BQ 24600
BQ 24600
BQ 24600
bq24600
SLUS891B – FEBRUARY 2010 – REVISED NOVEMBER 2014
– Thermal Shutdown (1) For all available packages, see the orderable addendum at
the end of the datasheet.
• Status Outputs
– Adapter Present Simplified Schematic
– Charger Operation Status ADAPTER +
R11
2 kW D2 C8 C9
R6 10 µF 10 µF
ADAPTER - MBRS540T3
10 W
• Charge Enable Pin C2
2.2 µF VREF VCC HIDRV N
Q4
SiR426
C7
R7 1 µF RSR
ISET
PH
BTST
C6
L1
3.3 µH*
0.010 Ω
VBAT
PACK+
D1 0.1 µF PACK-
R2 Cff
ADAPTER + STAT 900 kW 22 pF
GND C10 C11
R1
VREF
100 kW
TS VFB
Sense
– < 15-μA Off-State Battery Discharge Current R10
430 kW
0.1 μF
PwrPad
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq24600
SLUS891B – FEBRUARY 2010 – REVISED NOVEMBER 2014 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 11
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 19
3 Description ............................................................. 1 8 Application and Implementation ........................ 21
4 Revision History..................................................... 2 8.1 Application Information............................................ 21
8.2 Typical Application ................................................. 21
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 26
6.1 Absolute Maximum Ratings ..................................... 4 10 Layout................................................................... 27
6.2 Handling Ratings ...................................................... 4 10.1 Layout Guidelines ................................................. 27
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 28
6.4 Thermal Information .................................................. 5 11 Device and Documentation Support ................. 29
6.5 Electrical Characteristics........................................... 5 11.1 Trademarks ........................................................... 29
6.6 Timing Requirements ................................................ 8 11.2 Third-Party Products Disclaimer ........................... 29
6.7 Typical Characteristics .............................................. 9 11.3 Electrostatic Discharge Caution ............................ 29
7 Detailed Description ............................................ 10 11.4 Glossary ................................................................ 29
7.1 Overview ................................................................. 10 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram ....................................... 10 Information ........................................................... 29
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Changed Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Device and Documentation ........................................ 1
• Changed feature text From: "Supports 1-6 Battery Cells" To: "Supports 1S-6S Battery Cells"............................................. 1
• Changed the Application list .................................................................................................................................................. 1
• Deleted the Table of Graphs from the Typical Characteristics section ................................................................................. 9
• Changed the Description of D3, D4 in Table 4 From: "LED diode, green, 2.1 V, 10 mΩ, Vishay-Dale,
WSL2010R0100F" To:"LED diode, green, 2.1 V, 20 mA, LTST-C190GKT"........................................................................ 22
RVA Package
(Top View)
LODRV
HIDRV
BTST
PH
16 15 14 13
VCC 1 12 REGN
CE 2 11 GND
STAT 3 10 SRP
TS 4 9 SRN
5 6 7 8
VFB
VREF
ISET
PG
Pin Functions
PIN
I/O FUNCTION DESCRIPTION
NAME NO.
VCC 1 I IC power positive supply. Connect, through a 10-Ω resistor to the common-source (diode-OR) point: source of high-side P-
channel MOSFET and source of reverse-blocking power P-channel MOSFET. Or connect through a 10-Ω resistor to the
cathode of the input diode. Place a 1-μF ceramic capacitor from VCC to the GND pin close to the IC.
CE 2 I Charge-enable active-HIGH logic input. HI enables charge. LO disables charge. It has an internal 1MΩ pull-down resistor.
STAT 3 I Open-drain charge status pin to indicate various charger operation (See Table 2)
TS 4 I Temperature qualification voltage input for battery pack negative temperature coefficient thermistor. Program the hot and cold
temperature window with a resistor divider from VREF to TS to GND.
PG 5 O Open-drain power-good status output. The transistor turns on when a valid VCC is detected. It is turned off in the sleep mode.
PG can be used to drive an LED or communicate with a host processor. It can be used to drive ACFET and BATFET.
VREF 6 O 3.3-V regulated voltage output. Place a 1-μF ceramic capacitor from VREF to the GND pin close to the IC. This voltage could
be used for programming of voltage and current regulation and for programming the TS threshold.
ISET 7 I Charge current set input. The voltage of ISET pin programs the charge current regulation, pre-charge current and termination
current set-point.
VFB 8 O Output voltage analog feedback adjustment. Connect the output of a resistive voltage divider from the battery terminals to this
node to adjust the output battery regulation voltage.
SRN 9 I Charge-current sense resistor, negative input. A 0.1-μF ceramic capacitor is placed from SRN to SRP to provide differential-
mode filtering. An optional 0.1-μF ceramic capacitor is placed from SRN pin to GND for common-mode filtering.
SRP 10 I Charge-current sense resistor, positive input. A 0.1-μF ceramic capacitor is placed from SRN to SRP to provide differential-
mode filtering. A 0.1-μF ceramic capacitor is placed from SRP pin to GND for common-mode filtering.
GND 11 -- Low-current sensitive analog/digital ground. On PCB layout, connect with thermal pad underneath the IC.
REGN 12 O PWM low-side driver positive 6-V supply output. Connect a 1-μF ceramic capacitor from REGN to the PGND pin, close to the
IC. Use for low-side driver and high-side driver bootstrap voltage by connecting a small-signal Schottky diode from REGN to
BTST.
LODRV 13 O PWM low-side driver output. Connect to the gate of the low-side power MOSFET with a short trace.
PH 14 I PWM high-side driver negative supply. Connect to the phase-switching node (junction of the low-side power MOSFET drain,
high-side power MOSFET source, and output inductor).
HIDRV 15 O PWM high-side driver output. Connect to the gate of the high-side power MOSFET with a short trace.
BTST 16 I PWM high-side driver negative supply. Connect the 0.1-μF bootstrap capacitor from PH to BTST, and a bootstrap Schottky
diode from REGN to BTST.
Thermal -- -- Exposed pad beneath the IC. Always solder thermal pad to the board, and have vias on the thermal pad plane star-
pad connecting to GND and ground plane for high-current power converter. It also serves as a thermal pad to dissipate the heat.
6 Specifications
6.1 Absolute Maximum Ratings (1) (2) (3)
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
(3) Must have a series resistor between battery pack and VFB if battery-pack voltage is expected to be greater than 16 V. Usually the
resistor-divider top resistor takes care of this.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
10 V/div
10 V/div
VCC PH
2 V/div
5 V/div
/PG LODRV
2 V/div
2 A/div
VREF IBAT
5 V/div
5 V/div
REGN CE
10 V/div
10 V/div
PH PH
5 V/div
0.2 V/div 5 V/div
LODRV
LODRV 2 A/div
CE
2 A/div
IL
20 V/div
IL
VBAT
7 Detailed Description
7.1 Overview
The bq24600 is a highly integrated Li-ion or Li-polymer switch-mode battery charge controller.
bq24600
VCC - SLEEP VCC
3.3V
SRN+100mV + LDO
VREF
VCC - UVLO
VUVLO VREF
+
INTERNAL
CE REFERENCE
1M
COMP
ERROR BTST
AMPLIFIER
- CE
+
+ PWM
1V -
VFB + LEVEL HIDRV
SHIFTER
-
2.1 V
BAT_OVP
20uA +
SRP-SRN SYNCH
SRP PH
-
+ PWM
+ 20xV(SRP-SRN) 5 mV - VCC
20X + CONTROL
- LOGIC
IBAT_ REG -
CE
SRN BTST - REFRESH 6V LDO REGN
_+
20μA PH +
ENA_BIAS
4.2V
FAULT
+ LODRV
V(SRP-SRN) CHG_OCP
2mA 160% X IBAT_REG
- CHARGE
GND
8mA FAULT
Safety Timer
IC Tj + TSHUT
CHARGE
145degC - STAT
DISCHARGE STAT
BAT
+
BAT_OVP
- STATE
104% X VBAT_REG
ISET ISET MACHINE
IBAT_ REG LOGIC PG
ISET PG
10
LOWV BATTERY
DETECTION
VFB - DISCHARGE VREF
LOWV LOGIC
+ VCC +
ACOV
1.55V +- -
LTF -
VACOV +-
+
TS
SUSPEND
VFB - HTF +
RCHRG
+ -
2.05 V +-
TCO +
RCHRG
20xV(SRP-SRN) - -
TERM TERM
ISET +
10 TERMINATE CHARGE
bq24600
7.3.3 Precharge
On power up, if the battery voltage is below the VLOWV threshold, the bq24600 applies the precharge current to
the battery. This feature is intended to revive deeply discharged cells. If the VLOWV threshold is not reached within
30 minutes of initiating precharge, the charger turns off and a FAULT is indicated on the status pins.
The precharge current is fixed 1/10th of the programmed charge current, which is determined by the voltage on
the ISET pin according to Equation 3:
I VISET
IPRECHARGE = CHARGE =
10 200 ´ RSR (3)
The minimum precharge current is clamped to be around 125 mA with default 10-mΩ sensing resistor.
Charge
Current
Charge
Voltage
VLOWV
7.3.5 Power Up
The bq24600 uses a SLEEP comparator to determine the source of power on the VCC pin, because VCC can be
supplied either from the battery or the adapter. If the VCC voltage is greater than the SRN voltage, bq24600 exits
the SLEEP mode. If all other conditions are met for charging, bq24600 then attempts to charge the battery (see
Enable and Disable Charging). If the SRN voltage is greater than VCC, bq24600 enters a low-quiescent-current
(<15 μA) SLEEP mode to minimize current drain from the battery.
If VCC is below the UVLO threshold, the device is disabled.
VLTF VLTF
VLTFH VLTFH
VHTF
VTCO
CHARGE SUSPENDED CHARGE SUSPENDED
GND GND
Assuming a 103AT NTC thermistor on the battery pack as shown in Figure 11, the value RT1 and RT2 can be
determined by using Equation 5 and Equation 6:
æ 1 1 ö
VVREF ´ RTHCOLD ´ RTHHOT ´ ç - ÷
V
è LTF V TCO ø
RT2 =
æV ö æV ö
RTHHOT ´ ç VREF - 1÷ - RTHCOLD ´ ç VREF - 1÷
è VTCO ø è VLTF ø (5)
VVREF
-1
VLTF
RT1 =
1 1
+
RT2 RTHCOLD (6)
For example, a 103AT NTC thermestor is used to monitor the battery pack temperature. Select TCOLD = 0ºC and
TCUT_OFF = 45ºC. Then we get RT2 = 430 kΩ, RT1 = 9.311 Ω. A small RC filter is suggested to use for system-
level ESD protection.
VREF
bq24600 RT1
TS
RT2 RTH
103AT
7.3.16 PG Output
The open-drain PG (power-good) output indicates whether the VCC voltage is valid or not. The open-drain FET
turns on whenever bq24600 has a valid VCC input (not in UVLO or ACOV or SLEEP mode). The PG pin can be
used to drive an LED or communicate to the host processor. It can also be used to drive ACFET and BATFET.
1s timer
VFB < VLOWV No No
expired
Yes Yes
0.5s timer
VFB > VRECH No No
expired
Yes
Yes
Battery Present,
Disable 125mA Begin Charge
Charge
Battery Absent
Once the device has powered up, an 8-mA discharge current is applied to the SRN terminal. If the battery
voltage falls below the LOWV threshold within 1 second, the discharge source is turned off, and the charger is
turned on at low charge current (125 mA). If the battery voltage rises above the recharge threshold within 500
ms, no battery is present and the cycle restarts. If either the 500-ms or 1-second timer times out before the
respective thresholds are hit, a battery is detected and a charge cycle is initiated.
VREG
VRECH
(VWAKE) Battery
inserted
VLOWV
(VDISH) Battery detected
t WAKE
t LOWV_DEG tRECH_DEG
Care must be taken that the total output capacitance at the battery node is not so large that the discharge current
source cannot pull the voltage below the LOWV threshold during the 1-second discharge time. The maximum
output capacitance can be calculated as shown in Equation 8.
I ´ tDISCH
CMAX = DISCH
é R ù
0.5 ´ ê1+ 2 ú
ë R1 û (8)
Where CMAX is the maximum output capacitance, IDISCH is the discharge current, tDISCH is the discharge time, and
R2 and R1 are the voltage feedback resistors from the battery to the VFB pin. The 0.5 factor is the difference
between the RECHARGE and the LOWV thresholds at the VFB pin.
7.3.20.1 Example
For a 3-cell Li+ charger with R2 = 500 kΩ, R1 = 100kΩ (giving 12.6 V for voltage regulation), IDISCH = 8 mA,
tDISCH = 1 second,
8mA ´ 1sec
CMAX = = 2.7mF
é 500 kW ù
0.5 ´ ê1+ ú
ë 100 kW û (9)
Based on these calculations, no more than 2.7 mF should be allowed on the battery node for proper operation of
the battery-detection circuit.
POR
SLEEP MODE
Yes
Yes
See Enabling and Disabling
Charge Section
Indicate NOT
Conditions met Conditions met
No CHARGING, No No
for charge? for charge?
Suspend timers
Yes Yes
Regulate
precharge current
Start 30 minute Precharge
VFB < VLOWV Yes VFB < VLOWV Yes
precharge timer Indicate Charge- timer expired?
In-Progress
Start Fastcharge
No No
timer
Regulate
fastcharge current Yes
Indicate NOT
Conditions met
CHARGING, No Yes
for charge? Indicate Charge-
Suspend timers
In-Progress
No
No
Charge Complete
VFB > VRECH Yes
VFB < VRECH No
Indicate DONE
Battery Removed
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
ADAPTER +
R11 C8 C9
2 kW D2
R6 10 µF 10 µF
ADAPTER - MBRS540T3
10 W
C2
2.2 µF Q4
VREF VCC HIDRV N SiR426
C7
R7 1 µF RSR
PH
100 kW L1 0.010 Ω
VBAT
BTST PACK+
ISET C6
D1 0.1 µF 3.3 µH*
PACK-
R8 REGN BAT54
22.1 kW VREF
C5 C13
C4 C12
1 µF 10 µF* 10 µF*
1 µF Q5
CE
SiR426
bq24600 LODRV N
R13 10 kW R2
D3 Cff
ADAPTER + STAT 900 kW 22 pF
GND C10 C11
R14 10 kW 0.1 µF 0.1 µF
D4
PG
SRP R1
VREF
100 kW
SRN
R9 R5
Pack 9.31 kW 100 W
Thermistor TS VFB
Sense PwrPad
R10 0.1 μF
430 kW
R1 R2 (1206)
(2010)
Adapter 2W 4.7 -30W
VCC pin
connector C1 C2
2.2 mF 0.1-1 mF
PH
PH
5 V/div
HIDRV
5 V/div
LODRV
2 A/div
LODRV
IBAT
2 A/div
5 V/div
CE IL
10 V/div
PH
5 V/div
5 V/div
PH
2 A/div 5 V/div
2 A/div
IL
LODRV
VBAT
IL
105
100
28 Vin, 6 cell
24 Vin, 5 cell
Efficiency - %
95
90
20 Vin, 4 cell
20 Vin, 3 cell
85
12 Vin, 2 cell
12 Vin, 1 cell
80
0 1 2 3 4 5 6 7 8
IBAT - Output Current - A
10 Layout
R SNS
L1 R1 V BAT
SW
High
Frequency
VIN BAT
Current
Path C2 C3
C1 PGND
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
BQ24600RVAR ACTIVE VQFN RVA 16 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 OAQ
BQ24600RVAT ACTIVE VQFN RVA 16 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 OAQ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Sep-2018
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Sep-2018
Pack Materials-Page 2
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