm apertures. 40 60 80 100 120 40 60 80 100 120
Speed mm/s Speed mm/s
GC 10 T4 may be
required
Contour Plot of 0.22mm diam circles Cpk Contour Plot of 0.20mm diam circles Cpk
0.22mm 0.20mm
diam Cpk diam Cpk
< 1.33 < 1.33
1.33 – 1.67 1.33 – 1.67
0.04 1.67 – 2.00 0.04 1.67 – 2.00
> 2.00 > 2.00
Pressure kg/mm

Pressure kg/mm
0.03 0.03

0.02 0.02

40 60 80 100 120 40 60 80 100 120

Speed mm/s Speed mm/s

0.28mm – 0.20mm round apertures, (120µm stencil)

11 January 26, 2016 Engineering Manual GC10 Solder Paste

Operating Parameters – Separation Speed
Print Process Window
(LOCTITE GC 10 SAC305 T3 885V)
• Excellent printing in the Separation speed. Cpk
range down to 0.22mm Loctite GC 10 SAC305 T3 885V
round apertures. Variable
• Fast separation speed is 5 Fast
preferable. Medium
Slow
4

Cpk
2
1.67 ref
1.33 ref
1

0
) ) ) ) s s s s s
ap ap ap ap le le le le le
m m m m c irc circ c irc circ c irc
. 4m 5m 31
m
27
m
d ia dia d ia dia d ia
(0 0.3 0. 0. m m m m m
A ( ( ( m m m m m
A P A 28 25 22 20 18
BG BG CS BG
m u m 0. 0. 0. 0. 0.
m
8m m 5m 5m
0. 5m 0. 0.
0.

0.8mm BGA – 0.18mm round apertures, 120m stencil thickness, 60mm/s,10kg

12 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
Continuous Print and Abandon Stability Assessment

Henkel Board 0.8mm BGA to 0.18mm diameter circles Process flow for Henkel print test as shown below

Paste Paste Dry under Print 15 PCBs,

added to stencil kneaded stencil wipe dry wipe every 5

Print 5 PCBs 2hr pause Print 5 PCBs 1hr pause

Blank stencil
Volumes Print 15 PCBs, Volumes
1000 or 2000
Measured dry wipe every 5 Measured
cycles

• Printing • 250mm, 60 squeegee

• DEK Europa • 60mm/s squeegee speed
• Stainless steel, laser cut • Fast separation speed
• 120m thickness • Conditions typical, 22C, 40% RH
• Vacuum tooling • Koh Young KY-8020T volume measurement

13 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
– Abandon Stability 22C/40%RH
Print Process Window (LOCTITE GC 10 SAC305 T3 885V)
• Print Capabilities Abandon time 1hr, 2hr, 2hr + 1 knead
Loctite GC 10 SAC305 T3 885V
• Excellent printing in the
5 Variable
range down to 0.22mm Initial
1hr
round apertures 4 2hr
• Single knead cycle required 2hr + knead
after 2hr abandon at 3
0.20mm round apertures

Cpk
2
1.67 ref
1.33 ref
1

0
) ) ) ) s s s s s
ap ap ap ap r cle
r cle
rcle
rc le
r cle
m m m m ci ci ci ci ci
. 4m 35m 31m 27m dia dia dia dia dia
(0 (0
.
(0
.
(0
.
m m m m m
A
B G GA S P GA
28m 25m 22m 20m 18m
m µB C B 0. 0. 0. 0. 0.
m m m m
8 m m
0. 5m 0.
5
0.
5
0.

0.8mm BGA – 0.15mm round apertures

120m stencil thickness, 60mm/s, fast separation, 250mm squeegee, 10kg

14 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
– Abandon Stability 22C/40%RH
Print Process Window (LOCTITE GC 10 SAC305 T3 885V)

• Transfer Efficiencies Initial

0 .8 mm BGA ( 0 .4 mm ap)
1 hr ab 2 hr ab Initial
0 .5 mm BGA (0 .3 4 mm ap)
1 hr ab 2 hr ab
160 160
1.5 Vnom 1.5 Vnom

• Excellent printing in the

Transfer Efficiency %
120 120

Transfer Efficiency %
_ _
range 0.40mm down to _
X=98.5 X=97.7 X=94.4 _
X=88.8
_
X=86.9
_
X=85.6
0.27mm round apertures 80 80

0.5 Vnom 0.5Vnom

40 40

0 0
1 3 5 7 9 11 13 15 17 19 21 23 25 1 3 5 7 9 11 13 15 17 19 21 23 25
Print No. Print No.

0 .5 mm C SP ( 0 .3 1 mm ap) 0 .5 mm BGA (0 .2 7 mm dia ap)

Initial 1 hr ab 2 hr ab Initial 1 hr ab 2 hr ab
160 160
1.5 Vnom 1.5 Vnom
Transfer Efficiency %

Transfer Efficiency %
120 120

_
X=84.7 _
80 _ _ _ _
X=84.9 X=83.2
80
X=84.7 X=83.5 X=82.4

0.5V nom 0.5 Vnom

40 40

0 0
1 3 5 7 9 11 13 15 17 19 21 23 25 1 3 5 7 9 11 13 15 17 19 21 23 25
Print No. Print no.

0.8mm BGA – 0.5mm BGA round apertures

120m stencil thickness, 60mm/s, fast separation, 250mm squeegee, 10kg

15 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
– Abandon Stability 22C/40%RH
Print Process Window (LOCTITE GC 10 SAC305 T3 885V)
• Transfer Efficiencies 0 .2 5 mm dia r ound aper tur es 0 .2 2 mm dia r ound aper tur es
Initial 1 hr ab 2 hr ab Initial 1 hr ab 2 hr ab
160 160

• Excellent printing in the 1.5 Vnom 1.5 Vnom

range down to 0.22mm

Transfer Efficiency %

Transfer Efficiency %
120 120 _
_ _ X=96.3
round apertures X=92.0 X=92.1
_ _ _
• Single knead cycle for best 80 X=90.6 80
X=96.1 X=95.0

results after 2hr abandon at 0.5 Vnom 0.5 Vnom

40 40
0.20mm round apertures
and below 0 0
1 3 5 7 9 11 13 15 17 19 21 23 25 1 3 5 7 9 11 13 15 17 19 21 23 25
Print No. Print No.

0 .2 0 mm dia r ound aper tur es 0 .1 8 mm dia r ound aper tur es

Initial 1 hr ab 2 hr ab Initial 1 hr ab 2 hr ab
160 160
1.5 Vnom 1.5 Vnom
Transfer Efficiency %

Transfer Efficiency %
120 120 _
X=95.1
_ _ _ _
X=99.6 X=99.4 X=94.6 _
80 X=95.7 80 X=88.3

0.5 Vnom 0.5 Vnom

40 40

0 0
1 3 5 7 9 11 13 15 17 19 21 23 25 1 3 5 7 9 11 13 15 17 19 21 23 25
Print No. Print No.

0.28mm – 0.20mm round apertures

120m stencil thickness, 60mm/s, fast separation, 250mm squeegee, 10kg

16 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
– Continuous Print Stability
Print Process Window (LOCTITE GC 10 SAC305 T3 885V)
• Print Capabilities
Continuous Print Stability 1000 cycles, 2000 cycles
• No impact on print Loctite GC 10 SAC305 T3 885V
performance after 8 hours
Variable
(1000 cycles) and 16 hours 5 Initial
(2000 cycles) printing 1,000 cycles
4 2,000 cycles

Cpk 2
1.67 ref
1.33 ref
1

0
) ) ) ) s s s s s
ap ap ap ap r cle c le cle c le cle
m m m m ci c ir cir c ir cir
. 4m 35m 31m 27m di
a
di
a
di
a
di
a
di
a
(0 (0.
( 0.
(0.
m m m m m
A
BG GA SP GA 8m 5m 2m 0m 8m
µB C B 0.2 0 .2 0 .2 0 .2 0 .1
m m m
8m m
5m 5m
0. 5m . .
0. 0 0

0.8mm BGA – 0.18mm round apertures, 120m stencil thickness,

60mm/s, Fast separation, 250mm squeegee, 10kg

17 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
– Continuous Print Stability
Print Process Window (LOCTITE GC 10 SAC305 T3 885V)
• Transfer Efficiencies 0 .8 mm BGA ( 0 .4 mm ap) 0 .5 mm BGA (0 .3 4 mm ap)
Initial 1000 prints 2000 prints Initial 1000 prints 2000 prints
160 160

• No impact on print 1.5 V nom 1.5 Vnom

performance after 8 hours

Transfer Efficieny %
120 120

Transfer Effiency %
_ _ _
X=98.5 X=96.5 _ _
(1000 cycles) and 16 hours X=94.1 X=88.8 X=87.2
_
X=83.8

(2000 cycles) printing 80 80

0.5 Vnom 0.5 Vnom

40 40

0 0
1 5 9 13 17 21 25 29 33 37 41 45 1 5 9 13 17 21 25 29 33 37 41 45
Print No. Print No.

0 .5 mm C SP ( 0 .3 1 mm ap) 0 .5 mm BGA ( 0 .2 7 mm ap)

Initial 1000 prints 2000 prints Initial 1000 prints 2000 prints
160 160
1.5 Vnom 1.5 Vnom
Transfer Efficiency %

Transfer Efficiency %
120 120
_ _
_ _ _ X=84.7 X=83.5 _
X=84.7 X=84.0 X=80.8 X=80.9
80 80

0.5 Vnom 0.5 Vnom

40 40

0 0
1 5 9 13 17 21 25 29 33 37 41 45 1 5 9 13 17 21 25 29 33 37 41 45
Print No. Print no.

0.8mm BGA – 0.5mm BGA round apertures, 120m stencil thickness,

60mm/s, Fast separation, 250mm squeegee, 10kg

18 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
– Continuous Print Stability
Print Process Window (LOCTITE GC 10 SAC305 T3 885V)
• Transfer Efficiencies 0 .2 5 mm dia r ound aper tur es 0 .2 2 mm dia r ound aper tur es
Initial 1000 prints 2000 prints Initial 1000 prints 2000 prints
160 160
1.5 Vnom 1.5 Vnom

• No impact on print

Transfer Efficiency %

Transfer Efficiency %
120 120 _ _
_ _ _
_ X=96.3 X=93.9
X=92.0 X=89.6
performance after 8 hours X=89.0 X=85.5

(1000 cycles) and 16 hours 80 80

(2000 cycles) printing 0.5 Vnom 0.5 Vnom

40 40

0 0
1 5 9 13 17 21 25 29 33 37 41 45 1 5 9 13 17 21 25 29 33 37 41 45
Print No. Print No.

0 .2 0 mm dia r ound aper tur es 0 .1 8 mm dia r ound aper tur es

Initial 1000 prints 2000 prints Initial 1000 prints 2000 prints
160 160
1.5 Vnom 1.5 Vnom

_ _
Transfer Efficiency %

120 _ 120 _ _ _

Transfer Efficiency %
X=99.6 X=96.9 X=95.1 X=92.7
X=91.9 X=87.2

80 80

0.5 Vnom 0.5 Vnom

40 40

0 0
1 5 9 13 17 21 25 29 33 37 41 45 1 5 9 13 17 21 25 29 33 37 41 45
Print No. Print no.

0.28mm– 0.20mm round apertures, 120m stencil thickness,

60mm/s, Fast separation, 250mm squeegee, 10kg

19 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow)
Paste Properties After Continuous Printing
Profile 2
1,000 cycles 2,000 cycles 300

Initial (8 hours) (16 hours)

250
22°C, 40%RH 22°C, 40%RH 217°C

Temperature (°C)
200

150
0.5mm CSP

100

50

0
0 1 2 3 4 5 6
Time (min)
6.5mm Overprint

• No change to reflow performance after 16hours

printing (2000 print cycles)

20 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
Slump
• Slump evaluation was performed in accordance with J-STD-005A, IPC-TM-650 2.4.35
• First spacing with no bridge recorded after 10 minutes at 182C (35C below melting point 217C)

Stencil A 21 A 20
Design/ 200m 100m
thickness

Aperture 0.63 x 0.33 x 0.33 x 0.20 x

2.03mm 2.03mm 2.03mm 2.03mm

Pass
0.63mm 0.30mm 0.30mm 0.25mm
mark

GC 10
0.33mm 0.10mm 0.08mm 0.075mm
25C

GC 10
0.33mm 0.15mm 0.15mm 0.125mm
182C

A21 A20
200m 100m

21 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Tack Force

• Tackiness evaluation was performed in accordance with J-STD-005A,

IPC-TM-650 2.4.44
• GC10 tack-life >48hours

IPC Tack force gF

100
90
80
70 Malcom TK1 Tackiness Tester
Tack Force gF

60
50
40
30
20
Preload 300g
10
Preload time 5 secs
0
0 6 16 24 48 Retraction Speed 2.5mm/sec
Time hours
Deposit diameter 5.1mm
Tack force gF 80% Peak Tack Force
Deposit height 0.25mm

22 January 26, 2016 Engineering Manual GC10 Solder Paste

Operating Parameters
Solder Balling
• Solder balling performance as been assessed in accordance with
an extended version of IPC-TM-650 2.4.4.3
• Clear and colourless residues observed post-reflow

Initial 24hrs 25C 50% RH

Preferred Pass Preferred Pass

23 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
Reflow Process Window (Air)
• LOCTITE GC 10 solder paste offers halogen containing reflow performance in a
truly halogen free formulation
• GC 10 shows excellent coalescence onto a range of PCB and component finishes
especially during long-hot profiles
• There is no single profile that works for all applications and each process should be
assessed individually, under laboratory conditions the following profiles have been
found to give good results
• These process window guidelines are suitable for Type 3 SAC powder

Reflow Profiles Profile 1 2 3 4

300
Profile 1
Profile 2
250 Profile 3 Peak Temp (°C) 244 254 260 255
Profile 4
217°C
Time to Peak (min) 3.3 4.5 5.1 6.0
Temperature (° C)

200

150 (No
Soak Time (150-200°C) (min) Soak) 2.35 2.80 3.44
100
1.0
50
Time above Liquidus (min) 0.62 1.46 1.75 1.45
0
0 1 2 3 4
Time (minutes)
5 6 7 Time above Liquidus (sec) 37.2 87.6 105.0 87.0

24 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow)

Reflow Profiles
300

Reflow Profile 250

Profile 1
Profile 2
Profile 3
Profile 4
217°C

T e mp e r a t u r e ( ° C )
200

150

1 2 3 4 100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
1206 chips
0603 chips
0402 chips

25 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow)

Reflow Profiles
300

Reflow Profile 250

Profile 1
Profile 2
Profile 3
Profile 4
217°C

T e mp e r a t u r e ( ° C )
200

150

1 2 3 4 100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
Overprinted
Solder ball
0.5mm CSP56
0.4mm TQFP120

26 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow – GC10)

Reflow Profiles

Reflow Profile
Profile 1
250 Profile 2

217°C
200

Temperature (°C)
2 4
150

100

50

0 1 2 3 4 5 6
Time (minutes)
0201 chips
0402 chips
1206 chips

27 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow – GC10)

Reflow Profiles

Reflow Profile
Profile 1
250 Profile 2

217°C
200

Temperature (°C)
150

1 2 100

50

0 1 2 3 4 5 6
Time (minutes)
0.4mm TQFP
0.5mm CSP56

28 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
Voiding
• Void performance assessed using 4 different reflow profiles.
• 0.5mm CSP, 120µm stencil 300
Reflow Profiles

Profile 1
Profile 2

•
250 Profile 3
Profile 4

With component, 0.5mm CSP, SAC305 balls 217°C

T e mp e r a t u r e ( ° C )
200

• GC 10 shows low levels of voiding over a range of profiles

150

100

• Void Percentage analysed in accordance with IPC7095B 50

0
0 1 2 3 4 5 6 7
Time (minutes)

Boxplot of IPC Voiding Percentage Line Plot of No. of Voids

10
20 Class 1

8
15 Class 2
IPC voiding %

% Voiding
6

10 Class 3

5
2

0
0
Profile 1 Profile 2 Profile 3 Profile 4 Profile 1 Profile 2 Profile 3 Profile 4

GC 10 meets IPC7095B class 3

29 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters
2nd side reflow
Reflow Profiles

2nd second side reflow profile

300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

T e mp e r a t u r e ( ° C )
200

150

1 2 3 4 100

50

0
0 1 2 3 4 5 6 7
0.5mm CSP 56

Time (minutes)
0201
0402

30 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
Voiding after 2nd side reflow
• Void performance assessed using 4 different reflow profiles.
• 0.5mm CSP, 120µm stencil 300
Reflow Profiles

Profile 1
Profile 2

•
250 Profile 3
Profile 4

With component, 0.5mm CSP, SAC305 balls 217°C

T e mp e r a t u r e ( ° C )
200

• GC 10 shows no deterioration in voiding with pre reflowed boards

150

100

50

0
0 1 2 3 4 5 6 7
Time (minutes)

Boxplot of % voiding Line Plot of No. of voids

GC 10 T3
10 Pre reflow
No pre-reflow
20 Class 1
pre-reflowed

8
15 Class 2
Percentage

No. of Voids
10 Class 3

Profile Profile 1 Profile 2 Profile 3 Profile 4 Profile 1 Profile 2 Profile 3 Profile 4 0

Pre reflow No pre-reflow pre-reflowed
Profile 1 Profile 2 Profile 3 Profile 4

GC 10 meets IPC7095B class 3

31 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters
Pin Testing
Reflow Profiles
300

Before After 250

Profile 1
Profile 2
Profile 3
Profile 4
217°C

Test Test

T e mp e r a t u r e ( ° C )
200

150

100

50

0
0 1 2 3 4 5 6 7
Time (minutes)

Board
Stencil 100m

Pads 500 pads per board, 2 boards tested

Probe 0.9mm 4 point plain crown light spring probe 100g spring force

Profiles 4 reflow profiles

No. of reflow 1, 2, 3 & 4 passes through oven

Atmosphere Air & 1000ppm O2

Time after reflow 1 day, 1 week

32 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Pin Testing
Reflow Profiles
300

Reflow Profile (% after 1000 tests) 250

Profile 1
Profile 2
Profile 3
Profile 4
217°C

T e mp e r a t u r e ( ° C )
200

150

1 2 3 4 100

50

100% 100% 100% 99.5% 0

0 1 2 3 4 5 6 7
1 reflow

Time (minutes)

100% 100% 99.6% 99.9%

2 reflows

99.9% 100% 100% 98.9%

3 reflows

99.9% 100% 100% 98.5%

4 reflows

33 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Pin Testing
Reflow Profiles
300

Reflow Profile (% after 1000 tests) 250

Profile 1
Profile 2
Profile 3
Profile 4
217°C

T e mp e r a t u r e ( ° C )
200

150

1 2 3 4 100

50

100% 100% 100% 100% 0

0 1 2 3 4 5 6 7
Reflowed in N2

Time (minutes)

100% 99.9% 99.8% 99.6%

1 day after reflow
1 week after reflow

100% 99.8% 99.3% 99.6%

34 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Surface Finish
Reflow Profiles
300

Reflow Profile (0.5mm CSP56) 250

Profile 1
Profile 2
Profile 3
Profile 4
217°C

T e mp e r a t u r e ( ° C )
200

150

1 2 3 4 100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
OSP Finish
Silver Finish
Tin Finish

35 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Surface Finish
Reflow Profiles
300

Reflow Profile (0201) 250

Profile 1
Profile 2
Profile 3
Profile 4
217°C

T e mp e r a t u r e ( ° C )
200

150

1 2 3 4 100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
OSP Finish
Silver Finish
Tin Finish

36 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Surface Finish
Reflow Profiles
300

Reflow Profile (0402) 250

Profile 1
Profile 2
Profile 3
Profile 4
217°C

T e mp e r a t u r e ( ° C )
200

150

1 2 3 4 100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
OSP Finish
Silver Finish
Tin Finish

37 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Surface Finish
Reflow Profiles
300

Reflow Profile (6.5mm overprinted solder ball) 250

Profile 1
Profile 2
Profile 3
Profile 4
217°C

T e mp e r a t u r e ( ° C )
200

150

1 2 3 4 100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
OSP Finish
Silver Finish
Tin Finish

38 January 26, 2016 Engineering Manual GC 10 Solder Paste

Reliability and Specification Testing
Head in Pillow Test Head in Pillow
Time to first defect

14

• Print solder paste on a Cu plate, 0402 pad, stencil thickness 12

Average Time (s)

125µm. 10

• When the solder paste starts to melt, place a solder sphere 8

6
(SAC305, 0.76mm diameter) on the printed solder paste
• Place another sphere after 3sec, 6 sec, 9sec… until the 4

2
solder sphere no-longer coalesces
• Flux activity at elevated temperatures – up to 20% longer 0
10 A B C D E F G
or or or or or or or
than industry standard – helping to reduce HiP GC tit tit tit tit tit tit tit
pe pe pe pe pe pe pe
m m m m m m m
Co Co Co Co Co Co Co
Paste

Place a solder
sphere onto
printed paste

…..
…..
250+/-5˚C 250+/-5˚C
Copper plate Initial 3sec 6 sec First
Solder paste 1st sphere 2nd sphere 3rd sphere Defect
Solder sphere

39 January 26, 2016 Engineering Manual GC 10 Solder Paste

Reliability and Specification Testing
J-STD- 004B

Standard Test Result

Pass
Cu Corrosion

GC 10 Control
ANSI/ Pass
Cu Mirror
J-STD-004B

Halogen Pass (no added halogen)

6.0x1011 Ohms after 7days

Surface Insulation Resistance Pass

Electromigration Pass 5.0x1010 Ohms after 21days

GC 10 J-STD-004B classification ROL0

40 January 26, 2016 Engineering Manual GC 10 Solder Paste

Reliability and Specification Testing
3rd Party Testing
• SGS report for GC 10
• Sample reflowed flux residue
• Reference EN14582/IC Analysis
• To meet halogen free requirements
• Br<900ppm, Cl <900ppm, and combined <1500ppm

• Halogen – Fluorine - ND
• Halogen – Chorine - ND
• Halogen – Bromine – ND
• Halogen – Iodine – ND

GC 10 has no detectable halogen and is designated as halogen free

41 January 26, 2016 Engineering Manual GC 10 Solder Paste

Reliability and Specification Testing
IPC J-STD 004B
ReflowProfiles
Reflow Profiles
Profile 11
Profile
250
250 Profile 22
Profile

217°C
217°C
200
200

(° C)
Temperature (°C)
Temperature
150
150

100
100

50
50

0
0 11 22 3
3 4
4 55 66
Time(minutes)
Time (minutes)

42 January 26, 2016 Engineering Manual GC 10 Solder Paste

Contents
1. Performance Summary
2. Introduction: Properties, Features & Benefits
3. Operating Parameters
• Printing: Process Window
• Printing: Continuous and Abandon Time Testing
• Slump Testing
• Tack-Life Force
• Reflow Process Window
• Reflow Performance Testing
• Voiding Data
4. Reliability and Specification Testing
5. Operating Parameters: Storage
• Printing & Reflow Performance
6. Product Summary

43 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters: Storage
Printing After Storage 12 months 25C

• Print Capabilities
Abandon time after storage 1hr, 2hr, 2hr + 1 knead
• Excellent print capability Loctite GC 10 SAC305 T3 885V 12 months 25°C
6 Variable
after storage for 12 months
Initial
@ 25C 5 1hr
• No knead cycle required 2hr
after 2hrs abandon down to 4 2hr + k nead

0.22mm round apertures 3

Cpk
2
1.67 ref
1 1.33 ref

0
) ) ) ) es es es es es
ap ap ap ap r cl rcl r cl r cl rcl
m m m m ci c i ci ci c i
m 5m 1m 7m a a a a a
0.4 . 3 . 3 . 2 di di di di di
( (0 (0 (0 m m m m m
A m m m m
BG GA S P GA 8 5 2 0 18m
m µB m
C
m
B
0.
2
0.
2
0.
2
0.
2 0.
.8m m m m
0 5m 0.
5
0.
5
0.

0.8mm BGA – 0.18mm round apertures, 120m stencil thickness, 60mm/s,

Fast separation, 250mm squeegee, 10kg

44 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters: Storage
Printing After Storage 12 months 25C

• Print Capabilities Continuous Print Stability after storage 1,000 cycles

• Excellent print capability Loctite GC 10 SAC305 T3 885V 12 months 25°C
6 Variable
after storage for 12 months
Initial
@ 25C 5 1,000 cy cles
• Excellent print performance
after 1000 cycles down to 4
0.22mm round apertures
3

Cpk
2
1.67 ref
1.33 ref
1

0
) ) ) ) s s s s s
ap ap ap ap rc
le
rc
le
ri c
le
ri c
le
ri c
le
m
m m m m ci ci c c c
.4 35m 31m 27m di
a
di
a
di
a
di
a
di
a
(0 (0. ( 0. ( 0. m m m m m
A m m m m m
BG BGA C SP BGA 28 25 22 20 . 18
m µ 0. 0 . 0 . 0 . 0
m m
. 8m m
m
5 m 5 m
0 5 0. 0.
0.

0.8mm BGA – 0.18mm round apertures, 120m stencil thickness, 60mm/s,

Fast separation, 250mm squeegee, 10kg

45 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters: Storage
Printing After Storage 12 months 25C

• Transfer Efficiencies 0.8mm BGA (0.4mm apertures) 0.5mm BGA (0.34mm apertures)
Initial 1 hr ab 2 hr ab 1000 prints Initial 1 hr ab 2 hr ab 1000 prints
160

•
160
Excellent print capability 1.5 Vnom 1.5 Vnom

after storage for 12 months

Transfer Efficiency %
Transfer Efficiency %
120 120
_ _ _ _
X=97.5 _ _
_
@ 25C X=98.9
_
X=95.5 X=90.9
X=88.7
X=88.3
X=86.0
X=98.6
80 80
1

• No knead cycle required 0.5 Vnom 0.5 Vnom

40
after 2hrs abandon 40

0
• Excellent print
0
1 5 9 13 17 21
Print No.
25 29 33 37 1 5 9 13 17 21
Print No.
25 29 33 37

performance after 1000

cycles 0.5mm CSP (0.31mm apertures) 0.5mm BGA (0.27mm apertures)
Initial 1 hr ab 2 hr ab 1000 prints Initial 1 hr ab 2 hr ab 1000 prints
160 160
1.5 Vnom 1.5 Vnom
Transfer Efficiency %

Transfer Efficiency %
120 120
_ _ _
_ _ _
X=88.1 X=84.8 X=88.1 X=85.7
X=85.8 X=84.3
_ _
80 80
X=87.3 X=85.6

0.5 Vnom 0.5 Vnom

40 40

0 0
1 5 9 13 17 21 25 29 33 37 1 5 9 13 17 21 25 29 33 37
Print No. Print No.

0.8mm BGA – 0.5mm BGA, 120m stencil thickness, 60mm/s,

Fast separation, 250mm squeegee, 10kg

46 January 26, 2016 Engineering Manual GC 10 Solder Paste

Operating Parameters: Storage
Printing After Storage 12 months 25C

• Transfer Efficiencies 0.25mm dia round apertures 0.22mm dia round apertures
Initial 1 hr ab 2 hr ab 1000 prints Initial 1 hr ab 2 hr ab 1000 prints

•
160 160
Excellent print capability 1.5 Vnom 1.5 Vnom

after storage for 12 months _

Transfer Efficiency %

Transfer Efficiency %
120 _ _ _ 120 X=101.6
X=96.5 X=94.5 X=91.8
@ 25C _ _ _ _
80 X=96.0 80 X=101.8 X=100.6 X=97.1

• No knead cycle required 0.5 Vnom 0.5 Vnom

40 40
after 2hrs abandon
0 0
• Excellent print 1 5 9 13 17 21
Print no.
25 29 33 37 1 5 9 13 17 21
Print No.
25 29 33 37

performance after 1000

cycles 0.2mm dia round apertures 0.18mm dia round apertures
Initial 1 hr ab 2 hr ab 1000 prints Initial 1 hr ab 2 hr ab 1000 prints
160 160
1.5V nom 1.5 Vnom
_ _ _ _
X=108.4 X=101.9 _ X=99.2 X=98.5
Transfer Efficiency %

Transfer Efficiency %
120 120
X=102.0

_ _
X=103.5 _
80 X=100.0 80 X=92.7

0.5 Vnom 0.5 Vnom

40 40

0 0
1 5 9 13 17 21 25 29 33 37 1 5 9 13 17 21 25 29 33 37
Print no. Print No.

0.25mm – 0.18mm round apertures, 120m stencil thickness, 60mm/s,

Fast separation, 250mm squeegee, 10kg

47 January 26, 2016 Engineering Manual GC 10 Solder Paste

 Operating Parameters: Storage
Reflow After Storage to 12months 25C
Profile 2

After Paste storage 300

250

217°C

Temperature (°C)
200

12m 25°C
150

Initial 1m 40°C 6m 25°C 100

50

0
0 1 2 3 4 5 6
Time (min)
0.5mm CSP
0201
0402

48 January 26, 2016 Engineering Manual GC 10 Solder Paste

Contents
1. Performance Summary
2. Introduction: Properties, Features & Benefits
3. Operating Parameters
• Printing: Process Window
• Printing: Continuous and Abandon Time Testing
• Slump Testing
• Tack-Life Force
• Reflow Process Window
• Reflow Performance Testing
• Voiding Data
4. Reliability and Specification Testing
5. Operating Parameters: Storage
• Printing & Reflow Performance
6. Product Summary

49 January 26, 2016 Engineering Manual GC 10 Solder Paste

GC 10: Performance Summary

Flux
• Halogen-free flux: passes IC with pretreatment IPC-TM-650
2.3.34/EN14582
• Halogen-free flux classification: ANSI/J-STD-004 Rev. B for
a type ROL0 classification

Paste
• Suitable for printing up to 125mm/s (5”/s)
• Optimized for long hot soak reflow profiles
• Excellent coalescence in air & nitrogen atmosphere
• Excellent humidity resistance
• Excellent solderability on challenging surface finishes,
including CuNiZn
• Colourless residues for easy post-reflow inspection
• Long 12 month shelf-life when stored below 25C

50 January 26, 2016 Engineering Manual GC 10 Solder Paste

Thank you!