default search action
ITC 2002: Baltimore, MD, USA
- Proceedings IEEE International Test Conference 2002, Baltimore, MD, USA, October 7-10, 2002. IEEE Computer Society 2002, ISBN 0-7803-7543-2
Homegrown versus Commercial Solutions for Low-Cost Text
- Bozena Kaminska:
Homegrown Tools and Equipment versus EDA and ATE Vendors: The Future of Design to Test Product Lines. 23 - Bill Bottoms:
Homegrown Tools and Equipment versus EDA and ATE Vendors: The Future of Design to Test Product Lines. 24 - Gregory S. Spirakis:
Homegrown Tools and Equipment versus EDA and ATE Vendors: The Future of Design to Test Product Lines. 25 - Dale E. Hoffman:
Homegrown Tools and Equipment versus EDA and ATE Vendors: The Future of Design to Test Product Lines. 26
Testing the Tester
- Rochit Rajsuman:
Testing The Tester. 27 - Alfred L. Crouch:
Testing the Tester: What Broke? Where? When? Why? 28 - John C. Johnson:
Testing the Tester: Specification and Validation Approaches. 29 - Rochit Rajsuman:
Testing The Tester. 30
Plenary
- Alex d'Arbeloff:
Managing in the ATE Business - Postcards from the Past, Lessons for the Future. 12 - Peter C. Maxwell:
The Heisenberg Uncertainty of Test. 13
Memory Testing
- Jean-Michel Portal, L. Forli, Hassen Aziza, Didier Née:
An Automated Methodology to Diagnose Geometric Defect in the EEPROM Cell. 31-36 - Sau-Kwo Chiu, Jen-Chieh Yeh, Chih-Tsun Huang, Cheng-Wen Wu:
Diagonal Test and Diagnostic Schemes for Flash Memorie. 37-46 - A. T. Sivaram, Daniel Fan, A. Yiin:
Efficient Embedded Memory Testing with APG. 47-54
Advances in Soc Testing
- Bart Vermeulen, Tom Waayers, Sjaak Bakker:
EEE 1149.1-Compliant Access Architecture for Multiple Core Debug on Digital System Chips. 55-63 - Paul Theo Gonciari, Bashir M. Al-Hashimi, Nicola Nicolici:
Integrated Test Data Decompression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing. 64-73 - Yu Huang, Sudhakar M. Reddy, Wu-Tung Cheng, Paul Reuter, Nilanjan Mukherjee, Chien-Chung Tsai, Omer Samman, Yahya Zaidan:
Optimal Core Wrapper Width Selection and SOC Test Scheduling Based on 3-D Bin Packing Algorithm. 74-82
Defect-Oriented Test
- Sudhakar M. Reddy, Irith Pomeranz, Huaxing Tang, Seiji Kajihara, Kozo Kinoshita:
On Testing of Interconnect Open Defects in Combinational Logic Circuits with Stems of Large Fanout. 83-89 - Jaume Segura, Ali Keshavarzi, Jerry M. Soden, Charles F. Hawkins:
Parametric Failures in CMOS ICs - A Defect-Based Analysis. 90-99 - Cecilia Metra, Stefano Di Francescantonio, T. M. Mak:
Clock Faults? Impact on Manufacturing Testing and Their Possible Detection Through On-Line Testing. 100-109
High-Performance Timing Measurements
- Hideo Okawara:
Frequency/Phase Movement Analy i by Orthogonal Demodulation. 110-119 - Mani Soma, Welela Haileselassie, Jessica Yan, Rajesh Raina:
A Wavelet-Based Timing Parameter Extraction Method. 120-128 - Sassan Tabatabaei, André Ivanov:
An Embedded Core for Sub-Picosecond Timing Measurements. 129-137
Test Data Reduction
- M. J. Geuzebroek, J. Th. van der Linden, Ad J. van de Goor:
Test Point Insertion that Facilitates ATPG in Reducing Test Time and Data Volume. 138-147 - Vishal Jain, John A. Waicukauski:
Scan Test Data Volume Reduction in Multi-Clocked Designs with Safe Capture Technique. 148-153 - Erik H. Volkerink, Ajay Khoche, Subhasish Mitra:
Packet-Based Input Test Data Compression Techniques. 154-163
Memory DFT, Bist and Repair
- Osamu Hirabayashi, Azuma Suzuki, Tomoaki Yabe, Atsushi Kawasumi, Yasuhisa Takeyama, Keiichi Kushida, Akihito Tohata, Nobuaki Otsuka:
DFT Techniques for Wafer-Level At-Speed Testing of High-Speed SRAMs. 164-169 - Shigeki Tomishima, Hiroaki Tanizaki, Mitsutaka Niiro, Masanao Maruta, Hideto Hidaka, T. Tada, Kenji Gamo:
A Variable Drivability (VD) Output Buffer for the System In a Package (SIP) and High Frequency Wafer Test. 170-177 - Bruce Cowan, Owen Farnsworth, Peter Jakobsen, Steven F. Oakland, Michael Ouellette, Donald L. Wheater:
On-Chip Repair and an ATE Independent Fusing Methodology. 178-186 - Jayasanker Jayabalan, Juraj Povazanec:
Integration of SRAM Redundancy into Production Test. 187-193
Design Validation - Novel ATPG Applications
- Jacob A. Abraham, Vivekananda M. Vedula, Daniel G. Saab:
Verifying Properties Using Sequential ATPG. 194-202 - Ganapathy Parthasarathy, Madhu K. Iyer, Tao Feng, Li-C. Wang, Kwang-Ting Cheng, Magdy S. Abadir:
Combining ATPG and Symbolic Simulation for Efficient Validation of Embedded Array Systems. 203-212 - Jayanta Bhadra, Narayanan Krishnamurthy:
Automatic Generation of Design Constraints in Verifying High Performance Embedded Dynamic Circuits. 213-222 - Andreas G. Veneris, Magdy S. Abadir, Mandana Amiri:
Design Rewiring Using ATPG. 223-232
Novel Techniques for Diagnostics
- Ronald D. Blanton, John T. Chen, Rao Desineni, Kumar N. Dwarakanath, Wojciech Maly, Thomas J. Vogels:
Fault Tuples in Diagnosis of Deep-Submicron Circuits. 233-241 - Yasuo Sato, Iwao Yamazaki, Hiroki Yamanaka, Toshio Ikeda, Masahiro Takakura:
A Persistent Diagnostic Technique for Unstable Defects. 242-249 - David B. Lavo, Ismed Hartanto, Tracy Larrabee:
Multiplets, Models, and the Search for Meaning: Improving Per-Test Fault Diagnosis. 250-259 - Camelia Hora, Rene Segers, Stefan Eichenberger, Maurice Lousberg:
An Effective Diagnosis Method to Support Yield Improvement. 260-269
Connecting Disconnects
- Tom Austin, Charisma Canlas, Brady Morgan, Jorge L. Rodriguez:
Across the Great Divide: Examination of Simulation Data with Actual Silicon Waveforms Improves Device Characterization and Production Test Development. 270-279 - A. T. Sivaram, William Fritzsche, Toshitaka Koshi, Nam Lai:
DUT Capture Using Simultaneous Logic Acquisition. 280-289 - Gregory A. Maston:
Considerations for STIL Data Application. 290-296 - Guy Peterson:
Verification of Device Interface Hardware Interconnections Prior to the Start of Testing. 297-300
Test Data Compression
- Janusz Rajski, Jerzy Tyszer, Mark Kassab, Nilanjan Mukherjee, Rob Thompson, Kun-Han Tsai, Andre Hertwig, Nagesh Tamarapalli, Grzegorz Mrugalski, Geir Eide, Jun Qian:
Embedded Deterministic Test for Low-Cost Manufacturing Test. 301-310 - Subhasish Mitra, Kee Sup Kim:
X-Compact: An Efficient Response Compaction Technique for Test Cost Reduction. 311-320 - C. V. Krishna, Nur A. Touba:
Reducing Test Dat Volume Using LFSR Reseeding with Seed Compression. 321-330 - Francis G. Wolff, Christos A. Papachristou:
Multiscan-Based Test Compression and Hardware Decompression Using LZ77. 331-339
Lecture Series - Embedded IP for Soc Infrastructure
- Yervant Zorian:
Embedded Memory Test and Repair: Infrastructure IP for SOC Yield. 340-349 - Mark Craig, Alvin Jee, Prashant Maniar:
An Integrated Approach to Yield Loss Characterization. 350-356 - Eric Dupont, Michael Nicolaidis:
Robustness IPs for Reliability and Security of SoCs. 357-364
Chip-Level Crosstalk Identification and Testing
- Shahin Nazarian, Hang Huang, Suriyaprakash Natarajan, Sandeep K. Gupta, Melvin A. Breuer:
XIDEN: Crosstalk Target Identification Framework. 365-374 - Aditya D. Sathe, Michael L. Bushnell, Vishwani D. Agrawal:
Analog Macromodeling of Capacitive Coupling Faults in Digital Circuit Interconnects. 375-383 - Bipul Chandra Paul, Kaushik Roy:
Testing CrossTalk Induced Delay Faults in Static CMOS Circuits Through Dynamic Timing Analysis. 384-390
Advances in Fault Simulation and Test Generation
- A. V. S. S. Prasad, Vishwani D. Agrawal, Madhusudan V. Atre:
A New Algorithm for Global Fault Collapsing into Equivalence and Dominance Sets. 391-397 - Li-C. Wang, Magdy S. Abadir, Juhong Zhu:
On Testing High-Performance Custom Circuits without Explicit Testing of the Internal Faults. 398-406 - Jing-Jia Liou, Li-C. Wang, Kwang-Ting Cheng, Jennifer Dworak, M. Ray Mercer, Rohit Kapur, Thomas W. Williams:
Analysis of Delay Test Effectiveness with a Multiple-Clock Scheme. 407-416
Adventures in Interfacing
- David Gessel, Alexander H. Slcoum, Alexander D. Sprunt, Scott Ziegenhagen:
Realistic Spring Probe Testing Methods and Results. 417-423 - Kenichi Kataoka, Toshihiro Itoh, Katsuya Okumura, Tadatomo Suga:
Low-Contact-Force Probing on Copper Electrodes. 424-429 - Wolfram Humann:
Compensation of Transmission Line Loss for Gbit/s Test on ATEs. 430-437
DFT Testers
- John S. Davis, David C. Keezer:
Multi-Purpose Digital Test Core Utilizing Programmable Logic. 438-445 - Stephen K. Sunter, Benoit Nadeau-Dostie:
Complete, Contactless I/O Testing - Reaching the Boundary in Minimizing Digital IC Testing Cost. 446-455 - Mike Mayberry, John Johnson, Navid Shahriari, Mike Tripp:
Realizing the Benefits of Structural Test for Intel Microprocessors. 456-463
Production Test Automation
- David Turner, David Abercrombie, James McNames, W. Robert Daasch, Robert Madge:
Isolating and Removing Sources of Variation in Test Data. 464-471 - Rajneesh Mahajan, Ramesh Govindarajulu, James R. Armstrong, F. Gail Gray:
A Multi-Language Goal-Tree Based Functional Test Planning System. 472-481 - David Williams, Anthony P. Ambler:
System Manufacturing Test Cost Model. 482-490
Soft and Hard Failure Analysis and On-Line Testing
- Yi Zhao, Li Chen, Sujit Dey:
On-Line Testing of Multi-Source Noise-Induced Errors on the Interconnects and Buses of System-on-Chips. 491-499 - Alfredo Benso, Stefano Di Carlo, Giorgio Di Natale, Paolo Prinetto:
Static Analysis of SEU Effects on Software Applications. 500-508 - Sreejit Chakravarty, Ankur Jain, Nandakumar Radhakrishnan, Eric W. Savage, Sujit T. Zachariah:
Experimental Evaluation of Scan Tests for Bridges. 509-518
Soc Benchmarks
- Erik Jan Marinissen, Vikram Iyengar, Krishnendu Chakrabarty:
A Set of Benchmarks fo Modular Testing of SOCs. 519-528 - Sandeep Kumar Goel, Erik Jan Marinissen:
Effective and Efficient Test Architecture Design for SOCs. 529-538 - Sandeep Koranne, Vikram Iyengar:
On the Use of k-tuples for SoC Test Schedule Representation. 539-548
Appliaction Series - High-Speed Test Interfaces
- Todd Sargent:
Physical Principles of Interface Design. 549-554 - Thomas P. Warwick:
What a Device Interface Board Really Costs: An Evaluation of Technical Considerations for Testing Products Operating in the Gigabit Region. 555-564 - David E. McFeely:
The Process and Challenges of a High-Speed DUT Board Project. 565-573
Test and Debug of Microprocessors
- Robert Bailey, A. Metayer, B. Svrcek, Nandu Tendolkar, E. Wolf, Eric Fiene, Mike Alexander, Rick Woltenberg, Rajesh Raina:
Test Methodology for Motorola's High Performance e500 Core Based on PowerPC Instruction Set Architecture. 574-583 - Timothe Litt:
Support for Debugging in the Alpha 21364 Microprocessor. 584-589 - Praveen Parvathala, Kaila Maneparambil, William Lindsay:
FRITS - A Microprocessor Functional BIST Method. 590-598
FPGA Testing
- Shahin Toutounchi, Andrew Lai:
FPGA Test and Coverage. 599-607 - Mehdi Baradaran Tahoori, Subhasish Mitra, Shahin Toutounchi, Edward J. McCluskey:
Fault Grading FPGA Interconnect Test Configurations. 608-617 - Charles E. Stroud, Jeremy Nall, Matthew Lashinsky, Miron Abramovici:
BIST-Based Diagnosis of FPGA Interconnect. 618-627
Lecture Series-Silicon Debug
- Hari Balachandran, Kenneth M. Butler, Neil Simpson:
Facilitating Rapid First Silicon Debug. 628-637 - Bart Vermeulen, Tom Waayers, Sandeep Kumar Goel:
Core-Based Scan Architecture for Silicon Debug. 638-647 - Xinli Gu, Weili Wang, Kevin Li, Heon C. Kim, Sung Soo Chung:
Re-Using DFT Logic for Functional and Silicon Debugging Test. 648-656 - Don Douglas Josephson:
The Manic Depression of Microprocessor Debug. 657-663 - Carol Pyron, Rekha Bangalore, Dawit Belete, Jason Goertz, Ashutosh Razdan, Denise Younger:
Silicon Symptoms to Solutions: Applying Design for Debug Techniques. 664-672
Data Analysis and Yield Model Validation
- Robert Madge, B. H. Goh, V. Rajagopalan, C. Macchietto, W. Robert Daasch, Chris Schuermyer, C. Taylor, David Turner:
Screening MinVDD Outliers Using Feed-Forward Voltage Testing. 673-682 - Minh Quach, Tuan Pham, Tim Figal, Bob Kopitzke, Pete O'Neill:
Wafer-Level Defect-Based Testing Using Enhanced Voltage Stress and Statistical Test Data Evaluation. 683-692 - Thomas S. Barnett, Matt Grady, Kathleen G. Purdy, Adit D. Singh:
Redundancy Implications for Early-Life Reliability: Experimental Verification of an Integrated Yield-Reliability Model. 693-699
Jitter Testing in Multi-Gigahertz Digital Systems
- Yi Cai, S. A. Werner, G. J. Zhang, M. J. Olsen, Robert D. Brink:
Jitter Testing for Multi-Gigabit Backplane SerDes - Techniques to Decompose and Combine Various Types of Jitter. 700-709 - Mike P. Li, Jan B. Wilstrup:
On the Accuracy of Jitter Separation from Bit Error Rate Function. 710-716 - Takahiro J. Yamaguchi, Mani Soma, Masahiro Ishida, Hirobumi Musha, Louis Malarsie:
A New Method for Testing Jitter Tolerance of SerDes Devices Using Sinusoidal Jitter. 717-725
Efficient Approaches to Soc Testing
- Ishwar Parulkar, Thomas A. Ziaja, Rajesh Pendurkar, Anand D'Souza, Amitava Majumdar:
A Scalable, Low Cost Design-for-Test Architecture for UltraSPARCTM Chip Multi-Processors. 726-735 - Sungbae Hwang, Jacob A. Abraham:
Optimal BIST Using an Embedded Microprocessor. 736-745
1149.1 Verification and Validation
- Dave Stang, Ramaswami Dandapani:
An Implementation of IEEE 1149.1 to Avoid Timing Violations and Other Practical In-Compliance Improvements. 746-754 - Michael Cogswell, Shazia Mardhani, Kevin Melocco, Hina Arora:
A Structured Graphical Tool for Analyzing Boundary Scan Violations. 755-762 - Adam Kristof:
Improved Digital I/O Ports Enhance Testability of Interconnections. 763-772 - Sezer Gören, F. Joel Ferguson:
Testing Finite State Machines Based on a Structural Coverage Metric . 773-780
Scan Stitching
- David Berthelot, Samit Chaudhuri, Hamid Savoj:
An Efficient Linear Time Algorithm for Scan Chain Optimization and Repartitioning. 781-787 - Loïs Guiller, Frederic Neuveux, S. Duggirala, R. Chandramouli, Rohit Kapur:
Integrating DFT in the Physical Synthesis Flow. 788-795 - Yannick Bonhomme, Patrick Girard, Christian Landrault, Serge Pravossoudovitch:
Power Driven Chaining of Flip-Flops in Scan Architectures. 796-803 - Frank te Beest, Ad M. G. Peeters, Marc Verra, Kees van Berkel, Hans G. Kerkhoff:
Automatic Scan Insertion and Test Generation for Asynchronous Circuits. 804-813
DFT for Manufacturing Problems
- Marcelino B. Santos, Isabel C. Teixeira, João Paulo Teixeira, Salvador Manich, Rosa Rodríguez-Montañés, Joan Figueras:
RTL Level Preparation of High-Quality/Low-Energy/Low-Power BIST. 814-823 - Zhigang Jiang, Sandeep K. Gupta:
An ATPG for Threshold Testing: Obtaining Acceptable Yield in Future Processes. 824-833 - Seongmoon Wang:
Generation of Low Power Dissipation and High Fault Coverage Patterns for Scan-Based BIST. 834-843 - Ozgur Sinanoglu, Ismet Bayraktaroglu, Alex Orailoglu:
Scan Power Reduction Through Test Data Transition Frequency Analysis. 844-850
Mixed-Signal Test Techniques
- Carsten Wegener, Michael Peter Kennedy:
Implementation of Model-Based Testing for Medium to High-Resolution Nyquist-Rate ADCs. 851-860 - M. Stancic, Liquan Fang, M. H. H. Weusthof, R. M. W. Tijink, Hans G. Kerkhoff:
A New Test Generation Approach for Embedded Analogue Cores in SoC. 861-869 - Gunter Krampl, Marco Rona, Hermann Tauber:
Test Setup Simulation - A High-Performance VHDL-Based Virtual Test Solution Meeting Industrial Requirements. 870-878 - Maurizio Gavardoni:
Use of Pipeline Converters for ATE Applications. 879-884
Go-Fast ATE!
- Ahmed Rashid Syed:
R4X/D4X - Formatters for Flexible Test System Architecture. 885-893 - Toshiyuki Okayasu, Masakatsu Suda, Kazuhiro Yamamoto:
CMOS Circuit Technology for Precise GHz Timing Generator. 894-902 - Masashi Shimanouchi:
New Paradigm for Signal Paths in ATE Pin Electronics are Needed for Serialcom Device Testing. 903-912 - Jean-Pascal Mallet:
High Current DPS Architecture for Sort Test Challenge. 913-922
System Test Design, Bist and System Verification
- Tapan J. Chakraborty, Chen-Huan Chiang:
A Novel Fault Injection Method for System Verification Based on FPGA Boundary Scan Architectur. 923-929 - Andrea Baldini, Alfredo Benso, Paolo Prinetto, Sergio Mo, Andrea Taddei:
Efficient Design of System Test: A Layered Architecture. 930-939 - Liviu Miclea, Szilárd Enyedi, Alfredo Benso:
Itelligent Agents and BIST/BISR - Working Together in Distributed Systems. 940-946
Advances in IDDX
- Bartomeu Alorda, M. Rosales, Jerry M. Soden, Charles F. Hawkins, Jaume Segura:
Charge Based Transient Current Testing (CBT) for Submicron CMOS SRAMs. 947-953 - David I. Bergman, Hans Engler:
Improved IDDQ Testing with Empirical Linear Prediction. 954-963 - Bram Kruseman, Stefan van den Oetelaar, Josep Rius:
Comparison of IDDQ Testing and Very-Low Voltage Testing. 964-973
Delay-Test
- Manish Sharma, Janak H. Patel:
Finding a Small Set of Longest Testable Paths that Cover Every Gate. 974-982 - Xiao Liu, Michael S. Hsiao, Sreejit Chakravarty, Paul J. Thadikaran:
Techniques to Reduce Data Volume and Application Time for Transition Test. 983-992 - Ramesh C. Tekumalla, Scott Davidson:
On Identifying Indistinguishable Path Delay Faults and Improving Diagnosis. 993-1002
Embedded Test for Analog and Digital
- Kazumi Hatayama, Michinobu Nakao, Yoshikazu Kiyoshige, Koichiro Natsume, Yasuo Sato, Takaharu Nagumo:
Application of High-Quality Built-In Test to Industrial Designs. 1003-1012 - Nadir Z. Basturkmen, Sudhakar M. Reddy, Irith Pomeranz:
Pseudo Random Patterns Using Markov Sources for Scan BIST. 1013-1021 - Mohamed M. Hafed, Gordon W. Roberts:
Test and Evaluation of Multiple Embedded Mixed-Signal Test Cores. 1022-1030
Maximizing Test Effectiveness and Minimizing Cost
- Aubin Roy, Stephen K. Sunter, Alessandra Fudoli, Davide Appello:
High Accuracy Stimulus Generation for A/D Converter BIST. 1031-1039 - John Gatej, Lee Song, Carol Pyron, Rajesh Raina, Tom Munns:
valuating ATE Features in Terms of Test Escape Rates and Other Cost of Test Culprits. 1040-1049 - Peter C. Maxwell:
Wafer/Package Test Mix for Optimal Defect Detection. 1050-1055
Board Test and Bist for Mems
- Bill Eklow, Carl Barnhart, Kenneth P. Parker:
IEEE P1149.6: A Boundary-Scan Standard for Advanced Digital Networks. 1056-1065 - Kathy Hird, Kenneth P. Parker, Bill Follis:
Test Coverage: What Does It Mean When a Board Test Passes?. 1066-1074 - Nilmoni Deb, R. D. (Shawn) Blanton:
Built-In Self Test of CMOS-MEMS Accelerometers. 1075-1084
Debug and Diagnosis
- Jiang Brandon Liu, Andreas G. Veneris, Hiroshi Takahashi:
Incremental Diagnosis of Multiple Open-Interconnects. 1085-1092 - Mohammad H. Tehranipour, Mehrdad Nourani:
Signal Integrity Loss in SoC's Interconnects: A Diagnosis Approach Using Embedded Microprocessor. 1093-1102 - Sandeep Kumar Goel, Bart Vermeulen:
Hierarchical Data Invalidation Analysis for Scan-Based Debug on Multiple-Clock System Chips. 1103-1110
Delay-Test: Practical Experience and Solutions
- Dawit Belete, Ashutosh Razdan, William Schwarz, Rajesh Raina, Christopher Hawkins, Jeff Morehead:
Use of DFT Techniques In Speed Grading a 1GHz+ Microprocessor . 1111-1119 - Jayashree Saxena, Kenneth M. Butler, John Gatt, R. Raghuraman, Sudheendra Phani Kumar, Supatra Basu, David J. Campbell, John Berech:
Scan-Based Transition Fault Testing - Implementation and Low Cost Test Challenges . 1120-1129 - Bhaskar Chatterjee, Manoj Sachdev, Ali Keshavarzi:
A DFT Technique for Low Frequency Delay Fault Testing in High Performance Digital Circuits. 1130-1139
RF Testing
- Koji Asami, Yasuo Furukawa, Michael Purtell, Motoo Ueda, Karl Watanabe, Toshifumi Watanabe:
WCDMA Testing with a Baseband/IF Range AWG. 1140-1145 - Kevin M. MacKay:
Testing Wireless Local Area Network Transceiver ICs at 5 GHz. 1146-1150 - John Ferrario, Randy Wolf, Steve Moss:
Architecting Millisecond Test Solutions for Wireless Phone RFIC's. 1151-1158
Test Resource
- Vikram Iyengar, Sandeep Kumar Goel, Erik Jan Marinissen, Krishnendu Chakrabarty:
Test Resource Optimization for Multi-Site Testing of SOCs Under ATE Memory Depth Constraints. 1159-1168 - Rainer Dorsch, Ramón Huerta Rivera, Hans-Joachim Wunderlich, Martin Fischer:
Adapting an SoC to ATE Concurrent Test Capabilities. 1169-1175 - Mohsen Nahvi, André Ivanov, Resve A. Saleh:
Dedicated Autonomous Scan-Based Testing (DAST) for Embedded Cores. 1176-1184
Can System Test and IC Test Learn from Each Other?
- David Williams:
Test Coverage Models for System Test? 1185 - Rochit Rajsuman:
Can IC Test Learn from How a Tester is Tested. 1186 - Scott Davidson:
What Can IC Test Teach System Test? 1187 - Anthony P. Ambler:
Is It Rocket Science? 1188-1189
Taps All Over My Chips
- Bart Vermeulen:
TAPS All Over My Chips! So Now What Do I Do? 1190 - Lee Whetsel:
Inevitable Use of TAP Domains in SOCs. 1191 - Steven F. Oakland:
TAPs All Over My Chips. 1192 - Teresa L. McLaurin:
TAPS All Over My Chips. 1193-1194
Can Scan Achieve The Quality Level We Are Looking For?
- Anjali Kinra Vij:
Good Scan = Good Quality Level? Well, It Depends ? 1195 - Carol Pyron:
Scan and BIST Can Almost Achieve Test Quality Levels. 1196 - Grady Giles:
Is Scan (Alone) Sufficient to Test Today?s Microprocessors? Not Quite, but We Can?t Get the Job Done Without It. 1197 - Phil Nigh:
Scan-Based Testing: The Only Practical Solution for Testing ASIC/Consumer Products. 1198 - David M. Wu:
Trouble With Scan. 1199-1200
Mixed-Signal Bist: Fact or Fiction?
- Arnold Frisch:
A/MS BISTs: The FACTS, Just the Facts. 1201 - Karim Arabi:
Mixed-Signal BIST: Fact or Fiction. 1202 - Lee Y. Song:
Mixed Signal BIST: Fact or Fiction. 1203 - Gordon W. Roberts:
Mixed-Signal BIST: Fact or Fiction. 1204 - Stephen K. Sunter:
IC Mixed-Signal BIST: Separating Facts from Fiction. 1205
Mission Possible?: An Open Ate Tester Architecture
- Dennis R. Conti:
Mission Impossible? Open Architecture ATE. 1207 - Paul F. Scrivens:
Mission Possible? Open Architecture ATE. 1208 - Paul D. Roddy:
Is an Open Architecture Tester Really Achievable? 1209 - Sergio M. Perez:
The Consequences of an Open ATE Architecture. 1210 - Mark Jagiela:
An Open Architecture for Semiconductor Test: Enablers and Challenges. 1211 - Burnell G. West:
Open ATE Architecture: Key Challenges. 1212-1213
The Impacts of Outsourcing on Test
- Bill Price:
The Role of Test in a Highly Outsourced Business Model. 1214 - Davide Appello:
The Yield of Test Outsourcing. 1215 - Fidel Muradali:
The Impact of Outsourcing on Test. 1216 - Peter Muhmenthaler:
Outsourcing Test without Standards? 1217-1218
Test and Repair of Commodity and Embedded Flash Memories
- Jean Michel Daga:
Test and Repair of Embedded Flash Memories. 1219 - Paul Okino:
Test Time Impact of Redundancy Repair in Embedded Flash Memory. 1220 - Riichiro Shirota:
Test and Repair of Non-Volatile Commodity and Embedded Memories (NAND Flash Memory). 1221 - Roger Barth:
Selective Optimization of Test for Embedded Flash Memory. 1222 - Shigeo Tsuchida:
Test and Repair of Nonvolatile Commodity and Embedded Memories. 1223-1224
Testing Highly Integrated Circuits and Systems Using A Low-Cost Tester: How to Overcome The Challenge?
- Mustapha Slamani:
Testing Highly Integrated Wireless Circuits and Systems with Low Cost Tester: How to Overcome the Challenge? 1225 - Alan Kafton:
Wireless SOC Testing: Can RF Testing Costs Be Reduced? 1226-1227
Multi-GHZ Era: Test Challenges and Solutions
- Chuck Hawkins, Jaume Segura:
GHz Testing and Its Fuzzy Targets. 1228 - Takahiro J. Yamaguchi:
Multi-GHz interface devices should be tested using external test resources. 1229 - David C. Keezer:
Challenges and Solutions for Multi-Gigahertz Testing. 1230 - Manoj Sachdev:
Multi-Gigahertz Digital Test Challenges and Techniques. 1231 - Mike Tripp:
On-Die DFT Based Solutions are Sufficient for Testing Multi-GHz Interfaces in Manufacturing (and Are Also Key to Enabling Lower Cost ATE Platforms). 1232 - Ulrich Schoettmer:
Multi-Gigahertz Digital Test Challenges and Techniques. 1233-1234
Board Test and ITC: What Does the Future Hold?
- Bill Eklow:
Is Board Test Worth Talking About? 1235 - Gordon D. Robinson:
Board Test: Wanted Dead or Alive. 1236 - Kenneth M. Butler:
Is ITC Bored with Board Test? 1237 - Kenneth P. Parker:
Board Test Is NOT Mature. 1238 - Monica Lobetti Bodoni:
Panel: "Board Test and ITC: What Does the Future Hold?". 1239
2001 ITC Best Paper
- W. Robert Daasch, Kevin Cota, James McNames, Robert Madge:
Neighbor Selection for Variance Reduction in IDDQ and Other Parametric Data. 1240
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.