M24128-BW, M24128-BR

M24256-BW, M24256-BR
256Kbit and 128Kbit Serial I²C Bus EEPROM
With Three Chip Enable Lines

FEATURES SUMMARY
■ Compatible with I2C Extended Addressing Figure 1. Packages
■ Two-Wire I2C Serial Interface
Supports 400kHz Protocol
■ Single Supply Voltage:
– 2.5 to 5.5V for M24128-BW, M24256-BW
– 1.8 to 5.5V for M24128-BR, M24256-BR
■ Hardware Write Control
■ BYTE and PAGE WRITE (up to 64 Bytes) 8
■ RANDOM and SEQUENTIAL READ Modes
■ Self-Timed Programming Cycle
■ Automatic Address Incrementing 1
■ Enhanced ESD/Latch-Up Protection PDIP8 (BN)
■ More than 1 Million Erase/Write Cycles
■ More than 40-Year Data Retention

Table 1. Product List

8
Reference Part Number
M24128-BW
128 Kbits 1
M24128-BR
SO8 (MN)
M24256-BW 150 mil width
256 Kbits
M24256-BR

1
SO8 (MW)
200 mil width

TSSOP8 (DW)
169 mil width

June 2005 1/25

M24128-BW, M24128-BR, M24256-BW, M24256-BR

TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 1. Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 2. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Power On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. DIP, SO and TSSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 4. Maximum RP Value versus Bus Parasitic Capacitance (C) for an I2C Bus . . . . . . . . . . . 5
Figure 5. I2C Bus Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Device Select Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Most Significant Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 5. Least Significant Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

DEVICE OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Start Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Stop Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Acknowledge Bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Memory Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 6. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 6. Write Mode Sequences with WC=1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 8
Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Byte Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 7. Write Mode Sequences with WC=0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 8. Write Cycle Polling Flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Minimizing System Delays by Polling On ACK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 9. Read Mode Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Sequential Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Acknowledge in Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 7. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

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 M24128-BW, M24128-BR, M24256-BW, M24256-BR

DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 8. Operating Conditions (M24128-BW, M24256-BW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Operating Conditions (M24128-BR, M24256-BR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 10. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 10.AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 11. Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 12. DC Characteristics (M24128-BW, M24256-BW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 13. DC Characteristics (M24128-BR, M24256-BR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 14. AC Characteristics ( M24128-BW, M24256-BW). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 15. AC Characteristics (M24128-BR, M24256-BR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 11.AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 12.PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline . . . . . . . . . . . . . . . . . 19
Table 16. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data . . . . . . . . . . 19
Figure 13.SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . 20
Table 17. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
20
Figure 14.SO8 wide – 8 lead Plastic Small Outline, 200 mils body width, Package Outline . . . . . . 21
Table 18. SO8 wide – 8 lead Plastic Small Outline, 200 mils body width, Package Mechanical Data
21
Figure 15.TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline . . . . . . . . . . . . . . . . . . . 22
Table 19. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data . . . . . . . . . . . . 22

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 20. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 21. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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M24128-BW, M24128-BR, M24256-BW, M24256-BR

SUMMARY DESCRIPTION ter. The Start condition is followed by a Device

2 Select Code and Read/Write bit (RW) (as de-
These I C-compatible electrically erasable pro-
scribed in Table 3.), terminated by an acknowl-
grammable memory (EEPROM) devices are orga-
edge bit.
nized as 32K x 8 bits (M24256-BW and M24256-
BR) and 16K x 8 bits (M24128-BW and M24128- When writing data to the memory, the device in-
BR). serts an acknowledge bit during the 9th bit time,
following the bus master’s 8-bit transmission.
When data is read by the bus master, the bus
Figure 2. Logic Diagram master acknowledges the receipt of the data byte
in the same way. Data transfers are terminated by
a Stop condition after an Ack for Write, and after a
VCC
NoAck for Read.
Power On Reset
3 In order to prevent inadvertent Write operations
during Power Up, a Power On Reset (POR) circuit
E0-E2 SDA is implemented.
M24256-B At Power Up, the device will not respond to any in-
SCL M24128-B struction until VCC has reached the POR threshold
voltage (this threshold is lower than the VCC mini-
WC mum operating voltage defined in Table 8. and Ta-
ble 9.). In the same way, as soon as VCC drops
from the normal operating voltage, below the POR
threshold voltage, all the operations are disabled
and the device will not respond to any instruction.
VSS
AI02809 Prior to selecting and issuing instructions to the
memory, a valid and stable VCC voltage must be
applied. This voltage must remain stable and valid
until the end of the transmission of the instruction
and, for a Write instruction, until the completion of
the internal write cycle (tW).
Table 2. Signal Names
E0, E1, E2 Chip Enable Figure 3. DIP, SO and TSSOP Connections
SDA Serial Data

SCL Serial Clock

M24256-B
WC Write Control M24128-B
E0 1 8 VCC
VCC Supply Voltage
E1 2 7 WC
VSS Ground E2 3 6 SCL
2C
I uses a two-wire serial interface, comprising a VSS 4 5 SDA
bi-directional data line and a clock line. The devic- AI02810B

es carry a built-in 4-bit Device Type Identifier code

(1010) in accordance with the I2C bus definition.
The device behaves as a slave in the I2C protocol,
with all memory operations synchronized by the Note: See PACKAGE MECHANICAL section for package dimen-
serial clock. Read and Write operations are initiat- sions, and how to identify pin-1.
ed by a Start condition, generated by the bus mas-

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 M24128-BW, M24128-BR, M24256-BW, M24256-BR

SIGNAL DESCRIPTION
Serial Clock (SCL). This input signal is used to Chip Enable (E0, E1, E2). These input signals
strobe all data in and out of the device. In applica- are used to set the value that is to be looked for on
tions where this signal is used by slave devices to the three least significant bits (b3, b2, b1) of the 7-
synchronize the bus to a slower clock, the bus bit Device Select Code. These inputs must be tied
master must have an open drain output, and a to VCC or VSS, to establish the Device Select
pull-up resistor must be connected from Serial Code. When not connected (left floating), these in-
Clock (SCL) to VCC. (Figure 4. indicates how the puts are read as Low (0,0,0).
value of the pull-up resistor can be calculated). In Write Control (WC). This input signal is useful
most applications, though, this method of synchro- for protecting the entire contents of the memory
nization is not employed, and so the pull-up resis- from inadvertent write operations. Write opera-
tor is not necessary, provided that the bus master tions are disabled to the entire memory array when
has a push-pull (rather than open drain) output. Write Control (WC) is driven High. When uncon-
Serial Data (SDA). This bi-directional signal is nected, the signal is internally read as VIL, and
used to transfer data in or out of the device. It is an Write operations are allowed.
open drain output that may be wire-OR’ed with When Write Control (WC) is driven High, Device
other open drain or open collector signals on the Select and Address bytes are acknowledged,
bus. A pull up resistor must be connected from Se- Data bytes are not acknowledged.
rial Data (SDA) to VCC. (Figure 4. indicates how
the value of the pull-up resistor can be calculated).

Figure 4. Maximum RP Value versus Bus Parasitic Capacitance (C) for an I2C Bus

VCC
20
Maximum RP value (kΩ)

16
RP RP
12
SDA

8 MASTER C
fc = 100kHz SCL

4
fc = 400kHz C

0
10 100 1000
C (pF)
AI01665b

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M24128-BW, M24128-BR, M24256-BW, M24256-BR

Figure 5. I2C Bus Protocol

SCL

SDA

SDA SDA
START Input Change STOP
Condition Condition

SCL 1 2 3 7 8 9

SDA MSB ACK

START
Condition

SCL 1 2 3 7 8 9

SDA MSB ACK

STOP
Condition
AI00792B

Table 3. Device Select Code

Device Type Identifier1 Chip Enable Address2 RW

b7 b6 b5 b4 b3 b2 b1 b0
Device Select Code 1 0 1 0 E2 E1 E0 RW
Note: 1. The most significant bit, b7, is sent first.
2. E0, E1 and E2 are compared against the respective external pins on the memory device.

Table 4. Most Significant Byte Table 5. Least Significant Byte

b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

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 M24128-BW, M24128-BR, M24256-BW, M24256-BR

DEVICE OPERATION
The device supports the I2C protocol. This is sum- Data (SDA) Low to acknowledge the receipt of the
marized in Figure 5.. Any device that sends data eight data bits.
on to the bus is defined to be a transmitter, and Data Input
any device that reads the data to be a receiver.
The device that controls the data transfer is known During data input, the device samples Serial Data
as the bus master, and the other as the slave de- (SDA) on the rising edge of Serial Clock (SCL).
vice. A data transfer can only be initiated by the For correct device operation, Serial Data (SDA)
must be stable during the rising edge of Serial
bus master, which will also provide the serial clock
for synchronization. The M24xxx-B device is al- Clock (SCL), and the Serial Data (SDA) signal
must change only when Serial Clock (SCL) is driv-
ways a slave in all communication.
en Low.
Start Condition
Memory Addressing
Start is identified by a falling edge of Serial Data
To start communication between the bus master
(SDA) while Serial Clock (SCL) is stable in the
High state. A Start condition must precede any and the slave device, the bus master must initiate
a Start condition. Following this, the bus master
data transfer command. The device continuously
monitors (except during a Write cycle) Serial Data sends the Device Select Code, shown in Table 3.
(on Serial Data (SDA), most significant bit first).
(SDA) and Serial Clock (SCL) for a Start condition,
and will not respond unless one is given. The Device Select Code consists of a 4-bit Device
Stop Condition Type Identifier, and a 3-bit Chip Enable “Address”
(E2, E1, E0). To address the memory array, the 4-
Stop is identified by a rising edge of Serial Data bit Device Type Identifier is 1010b.
(SDA) while Serial Clock (SCL) is stable and driv-
Up to eight memory devices can be connected on
en High. A Stop condition terminates communica-
tion between the device and the bus master. A a single I2C bus. Each one is given a unique 3-bit
code on the Chip Enable (E0, E1, E2) inputs.
Read command that is followed by NoAck can be
followed by a Stop condition to force the device When the Device Select Code is received, the de-
into the Stand-by mode. A Stop condition at the vice only responds if the Chip Enable Address is
end of a Write command triggers the internal EE- the same as the value on the Chip Enable (E0, E1,
PROM Write cycle. E2) inputs.
Acknowledge Bit (ACK) The 8th bit is the Read/Write bit (RW). This bit is
set to 1 for Read and 0 for Write operations.
The acknowledge bit is used to indicate a success-
ful byte transfer. The bus transmitter, whether it be If a match occurs on the Device Select code, the
bus master or slave device, releases Serial Data corresponding device gives an acknowledgment
(SDA) after sending eight bits of data. During the on Serial Data (SDA) during the 9th bit time. If the
9th clock pulse period, the receiver pulls Serial device does not match the Device Select code, it
deselects itself from the bus, and goes into Stand-
by mode.

Table 6. Operating Modes

Mode RW bit WC 1 Bytes Initial Sequence

Current Address Read 1 X 1 START, Device Select, RW = 1

0 X START, Device Select, RW = 0, Address
Random Address Read 1
1 X reSTART, Device Select, RW = 1
Sequential Read 1 X ≥1 Similar to Current or Random Address Read
Byte Write 0 VIL 1 START, Device Select, RW = 0
Page Write 0 VIL ≤ 64 START, Device Select, RW = 0
Note: 1. X = VIH or VIL.

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M24128-BW, M24128-BR, M24256-BW, M24256-BR

Figure 6. Write Mode Sequences with WC=1 (data write inhibited)

WC

ACK ACK ACK NO ACK

BYTE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN

START

STOP
R/W

WC

ACK ACK ACK NO ACK

PAGE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN 1 DATA IN 2
START

R/W

WC (cont'd)

NO ACK NO ACK

PAGE WRITE DATA IN N

(cont'd)
STOP

AI01120C

Write Operations When the bus master generates a Stop condition

Following a Start condition the bus master sends immediately after the Ack bit (in the “10th bit” time
a Device Select Code with the R/W bit (RW) reset slot), either at the end of a Byte Write or a Page
to 0. The device acknowledges this, as shown in Write, the internal memory Write cycle is triggered.
Figure 7., and waits for two address bytes. The de- A Stop condition at any other time slot does not
vice responds to each address byte with an ac- trigger the internal Write cycle.
knowledge bit, and then waits for the data byte. After the Stop condition, the delay tW, and the suc-
Writing to the memory may be inhibited if Write cessful completion of a Write operation, the de-
Control (WC) is driven High. Any Write instruction vice’s internal address counter is incremented
with Write Control (WC) driven High (during a pe- automatically, to point to the next byte address af-
riod of time from the Start condition until the end of ter the last one that was modified.
the two address bytes) will not modify the memory During the internal Write cycle, Serial Data (SDA)
contents, and the accompanying data bytes are is disabled internally, and the device does not re-
not acknowledged, as shown in Figure 6.. spond to any requests.
Each data byte in the memory has a 16-bit (two Byte Write
byte wide) address. The Most Significant Byte (Ta- After the Device Select code and the address
ble 4.) is sent first, followed by the Least Signifi- bytes, the bus master sends one data byte. If the
cant Byte (Table 5.). Bits b15 to b0 form the addressed location is Write-protected, by Write
address of the byte in memory. Control (WC) being driven High, the device replies

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 M24128-BW, M24128-BR, M24256-BW, M24256-BR

with NoAck, and the location is not modified. If, in- data starts to become overwritten in an implemen-
stead, the addressed location is not Write-protect- tation dependent way.
ed, the device replies with Ack. The bus master The bus master sends from 1 to 64 bytes of data,
terminates the transfer by generating a Stop con- each of which is acknowledged by the device if
dition, as shown in Figure 7.. Write Control (WC) is Low. If Write Control (WC) is
Page Write High, the contents of the addressed memory loca-
The Page Write mode allows up to 64 bytes to be tion are not modified, and each data byte is fol-
written in a single Write cycle, provided that they lowed by a NoAck. After each byte is transferred,
are all located in the same ’row’ in the memory: the internal byte address counter (the 6 least sig-
that is, the most significant memory address bits, nificant address bits only) is incremented. The
b15-b6, are the same. If more bytes are sent than transfer is terminated by the bus master generat-
will fit up to the end of the row, a condition known ing a Stop condition.
as ‘roll-over’ occurs. This should be avoided, as

Figure 7. Write Mode Sequences with WC=0 (data write enabled)

WC

ACK ACK ACK ACK

BYTE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN

START

STOP
R/W

WC

ACK ACK ACK ACK

PAGE WRITE DEV SEL BYTE ADDR BYTE ADDR DATA IN 1 DATA IN 2
START

R/W

WC (cont'd)

ACK ACK

PAGE WRITE DATA IN N

(cont'd)
STOP

AI01106C

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M24128-BW, M24128-BR, M24256-BW, M24256-BR

Figure 8. Write Cycle Polling Flowchart using ACK

WRITE Cycle
in Progress

START Condition

DEVICE SELECT
with RW = 0

NO ACK
Returned

First byte of instruction YES

with RW = 0 already
decoded by the device

Next
NO Operation is YES
Addressing the
Memory
Send Address
and Receive ACK
ReSTART

STOP NO START YES

Condition

DATA for the DEVICE SELECT

WRITE Operation with RW = 1

Continue the Continue the

WRITE Operation Random READ Operation AI01847C

Minimizing System Delays by Polling On ACK – Initial condition: a Write cycle is in progress.
During the internal Write cycle, the device discon- – Step 1: the bus master issues a Start condition
nects itself from the bus, and writes a copy of the followed by a Device Select Code (the first
data from its internal latches to the memory cells. byte of the new instruction).
The maximum Write time (tw) is shown in Table – Step 2: if the device is busy with the internal
14. and Table 15., but the typical time is shorter. Write cycle, no Ack will be returned and the
To make use of this, a polling sequence can be bus master goes back to Step 1. If the device
used by the bus master. has terminated the internal Write cycle, it
The sequence, as shown in Figure 8., is: responds with an Ack, indicating that the
device is ready to receive the second part of
the instruction (the first byte of this instruction
having been sent during Step 1).

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 M24128-BW, M24128-BR, M24256-BW, M24256-BR

Figure 9. Read Mode Sequences

ACK NO ACK
CURRENT
ADDRESS DEV SEL DATA OUT
READ

START

STOP
R/W

ACK ACK ACK ACK NO ACK

RANDOM
ADDRESS DEV SEL * BYTE ADDR BYTE ADDR DEV SEL * DATA OUT
READ
START

START

STOP
R/W R/W

ACK ACK ACK NO ACK

SEQUENTIAL
CURRENT DEV SEL DATA OUT 1 DATA OUT N
READ
START

STOP
R/W

ACK ACK ACK ACK ACK

SEQUENTIAL
RANDOM DEV SEL * BYTE ADDR BYTE ADDR DEV SEL * DATA OUT 1
READ
START

START

R/W R/W

ACK NO ACK

DATA OUT N
STOP

AI01105C

Note: 1. The seven most significant bits of the Device Select Code of a Random Read (in the 1st and 4th bytes) must be identical.

Read Operations puts the contents of the addressed byte. The bus
Read operations are performed independently of master must not acknowledge the byte, and termi-
the state of the Write Control (WC) signal. nates the transfer with a Stop condition.
After the successful completion of a Read opera- Current Address Read
tion, the device’s internal address counter is incre- For the Current Address Read operation, following
mented by one, to point to the next byte address. a Start condition, the bus master only sends a De-
Random Address Read vice Select Code with the R/W bit set to 1. The de-
vice acknowledges this, and outputs the byte
A dummy Write is first performed to load the ad- addressed by the internal address counter. The
dress into this address counter (as shown in Fig-
counter is then incremented. The bus master ter-
ure 9.) but without sending a Stop condition. Then, minates the transfer with a Stop condition, as
the bus master sends another Start condition, and
shown in Figure 9., without acknowledging the
repeats the Device Select Code, with the RW bit byte.
set to 1. The device acknowledges this, and out-

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M24128-BW, M24128-BR, M24256-BW, M24256-BR

Sequential Read Acknowledge in Read Mode

This operation can be used after a Current Ad- For all Read commands, the device waits, after
dress Read or a Random Address Read. The bus each byte read, for an acknowledgment during the
master does acknowledge the data byte output, 9th bit time. If the bus master does not drive Serial
and sends additional clock pulses so that the de- Data (SDA) Low during this time, the device termi-
vice continues to output the next byte in sequence. nates the data transfer and switches to its Stand-
To terminate the stream of bytes, the bus master by mode.
must not acknowledge the last byte, and must
generate a Stop condition, as shown in Figure 9..
The output data comes from consecutive address-
es, with the internal address counter automatically INITIAL DELIVERY STATE
incremented after each byte output. After the last
memory address, the address counter ‘rolls-over’, The device is delivered with all the memory array
and the device continues to output data from bits set to 1 (each byte contains FFh).
memory address 00h.

12/25
 M24128-BW, M24128-BR, M24256-BW, M24256-BR

MAXIMUM RATING
Stressing the device outside the ratings listed in this specification, is not implied. Exposure to Ab-
Table 7. may cause permanent damage to the de- solute Maximum Rating conditions for extended
vice. These are stress ratings only, and operation periods may affect device reliability. Refer also to
of the device at these, or any other conditions out- the STMicroelectronics SURE Program and other
side those indicated in the Operating sections of relevant quality documents.

Table 7. Absolute Maximum Ratings

Symbol Parameter Min. Max. Unit
TA Ambient Operating Temperature –40 125 °C
TSTG Storage Temperature –65 150 °C

TLEAD Lead Temperature during Soldering See note 1 °C

VIO Input or Output range –0.50 6.5 V

VCC Supply Voltage –0.50 6.5 V

VESD Electrostatic Discharge Voltage (Human Body model) 2 –3000 3000 V

Note: 1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and
the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU
2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500Ω, R2=500Ω)

13/25
M24128-BW, M24128-BR, M24256-BW, M24256-BR

DC AND AC PARAMETERS
This section summarizes the operating and mea- ment Conditions summarized in the relevant
surement conditions, and the DC and AC charac- tables. Designers should check that the operating
teristics of the device. The parameters in the DC conditions in their circuit match the measurement
and AC Characteristic tables that follow are de- conditions when relying on the quoted parame-
rived from tests performed under the Measure- ters.

Table 8. Operating Conditions (M24128-BW, M24256-BW)

Symbol Parameter Min. Max. Unit

VCC Supply Voltage 2.5 5.5 V

TA Ambient Operating Temperature –40 85 °C

Table 9. Operating Conditions (M24128-BR, M24256-BR)

Symbol Parameter Min. Max. Unit

VCC Supply Voltage 1.8 5.5 V

TA Ambient Operating Temperature –40 85 °C

Table 10. AC Measurement Conditions

Symbol Parameter Min. Max. Unit

CL Load Capacitance 100 pF

Input Rise and Fall Times 50 ns

Input Levels 0.2VCC to 0.8VCC V

Input and Output Timing Reference Levels 0.3VCC to 0.7VCC V

Figure 10. AC Measurement I/O Waveform

Input Levels Input and Output

Timing Reference Levels
0.8VCC
0.7VCC

0.3VCC
0.2VCC
AI00825B

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 M24128-BW, M24128-BR, M24256-BW, M24256-BR

Table 11. Input Parameters

Symbol Parameter1,2 Test Condition Min. Max. Unit
CIN Input Capacitance (SDA) 8 pF
CIN Input Capacitance (other pins) 6 pF
ZL VIN < 0.3 VCC 30 kΩ
Input Impedance (WC)
ZH VIN > 0.7VCC 500 kΩ
Pulse width ignored
tNS Single glitch 100 ns
(Input Filter on SCL and SDA)
Note: 1. TA = 25°C, f = 400kHz
2. Sampled only, not 100% tested.

Table 12. DC Characteristics (M24128-BW, M24256-BW)

Test Condition
Symbol Parameter Min. Max. Unit
(in addition to those in Table 8.)
Input Leakage Current VIN = VSS or VCC
ILI ±2 µA
(SCL, SDA) device in Stand-by mode
ILO Output Leakage Current VOUT = VSS or VCC, SDA in Hi-Z ±2 µA
VCC =2.5V, fc=400kHz (rise/fall time < 30ns) 1 mA
ICC Supply Current
VCC = 5V, fc=400kHz (rise/fall time < 30ns) 2 mA
VIN = VSS or VCC , VCC = 2.5V 2 µA
ICC1 Stand-by Supply Current
VIN = VSS or VCC , VCC = 5V 10 µA
VIL Input Low Voltage (SCL, SDA) –0.45 0.3VCC V
Input High Voltage
VIH 0.7VCC VCC+1 V
(SCL, SDA, WC)
VOL Output Low Voltage IOL = 2.1 mA, VCC = 2.5 V 0.4 V

Table 13. DC Characteristics (M24128-BR, M24256-BR)

Test Condition
Symbol Parameter Min. Max. Unit
(in addition to those in Table 9.)
Input Leakage Current VIN = VSS or VCC
ILI ±2 µA
(SCL, SDA) device in Stand-by mode
ILO Output Leakage Current VOUT = VSS or VCC, SDA in Hi-Z ±2 µA
ICC Supply Current VCC =1.8V, fc=100kHz (rise/fall time < 30ns) 0.8 mA
ICC1 Stand-by Supply Current VIN = VSS or VCC , VCC = 1.8 V 1 µA
Input Low Voltage (SCL, SDA) –0.45 0.3 VCC V
VIL Input Low Voltage
–0.45 0.5 V
(E2, E1, E0, WC)
Input High Voltage
VIH 0.7VCC VCC+1 V
(E2, E1, E0, SCL, SDA, WC)
VOL Output Low Voltage IOL = 0.7 mA, VCC = 1.8 V 0.2 V

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M24128-BW, M24128-BR, M24256-BW, M24256-BR

Table 14. AC Characteristics ( M24128-BW, M24256-BW)

Test conditions specified in Table 8.
Symbol Alt. Parameter Min. Max. Unit
fC fSCL Clock Frequency 400 kHz
tCHCL tHIGH Clock Pulse Width High 600 ns
tCLCH tLOW Clock Pulse Width Low 1300 ns
tCH1CH2 tR Clock Rise Time 300 ns
tCL1CL2 tF Clock Fall Time 300 ns

tDH1DH2 2 tR SDA Rise Time 20 300 ns

tDL1DL2 2 tF SDA Fall Time 20 300 ns

tDXCX tSU:DAT Data In Set Up Time 100 ns

tCLDX tHD:DAT Data In Hold Time 0 ns
tCLQX tDH Data Out Hold Time 200 ns

tCLQV 3 tAA Clock Low to Next Data Valid (Access Time) 200 900 ns

tCHDX 1 tSU:STA Start Condition Set Up Time 600 ns

tDLCL tHD:STA Start Condition Hold Time 600 ns

tCHDH tSU:STO Stop Condition Set Up Time 600 ns
Time between Stop Condition and Next Start
tDHDL tBUF 1300 ns
Condition
tW tWR Write Time 5 ms
Note: 1. For a reSTART condition, or following a Write cycle.
2. Sampled only, not 100% tested.
3. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA.

16/25
 M24128-BW, M24128-BR, M24256-BW, M24256-BR

Table 15. AC Characteristics (M24128-BR, M24256-BR)

Test conditions specified in Table 9.
Symbol Alt. Parameter Min. Max. Unit
fC fSCL Clock Frequency 400 kHz
tCHCL tHIGH Clock Pulse Width High 600 ns
tCLCH tLOW Clock Pulse Width Low 1300 ns
tCH1CH2 tR Clock Rise Time 300 ns
tCL1CL2 tF Clock Fall Time 300 ns

tDH1DH2 2 tR SDA Rise Time 20 300 ns

tDL1DL2 2 tF SDA Fall Time 20 300 ns

tDXCX tSU:DAT Data In Set Up Time 100 ns

tCLDX tHD:DAT Data In Hold Time 0 ns
tCLQX tDH Data Out Hold Time 200 ns

tCLQV 3 tAA Clock Low to Next Data Valid (Access Time) 200 900 ns

tCHDX 1 tSU:STA Start Condition Set Up Time 600 ns

tDLCL tHD:STA Start Condition Hold Time 600 ns

tCHDH tSU:STO Stop Condition Set Up Time 600 ns
Time between Stop Condition and Next Start
tDHDL tBUF 1300 ns
Condition
tW tWR Write Time 10 ms
Note: 1. For a reSTART condition, or following a Write cycle.
2. Sampled only, not 100% tested.
3. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA.

17/25
M24128-BW, M24128-BR, M24256-BW, M24256-BR

Figure 11. AC Waveforms

tCHCL tCLCH

SCL

tDLCL

SDA In

tCHDX tCLDX SDA tDXCX tCHDH tDHDL

START SDA Change STOP START
Condition Input Condition Condition

SCL

SDA In

tCHDH tW tCHDX
STOP Write Cycle START
Condition Condition

SCL

tCLQV tCLQX

SDA Out Data Valid

AI00795C

18/25
 M24128-BW, M24128-BR, M24256-BW, M24256-BR

PACKAGE MECHANICAL

Figure 12. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline

b2 E

A2 A

A1 L

b e c
eA

eB
D

E1

1
PDIP-B

Note: Drawing is not to scale.

Table 16. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data
mm inches
Symb.
Typ. Min. Max. Typ. Min. Max.
A 5.33 0.210
A1 0.38 0.015
A2 3.30 2.92 4.95 0.130 0.115 0.195
b 0.46 0.36 0.56 0.018 0.014 0.022
b2 1.52 1.14 1.78 0.060 0.045 0.070
c 0.25 0.20 0.36 0.010 0.008 0.014
D 9.27 9.02 10.16 0.365 0.355 0.400
E 7.87 7.62 8.26 0.310 0.300 0.325
E1 6.35 6.10 7.11 0.250 0.240 0.280
e 2.54 – – 0.100 – –
eA 7.62 – – 0.300 – –
eB 10.92 0.430
L 3.30 2.92 3.81 0.130 0.115 0.150

19/25
M24128-BW, M24128-BR, M24256-BW, M24256-BR

Figure 13. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline

h x 45˚

A
C
B
e CP

E H
1

A1 α L

SO-a

Note: Drawing is not to scale.

Table 17. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data
mm inches
Symb.
Typ. Min. Max. Typ. Min. Max.
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
B 0.33 0.51 0.013 0.020
C 0.19 0.25 0.007 0.010
D 4.80 5.00 0.189 0.197
E 3.80 4.00 0.150 0.157
e 1.27 – – 0.050 – –
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.020
L 0.40 0.90 0.016 0.035
α 0° 8° 0° 8°
N 8 8
CP 0.10 0.004

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 M24128-BW, M24128-BR, M24256-BW, M24256-BR

Figure 14. SO8 wide – 8 lead Plastic Small Outline, 200 mils body width, Package Outline

A2 A
C
B
e CP

E H
1
A1 α L

SO-b

Note: Drawing is not to scale.

Table 18. SO8 wide – 8 lead Plastic Small Outline, 200 mils body width, Package Mechanical Data
mm inches
Symb.
Typ. Min. Max. Typ. Min. Max.
A 2.03 0.080
A1 0.10 0.25 0.004 0.010
A2 1.78 0.070
B 0.35 0.45 0.014 0.018
C 0.20 – – 0.008 – –
D 5.15 5.35 0.203 0.211
E 5.20 5.40 0.205 0.213
e 1.27 – – 0.050 – –
H 7.70 8.10 0.303 0.319
L 0.50 0.80 0.020 0.031
α 0° 10° 0° 10°
N 8 8
CP 0.10 0.004

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M24128-BW, M24128-BR, M24256-BW, M24256-BR

Figure 15. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline

8 5
c

E1 E

1 4

A1 L
A A2
CP L1

b e
TSSOP8AM

Note: Drawing is not to scale.

Table 19. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data
mm inches
Symbol
Typ. Min. Max. Typ. Min. Max.
A 1.200 0.0472
A1 0.050 0.150 0.0020 0.0059
A2 1.000 0.800 1.050 0.0394 0.0315 0.0413
b 0.190 0.300 0.0075 0.0118
c 0.090 0.200 0.0035 0.0079
CP 0.100 0.0039
D 3.000 2.900 3.100 0.1181 0.1142 0.1220
e 0.650 – – 0.0256 – –
E 6.400 6.200 6.600 0.2520 0.2441 0.2598
E1 4.400 4.300 4.500 0.1732 0.1693 0.1772
L 0.600 0.450 0.750 0.0236 0.0177 0.0295
L1 1.000 0.0394
α 0° 8° 0° 8°

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 M24128-BW, M24128-BR, M24256-BW, M24256-BR

PART NUMBERING

Table 20. Ordering Information Scheme

Example: M24256 – B W MN 6 T P

Device Type
M24 = I2C serial access EEPROM

Device Function
256 = 256 Kbit (32K x 8)
128 = 128 Kbit (16K x 8)

Operating Voltage
W3 = VCC = 2.5 to 5.5V
R1 = VCC = 1.8 to 5.5V

Package
BN = PDIP8
MN = SO8 (150 mil width)
MW = SO8 (200 mil width)
DW = TSSOP8 (169 mil width)

Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow

Option
blank = Standard Packing
T = Tape and Reel Packing

Plating Technology
blank = Standard SnPb plating
P or G = Lead-Free and RoHS compliant

For a list of available options (speed, package, etc.) or for further information on any aspect of this device,
please contact your nearest ST Sales Office.

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M24128-BW, M24128-BR, M24256-BW, M24256-BR

REVISION HISTORY

Table 21. Document Revision History

Date Rev. Description of Revision
28-Dec-1999 2.1 TSSOP8 package added
E2, E1, E0 must be tied to Vcc or Vss
24-Feb-2000 2.2
Low Pass Filter Time Constant changed to Glitch Filter
22-Nov-2000 2.3 -V voltage range added
-V voltage range changed to 2.5V to 3.6V
Lead Soldering Temperature in the Absolute Maximum Ratings table amended
30-Jan-2001 2.4
Write Cycle Polling Flow Chart using ACK illustration updated. SO8(wide) package added
References to PSDIP8 changed to PDIP8, and Package Mechanical data updated
-R voltage range added. Package mechanical data updated for TSSOP8 and TSSOP14
01-Jun-2001 2.5 packages according to JEDEC\MO-153
Document promoted from “Preliminary Data” to “Full Data Sheet”
TSSOP14 package removed
16-Oct-2001 2.6
Absolute Max Ratings and DC characteristics updated for M24256-BV
09-Nov-2001 2.7 Specification of Test Condition for Leakage Currents in the DC Characteristics table improved
1 million Erase/Write cycle endurance for M24256-B and M24256-BW products with process
21-Mar-2002 2.8
letter "V"
Document reformatted. Parameters changed are: 1 million Erase/Write cycle endurance and 5
18-Oct-2002 3.0
ms write time for M24128-B and M24128-BW products with process letter "B".
Superfluous (and incorrectly present) 100kHz AC Characteristics table for M24256-BR
20-Nov-2002 3.1
removed.
Initial delivery state specified. -R and -S ranges are no longer Preliminary Data. Package
02-Jun-2003 3.2
mechanical data for unavailable package removed.
Table of contents, and Pb-free options added. Minor wording changes in Summary
22-Oct-2003 4.0 Description, Power-On Reset, Memory Addressing, Write Operations, Read Operations.
VIL(min) improved to -0.45V.

SO8W package added. Absolute Maximum Ratings for VIO(min) and VCC(min) changed.
16-Apr-2004 5.0
Soldering temperature information clarified for RoHS compliant devices.
M24xxx-B, M24xxx-BV and M24xxx-BS removed from the datasheet.
Product List summary table added.
Power On Reset paragraph updated.
13-Jun-2005 6.0 Figure 4., Maximum RP Value versus Bus Parasitic Capacitance (C) for an I2C Bus updated.
ZL and ZH definition changed.
ICC and ICC1 updated in Table 12., DC Characteristics (M24128-BW, M24256-BW).
Device Grade information further clarified to Table 20., Ordering Information Scheme.

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 M24128-BW, M24128-BR, M24256-BW, M24256-BR

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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