Two-Dimensional Conduction: Shape Factors and Dimensionless Conduction Heat Rates
Two-Dimensional Conduction: Shape Factors and Dimensionless Conduction Heat Rates
Two-Dimensional Conduction: Shape Factors and Dimensionless Conduction Heat Rates
Shape Factors
and
Dimensionless Conduction Heat Rates
Chapter 4
Sections 4.1 and 4.3
General Considerations
General Considerations
• Two-dimensional conduction:
– Temperature distribution is characterized by two spatial coordinates,
e.g., T (x,y).
– Heat flux vector is characterized by two directional components,
e.g., qx′′ and qy′′ .
Note the shapes of lines of constant temperature (isotherms) and heat flow lines
(adiabats).
• Solution Methods:
– Exact/Analytical: Separation of Variables (Section 4.2)
¾ Limited to simple geometries and boundary conditions.
Flux Plots
• Utility: Requires delineation of isotherms and heat flow lines. Provides a
quick means of estimating the rate of heat flow.
• Procedure: Systematic construction of nearly perpendicular isotherms and heat
flow lines to achieve a network of curvilinear squares.
• Rules:
– On a schematic of the two-dimensional conduction domain, identify all
lines of symmetry, which are equivalent to adiabats and hence heat flow lines.
• Exact and approximate results for common two- and three-dimensional systems are
provided in Table 4.1(a). For example,
Case 6. Long (L>>w) circular
cylinder centered in square
solid of equal length
2π L
S=
1n (1.08w / D )
• Two-dimensional conduction resistance:
Rcond ( 2 D ) = ( Sk )
−1
(4.21)
Dimensionless Heat Rate
Schematic:
ASSUMPTIONS: (1) Steady-state conditions, (2) Soil is a homogeneous medium of known and
constant properties, (3) Negligible contact resistance.
ANALYSIS: From an energy balance on the container, q = E& g and from case 1 of Table 4.1(a),
2π D
q= k (T1 − T2 )
1 − D / 4z
Problem: Shape Factor (cont.)
Hence ,
q (1 − D / 4 z )
T1 = T2 +
k 2π D
500W (1-2m/40m )
=20oC+ =92.7 o C
0.52 W/m ⋅ K 2π(2m)
COMMENTS:
(1) If the canister is buried within an infinite medium of temperature T2=20°C, we may use
Case 12 of Table 4.1(b). With As = π D 2 and q*ss = 1, Eqns. (4.22) and (4.23) yield
q 500W
T1 = T2 + = 20oC+ = 96.5 o C
k 2π D 0.52W/m ⋅ K 2π(2m)
The heat flow lines shown in the figure presume a fin effectiveness of εf > 1 . How would the lines look
for εf < 1 ?
Schematic:
Problem: Thermal Circuit (cont)
ASSUMPTIONS: (1) Steady-state conditions, (2) Constant properties, (3) Large base material, (4)
Infinite fin.
ANALYSIS: (a,b) From the thermal circuit with the junction resistance, the heat rate and junction
temperature are
T −T Tb − T∞
qf = b ∞ = (1)
Rtot Rb + Rt , j + R f
(
T j = T∞ + q f R f + Rt , j ) (2)
1/ 2
With q f = ( hPkAc ) θb for an infinite fin (Table 3.4) and P = π D,
−1/ 2 −1/ 2
= ⎡50 W m 2 ⋅ K π 2 ( 0.005 m ) 240 W m ⋅ K 4 ⎤
3
R f = ( hPkAc ) = 16.4 K W
⎢⎣ ⎥⎦
Problem: Thermal Circuit (cont.)
COMMENTS:
(1) Why is the effect of the base material on the heat rate and the junction temperature substantial for the
stainless steel and not for the aluminum?
(2) Why is the relative effect of the contact resistance on the heat rate and the junction temperature more
pronounced for the aluminum alloy base than for the stainless steel?