A 350-MS S Continuous-Time DeltaSigma Modulator With A Digitally Assisted Binary-DAC and A 5-Bits Two-Step-ADC Quantizer in 130-nm CMOS
A 350-MS S Continuous-Time DeltaSigma Modulator With A Digitally Assisted Binary-DAC and A 5-Bits Two-Step-ADC Quantizer in 130-nm CMOS
A 350-MS S Continuous-Time DeltaSigma Modulator With A Digitally Assisted Binary-DAC and A 5-Bits Two-Step-ADC Quantizer in 130-nm CMOS
9, SEPTEMBER 2015
Abstract— Two techniques to improve the performance of A drawback of DEM is that the required shuffling of all
continuous-time delta–sigma (CTDS) modulators are presented. DAC elements dramatically increases the circuit complexity
A digital calibration technique is introduced to enable the as a function of the number of involved current cells [5].
use of binary current digital-to-analog converters (DACs) with-
out dynamic element matching. Furthermore, a high-speed This results in an excess loop delay (ELD) in the modulator’s
two-step analog-to-digital data converter quantizer is introduced feedback path which can cause the DAC pulse to be shifted
to efficiently increase the resolution of the quantizer in CTDS into the next clock cycle. This effectively increases the order
modulators with high-sampling rates. A proof-of-concept proto- of the loop filter, potentially destabilizing the modulator,
type implemented in 130-nm CMOS shows that the proposed cal- and degrading its noise-shaping performance, particularly in
ibration technique can compensate for up to 5% of mismatch in
the DAC elements. The modulator has a measured SNDR/SFDR high-speed CTDS modulators [6], [7].
of 60.3/74 dB for a sampling rate of 350 MS/s and oversampling A promising technique to substitute the DEM block is DAC
ratio of 20, translating to an 8.75-MHz bandwidth. The total calibration. There are limited reported works on DAC cali-
power consumption is 5.5 mW from a 1.6 V supply. bration in CTDS modulators [2], [8]–[11]. These techniques
Index Terms— Continuous-time, delta–sigma modulator, are reported for unary DAC structures. Thus, the complexity
self-calibration, two-step analog-to-digital data converter (ADC). of these techniques (e.g., the number of switches and their
I. I NTRODUCTION control signals, the number of unit element in the layout, etc.)
can significantly increase when applying the technique in a
C ONTINUOUS-TIME delta–sigma (CTDS) modulators
are an efficient option to realize medium-to-high-
resolution/low-to-medium-bandwidth analog-to-digital data
higher resolution DAC.
This paper proposes a digital DAC self-calibration technique
converters (ADCs). Current-mode digital-to-analog convert- that can be used in binary current-mode DACs. The proposed
ers (DACs) are widely used as one of the building blocks calibration technique is a foreground method and requires no
in CTDS modulators. These DACs must be extremely linear significant additional analog circuitry. The digital correction
to attain sufficient linearity for the modulator. Conventionally, block used to implement the calibration is also very simple
single-bit DACs that are inherently linear are utilized in due to the limited number of correction coefficients necessary
delta–sigma modulators. However, they are sensitive to clock for the binary output of the modulator.
jitter [1]. Furthermore, in single-loop delta–sigma modulators Traditionally, delta–sigma modulators utilize a unary DAC
with high integrator gain to maximize the signal-to-noise architecture, where the complexity is dramatically increased
ratio (SNR), they can result in an unstable output [2]–[4]. by the DAC resolution. However, the proposed DAC cali-
Accordingly, multibit DACs are required to attain less sensi- bration allows the proposed CTDS modulator to employ a
tivity to clock jitter [1] and stable operation with a good SNR binary DAC architecture without DEM. Thus, due to the
in high-order modulators. simplicity of the binary DAC cell, increasing DAC resolu-
The inherent current-cell mismatches in the current-mode tion becomes practical, and the resolution of the modulator’s
DACs of a multibit structure limit the linearity performance quantizer is also increased. Although flash ADCs are the
of the CTDS modulator. To mitigate this problem, dynamic common architecture to realize the quantizer, they require
element matching (DEM) techniques are usually utilized to many comparators and a relatively large encoder, complicating
shape the DAC element mismatch errors to high frequencies. the design of the quantizer. Alternatively, a two-step ADC
quantizer is a good candidate to increase the quantizer’s
Manuscript received February 28, 2014; revised July 10, 2014; accepted resolution without requiring many comparators and a large
August 25, 2014. Date of publication September 15, 2014; date of current digital encoder (see [12], [13] in discrete-time modulators).
version August 21, 2015.
M. Taherzadeh-Sani is with the Department of Electrical Engineering, Thus, in this paper, a multibit two-step-ADC quantizer, along
Ferdowsi University of Mashhad, Mashhad 91779-48974, Iran (e-mail: with a foreground digital binary-DAC calibration technique,
[email protected]). is introduced within the CTDS modulator.
F. Nabki is with the CoFaMic Research Centre, Université du Québec à
Montréal, Montréal, QC H2L 2C4, Canada (e-mail: [email protected]). As a proof-of-concept, a second-order CTDS modula-
Digital Object Identifier 10.1109/TVLSI.2014.2352463 tor that utilizes the proposed techniques was implemented
1063-8210 © 2014 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.
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TAHERZADEH-SANI AND NABKI: 350-MS/s CTDS MODULATOR 1915
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1916 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, VOL. 23, NO. 9, SEPTEMBER 2015
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TAHERZADEH-SANI AND NABKI: 350-MS/s CTDS MODULATOR 1917
TABLE I
S TATES OF A LL P HASES ϕi D URING THE DAC C ALIBRATION
TABLE II
E STIMATED VALUES OF THE DAC E LEMENTS D URING M EASUREMENTS
OF A T YPICAL D IE U SING THE P ROPOSED C ALIBRATION T ECHNIQUE
Fig. 7. Measured output SNDR versus the input amplitude of the modulator.
normal operation. Note that a calibration technique based on
similar toggling of the DAC unit elements is also presented
in [18] for a discrete-time delta–sigma modulator. However, 40.4, and 40.9 dB, respectively, at an 8.75-MHz bandwidth
it utilizes extra DAC elements to estimate the coefficient (sampling rate of 350 MS/s and OSR of 20). As shown in
errors, and not the modulator DAC itself. As demonstrated Fig. 6(b), with the same bandwidth, the proposed calibration
in Section V, the proposed calibration technique can estimate technique improves the SNDR, SNR, and SFDR values to
a relatively large current-mismatch value of 5%. 60.3, 62, and 74 dB, respectively. In addition, the modulator’s
dynamic range is 65 dB after calibration, as can be seen
V. M EASUREMENT R ESULTS in Fig. 7. The total power consumption of the circuit is 5.5 mW
from a 1.6-V supply voltage.
The second-order CTDS modulator that utilizes the pro-
Table III lists the performance summary of the presented
posed techniques was implemented in a 130-nm CMOS tech-
CTDS modulator, outlining its main conversion characteristics
nology. A chip micrograph is shown in Fig. 5. The circuitry
and its performance before and after calibration. Fig. 8 shows
occupies an active area of 260 μm × 300 μm. Measure-
a comparison of the presented CTDS modulator to state-of-
ments of this proof-of-concept prototype demonstrated that
the-art CTDS modulators in 130-nm CMOS. The following
the proposed calibration technique can calibrate up to 5% of
figure of merit (FOM) is used here:
mismatch in the DAC elements. Note that, in this design, the
DAC elements were sized intentionally small to be relatively Power
FOM = (2)
highly mismatched. Table II shows the DAC mismatch values 2 × BW × 2ENOB
that were estimated using the proposed calibration technique. where BW represents the modulator bandwidth, and ENOB is
As shown in Fig. 6(a) before calibration, the measurements the effective number of bits. Although the goal of this paper
of the modulator show an SNDR, SNR, and SFDR of 35.5, is to provide a proof-of-concept design for the two presented
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1918 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, VOL. 23, NO. 9, SEPTEMBER 2015
A PPENDIX
In summary, in the proposed DAC calibration technique,
by two consecutive measurements in which the code of B2 is
toggled, the ratio of I2 /I1 is extracted. This Appendix aims
at briefly presenting the mathematical details of the proposed
calibration technique.
Toggling code B2 from −1 to +1, is equivalent to adding
an error signal to the DAC output with a normalized value of
2I2
E DAC = (A.1)
IREF
Fig. 8. Comparison of this work to state-of-the-art delta–sigma where IREF is the differential reference current of the DAC.
modulators implemented in 130-nm CMOS that are reported in the
International Solid-State Circuits Conference (ISSCC) or the Symposium on Since the DAC is a single-bit DAC with IREF = 2I1
VLSI Circuits (VLSI) [19].
I2
E DAC = . (A.2)
I1
techniques, its FOM remains comparable with the state-of- This error signal goes to the modulator’s output through the
the-art CTDS modulators in 130-nm CMOS, while providing DAC error transfer function of
advantages with regards to design simplicity in the increased-
H (z)
resolution quantizer and increased-resolution DAC, and with ETF(z) = (A.3)
regards to robustness against high mismatch values in the DAC 1 + H (z)
elements. where H (z) is the equivalent loop-filter transfer function (in
It should be noted that the modulator exhibits higher band- discrete-time domain) of the modulator. Since during the
width and resolution in simulations. However, due to some calibration phase, VIN = 0, the modulator’s output is given
unforeseen issues in its digital block, the sampling frequency by
had to be reduced. This reduction resulted in a lower modulator
bandwidth, and also affected the noise shaping behavior of OUT(z) = NTF(z) × Q N (z) + ETF(z) × E DAC
the modulator, which reduced the effective measured reso- 1 H (z) I2
= Q N (z) + (A.4)
lution. Furthermore, a few missing codes in the output of 1 + H (z) 1 + H (z) I1
the two-step ADC were observed during measurements. This
where Q N is the quantization noise of the quantizer. Consid-
slight reduction in the quantizer’s resolution, attributed to
ering a high low-frequency gain for H , the dc value of the
process variations, can lead to a reduced performance of the
modulator’s output is equal to I2 /I1 . Similar technique can be
modulator. However, this is mitigated by the shaping of the
used to measure other current source values.
quantizer’s error by the loop filter, and its effect is accounted
for in the measurement results.
ACKNOWLEDGMENT
VI. C ONCLUSION The authors would like to thank Prof. A. Hamoui (deceased)
This paper presented a proof-of-concept prototype in from McGill University, Montréal, QC, Canada, for the fruitful
130-nm CMOS to introduce two techniques to improve CTDS discussions.
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TAHERZADEH-SANI AND NABKI: 350-MS/s CTDS MODULATOR 1919
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