MC14512B 8-Channel Data Selector: PDIP-16 P Suffix CASE 648
MC14512B 8-Channel Data Selector: PDIP-16 P Suffix CASE 648
16
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.) SOIC–16
14512B
D SUFFIX AWLYWW
Symbol Parameter Value Unit
CASE 751B
VDD DC Supply Voltage Range – 0.5 to +18.0 V 1
Vin, Vout Input or Output Voltage Range – 0.5 to VDD + 0.5 V
(DC or Transient) 16
Iin, Iout Input or Output Current ± 10 mA SOEIAJ–16
(DC or Transient) per Pin F SUFFIX MC14512B
CASE 966 AWLYWW
PD Power Dissipation, 500 mW
per Package (Note NO TAG) 1
TA Ambient Temperature Range – 55 to +125 °C
A = Assembly Location
Tstg Storage Temperature Range – 65 to +150 °C
WL or L = Wafer Lot
TL Lead Temperature 260 °C YY or Y = Year
(8–Second Soldering) WW or W = Work Week
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C ORDERING INFORMATION
This device contains protection circuitry to guard against damage due to high Device Package Shipping
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this MC14512BCP PDIP–16 2000/Box
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) vVDD.
MC14512BD SOIC–16 48/Rail
Unused inputs must always be tied to an appropriate logic voltage level (e.g., MC14512BDR2 SOIC–16 2500/Tape & Reel
either VSS or VDD). Unused outputs must be left open.
MC14512BF SOEIAJ–16 See Note 1.
TRUTH TABLE
C B A Inhibit Disable Z
0 0 0 0 0 X0
0 0 1 0 0 X1
0 1 0 0 0 X2
0 1 1 0 0 X3
1 0 0 0 0 X4
1 0 1 0 0 X5
1 1 0 0 0 X6
1 1 1 0 0 X7
X X X 1 0 0
X X X X 1 High
Impedance
X = Don’t Care
PIN ASSIGNMENT
X0 1 16 VDD
X1 2 15 DIS
X2 3 14 Z
X3 4 13 C
X4 5 12 B
X5 6 11 A
X6 7 10 INH
VSS 8 9 X7
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MC14512B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic Symbol
VDD
Vdc Min
– 55_C
Max Min
25_C
Typ (4.) Max Min
125_C
Max Unit
Output Voltage “0” Level VOL 5.0 — 0.05 — 0 0.05 — 0.05 Vdc
Vin = VDD or 0 10 — 0.05 — 0 0.05 — 0.05
15 — 0.05 — 0 0.05 — 0.05
“1” Level VOH 5.0 4.95 — 4.95 5.0 — 4.95 — Vdc
Vin = 0 or VDD 10 9.95 — 9.95 10 — 9.95 —
15 14.95 — 14.95 15 — 14.95 —
Input Voltage “0” Level VIL Vdc
(VO = 4.5 or 0.5 Vdc) 5.0 — 1.5 — 2.25 1.5 — 1.5
(VO = 9.0 or 1.0 Vdc) 10 — 3.0 — 4.50 3.0 — 3.0
(VO = 13.5 or 1.5 Vdc) 15 — 4.0 — 6.75 4.0 — 4.0
“1” Level VIH Vdc
(VO = 0.5 or 4.5 Vdc) 5.0 3.5 — 3.5 2.75 — 3.5 —
(VO = 1.0 or 9.0 Vdc) 10 7.0 — 7.0 5.50 — 7.0 —
(VO = 1.5 or 13.5 Vdc) 15 11 — 11 8.25 — 11 —
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MC14512B
ID VDD
DISABLE
INHIBIT Z
A CL
B
C
X0
X1
PULSE X2
Vin 50% GENERATOR
50% X3
DUTY X4
CYCLE X5
X6
X7
VSS
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MC14512B
VDD
20 ns 20 ns
90% VDD
DISABLE DATA 50%
INHIBIT Z 10% VSS
A tPLH tPHL
CL 90% VOH
B 50%
C Z 10%
VOL
X0 tTLH tTHL
PULSE X1
GENERATOR TEST CONDITIONS:
X2 INHIBIT = VSS
X3 A, B, C = VSS
X4
X5 20 ns 20 ns
X6 INHIBIT, VDD
90%
X7 A, B, OR C 50%
10% VSS
tPHL tPLH
VSS Parameter Test Conditions 90% VOH
50%
Inhibit to Z A, B, C = VSS, XO = VDD Z 10% VOL
A, B, C to Z Inh = VSS, XO = VDD tTHL tTLH
VDD
PULSE 20 ns
VDD 20 ns
GENERATOR VDD
DISABLE 90%
VDD 50%
INHIBIT Z DISABLE 10%
CL VSS
A INPUT
B 1k S1 tPZL
S3 tPLZ
C VOH
90%
X0 S2 OUTPUT 10% VOL ≈ 2.5 V @ VDD = 5 V,
S4 X1 10 V, AND 15 V
tPHZ tPZH
X2 ≈ 2 V @ VDD = 5 V
X3 VSS OUTPUT
90%
VOH ≈ 6 V @ VDD = 10 V
VSS X4 10% ≈ 10 V @ VDD = 15 V
VOL
X5
X6 Switch Positions for 3–State Test
X7 Test S1 S2 S3 S4
tPHZ Open Closed Closed Open
VSS
tPLZ Closed Open Open Closed
tPZL Closed Open Open Closed
tPZH Open Closed Closed Open
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MC14512B
LOGIC DIAGRAM
13
C
12
B 15
11 DISABLE
A
1 10 DATA
X0 SELECTED
BUS
INHIBIT DEVICE
2 VDD IOD
X1
MC14512B
3 IL
X2
14 LOAD
Z ITL
4
X3 MC14512B
5
X4
ITL
6 MC14512B
X5
7 VSS
X6
9
X7 1 1
OUT
IN IN OUT
2 2
TRANSMISSION
GATE
Output terminals of several MC14512B 8–Bit Data (including fanout to other device inputs), and can be
Selectors can be connected to a single date bus as shown. calculated by:
One MC14512B is selected by the 3–state control, and the IOD – IL
remaining devices are disabled into a high–impedance “off” N= +1
ITL
state. The number of 8–bit data selectors, N, that may be
connected to a bus line is determined from the output drive N must be calculated for both high and low logic state of the
current, IOD, 3–state or disable output leakage current, ITL, bus line.
and the load current, IL, required to drive the bus line
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MC14512B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08 NOTES:
–A– 1. DIMENSIONING AND TOLERANCING PER ANSI
ISSUE R Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
16 9 3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
B 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 8 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F C L A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
S C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
SEATING F 0.040 0.70 1.02 1.77
–T– PLANE G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
H K M J 0.008 0.015 0.21 0.38
J K 0.110 0.130 2.80 3.30
G L 0.295 0.305 7.50 7.74
D 16 PL
M 0_ 10 _ 0_ 10 _
0.25 (0.010) M T A M S 0.020 0.040 0.51 1.01
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
–A– ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
16 9 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
–B– MOLD PROTRUSION.
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
1 8
0.25 (0.010) M B S PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
F A 9.80 10.00 0.386 0.393
K R X 45 _ B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
C F 0.40 1.25 0.016 0.049
–T– SEATING G 1.27 BSC 0.050 BSC
PLANE
M J J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
D 16 PL M 0_ 7_ 0_ 7_
P 5.80 6.20 0.229 0.244
0.25 (0.010) M T B S A S R 0.25 0.50 0.010 0.019
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MC14512B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
16 9 LE MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
Q1 OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
E HE M_ 4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
1 8 L DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DETAIL P DIMENSION AT MAXIMUM MATERIAL CONDITION.
Z DAMBAR CANNOT BE LOCATED ON THE LOWER
D RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
VIEW P
e A MILLIMETERS INCHES
c DIM MIN MAX MIN MAX
A ––– 2.05 ––– 0.081
A1 0.05 0.20 0.002 0.008
b 0.35 0.50 0.014 0.020
c 0.18 0.27 0.007 0.011
A1 D 9.90 10.50 0.390 0.413
b E 5.10 5.45 0.201 0.215
e 1.27 BSC 0.050 BSC
0.13 (0.005) M 0.10 (0.004) HE 7.40 8.20 0.291 0.323
L 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M 0_ 10 _ 0_ 10 _
Q1 0.70 0.90 0.028 0.035
Z ––– 0.78 ––– 0.031
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