John Bowers - 2013 UCSB Faculty Research Lecture

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The Promise of Silicon Photonics

2013 Faculty Research Lecture 1 John E. Bowers, Director, Institute for Energy Efficiency Kavli Professor of Nanotechnology

What is silicon photonics?


Making photonic integrated circuits on Silicon using CMOS process technology in a CMOS fab

Why is it important? What is the future? What is the problem? What is the economic driver?

Big Data

Internet Users: 2 billion (>20% of World population) Google Search: More than a billion searches daily YouTube adds 24 hours of video every minute, 1+ billion views a day

Mobile Data Traffic

Tbytes/month

Today

Source: Network Traffic Forecast and Analysis 2013-2017 by Information Gatekeepers 2013.

The Growth of Data Transmission


Data transmitted over a fiber optic backbone

100x

Kilper et, al., Power Trends in Communication Networks, J. Selected Topics in Quantum Electronics, March/April 2011

The Growth of Telecommunication Power Consumption

C. Lange et al., Energy Consumption of Telecommunication Networks and Related Improvement Options, J. Selected Topics in Quantum Electronics, March/April 2011

Data Servers

Source: Energy Cost, the Key Challenge of Todays Data Centers, Michael Poess (Oracle) and Raghunath O. Nambiar (HP) 2010

Data Center Carbon Footprint

Data Center Carbon Footprint

Data Center (Warehouse Computer)

10

Lots of Cooling Towers

11

Lots of cooling water

12

Modern Data Center


100 MW power Million of servers Tens of thousands of fibers

13
From Donn Lee (Facebook)

Servers

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Mostly connected today with electrical cables within a rack

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Non-Scalable Fiber Interconnects in a Data Center

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A Global Optical Network

Follow the sun data center strategy: Global load balancing. Use cheaper electricity at night.

Worldwide Fiber Optic Communication

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Reduction in energy to transport a bit across the ocean


10 6 Energy / Bit / 1000-km (J) 10 3 10 0 10 -3 10 -6 10 -9 10 -12 1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 Year After Tucker (2011)
Marconi Trans-Atlan=c Fessenden Trans-Atlan=c NY - Paris TAT-1 TAT-3 TAT-5 TAT-8

First Trans-Atlan=c Newhaven - Azores

Key West - Havana

100 Million
TAT-9 TAT-11

TAT-10 TAT-12/13

WDM terrestrial

Invention of Morse Code


Where did it all begin? 1839 William Morse: Invention of Morse Code and the telegraph. The first message: "What hath God wrought!''

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The First Transatlantic Cable


1839 Gisborne and Field The first two attempts failed On 16 August,1858 a telegram of congratulations from Queen Victoria to US President James Buchanan

Agamemnon and Niagra laying cable

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Wireless Telegraphy
1902 Marconi Invention of wireless telegraphy (radio) Wireless transmission across the Atlantic

1912 Word of the Titanic sinking sent to shore. Marconi had been scheduled on that trip, but had left on the Lusitania three days earlier.

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Reduction in energy to transport a bit across the ocean


10 6 Energy / Bit / 1000-km (J) 10 3 10 0 10 -3 10 -6 10 -9 10 -12 1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 Year
Marconi Trans-Atlan=c Fessenden Trans-Atlan=c NY - Paris Wireless Telegraphy

First Trans-Atlan=c Newhaven - Azores

The Invention of the Telephone


1876 Bell speaks the famous words: "Mr. Watson -- come here -- I want to see you.

Alexander Graham Bell

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Multiplexing is Crucial

New York City 1903

Time multiplexing was invented in 1910 by George O. Squier. It allowed multiple telephone calls to be transmitted over one wire.

Coax Cable
1931 Lloyd Espenschied and Herman A. Affel invented coaxial cable

Cable with 22 coaxial cables that can carry 90,000 telephone calls

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First Transatlantic Telephone Cable


TAT-1 1956 ATT Bell Labs and British Post Office

Reduction in energy to transport a bit across the ocean


10 6 Energy / Bit / 1000-km (J) 10 3 10 0 10 -3 10 -6 10 -9 10 -12 1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 Year
Marconi Trans-Atlan=c Fessenden Trans-Atlan=c NY - Paris Wireless Telegraphy Coax

First Trans-Atlan=c Newhaven - Azores

TAT-1 36 channels TAT-3 138 channels

~20% p.a. improvement

Transistor
The transistor was demonstrated in 1947 and Shockley, Bardeen, Brattain received the Nobel Prize in 1956. This enabled solid state amplifiers.

John Bardeen, William Shockley, Walter Brattain

Reduction in energy to transport a bit across the ocean


10 6 Energy / Bit / 1000-km (J) 10 3 10 0 10 -3 10 -6 10 -9 10 -12 1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 Year
Marconi Trans-Atlan=c Fessenden Trans-Atlan=c NY - Paris TAT-1 TAT-3 TAT-7 4000 channels Wireless Telegraphy Coax

First Trans-Atlan=c Newhaven - Azores

~20% p.a. improvement

Microwave cable and microwave antennas were dominant through the 1960s

6 cm diameter circular waveguides with 40 to 120 GHz for 230,000 voice circuits.
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Invention of Fiber Optics


In 1854, John Tyndall demonstrated to the Royal Society that light could be conducted through a curved stream of water, proving that a light signal could be bent. In 1966, Charles Kao studied optical losses in glass, set the goal of 20 dB/km and received the Nobel Prize 2010

Robert Mauer, Donald Keck, and Peter Schultz, from Corning purified silica and reduced optical loss to 16 dB/km in 1970.

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Why Fiber Optics?


Loss is low (0.2 dB/km 1550 nm C-band for fiber compared to 1000 dB/km for coax at 20 GHz) Capacity is large (300,000 GHz for fiber compared to 20 GHz for coax)

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Invention of Semiconductor Laser


1962 First Semiconductor Laser
Robert N. Hall at General Electric Marshall Nathan at IBM MIT Lincoln Laboratory

Nobel Prize in 2000

1962 Kroemer: Invention of Double heterostructure laser

400x

First Commercial Fiber Optic Cable


In 1977, the first optical telephone communication system was installed about 1.5 miles under downtown Chicago, and each optical fiber carried the equivalent of 672 voice channels.

Reduction in energy to transport a bit across the ocean


10 6 Energy / Bit / 1000-km (J) 10 3 10 0 10 -3 10 -6 10 -9 10 -12 1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 Year
Marconi Trans-Atlan=c Fessenden Trans-Atlan=c NY - Paris TAT-1 TAT-3 TAT-7 4000 channels TAT-8 40,000 channels TAT-10 TAT-11 1.13 Gbps Wireless Telegraphy Coax Optical + Regen. Optical + EDFA WDM

First Trans-Atlan=c Newhaven - Azores

~20% p.a. improvement

TAT-9

Invention of the EDFA


The erbium doped fiber amplifier (EDFA) was developed by Paynes group at the Univ. of Southampton in the late 1980s. This device amplifies light signals in an optical fiber network.

This led to TAT-12/13 operating at 5 Gbit/s (approximately 300,000 voice circuits)


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Wavelength Division Multiplexing


WDM was demonstrated by AT&T in 1978 and deployed in 1982 from Boston to Washington using GaAlAs lasers at 825 and 875 nm, and an InGaAsP LED at 1300 nm. Not widely used until 1992 after the invention of the optical amplifier.

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Reduction in energy to transport a bit across the ocean


10 6 Energy / Bit / 1000-km (J) 10 3 10 0 10 -3 10 -6 10 -9 10 -12
Marconi Trans-Atlan=c Fessenden Trans-Atlan=c NY - Paris TAT-1 TAT-3 TAT-8 40,000 channels TAT-10 TAT-11 1.13 Gbps Wireless Telegraphy Coax Optical + Regen. Optical + EDFA WDM

First Trans-Atlan=c Newhaven - Azores

Key West - Havana

TAT-7 4000 channels

~20% p.a. improvement

TAT-9 TAT-12/13 10 Gbps TAT-14 1.87 Tbps

Hypernia 10 Tbps

1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 Year

Reduction in energy to transport a bit across the ocean


10 6 Energy / Bit / 1000-km (J) 10 3 10 0 10 -3 10 -6 10 -9 10 -12
Telegraph Telephone Multiplexing Coax
TAT-1 TAT-3 TAT-8 40,000 channels TAT-10 TAT-11 1.13 Gbps Marconi Trans-Atlan=c Fessenden Trans-Atlan=c NY - Paris Wireless Telegraphy Coax Optical + Regen. Optical + EDFA WDM

Transistor Optical Fiber Double Heterostructure Semiconductor Laser

EDFA WDM

1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 Year

Reduction in energy to transport a bit across the ocean


10 6 Energy / Bit / 1000-km (J) 10 3 10 0 10 -3 10 -6 10 -9 10 -12
Telegraph Telephone Multiplexing Coax
TAT-1 TAT-3 Marconi Trans-Atlan=c Fessenden Trans-Atlan=c NY - Paris Wireless Telegraphy Coax Optical + Regen. Optical + EDFA WDM

Transistor Optical Fiber Double Heterostructure Semiconductor Laser

TAT-8 40,000 channels TAT-10 TAT-11 1.13 Gbps

100 Million

EDFA WDM

1860 1880 1900 1920 1940 1960 1980 2000 2020 2040 Year

Transmission Research records


Phase diversity started Space Division Multiplexing (SDM) starting

100
Polarization Division Multiplexing started

305 Tbit/s on a single fiber (2012)

Capacity on a single fiber

Tb/s

10
WDM started

6 Million In 32 years

100 Gb/s 10 1986

1990

1994

1998

2002

2006

2010

1977: 50 Mbit/s

Plot courtesy of P. Winzer and Chris Doerr

Long Haul:
6 million increase in capacity in 32 years. 100 million decrease in energy/bit in 150 years.

What about switching?

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Routers and Switches: Power and Power Density are Problems


Electrical Core switches: >10 kW/rack for 256 10 Gbit/s channels
Power density in high speed switching chips at fundamental limits Scaling to larger switches and higher bit rates difficult. Power proportional to frequency squared!

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Low Power 3D MEMS Switch Architecture


Silicon Fiber Block 384 Collimated Beams

Silicon MEMS Mirror Plane 384 Mirrors Electrostatic Control Moves in X & Y 10 nA x 100 V = 1 microW/channel 2D Gymbal Mirror Silicon Photonic integration is key! Impossible to build large (>100 port) switches without integration. Large wafer size essential. CMOS process uniformity essential (hinges).

Bowers et al. Optical MEMs conference 2009

>10,000x

Many electronic servers and switches require significant power (1 MW for some routers)

OFC OTuH2 2011 Traditional Architecture Electrical Optical Electrical Electrical

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OFC OTuH2 2011 Traditional Architecture Emerging Architecture

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Dan Tardent PCT 2013

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Dan Tardent PCT 2013

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Moving to Interconnects
Optical
Metro & Long Haul
0.1 80 km

Copper
Chip to Chip
1 50 cm

Intel Optical Products

Billions
Board to Board
50 100 cm

Rack to Rack
1 to 100 m

Millions

Thousands Decreasing Distances

Volumes

Drive optical to high volumes and low costs

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What about Interconnects?


No significant integration (typically 2 or 3 devices/PIC) 192 wavelength Cost is high transmission system Size is large Power is large (1 W/Gbps)

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Why not Integrate?


100 Gb/s Transmit

100 Gb/s Receive

Infinera 100 Gb/s Solution Receive

100 Gb/s Transmit


R. Nagarajan, Infinera ECOC 2007

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Why Silicon Photonics?


Integrate photonics with electronics
Same wafer Bump bonding of silicon PIC with silicon IC Same coefficient of thermal expansion 3D stacking
Cross-sectional view of an IBM Silicon Nanophotonics chip combining optical and electrical circuits Vlasov et al. IEDM postdeadline

Reduce cost by going to larger diameter wafers


InP limited by wafer breakage to 100 mm diameter

Reduce cost by sharing VLSI facility with electronics Improve yield by taking advantage of silicon process development Volume driver: Solve IC interconnect bottleneck (from 4 Tbps to 1 Pbps). Optical transmitters/receivers on processors, memories, switches.

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Bringing Si Manufacturing to the Laser


Lasers Si Manufacturing
Silicon Photonics is not about Silicon. It is about using CMOS processing to make photonic integrated circuits with high quality and low cost. Very high bandwidth Long distances InP Photonic Immunity Integrated to electrical noise circuits
Year of Production DRAM 1/2 Pitch (nm) Wafer Size (mm) 1995 270 150 1998 190 200

High volume, low cost Highly integrated Silicon Photonic Integrated circuits
2007 2010 2013 2016 65 43 32 22 300 Courtesy: 300 300 450 Rattner (Intel)

Six Generations

Scalability
2001 130 200 2004 90 200

Hybrid Silicon Photonics

Direct Gap III-V

III-V active region Silicon rib waveguide on SOI wafer

Silicon

Optical gain from III-V Material Efficient coupling to silicon passive photonic devices No bonding alignment necessary: suitable for high volume CMOS All back end processing low temperature (<350 C)

Alex Fang s Thesis

7 lasers operating c.w. simultaneously

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Hybrid Silicon History Chronology


2006 First hybrid silicon laser: Alex Fang et al. 2007 First cw laser performance: Alex Fang et al. 2007 First hybrid silicon amplifier: Hyundai Park et al. 2007 First hybrid silicon photodetector: Hyundai Park et al. 2007 First hybrid silicon ring laser: Alex Fang et al. 2007 First hybrid silicon mode locked laser: Brian Koch et al. 2008 First hybrid silicon electroabsorption modulator Y. Kuo et al. 2008 First hybrid silicon distributed feedback (DFB) laser: Alex Fang et al. 2008 First hybrid silicon Mach Zehnder modulator H. W. Chen et al. 2008 First optical buffer: Park et al. 2009 First 150 mm bonding: Liang et al. 2009 First 200 mm bonding: Intel, Aurrion et al. 2010 First triplexer (Laser+2 PDs+2 wavelength selective combiners) Chang 2011 First hybrid silicon WDM array Jain et al. 2011 First optical beam scanner: Baets (Ghent) et al. 2013 First integration of hybrid silicon technology with ULLW technology Piels et al. 2013 First co-processing of datacom and telecom PICs: Brian Koch et al. 57 2013 First quantum dot lasers: Alan Liu et al.

Hybrid Silicon Record Performance


2013 Narrowest DFB linewidth: 18 kHz Yariv et al. (Caltech) 2012 Highest cw power: 45 mW Alex Fang et al. (Aurrion) 2011 Lowest waveguide loss on silicon: 0.04 dB/m Jared Bauters et al. 2012 Highest level of integration: 64 devices Jon Doylend et al. 2012 First study of reliability: 40,000 hours at 70C Srinivasan et al. 2012 Highest laser yield: 99% Srinivasan et al. 2012 Fastest Si modulator: 74 GHz Tang et al. 2013 Highest receiver bandwidth: 400 Gbit/s Piels et al. 2013 Largest laser array bandwidth: > 200 nm Jain et al. 2013 Largest LED bandwidth: >200 nm DeGroote et al. 2013 Highest temperature: 120C Alan Liu et al. Segmented 74GHz TW: ~42 GHz

lumped: ~20 GHz

Y. Kuo, et al., OE 16(13), 9936 (2008)

Y. Tang, et al., OE 19(7), 5811(2011)

Tang et al. OFC2012 Postdeadline Paper

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Demonstrated hybrid silicon devices


FP, ring, DFB, and DBR lasers
(Fang, IEEE PTL, 20, 2008 )

19 dB/mm amplifier
(Kurczveil, SPIE PW, 2011)

ring
AMP

detector

DBR >20 GHz photodetector DFB MZM EAM


(Faralli, OSA OE, 20, 2012)

Microring laser

74-GHz EAM, 27-GHz MZI modulators


(Chen, OSA OE, 19, 2011; Tang, OSA OE, 20, 2012)

Microring resonator laser


(Liang, GFP, 2009) Slide 59

Hybrid Silicon Laser Research

Photonic Integration

Meint Smit Data

Heck JSTQE (2013)

Intel 50 Gb/s WDM Link


A Alduino et al, IPR 2010

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Jan 2013 OCP Facebook announcement


Justin Rattner Intel CTO Frank Frankowsky FB VP R&D Andy Bechtolsheim Arista: Founder and CEO Sun: Founder and CTO

1. Intel is working with Facebook and Quanta to define a new class of server architectures 2. First architecture is disaggregation 3. Intel has sampled its 100G photonic modules

Announced at Facebooks Open Compute Summit

Sept. 2013 Using Silicon Photonics for Disaggregation


Mezzanine Choices

Optical PCIe via Silicon Photonics


Intel AtomTM Micro-server tray Mezzanine Fiber

Intel Ethernet chip and Silicon Photonics

Intel Xeon processor based tray

Flexibility & TCO gains by upgrading components only when needed

Photonics in the Rack


Network & Storage move into TOR Switch TOR Switch distributed into Servers

To Spine Switches

Optical Rack

Xeon and Atom Fabric


Server Mem Mem Mem

Compute Network

DDR CPU DDR CPU DDR CPU


100G links

I/ O Appliance

Switch ASIC NIC SSD


SiPh

CPU Server SSD NIC


SiPh

RRC

SiPh

Server

Network Storage Compute Server Server Server Mem Mem Mem DDR CPU PCIe DDR CPU PCIe DDR CPU PCIe
SiPh

Xeon: PCIe Atom: Enet Server Server Server Compute Remote Storage HDDs SSDs CPU PCIe RRC Mem Mem Mem DDR CPU DDR CPU DDR CPU RRC

SiPh SiPh

Architecture offers flexible solutions and multiple Value Propositions


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Supercomputing: HP photonics technologies


On-chip Active cable Optical bus
Rx R xR x Rx Rx Rx R

Hybrid microring laser

Silicon PIC

interconnect

xR

xT x

Now

1 Year

3 Years

5 Years

7 Years
DWDM

10 Years

Single wavelength 100 pJ/bit

CWDM

>.1 pJ/bit

Aurrion PIC Integration


Brian Koch et al., OFC Postdeadline 2013

Telecom Tunable Lasers

Datacom uncooled WDM laser arrays

Modulators: 23 GHz, >15 dB ER, 1.3 Vpi >36 GHz, 0.8 A/W Photodetectors
0 5 10 15 20 25 30 35 40

E/O Response (dB)

-2

-4

-6

Frequency (GHz)

Separate wafer: 45 mW CW Lasers

IBM Aurrion Hybrid Silicon 60 Gbps Receiver: CLEO Postdeadline 2013

The Promise of Silicon Photonics

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Path to Ultralow Loss Waveguides


With Blumenthal

Fibers have low loss: 0.0002 dB/m (0.2 dB/km) Optical waveguides on InP, GaAs, Si have high loss: 30 dB/km How can we get fiber losses on chips?

Bauters et al. Optics Express (2011)

Path to Ultralow Loss Waveguides


With Blumenthal

Power (dBm)

thermal SiO2 SiO2 Si3N4 thermal SiO2

10 0 -10 -20 -30 -40


1 2 3 4 5

FSR=25.3nm 6 7 8 9 10 11 12 13 14 15 16 1

al. Optics 1527et 1531 1535 1539Express 1543 1547 (2011) 1551 1555 silicon substrate Bauters High Q Resonators (80Million Wavelength (nm)

CMOS Integration in Photonic IC


(with Theogarajan)
q q q q Smart Photonics Integrated electronic w/ photonic ICs Avoid driving 50 terminations Self-calibration Active feedback control

SOA

DET SOI Waveguides

Hybrid Silicon PIC from Aurrion

CMOS Integration in Photonic IC


(with Theogarajan)
q q q q Smart Photonics Integrated electronic w/ photonic ICs Avoid driving 50 terminations Self-calibration Active feedback control PIC
CMOS

Interconnects

Chen et al. OFC 2013

ROUTER IO POWER SCALING


IO power in watts for 64, 100 and 144 port switches
Generation 45nm Port BW(Gbps) 80 80 35nm 160 160 22nm 320 320 IO type Electronic Optical Electronic Optical Electronic Optical fJ/bit 7000 451 5048 284 4049 191 64 35.8W 2.3W 51.7W 2.9W 82.9W 3.9W 100 56.0W 3.6W 80.8W 4.5W 129.6W 6.1W 144 80.6W 5.2W 116.3W 6.5W 186.6W 8.8W

Assumes each generation will require a doubling of port speed to match improvements in processor performance Total device power must be less than 130W for normal forced air cooling with heatsink, 200W possible with special cooling. Assume max power budget of 50% (65W) for IO.

Optical IO on CMOS

Network on a Chip: Optical Interconnects


3D layer stacking will be prevalent in the 22nm timeframe Intra-chip optics can take advantage of this technology Photonics layer (with supporting electrical circuits) more easily integrated with high performance logic and memory layers Layers can be separately optimized for performance and yield
Optic al I/O

als

optica

Photonic Plane

On-chip o

l si g n

ptical tr affic
Memory Plane Logic Plane
Kash, Photonics in Supercomputing: the Road to Exascale, IPNRA, 2009

Off-ch ip

High Performance Computing


10 PetaFLOPS Roadrunner (IBM) 1 PetaFLOPS Jaguar (Cray) IBM Blue Gene/P 100 TFLOPS IBM Blue Gene/P National SuperComputer Center, Tianjin, China

Computational Throughput

IBM BladeCenter IQPACE cluster

10 TFLOPS

National Astronomical Observatory, Japan IBM BladeCenter

1 GFLOPS/W

1 TFLOPS 100 GFLOPS 10 MW 1 MW 100 kW 10 kW 1 kW

Power Consumption
Haney et al, OFC 2010, paper OMV2 Haney OFC (2011)

High Performance Computing: Interconnect Limits


10 PetaFLOPS

Performance enabled by a ~10 TFLOPS many-core chip with integrated chip I/O at ~.4 pJ/b:

~100 GFLOPS/W
Peta-FLOPS in a rack

1 PetaFLOPS

Computational Throughput

100 TFLOPS

10 TFLOPS

1 TFLOPS 100 GFLOPS 10 MW

Assuming: 4 pJ/b chip I/O link power (for 10-100 cm links) 200 W/chip with 40 W allocated to I/O maintaining ~.5 Bps/FLOPS I/O Performance barrier at ~10 GFLOPS/W limit
1 MW 100 kW 10 kW 1 kW

Power Consumption
Haney et al, OFC 2010, paper OMV2 Haney OFC (2011)

Available energy for interconnects


Microring Lasers

Lower threshold lasers Higher slope efficiency Di Liang Chong Zhang Alan Liu

IEEE Photonics Conference, Sept. 9, 2013 David Miller

Quantum Dot Lasers on Si


Alan Liu and Art Gossard

Stranski Krastanov growth High cw temperature (115C) High cw power (60 mW)

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Oscillators
The quietest oscillators are now optical (NIST)
Ultra-stable CW Laser Femtosecond Laser Comb

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Oscillators
The quietest oscillators are now optical (NIST) Integrate on a chip! Integrated mode locked lasers (Sudha Srinivasan, Mike Davenport) High Q resonators (Daryl Spencer) (90 million)

Packaged ULLW Ring

Heterogeneous PIC Based Mode-locked Laser

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Spectroscopy-on-chip
Theogarajan, Meinhart, Moskovits

Absorp=on spectroscopy
Broadband probe spectro
meter

D D D Laser probe Jared Hulme Detector

Broadband

Filter

probe

D D D D

Fluorescence spectroscopy
Laser probe spectro
meter

Raman spectroscopy
D Laser probe Filter spectro
meter

D D

Courtesy: Baets

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Si-based Raman Spectrometer on a Chip


C. D. Meinhart, M. Moskovits & J. Bowers

Gas sensing: O2, CO2, NO, H2S, CO, and N2O

Optical coherence tomography

Andreas Degroote Integrate on a chip

stratum corneum viable epidermis

papillary dermis

reticular dermis

Courtesy: Baets

G. Yurtsever et al 36

Acknowledgements
UCSB: Former students and postdocs: Alex Fang, Jared Bauters, Hui Wen Chen, Daoxin Dai, Jon Doylend, Martijn Heck, Sid Jain, Geza Kurzveil, Brian Koch, Di Liang, Hyundai Park, Molly Piels, Paolo Pintus, Matt Sysak, Yongbo Tang, Jason Tien Present students: Jock Bovington, Mike Davenport, Jared Hulme, Alan Liu, Jon Peters, Daryl Spencer, Alex Spott, Eric Stanton, Sudha Srinivasan, Chong Zhang Colleagues: Rod Alferness, Dave Auston, Dan Blumenthal, Larry Coldren, Nadir Dagli, Steve Denbaars, Art Gossard, Herb Kroemer, Chris Palmstrom, Mark Rodwell, Adel Saleh, Luke Theogarajan Intel : Richard Jones, Yimin Kang, Mario Paniccia, Matt Sysak Aurrion: Alex Fang, Greg Fish, Rob Guzzon, Eric Hall, Brian Koch, Erik Norberg, Anand Ramaswamy, John Roth, Dan Sparacin Hewlett Packard: Di Liang, Geza Kurzveil, Ray Beausoleil Cleanroom, MBE, MOCVD staff My Family: Ariel, Eric, Steve, Chris and Laetitia

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Summary
CMOS compatible silicon photonics combines two great inventions:
The transistor microprocessor The laser optical communications

and enable >100x lower power and lower power density. Silicon photonics makes sense for high volume markets like data centers, supercomputers, biosensors, and telecommunications and for highly integrated, high performance markets like low phase noise oscillators, gyroscopes, sensors.
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