Mems Seminar 2

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SEMINAR ON MEMS

Name -P.upendar reddy


H.no-17841A0318
UNDER THE GUIDANCE-B.ANIL KUMAR
Designation of guide- HOD Mechanical department
Content
 INTRODUCTION
 WHAT ARE MEMS?
 APPLICATION OF MEMS
 COMPONENETS
 MANUFACTURING PROCESS OF MEMS
 SILICON MICROMACHINING
BASIC TECHNIQUES
 THIN FILMS
 WET ETCHING
 DRY ETCHING
 FABRICATION PROCESS IN MEMS
Content…
 WET ETCHING
 DRY ETCHING
 EXCIMER LASER MICROMACHINING
 FABRICATION PROCESS IN MEMS
 ADVANCED MICRO SYSTEM FABRICATION TECHNOLOGIES
 PRECISION MACHINING TECHNOLOGIES
 EMERING SILICON MICRO FABRICATION TECHNOLOGIES
 ADVANTAGES
 DISADVANTAGES
 CONCLUSION
 REFERENCES
ABSTARCT

MEMS devices are very small,their components are usually


microscopic.pumps,valves,gears,pistons,as well as motors even steam engines have all
been fabricated by MEMS. MEMS Is not just about the miniaturization of mechanical
components or making things out of silicon (In fact ,the term MEMS is actually
misleading as many micro machined devices.Mems products tend to be application
specific, giving rise to a wide range of very different products
Introduction

 Micro electromechanical systems (MEMS) are micrometer-scale devices that


integrate electrical and mechanical elements.
 They have been used in diverse applications, from display technologies to sensor
systems to optical networks.
 MEMS are attractive for many applications because of their small size and weight,
which allow systems to be miniaturized.
What are MEMS?

(Micro-electromechanical Systems)
 Fabricated using micromachining technology
 Used for sensing, actuation or are passive micro-structures
 Usually integrated with electronic circuitry for control and/or information
processing
Components
Components…

 Micro Electronics: The microelectronics of a MEMS are very similar to chips as


we think of them today.

 Micro Sensors: The micro sensors act as the arms, eyes, nose, etc. They
constantly gather data from the surrounding environment and pass this information
on to the microelectronics for processing.
Components…

 Micro Actuators: A micro actuator acts as a switch or a trigger to activate an


external device. As the microelectronics is processing the data received from the
micro sensors, it is making decisions on what to do based on this data.

 Microstructures: Due to the increase in technology for micromachining,


extremely small structures can be built onto the surface of a chip.
MANUFACTURING PROCESS OF MEMS

 MATERIALS:MEMS are generally made from a material called polycrystalline


silicon which is a common material also used to make integrated circuits.

 PHOTOLITHOGRAPHY: Photolithography is the basic technique used to


define the shape of micro machine structures in the three techniques outlined
below.
BASIC TECHNIQUES

There are 3 basic techniques associated with silicon micromachining. They


are:
 Deposition of thin films of materials.
 Removal of material by wet chemical etching.
 Removal of material by dry chemical etching.
THIN FILMS

• There are number of different techniques that facilitate the deposition or


formation of very thin films of different materials on a silicon wafer.

• These films can then be patterned using photolithographic techniques and


suitable etching techniques.
WET ETCHING

• Wet etching is a blanket name that covers the removal of material by


immersing the wafer in a liquid bath of the chemical etch ant.

• Wet etch ants fall into two broad categories; isotropic etch ants and
anisotropic etch ants.
DRY ETCHING

 The most common form of dry etching for micromachining applications is


reactive ion etching.

 Ions are accelerated towards the material to be etched, and the etching
reaction is enhanced in the direction of travel of ion.
FABRICATION PROCESS IN MEMS

 Advanced Micro Systems Fabrication


Technologies
 Precision Machining Technologies
 Emerging Silicon Micro Fabrication Technologies
Advanced Micro Systems Fabrication
Technologies
• Plastics Technologies
• Glass Technologies
• Silicon Technologies
• Metals Technologies
Precision Machining Technologies

 Jet Deposition Technologies


 Laser Sintering Technologies
 Jet Molding Technologies
 Electrical Discharge Machining
 Micro milling / drilling
 3-D Micro Fabrication Technologies
Emerging Silicon Micro Fabrication
Technologies
 Deep Reactive Ion Etching
 Electroplated Photo resist
 Integration of Piezoelectric Devices
ADVANTAGES

There are four main advantages of using MEMS rather than ordinary large
scale machinery.
 Ease of production.
 MEMS can be mass-produced and are inexpensive to make.
 Ease of parts alteration.
 Higher reliability than their macro scale counterparts.
DISADVANTAGES

 Due to their size, it is physically impossible for MEMS to transfer any


significant power.
 MEMS are made up of Poly-Si (a brittle material), so they cannot be
loaded with large forces.
To overcome the disadvantages, many MEMS researchers are working
hard to improve MEMS material strength and ability to transfer
mechanical power. Nevertheless, MEMS still have countless number of
applications as stated below.
APPLICATION OF MEMS

 Inertial navigation units on a chip for munitions guidance and personal navigation.
 Electromechanical signal processing for ultra-small and ultra low-power wireless
communications.
 Distributed unattended sensors for asset tracking, environmental monitoring, and
security surveillance.
 Integrated fluidic systems for miniature analytical instruments, propellant, and
combustion control.
 Weapons safing, arming, and fuzing.
CONCLUSION

 Thus hereby we concluded our presentation in the topic of MEMS which


is going to be the future of the modern technical field in the growth of
micro sensor based applications such as automotive industries, wireless
communication, security systems, bio medical instrumentation and in
armed forces.
References

 Introduction to MEMS
 Fundamentals of Micro fabrication process
 MEMS Materials and process hand book

THANKS

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